Only Reflow Soldering
Chip Monolithic Ceramic Capacitor on Interposer for General
ZRB15XR61A475KE01_ (0402, X5R:EIA, 4.7uF, DC10V)
_: packaging code
Reference Sheet
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor on Interposer used for General Electronic equipment.
This product is applied for Only Reflow Soldering.
2.MURATA Part NO. System
(Ex.)
ZRB
15
X
(2)T
Dimensions
(1)L/W
Dimensions
R6
1A
475
(4)Rated
(3)Temperature
Characteristics
(5)Nominal
Capacitance
Voltage
K
(6)Capacitance
Tolerance
E01
(7)Murata’s Control
Code
3. Type & Dimensions
(1)-1 L
(1)-2 W
(2) T
e
1.0±0.15
0.5±0.15
0.65±0.15
0.1 to 0.4
(Unit:mm)
g
0.3 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X5R(EIA)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
-15 to 15 %
-55 to 85 °C
(25 °C)
(4)
Rated
Voltage
DC 10 V
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
4.7 uF
±10 %
Specifications and Test
Methods
(Operating
Temp. Range)
-55 to 85 °C
5.Package
mark
D
J
(8) Packaging
f180mm Reel
PAPER W8P2
f330mm Reel
PAPER W8P2
Packaging Unit
8000 pcs./Reel
30000 pcs./Reel
Product specifications in this catalog are as of Jun.8,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
ZRB15XR61A475KE01-01
1
D
(8)Packaging Code
■SPECIFICATIONS AND TEST METHODS
No
Item
1 Operating
Temperature Range
Specification
Test Method
R6 : -55°C to 85°C
R7 : -55°C to 125°C
C8 : -55°C to 105°C
D7 : -55°C to 125°C
Standard Temperature : 25°C
2 Rated Voltage
See the previous pages.
3 Appearance
No defects or abnormalities.
The rated voltage is defined as the maximum voltage which may be
applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated voltage range.
Visual inspection.
4 Dimension
Within the specified dimensions.
Using calipers.
5 Dielectric Strength
No defects or abnormalities.
6 Insulation
Resistance
More than 50Ω ∙ F
7 Capacitance
Within the specified tolerance.
No failure should be observed when 250% of the rated voltage is
applied between the terminations for 1 to 5 seconds, provided the
charge/discharge current is less than 50mA.
The insulation resistance should be measured with a DC voltage not
exceeding the rated voltage at Standard Temperature and 75%RH max.
and within 1 minutes of charging, provided the charge/discharge current
is less than 50mA.
The capacitance / D.F. should be measured at Standard Temperature
at the frequency and voltage shown in the table.
8 Dissipation Factor
(D.F.)
R6,R7,C8,D7 : 0.1 max.
Capacitance
C≦10μF
(10V min.)
C≦10μF
(6.3V max.)
C>10μF
Frequency
Voltage
1±0.1kHz
1.0±0.2Vrms
1±0.1kHz
0.5±0.1Vrms
120±24Hz
0.5±0.1Vrms
【7.Capacitance】
Perform a heat treatment at 150+0/-10℃ for one hour and then set for
24±2 hour at room temperature. Perform the initial measurement.
9 Capacitance
No bias
Temperature
Characteristics
To apply the test voltge through the Interposer board termination.
The capacitance change should be measured after 5min. at each
specified temp. stage.
In case of applying voltage, the capacitance change should be
measured after 1 more min. with applying voltage in equilibration
of each temp. stage.
R6 : Within ±15%
(-55°C to +85°C)
R7 : Withn ±15%
(-55°C to +125°C)
C8 : Within ±22%
(-55°C to +105°C)
D7 : Within +22%,-33% (-55°C to +125°C)
· Measurement Voltage
ZRB15X R6 1A 475 only : 0.10±0.03Vrms
Test Conditions
Step
Temperature(C)
1
25+/-2(for R6,R7,C8,D7)
2
-55+/-3(for R6,R7,C8,D7)
3
25+/-2(for R6,R7,C8,D7)
4
85+/-3(for R6)
125±3(forR7,D7)
105±3(for C8)
Applying
voltage(V)
No bias
To apply the test voltge through the Interposer board termination.
