NFZ5BBW4R5LZ10L

Reference Only Spec No. JENF243J-9103A-01 P.1/10 CHIP NOISE FILTER NFZ5BBW□□□LZT0□ Murata Standard Reference Specification【AEC-Q200】 1.Scope This reference specification applies to NFZ5BBW_LZ10 series, Chip Noise Filter for Automotive Electronics based on AEC-Q200 except for Power train and Safety. 2.Part Numbering (ex) NF Product ID Z Structure 5B BW Dimension (L×Ｗ) Features 2R9 Impedance L Z Performance 1 0 L Category Numbers Other Packaging of Circuit L:Taping(φ180mm/reel) K: Taping (φ330mm/reel) Characteristics 3.Rating Operating Temperature Range. (Ambient temperature; Self-temperature rise is not included) (Product temperature; Self- temperature rise is included) Storage Temperature Range. -40 to +105°C -40°C to +105°C -40°C to +125°C Impedance *1 Rated Current(mA) Customer Part Number MURATA Part Number ESD DC (Ω) Tolerance (%) Resistance (Ω) *2 Ambient temperature 85℃ *3 Ambient temperature 105℃ NFZ5BBW2R9LZ10L 2.9 0.012±20% 4000 2050 NFZ5BBW2R9LZ10K NFZ5BBW4R5LZ10L 4.5 0.015±20% 3400 1800 NFZ5BBW4R5LZ10K NFZ5BBW6R7LZ10L 6.7 0.019±20% 3100 1680 NFZ5BBW6R7LZ10K NFZ5BBW7R6LZ10L 7.6 0.019±20% 3100 1680 NFZ5BBW7R6LZ10K NFZ5BBW100LZ10L 10 0.024±20% 3000 1630 NFZ5BBW100LZ10K NFZ5BBW140LZ10L 14 0.030±20% 2600 1370 NFZ5BBW140LZ10K NFZ5BBW170LZ10L 17 0.035±20% 2500 1230 NFZ5BBW170LZ10K ±30 NFZ5BBW220LZ10L 22 0.044±20% 2300 1210 NFZ5BBW220LZ10K NFZ5BBW310LZ10L 31 0.058±20% 2000 1090 NFZ5BBW310LZ10K NFZ5BBW450LZ10L 45 0.083±20% 1650 1020 NFZ5BBW450LZ10K NFZ5BBW520LZ10L 52 0.100±20% 1610 1010 NFZ5BBW520LZ10K NFZ5BBW610LZ10L 61 0.106±20% 1600 1000 NFZ5BBW610LZ10K NFZ5BBW970LZ10L 97 0.187±20% 1200 700 NFZ5BBW970LZ10K NFZ5BBW141LZ10L 140 0.259±20% 1050 600 NFZ5BBW141LZ10K *1: As for the rated current, rated current derated as figure.1 depending on the operating temperature. *2: When applied rated current to the Products, temperature rise caused by self heating will be 40°C or less. *3: When applied rated current to the Products, temperature rise caused by self heating will be 20°C or less. MURATA MFG.CO., LTD 5A: 8kV 5A Reference Only Spec No. JENF243J-9103A-01 P.2/10 4. Testing Conditions 《Unless otherwise specified》 《In case of doubt》 Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C± 2°C Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH) Atmospheric Pressure : 86kPa to 106 kPa 5.Appearance and Dimensions 5.0±0.2 （0.2） 2.0±0.2 5.0±0.2 ※No Marking. 5.0±0.2 ■Unit Mass (Typical value) 0.22ｇ (in mm) 1.5±0.2 1.5±0.2 6.Electrical Performance No. 6.1 Item Impedance Specification Inductance shall meet item 3. 6.2 DC Resistance DC Resistance shall meet item 3. Test Method Measuring Equipment : Agilent 4284A or equivalent Measuring Frequency: 1MHz Measuring Equipment:Digital multi meter MURATA MFG.CO., LTD Spec No. JENF243J-9103A-01 Reference Only P.3/10 7. AEC-Q200 Requirement 7.1 Performance (based on Table 5 for Magnetics(Inductors / Transformer) AEC-Q200 Rev.D issued June. 1 2010 No Stress 3 High Temperature Exposure AEC-Q200 Murata Specification / Deviation Test Method 1000hours at 105 °C Meet Table A after testing. Set for 24hours at room temperature, then measured. Table A Appearance No damage Impedance (at 1MHz) DC Resistance 4 Temperature Cycling 7 Biased Humidity Within ±10% 1000cycles Meet Table A after testing. -40 °C to + 105 °C Set for 24hours at room temperature,then measured. 1000hours at 85 °C, 85%RH Meet Table A after testing. unpowered. 