A BRAND OF AKOUSTIS
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SF1186B-2
Designed for Front-end GPS Applications
Low Insertion Loss
3.0 x 3.0 x 1.3 mm Surface-mount Case
No Matching Network Required
Complies with Directive 2002/95/EC (RoHS)
Moisture Sensitivity Level: 1
AEC-Q200 Qualified
1575.42 MHz
SAW Filter
Maximum Ratings
Rating
Symbol
Maximum Input Signal Level
DC Voltage on any Non-ground Terminal
WVdc
Value
Units
+10
dBm
4
Volts
-45 to +125
°C
TSTG
-40 to +105
°C
Lead Soldering Temperature for 10 Seconds
TWAVE
260
°C
Peak Reflow Solder Temp for 40 Seconds
TReflow
235
°C
Operable Temperature Range
Storage Temperature Range
Suitable for Lead-free Soldering - Max Soldering Temperature
SM3030-6
260°C for 30 s
Electrical Characteristics
Characteristic
Center Frequency
1 dB Bandwidth
Passband Amplitude Ripple, fO ±2.0 MHz
Passband Group Delay
Passband Group Delay Ripple, fO ±2.0 MHz
Passband VSWR, fO ±2.0 MHz
Insertion Loss
Attenuation Referenced to 0 dB:
850 MHz
1500 MHz
1535.42 MHz
1615.42 MHz
1640 MHz
1700 MHz
Temperature Coefficient
Operating Temperature
Single-ended Input /Output Impedance Match
Case Style
Lid Symbolization
y=year, ww=week, s=shift
Standard Reel Quantity
Reel Size 7 Inch
Reel Size 13 Inch
Sym
fO
BW1
TA
Notes
Min
2.046
Typ
1575.42
15.3
0.1
27
1
1.4
2.68
Max
Units
MHz
MHz
dBP-P
ns
nsP-P
1.0
2.0
3.5
dB
45
51.2
40
52.7
20
38.9
20
58.8
45
59.1
50
56.7
-30
-40
+85
No matching network required for operation at 50 ohms
SM3030-6 3 x 3 mm Nominal Footprint
468 YWWS
500 Pieces/Reel
3000 Pieces/Reel
dB
ppm/°C
°C
Electrical Connections
Pin #
Description
Pin #
Description
1
Ground
4
Ground
2
Input
5
Output
3
Ground
6
Ground
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
NOTES:
1. The design, manufacturing process, and specifications of this device are subject to change.
2. US or International patents may apply.
3. RoHS compliant from the first date of manufacture.
© 2014 by RFM Integrated Device, Inc.
SF1186B-2 (R) 07/20/2022
Page 1 of 8
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Transfer function :
(1) S21 response (span : 300 MHz)
(2) S21 response (span : 3 GHz)
© 2014 by RFM Integrated Device, Inc.
SF1186B-2 (R) 07/20/2022
Page 2 of 8
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Reflection Functions:
S11
S22
© 2014 by RFM Integrated Device, Inc.
SF1186B-2 (R) 07/20/2022
Page 3 of 8
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Reflection Functions:
© 2014 by RFM Integrated Device, Inc.
SF1186B-2 (R) 07/20/2022
Page 4 of 8
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Group Delay:
28 Oct 2010 10:49:43
CH1
S2 1
DEL
1 0 n s/
3 : 42 2 . 72
REF 0 s
ps
-4 . 0 00
00 0
MHz
SF1 186B-2
GDD
CH1
Sm o
Marke rs
REF=2
m ea n
: 27 . 0 16
ns
s . de v
: 24 0 . 27
ps
: 869
ps
C
p-p
. 03
3
1
2
Full
CENTER
© 2014 by RFM Integrated Device, Inc.
SF1186B-2 (R) 07/20/2022
1 57 5 . 8 30
00 0
MHz
SP AN
Page 5 of 8
40 . 00 0
000
M Hz
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SM3030-6 Case
6-Terminal Ceramic Surface-Mount Case
3.0 X 3.0 mm Nominal Footprint
Case and PCB Footprint Dimensions
Dimension
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
K
L
N
K
N
mm
Nom
3.00
3.00
1.25
0.90
2.80
1.60
0.85
1.50
0.60
1.30
3.20
1.70
1.05
0.81
0.38
Min
2.87
2.87
1.12
0.77
2.67
1.47
0.72
1.37
0.47
1.17
Max
3.13
3.13
1.38
1.03
2.93
1.73
0.98
1.63
0.73
1.43
Inches
Nom
0.118
0.118
0.049
0.035
0.110
0.063
0.033
0.059
0.024
0.051
0.126
0.067
0.041
0.032
0.015
Min
0.113
0.113
0.044
0.030
0.105
0.058
0.028
0.054
0.019
0.046
Max
0.123
0.123
0.054
0.040
0.115
0.068
0.038
0.064
0.029
0.056
Case Materials
O
Materials
N
M
M
PCB Footprint Top View
Solder Pad
Plating
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
Lid Plating
2.0 to 3.0 µm Nickel
Body
Al2O3 Ceramic
TOP VIEW
BOTTOM VIEW
B
6
1
468
YWWS
A 2
G
C
3
5
E
4
D
© 2014 by RFM Integrated Device, Inc.
SF1186B-2 (R) 07/20/2022
Page 6 of 8
F
H
6
1
5
2
4
3
I
J
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Tape and Reel Specifications
Inches
7
13
"B" REF.
100 REF.
Tape and Reel Standard per ANSI/EIA-481
“B”
millimeters
178
330
Quantity Per Reel
500
3000
See Detail "A"
13.
0
12.0
20
.2
2.0
COMPONENT ORIENTATION
2.0
4.0
A
1.5
PIN #1
1.75
0.3
3.35
B
12.0
5.5
RO.3
(MAX.)
B
3.35
8.0
A
1.4
R0.5
(TYP.)
1.5
SECTION A-A
SECTION B-B
© 2014 by RFM Integrated Device, Inc.
SF1186B-2 (R) 07/20/2022
Page 7 of 8
USER DIRECTION OF FEED
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© 2014 by RFM Integrated Device, Inc.
SF1186B-2 (R) 07/20/2022
Page 8 of 8
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