10 Adhesive Strength of
Termination
JEMCGS-04493
No removal of the terminations or other defect should occur.
2
· Initial measurement
Perform a heat treatment at 150+0/-10°C for one hour and then set
at room temperature for 24±2 hours.
Perform the initial measurement.
Solder the capacitor on the test jig (glass epoxy board) shown in Fig.3
using an eutectic solder.
Then apply 5N force in parallel with the test jig for 10+/-1sec.
The soldering should be done either with an iron or using the reflow
method and should be conducted with care so that the soldering
is uniform and free of defects such as heat shock.
■SPECIFICATIONS AND TEST METHODS
No
Item
11 Vibration
Appearance
Resistance
Capacitance
12 Deflection
Specification
No defects or abnormalities.
Test Method
Solder the capacitor on the test jig (glass epoxy board) shown in Fig.3
using an eutectic solder.
The capacitor should be subjected to a simple harmonic motion having
a total amplitude of 1.5mm, the frequency being varied uniformly between
the approximate limits of 10 and 55Hz.
The frequency range, from 10 to 55Hz and return to 10Hz, should be traversed
in approximately 1 minute. This motion should be applied for a period of
2 hours in each 3 mutually perpendicular directions(total of 6 hours).
Solder the capacitor on the test jig (glass epoxy board) shown in Fig.1
using an eutectic solder.
Then apply a force in the direction shown in Fig 2 for 5±1 sec.
The soldering should be done by the reflow method and should be conducted
with care so that the soldering is uniform and free of defects such as heat
shock.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and rosin
(JIS-K-5902) (25% rosin in weight proportion) .
Preheat at 80 to 120℃ for 10 to 30 seconds.
After preheating, immerse in an eutectic solder solution for 2±0.5 seconds
at 230±5℃ or Sn-3.0Ag-0.5Cu solder solution for 2±0.5 seconds at 245±5℃.
Test Conditions : Reflow method
Solder : Sn-3.0Ag-0.5 Cu solder
Within the specified tolerance.
D.F.
R6,R7,C8,D7 : 0.1 max.
Appearance
No defects or abnormalities.
Capacitance
Change
Within ±10%
13 Solderability
of Termination
75% of the terminations is to be soldered evenly
and continuously.
14 Resistance to
Appearance
No defects or abnormalities.
Capacitance
Change
R6,R7,C8,D7 : Within ±7.5%
D.F.
R6,R7,C8,D7 : 0.1 max.
Soldering Heat
Solder Temperature : 255°C ±10°C[Peak Temperature]
Heat Time of over 200°C : 120s min
Exposure to room temperature : 24±2h
Pre-heat : Following conditions
Table1
Temperature
150C to 160C
More than 50Ω ∙ F
Dielectric
No defects.
· Initial measurement
Perform a heat treatment at 150+0/-10°C for one hour and then set at room
temperature for 24±2 hours.
Perform the initial measurement.
Appearance
No defects or abnormalities.
Capacitance
Change
R6,R7,C8,D7 : Within ±7.5%
Solder the capacitor on the test jig (glass epoxy board) shown in Fig.3
using an eutectic solder.
Perform the five cycles according to the four heat treatments
shown in the following table.
Set for 24±2 hours at room temperature, then measure.
D.F.
R6,R7,C8,D7 : 0.1 max.
Strength
15 Temperature
Sudden
Change
I.R.
More than 50Ω ∙ F
Dielectric
No defects.
Temperature
High
Humidity
(Steady)
17 Durability
Appearance
No defects or abnormalities.
Capacitance
Change
R6,R7,C8,D7 : Within ±12.5%
D.F.
R6,R7,C8,D7 : 0.2max.
I.R.
More than 6Ω ∙ F
Appearance
No defects or abnormalities.