8 Operational Life Apply 85 °C 1000 hours Meet Table A after testing. Set for 24hours at room temperature, then measured 9 External Visual Visual inspection No abnormalities 10 Physical Dimension Meet ITEM 5 （Style and Dimensions） No defects 12 Resistance to Solvents Per MIL-STD-202 Method 215 Not Applicable 13 Mechanical Shock Per MIL-STD-202 Method 213 Condition C: 100g’s/6ms/Half sine 14 Vibration 5g's for 20 minutes, 12cycles eah of 3 orientations Test from 10-2000Hz. 12cycles each of 3 orientations No-heating 15 Resistance to Soldering Heat Solder temperature 260C+/-5 °C Immersion time 10s 17 ESD Per AEC-Q200-002 18 Solderbility Within ±10% Per J-STD-002 Meet Table A after testing. Meet Table A after testing. Pre-heating: 150 to 180C /90±30s Meet Table A after testing. ESD Rank: Refer to Item 3. Rating. No defects Method b : Not Applicable 90% of the terminations is to be soldered. (Except exposed wire) MURATA MFG.CO., LTD Reference Only Spec No. JENF243J-9103A-01 AEC-Q200 No. Stress P.4/10 Murata Specification / Deviation Test Method 19 Electrical Characterization 20 Flammability Measured : Inductance No defects Per UL-94 Not Applicable 21 Board Flex Epoxy-PCB(1.6mm) Deflection 2mm(min) 60s minimum holding time Meet Table A after testing. Murata deviation request: 5s 22 Terminal Strength Per AEC-Q200-006 A force of 17.7N for 60s No defect 2.0±0.05 4.0±0.1 5.3±0.1 5.5±0.05 +0.1 φ 1.5 -0 8.0±0.1 *Lead-in/out wire (0.3) 12.0±0.2 8.1 Appearance and Dimensions of plastic tape 1.75±0.1 8. Specification of Packaging Dimension of the Cavity is measured at the bottom side. 2.4±0.1 Direction of feed 5.3±0.1 (in mm) 8.2 Specification of Taping (1) Packing quantity (standard quantity) φ180 mm reel : 500 pcs. / reel φ330 mm reel : 3000 pcs. / reel (2) Packing Method Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Plastic tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 8.3 Pull Strength Embossed carrier tape Cover tape 10N min. 5N min. 8.4 Peeling off force of cover tape Speed of Peeling off Peeling off force 165 to 180 degree 300mm/min 0.2 to 0.7N (minimum value is typical) F Cover tape Plastic tape MURATA MFG.CO., LTD Reference Only Spec No. JENF243J-9103A-01 P.5/10 8.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows. « Packaging Code : L (φ180mm reel) » Trailer : 160 min. 2.0±0.5 Leader Label 190 min 210 min Empty tape Cover tape  13.0±0.2  60± 1 0  21.0±0.8 13.0±1 0 Direction of feed 17.0±1.4 (in mm) 0  180± 3 « Packaging Code : K (φ330mm reel) » 2.0±0.5 Trailer 160min. Label 50min. 13.0±0.2 13.5±1.0 21.0±0.8 17.5±1.0 Leader 210min.. 190min. Empty Tape Cover tape Direction of feed (in mm) 330±2.0 8.6 Marking for reel Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ･･･ □□ OOOO  1) (1) (1)Factory Code (2) Date (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day (3) Serial No. 2) « Expression of RoHS marking» ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 8.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (2) ,Quantity, etc ･･･ MURATA MFG.CO., LTD Reference Only Spec No. JENF243J-9103A-01 P.6/10 8.8 Specification of Outer Case   Label   H  D  W 9. Reel φ180mm φ330mm Outer Case Dimensions (mm) W D H 186 186 93 340 340 95 Standard Reel Quantity in Outer Case (Reel) 4 4 Above Outer Case size is typical. It depends on a quantity of an order. Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Disaster prevention / crime prevention equipment (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Transportation equipment (trains, ships, etc.) (4) Power plant control equipment (9) Applications of similar complexity and /or reliability (5) Medical equipment requirements to the applications listed in the above 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10.1 Land pattern designing (Reflow Soldering) Recommended land patterns for reflow soldering are as follows: These have been designed for Electric characteristics and solderability. Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process. (Land pattern for Reflow soldering) Land (Land pattern for Flow soldering) 1.2[mm] Chip Colil 5.5 Solder Resist Product outline 4.1 Land outline Orifice of solder resist 1.8 1.85 2.0[mm] 2.7[mm] (in mm) 7.4[mm] 10.2 Flux, Solder Flux Solder ・Use rosin-based flux. ・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). ・Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder. ・Standard thickness of solder paste : 100μm to 150μm MURATA MFG.CO., LTD Spec No. JENF243J-9103A-01 Reference Only P.7/10 10.3 Flow soldering conditions / Reflow soldering conditions  Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. (1)Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time 60s min. Pre-heating Heating Cycle of flow Standard Profile Time. (s) Standard Profile Limit Profile 150℃、60s min. 250℃、4s～6s 265℃±3℃、5s 2 times 1 time (2)Reflow soldering profile 260℃ Temp. 245℃±3℃ 220℃ (℃) 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times MURATA MFG.CO., LTD Time(s) Limit Profile above 230°C、60s max. 260°C,10s 2 times Reference Only Spec No. JENF243J-9103A-01 P.8/10 10.4 Reworking with soldering iron. The following conditions must be strictly followed when using a soldering iron. Pre-heating Tip temperature Soldering iron output Tip diameter Soldering time Times 150°C,1 min 380°C max. 80W max. 3mm max. 3(+1,-0)s 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 10.5 Solder Volume ・Adhesive application of flow is recommended the 3-point application.（prevent the drop of products） Adhesive application position ・Amount of adhesive applied is a standard 1/2 to 2/3 of the bottom flange thickness. The bottom flange 10.6 Product's location The following shall be considered when designing and laying out P.C.B.’s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ Electrode The electorode part of the products should be located like the picture to the mechanical stress. Poor example） Electrode (Good example) Electrode Seam (2) Products location on P.C.B. separation Products (A,B,C,D) shall be located carefully so that products are not subject to the mechanical stress due to warping the board. Because they may be subjected the mechanical stress in order of ACB  D. A Electrode MURATA MFG.CO., LTD C B D Spec No. JENF243J-9103A-01 Reference Only P.9/10 10.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 minutes max. (3) Cleaner 1. Alternative cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 10.8 Resin coating The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 10.9 Caution for use  Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire.  Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core 10.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 10.11 Storage and Handling Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions  Products should be stored in the warehouse on the following conditions. Temperature : -10 ~ 40°C Humidity : 15 to 85% relative humidity No rapid change on temperature and humidity The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.  Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products.  Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.  Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. MURATA MFG.CO., LTD Spec No. JENF243J-9103A-01 11. Reference Only P.10/10 Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD