PLT5BPH2014R4SNL

Reference Only Spec No. :JEFL243B-9102J-01 P1/10 SMD type common-mode choke coil ＰＬＴ５ＢＰＨ☐☐☐☐☐☐ＳＮ☐ Murata Standard Reference Specification [AEC-Q200] 1. Scope This reference specification applies to SMD type Common Mode Choke Coil PLT5BPH Series for Automotive Electronics based on AEC-Q200. 2. Part Numbering (ex.) PLT Product ID 5BP Type H Application 101 Common Mode Impedance Zc 5R6 Rated Current S Winding Mode N Dimenssion L Packaging code L：Taping (Φ180mm reel) B ：Bulk H：Automotive 3. Rating Customer Part Number MURATA Part Number PLT5BPH1015R6SNL PLT5BPH1015R6SNB PLT5BPH2014R4SNL PLT5BPH2014R4SNB PLT5BPH3013R7SNL PLT5BPH3013R7SNB PLT5BPH5013R1SNL PLT5BPH5013R1SNB Common Mode Impedance Zc Rated Withstand Voltage Voltage (at10MHz) V(DC) V(DC) (Ω) DC Resistance (Rdc) (mΩ±30%) * Rated Current (A) Typ. Min. 125°C 150°C 100 60 5.6 2.9 4 200 120 4.4 2.4 7 80 2.2kV 10 2 200 300 180 3.7 2.2 11 500 300 3.1 1.8 17 Operating Temperature range : -55°C～+150°C Insulation Resistance (I.R.) (MΩmin.) Storage Temperature range : -55°C～+150°C ■* Rated Current is derated as below figure depending on the operating temperature. 7 6 5.6A PLT5BPH1015R6SN 4.4A PLT5BPH2014R4SN 3.7A PLT5BPH3013R7SN 3.1A PLT5BPH5013R1SN Rated Curent (A) 5 4 3 2.9A 2.4A 2.2A 1.8A 2 1 0 0 50 100 150 125 Operating Temperature (℃ ) MURATA MFG.CO.,LTD 200 ESD Rank Spec No. :JEFL243B-9102J-01 Reference Only P2/10 4. Standard Testing Conditions < Unless otherwise specified > Temperature: Ordinary Temp.15 ºC to 35 °C Humidity: Ordinary Humidity 25 %(RH) to 85 %(RH) < In case of doubt > Temperature: 20 °C ± 2 °C Humidity: 60 %(RH) to 70 %(RH) Atmospheric pressure: 86 kPa to 106 kPa 5. Style and Dimensions ■Equivalent Circuit (1) (2) (4) (3) No Polarity : E le c tr ode ( ) : R efe r ence Value (in:mm) ■Unit Mass (Typical value) 0.48g 6. Marking No Marking. 7. Electrical Performance No. Item Specification 7.1 Common Mode Meet item 3 Impedance (Zc) Typ. 7.2 Insulation Resistance (I.R.) 7.3 Withstand Voltage V(DC) 7.4 DC Resistance (Rdc) Test method Measuring Equipment: KEYSIGHT 4991A or the equivalent Measuring Frequency: 10MHz (ref.item 9) Measuring Voltage: Rated Voltage Time: within 1min. Products shall not be damaged. Voltage: Rated Voltage×2.5 Time: 1~5s. Measuring current: 1mA max. Meet item 3 (ref.item 9) (ref.item 9) Measuring Current : 100mA (ref.item 9) (In case of doubt in the above mentioned standard condition,measure by 4 terminal method.) MURATA MFG.CO.,LTD Spec No. :JEFL243B-9102J-01 Reference Only P3/10 8．Q200 Requirement 8-1. Performance (based on Table 13 for Ferrite EMI SUPPRESSORS/FILTERS) AEC-Q200 Rev.D issued June 1. 2010 AEC-Q200 No. 3 Stress High Temperature Exposure Test Method 1000hours at +150 deg C Set for 24hours at room temperature, then measured. Murata Specification / Deviation Meet Table A after testing. Table A Appearance Common Mode Impedance (%ΔZc) No damage within ±15% Insulation Resistance (I.R.) 4 Temperature Cycling 5 Destructive Physical Analysis 7 Biased Humidity 8 Operational Life 9 External Visual 10 Physical Dimension 1000cycles -55 deg C to +150 deg C Set for 24hours at room temperature, then measured. Per EIA469 No electrical tests 14 Vibration 15 Resistance to Soldering Heat Meet Table A after testing. Not Applicable 1000hours at 85 deg C, 85%RH Meet Table A after testing. Apply rated voltage. Apply max rated voltage and current. Apply 150 deg C 1000hours Set for 24hours at room temperature, then measured. Visual inspection Meet ITEM 4 （Style and Dimensions） 12 Resistance to Solvents Per MIL-STD-202 Method 215 13 Mechanical Shock Meet item 3 (ref.item 9.2) Meet Table A after testing. Apply rated current. (ref.item 9.2) No abnormalities No defects Not Applicable Per MIL-STD-202 Method 213 Meet Table A after testing. Condition F: 1500g’s(14.7N)/0.5ms/ Half sine 5g's(0.049N) for 20 minutes, Meet Table A after testing. 12cycles each of 3 oritentations Test from 10-2000Hz. 12cycles each of 3 orientations Pre-heating：150 to 180C / 90±30s Meet Table A after testing. 17 ESD No-heating Solder temperature 260C+/-5 deg C Immersion time 10s Per AEC-Q200-002 18 Solderbility Per J-STD-002 Method b : Not Applicable 90% of the terminations is to be soldered. (except partly-exposed wire) Flux:Ethanol solution of rosin,25(wt)% includes activator equivalent to 0.06 to 0.10(wt)% chlorine 19 Electrical Characterization 20 Flammability 21 Board Flex Measured : Impedance No defects. Per UL-94 Not Applicable Meet Table A after testing. 22 Terminal Strength 30 Electrical Transient Conduction Meet Table A after testing. ESD Rank: Refer to Item 3. Rating. Epoxy-PCB(1.6mm) Deflection 2mm(min) 60 sec minimum holding time Per AEC-Q200-006 A force of 17.7N for 60sec Per ISO-7637-2 No defects Not Applicable MURATA MFG.CO.,LTD Spec No. :JEFL243B-9102J-01 Reference Only 9. Measuring Terminal (When measuring and suppling the voltage, the following terminal is applied.) No. Item 9.1 Common Mode Impedance(Zc) 9.2 Withstand voltage Insulation Resistance (I.R.) Humidity life Operational Life 9.3 Measuring terminal Terminal Terminal Terminal Terminal Terminal Terminal Terminal Terminal DC Resistance (Rdc) 10. Measuring method for common mode impedance. Measured common mode impedance may be included measurement error due to stray capacitance, residual inductance of test fixture. To correct this error, the common mode impedance should be calculate as follows; (1) Measure admittance of the fixture(opened), Go Bo. (2) Measure impedance of the fixture(shorted), Rs Xs. (3) Measure admittance of the specimen, Gm Bm. (4) Calculate corrected impedance Z using the formula below. Z = (Rx2+Xx2) 1/2 Where Gm - Go － Rs Rx = (Gm-Go)２ + (Bm-Bo)２ Xx = - (Bm - Bo) － Xs (Gm-Go)２ + (Bm-Bo)２ 11. P.C.B., Flux, Solder and Soldering condition Test shall be done using P.C.B., Flux, Solder and Soldering condition which are specified in item 15 except the case of being specified special condition. 12. Common Mode Impedance (Zc) frequency characteristics (typical) MURATA MFG.CO.,LTD P4/10 Reference Only Spec No. :JEFL243B-9102J-01 P5/10 13. Specification of Packaging 13.1 Appearance and Dimensions (12mm-wide,Plastic tape) . 4.0±0.1 2.0±0.05 φ1.5+0.1/-0 1.75±0.1 0.4±0.05 5.5±0.05 *Dimension of the Cavity is measured 6.5±0.1 at the bottom side. 12.0±0.2 5.35±0.1 8.0±0.1 Direction of feed 5.1±0.1 φ1.5±0.1 (in:mm) 13.2 Specification of Taping (1) Packing quantity (Standard quantity) Φ180 mm reel: 300pcs. / reel (2) Packing Method Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape. (3) Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point The cover tape has no spliced point. (5) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 13.3 Pull Strength of Cover Tape Plastic Tape Cover Tape 5 N min. 10 N min. 165 to 180 degree 13.4 Peeling off force of Cover Tape F Cover tape 0.2N to 0.7N (minimum value is typical.) Speed of Peeling off: 300 mm / min Plastic tape 13.5 Dimensions of Leader-tape, Trailer and Reel 【Packaging code：L（Φ180mm reel）】 2.0±0.5 Trailer 160 min. Leader 210 min. 190 min. Empty Tape Cover tape Label φ 13.0±0.2 φ 60± 1 0 φ 21.0±0.8 13± 1 0 17±1.4 Direction of feed 0 φ 180± 3 (in mm) MURATA MFG.CO.,LTD Reference Only Spec No. :JEFL243B-9102J-01 13.6 Marking for reel P6/10 Customer part number, MURATA part number, Inspection number(*1), RoHS Marking(*2), Quantity, etc *1) < Expression of Inspection No. > □□ ○○○○ ◇◇◇ ① ② ③ ① Factory code ② Date First digit：year／Last digit of year Second digit：Month／Jan. to Sep.