Capacitance
Change
R6,R7,C8,D7 : Within ±12.5%
D.F.
R6,R7,C8,D7 : 0.2max.
I.R.
More than 25Ω ∙ F
JEMCGS-04493
Step
Temp.(C)
1
Min. Operating Temp.+0/-3
Time (min)
30±3
2
Room Temp
2 to 3
3
Max.Operating Temp.+3/-0
30±3
4
Room Temp
2 to 3
・Initial measurement
Perform a heat treatment at 150+0/-10°C for one hour and then let sit
for 24±2 hours at room temperature. Perform the initial measurement.
・GRM188B30J106M Measurement after test:
Perform a heat treatment and then let sit for 24±2 hours at room
temperature, then measure.
Solder the capacitor on the test jig (glass epoxy board) shown in Fig.3
using an eutectic solder.
Apply the rated voltage at 40±2℃ and 90 to 95% humidity for 500±12 hours.
The charge/discharge current is less than 50mA.
・Initial measurement
Perform a heat treatment at 150+0/-10°C for one hour and then let sit
for 24±2 hours at room temperature. Perform the initial measurement.
・Measurement after test
Perform a heat treatment and then let sit for 24±2 hours at room
temperature, then measure.
Solder the capacitor on the test jig (glass epoxy board) shown in Fig.3
using an eutectic solder.
Apply 100% of the rated voltage for 1000±12 hours at the maximum
operating temperature ±3℃. The charge/ discharge current is less than 50mA.
・Initial measurement
Perform a heat treatment at 150+0/-10°C for one hour and then let sit
for 24±2 hours at room temperature. Perform the initial measurement.
・Measurement after test
Perform a heat treatment and then let sit for 24±2 hours at room
temperature, then measure.
Strength
16 High
Time
2 min.
I.R.
3
■SPECIFICATIONS AND TEST METHODS
Recommended derating conditions on voltage and temperature
These Part Numbers are designed for use in the circuits where
continuous applied voltage to the capacitor is derated than rated
voltage, and guarantee Durability Test with 100% × rated voltage
as testing voltage at the maximum operating temperature.
The voltage and temperature derating conditions on the left are
recommended for use to ensure the same reliability level as
normal specification.
Useful Lifetime for mobile application specific MLCC
100
Usuful Lifetime [Year]
at rated voltage x 80%
These MLCC products are designed for use in devices with a typical lifetime of less than 5 years.
(Examples: Cellular phone, Smartphone, Tablet PC, Digital camera, Watch, Electronics dictionary,
Small-scale server, IPC-9592B class1 equipment, etc.)
These MLCC products are designed so that the useful lifetime can be extended longer than 5 years
under the following conditions:
「80% of the rated voltage or less, Maximum operating temperature -20 degree C or less」
Extended useful lifetime, under specific operating conditions, can be estimated from
the chart on the left.
10
1
85℃ Type
105℃ Type
0.1
40
50
60
70
80
※The useful lifetime is the time when cumulative failure rate becomes 1%.
※Please note that the useful lifetime data is for reference only and not guaranteed.
90 100 110 120 130
Product Temperture [℃]
JEMCGS-04493
4
■SPECIFICATIONS AND TEST METHODS
Adhesive Strength of Termination,Vibration Resistance,Resistance to Soldering Heat (Reflow method)
Test method : Deflection
Temperature Sudden Change,High Temperature High Humidity(Steady) ,Durability
・Test substrate
Material
: Copper-clad laminated sheets for PCBs
・Test substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (ZRB15: t:0.8mm)
Thickness : 1.6mm (ZRB15: t:0.8mm)
Copper foil thickness : 0.035mm
Copper foil thickness : 0.035mm
Gray colored part of Fig.1: Solder resist
4.0±0.1
Solder resist
A
B
a
c
Glass epoxy board
0.05以下
100
*2
3.5± 0.05
40
b
*1
8.0±0.3
φ1.5 +0.1
-0
f4.5
c
c
*1,2:2.0±0.05
f4.5
b
ランド
a
b
Land
1.75±0.1
c
(Coat with heat resistant resin for solder)
Baked electrode or
copper foil
t
Fig.1
Type
Dimension (mm)
b
1.5
3.0
a
0.4
1.0
ZRB15
ZRB18
20
Fig.3
(in mm)
50
Type
c
0.5
1.2
ZRB15
ZRB18
Pressurization
speed
1.0mm/s
Pressurize
R230
Flexure:≦1
pport
Capacitance meter
45
45
Fig.2
JEMCGS-04493
(in mm)
5
(in mm)
a
0.4
1.0
Dimension (mm)
b
1.5
3.0
c
0.5
1.2
Package
ZRB Type
1.Tape Carrier Packaging(Packaging Code:D/L/J/K)
1.1 Minimum Quantity(pcs./reel)
Type
ZRB15
ZRB18
X/7
A
6
φ180mm reel
Paper Tape
Plastic Tape
Code:D
Code:L
8000
3000
4000
φ330mm reel
Paper Tape
Plastic Tape
Code:J
Code:K
30000
8000
10000
1.2 Dimensions of Tape
(1)ZRB15
(in:mm)
+0.1
*1
*2
3.5±0.05
φ1.5 -0
1.75±0.1
4.0±0.1
B
A
8.0±0.3
*1,2:2.0±0.05
0.05 max.
t
Type
ZRB15
X
7
Product Dimensions
L
W
T
1.0±0.15
0.5±0.15
0.65±0.15
1.0±0.2
1.0±0.22
0.5±0.2
0.65±0.2
1.0+0.22/-0.2
0.7±0.15
A *3
B *3
t *3
0.8
1.3
0.95
*3 Nominal value
JEMCGP-02345F
6
Package
ZRB Type
(2)ZRB18
4.0±0.1
2.0±0.1
3.5±0.05
φ1.5
+0.1
-0
B
A
0.25±0.1
8.0±0.3
4.0±0.1
1.75±0.1
(in:mm)
t
Type
ZRB18
6
A
Product Dimensions
L
W
T
1.6±0.22
0.6±0.2
0.8±0.2
1.6±0.2
1.0±0.2
A *1
B *1
t
1.1
2.0
1.7 max.
*1 Nominal value
JEMCGP-02345F
7
め状態
(単位:mm)
Package
ZRB Type
(in:mm)
Fig.1
Package Chips
Chip
Fig.2
Dimensions of Reel
φ13±0.5
φ180+0/-3.0
φ330±2.0
φ21±0.8
φ50 min.
2.0±0.5
w1
W
Fig.3
Taping Diagram
ZRB15/18
W
16.5 max.
w1
10±1.5
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
JEMCGP-02345F
8
チップ詰め状態
Package
ZRBType
(単位:mm)
1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
(in:mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min.
(Only
a bottom tape existence )
(単位:
mm)
図1 チップ詰め状態
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1 to 0.6N in the direction as shown below.
165~180°
Top tape
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
JEMCGP-02345F
9
!
Caution
■Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment
⑨Data-processing equipment
⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
■Storage and Operation condition
1. The performance of chip MLCC on Interposer (ZR□ series) may be affected by the storage conditions.
1-1. Store the capacitors in the following conditions:
Room Temperature of +5℃ to +40℃ and a Relative Humidity of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere or high temperature and humidity
conditions during storage may affect solderability and packaging performance.
Therefore, please maintain the storage temperature and humidity. Use the product within six months after receipt ,
as prolonged storage may cause oxidation of the terminations (outer electrodes).
(2) Please confirm solderability before using after six months.
Store the capacitors without opening the original bag.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen
sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes. The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and
carefully confirm the various characteristics in actual use conditions and the actual system.