→1 to 9，Oct. to Dec.→O,N,D Third, Fourth digit：Day ③ Serial No. *2) < Expression of RoHS Marking > ROHS – Y (△) ① ② ① RoHS regulation conformity parts ② MURATA classification number 13.7 Marking for Outside package Customer name, Purchasing Order Number, Customer Part Number, MURATA part number, RoHS Marking (*2), Quantity, etc 13.8 Specification of Outer Case Standard Reel Quantity in Reel Outer case W D H (Reel) Φ180mm 186 186 93 5 *Above Outer Case size is typical. It depends on a quantity of an order. Outer case Dimensions (mm) Label H D W 14.△ ! Caution 14.1 Mounting Direction Mount products in right direction. Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also flames or other serious trouble. Ｚ 14.2 Limitation of Applications right direction Ｚ wrong direction Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3)Undersea equipment (4)Power plant control equipment (5) Medical equipment (6) Transportation equipment (trains, ships, etc.) (7) Traffic signal equipment (8) Disaster prevention / crime prevention equipment (9) Data-processing equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 14.3 Caution(Rating) Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and short/open circuit of the product or falling off the product may be occurred. 14.4 Fail Safe Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage that may be caused by the abnormal function or the failure of our products. 14.5 Attention regarding product's heat generation Please pay special attention to the product’s heat generation such as beyond Operating Temperature range, mounting product in close proximity to other products that radiate heat and beyond the rated current. 15. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 15.1 Flux and Solder Flux Solder Use rosin-based flux. (with Halogen content exceeding 0.2(wt)% conversion to chlorine). Do not use water-soluble flux. Use Sn-3.0Ag-0.5Cu solder MURATA MFG.CO.,LTD Reference Only Spec No. :JEFL243B-9102J-01 P7/10 15.2 Notes for Assembling When installing by the flow soldering, the degradation of the insulation resistance sometimes occurs. Products can only be soldered with reflow. The use in flow soldering is reserved. 15.3 Cleaning Conditions Do not clean after soldering. 15.4 Attention Regarding P.C.B. Bending The following shall be considered when designing P.C.B.'s and laying out products. (1) P .C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. 〔 Products Direction〕 a Products shall be located in the sideways direction (Length:a D *1 A > B C B D Slit Length:a< b a *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended Portion of Perforation 15.5 Attention Regarding P.C.B. Design < The Arrangement of Products > P.C.B. shall be designed so that products are far from the portion of perforation. The portion of perforation shall be designed as narrow as possible, and shall be designed so as not to be applied the stress in the case of P.C.B. separation. Products shall not be arranged on the line of a series of holes when there are big holes in P.C.B. (Because the stress concentrates on the line of holes.) × P.C.B. ○ ○ Portion of Perforation P.C.B. Product × ○ × Product Hole MURATA MFG.CO.,LTD Reference Only Spec No. :JEFL243B-9102J-01 P8/10 < At 2nd reflow soldering process > At 2nd reflow soldering process, the product mounted on PCB might be dropped off due to its weight. Please take care for preventing the dropping off. Under surface < Products Placing > Support pins shall be set under P.C.B to prevent causing a warp to P.C.B. during placing the products on the otherside of P.C.B. Pick- up nozzle Product < P.C.B. Separation > P.C.B. P.C.B. shall not be separated with hand. P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending. Support pin 15.6 Standard Land Dimensions 2.4 4.6 Res is t C opper foil p attern N o Pattern 2.4 7.0 (in m m) 15.7 Standard Soldering Condition 1.Reflow Soldering (1) Soldering conditions • Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. (2) Soldering Conditions Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. ・Soldering Profile for Lead Free solder (Sn-3.0Ag-0.5Cu solder ) Temp. (°C) 260°C 245±3° 220°C 240°C Limit Profile 180°C 150°C Standard Profile 30~60s 30s 90±30s Pre-heating Heating Peak temperature Cycle of reflow Time(s) Standard Profile Limit Profile 150°C ~ 180°C , 90s ± 30s above 220°C , 30s ~ 60s above 240°C , 30s max. 245°C ± 3°C 260°C , 10s 2 times 2 times MURATA MFG.CO.,LTD Spec No. :JEFL243B-9102J-01 Reference Only P9/10 2. Solder paste printing for reflow soldering · Standard thickness of solder paste should be 150 μm. Incidentally, depending on the reflow condition and the way of heat conduction, the solder would not wet up the terminal, being possible to lead to not enough connection between terminals and lands on the circuit board / open circuit in the circuit board. In case of use, always evaluate this part in your products with actual use condition. · For the solder paste printing pattern, use standard land dimensions. · For the resist and copper foil pattern, use standard land dimensions. · Use Sn-3.0Ag-0.5Cu solder 3. Reworking with Soldering iron · The following conditions shall be strictly followed when using a soldering iron. · Pre-heating: 150°C, 1 min · Soldering iron output: 30W max. · Tip temperature: 350°C max. · Tip diameter:φ3mm max. · Soldering time : 3(+1,-0) seconds. · Times : 2times max. Notes: Do not touch the products directly with the soldering iron. 4. Solder Volume Solder shall be used not to be exceeded the upper limits as shown below. Upper 上 限 limit Recommendable 最適 T ｔ 1t/≦3TT≦ t≦T (T: 電of 1/3T≦ (T:Thickness 極electrode) 厚 み) Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. In case if the solder volume is much, we recommend to make the size of the solder paste with less than the land pattern. 15.8 Caution for use Stainless steel Tweezers ･When you hold products with a tweezer, please hold like a figure of the right side, and sharp material, such as a pair of tweezers, shall not be touched to the Electrode. ･Mechanical shock should not be applied to the products mounted on the board to prevent the damage to electrode. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 15.9 Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance and/or corrosion of Inner Electrode may result from the use. (1) In the corrodible atmosphere (acidic gas, alkaline gas, chlorine, sulfur gas, organic gas and etc.) (2) In the atmosphere where liquid such as organic solvent, may splash on the products. (3) In the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. (4) In the atmosphere where the product is covered with dust or is subjected to salty breeze. MURATA MFG.CO.,LTD Spec No. :JEFL243B-9102J-01 Reference Only P10/10 15.10 Storage Conditions (1)Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2)Storage conditions • Products should be stored in the warehouse on the following conditions. Temperature: -10°C to 40°C Humidity: 15% to 85% relative humidity No rapid change on temperature and humidity • Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. • Avoid storing the product by itself bare (i.e.exposed directly to air). (3)Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 16. △Note ! (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO.,LTD