[Example of Temperature Caracteristics X7R(R7)]
Sample: 0.1μF, Rated Voltage 50VDC
[Example of Temperature Characteristics X5R(R6)]
Sample: 22μF, Rated Voltage 4VDC
20
Capacitance Change (%)
Capacitance Change (%)
20
15
10
5
0
-5
-10
10
5
0
-5
-10
-15
-15
-20
-75
15
-50
-25
0
25
50
75
100
125
150
-20
-75
JEMCGC-02188C
-50
-25
0
25
Temperature ( C)
Temperature ( C)
10
50
75
100
Caution
!
2.Measurement of Capacitance
1. Measure capacitance with the voltage and frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.
Typical Voltage Applied to the DC capacitor
DC Voltage
DC Voltage+AC
E
AC Voltage
E
Pulse Voltage
E
0
E
0
0
0
(E:Maximum possible applied voltage.)
1-2. Influence of over voltage
Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown
of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
4.Type of Applied Voltage and Self-heating Temperature
1.Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the
continuous application of an AC voltage or pulse voltage.
When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current
or pulse current will flow into the capacitor; therefore check the self-heating condition.
Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits
of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is
used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.
[Example of Temperature Rise (Heat Generation) in Chip
Monolithic Ceramic Capacitors in Contrast to Ripple Current]
Sample: R(R1) characteristics 10μF, Rated voltage: DC10V
Ripple Current
100
Temperature Rise (℃)
1-1. The load should be contained to the level
such that when measuring at atmospheric
temperature of 25°C, the product's self-heating
remains below 20°C and the surface
temperature of the capacitor in the actual circuit
remains within the maximum operating
temperature.
10
100kHz
500kHz
1MHz
1
JEMCGC-02188C
11
0
1
2
4
3
Current (Ar.m.s.)
5
6
!
Caution
5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type
capacitor changes depending on the DC voltage applied.
Please consider the DC voltage characteristics when a
capacitor is selected for use in a DC circuit.
[Example of DC Voltage Characteristics]
Capacitance Change (%)
Sample: R(R1) Characteristics 0.1μF, Rated Voltage 50VDC
1-1. The capacitance of ceramic capacitors may change
sharply depending on the applied voltage. (See figure)
Please confirm the following in order to secure the
capacitance.
(1) Determine whether the capacitance change caused
by the applied voltage is within the allowed range .
(2) In the DC voltage characteristics, the rate of
capacitance change becomes larger as voltage
increases, even if the applied voltage is below
the rated voltage. When a high dielectric constant
type capacitor is used in a circuit that requires a
tight (narrow) capacitance tolerance (e.g., a time
constant circuit), please carefully consider the
voltage characteristics, and confirm the various
characteristics in the actual operating conditions
of the system.
20
0
-20
-40
-60
-80
-100
0
10
20
30
DC Voltage (V)
40
50
[Example of AC Voltage Characteristics]
Capacitance Change (%)
Sample: X7R(R7) Characteristics 10μF, Rated Voltage 6.3VDC
2. The capacitance values of high dielectric
constant type capacitors changes depending
on the AC voltage applied.
Please consider the AC voltage characteristics
when selecting a capacitor to be used in a
AC circuit.
30
20
10
0
-10
-20
-30
-40
-50
-60
0
0.5
1
1.5
2
AC Voltage (Vr.m.s.)
6. Capacitance Aging
[ Example of Change Over Time (Aging characteristics) ]
1. The high dielectric constant type capacitors
have an Aging characteristic in which the capacitance
value decreases with the passage of time.
When you use a high dielectric constant type
capacitors in a circuit that needs a tight (narrow)
capacitance tolerance (e.g., a time-constant circuit),
please carefully consider the characteristics
of these capacitors, such as their aging, voltage,
and temperature characteristics. In addition,
check capacitors using your actual appliances
at the intended environment and operating conditions.
Capacitance Change(%)
20
10
0
-10
C0G(5C)
-20
X7R(R7)
-30
X5R(R6)
-40
10
100
1000
Time(h)
7.Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to being dropped may cause damage or
a crack in the dielectric material of the capacitor.
Do not use a dropped capacitor because the quality and reliability
may be deteriorated.
3. When printed circuit boards are piled up or handled, the corner
of another printed circuit board
should not be allowed to hit the capacitor in order to avoid
a crack or other damage to the capacitor.
JEMCGC-02188C
12
Crack
Floor
Mounting printed circuit board
Crack
10000
!
Caution
■Soldering and Mounting
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing
or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
[Component Direction]
①
Locate chip horizontal to the
direction in which stress acts.
(Bad Example)
1A
(Good Example)
[Chip Mounting Close to Board Separation Point]
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
Stress Level
A > D *1
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from the board separation surface.
A > C
Perforation
①
C
B
D
A
1A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
③②
[Mounting Capacitors Near Screw Holes]
When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.
Screw Hole
Recommended
2.Information before Mounting
1. Do not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the solderability of capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
JEMCGC-02188C
13
1C 1B
!
Caution
3.Maintenance of the Mounting (pick and place) Machine
1. To adjust the inspection tolerance for automated appearance sorting machine of mounting position,
because ZR□ series are easier to shift the mounting position than standard MLCC.
2. To check the overturn and reverse of ZR□ series.
3. To control mounting speed carefully, because ZR□ series is heavier than standard MLCC.
4. Make sure that the following excessive forces are not applied to the capacitors.
4-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept
to a minimum to prevent them from any damage or cracking. Please take into account the following precautions
and recommendations for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.
[Incorrect]
Suction Nozzle
Deflection
Board
Board Guide
[Correct]
Support Pin
2.Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent
the nozzle from moving smoothly. This imposes greater force upon the chip during mounting,
causing cracked chips. Also, the locating claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
JEMCGC-02188C
14
!
Caution
4-1.Reflow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
[Standard Conditions for Reflow Soldering]
Temperature(℃)
Soldering
Peak Temperature
220℃
Gradual
Cooling
ΔT
190℃
170℃
150℃
Preheating
2. Solderability of tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of
tin is used. Please confirm the solderability of tin plated
termination chips before use.
Table 1
Series
Chip Dimension(L/W) Code
Temperature Differential
15/18
ΔT≦190℃
ZRB
280
270
260
250
240
230
220
0
30
60
90
120
Soldering Time(s)
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Recommended Conditions
Lead Free Solder
Peak Temperature
Atmosphere
240 to 260℃
Air or N2
Lead Free Solder: Sn-3.0Ag-0.5Cu
4-2.Flow Soldering
1. ZR□ series is not apply flow soldering.
4-3.Correction of Soldered Portion
Do not correct with a soldering iron for ZR□ series.
Correction with a soldering iron for ZR□ series may cause loss suppress acoustic noise,
because the solder amount become excessive.
JEMCGC-02188C
Time
30-60 seconds
[Allowable Reflow Soldering Temperature and Time]
Soldering Temperature(℃)
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
shown in the table 1.
60-120 seconds
15
!
Caution
5.Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips
or broken solder joints. Take note not to vibrate PCBs.
6.Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder
joints. Provide support pins on the back side of the PCB to prevent warping or flexing.
Install support pins as close to the test-probe as possible.
1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board.
[Not Recommended]
[Recommended]
Support Pin
Peeling
Test-probe
Test-probe
7.Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that
caused bending or twisting the board.
1-1. In cropping the board, the stress as shown may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.
①
[Bending]
[Twisting]
1A
2. Check the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disc separator, router
type separator, etc.) to prevent the mechanical stress that can occur to the board.
Board Separation Method
Level of stress on board
Recommended
Notes
Hand Separation
Nipper Separation
High
×
Hand and nipper
separation apply a high
level of stress.
Use another method.
(1) Board Separation Jig
Medium
△*
Board Separation Apparatus
2) Disc Separator
3) Router Type Separator
Medium
Low
△*
◯
· Board handling
· Board handling
· Layout of slits
· Board bending direction · Design of V groove
· Layout of capacitors
· Arrangement of blades
· Controlling blade life
Board handling
* When a board separation jig or disc separator is used, if the following precautions are not observed,
a large board deflection stress will occur and the capacitors may crack.
Use router type separator if at all possible.
JEMCGC-02188C
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!
Caution
(1) Example of a suitable jig
[In the case of Single-side Mounting]
An outline of the board separation jig is shown as follows.
Recommended example: Stress on the component mounting position can be minimized by holding the
portion close to the jig, and bend in the direction towards the side where the capacitors are mounted.
Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress
being applied to the component mounting position, if the portion away from the jig is held and bent in the
direction opposite the side where the capacitors are mounted.
[Outline of jig]
[Hand Separation]
Recommended
Not recommended
Direction of load
Printed Circuit Board
V-groove
Printed circuit
board
Direction of
load
Load point
Component
s
Printed circuit
board
Load point
Board Cropping Jig
Components
[In the case of Double-sided Mounting]
Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the
above method. Therefore, implement the following measures to prevent stress from being applied to the components.
(Measures)
(1) Consider introducing a router type separator.
If it is difficult to introduce a router type separator, implement the following measures.
(Refer to item 1. Mounting Position)
(2) Mount the components parallel to the board separation surface.
(3) When mounting components near the board separation point, add slits in the separation position
near the component.
(4) Keep the mounting position of the components away from the board separation point.
(2) Example of a Disc Separator
An outline of a disc separator is shown as follows. As shown in the Principle of Operation, the top
blade and bottom blade are aligned with the V-grooves on the printed circuit board to separate the board.
In the following case, board deflection stress will be applied and cause cracks in the capacitors.
(1) When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom,
left-right or front-rear directions
(2) The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned
top-bottom
IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of the
V groove with consideration about strength of material of the printed circuit board.
[ Outline of Machine ]
[ Principle of Operation ]
[ Cross-section Diagram ]
Top Blade
Printed Circuit Board
Top Blade
V-groove
Bottom Blade
Printed Circuit Board
V-groove
[Disc Separator]
Recommended
Top Blade
Top-bottom Misalignment
Top Blade
Bottom Blade
Not recommended
Left-right Misalignment
Top Blade
Bottom Blade
Front-rear Misalignment
Top Blade
Bottom Blade
Bottom Blade
[V-groove Design]
Example of
Recommended
V-groove Design
JEMCGC-02188C
Left-right Misalignment
Not Recommended
Low-Angle
Depth too Shallow
17
Depth too Deep
!
(3) Example of Router Type Separator
The router type separator performs cutting by a router
rotating at a high speed. Since the board does not
bend in the cutting process, stress on the board can
be suppressed during board separation.
When attaching or removing boards to/from the router type
separator, carefully handle the boards to prevent bending.
[ Outline Drawing ]
Router
8. Assembly
1. Handling
If a board mounted with capacitors is held with one hand, the board may bend.
Firmly hold the edges of the board with both hands when handling.
If a board mounted with capacitors is dropped, cracks may occur in the capacitors.
Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.
2. Attachment of Other Components
2-1. Mounting of Other Components
Pay attention to the following items, when mounting other components on the back side of the board after
capacitors have been mounted on the opposite side.
When the bottom dead point of the suction nozzle is set too low, board deflection stress may be applied
to the capacitors on the back side (bottom side), and cracks may occur in the capacitors.
· After the board is straightened, set the bottom dead point of the nozzle on the upper surface of the board.
· Periodically check and adjust the bottom dead point.
Suction Nozzle
2-2. Inserting Components with Leads into Boards
When inserting components (transformers, IC, etc.) into boards, bending the board may cause cracks in the
capacitors or cracks in the solder. Pay attention to the following.
· Increase the size of the holes to insert the leads, to reduce the stress on the board during insertion.
· Fix the board with support pins or a dedicated jig before insertion.
· Support below the board so that the board does not bend. When using multiple support pins on the board,
periodically confirm that there is no difference in the height of each support pin.
Component with Leads
2-3. Attaching/Removing Sockets
When the board itself is a connector, the board may bend when a socket is attached or removed.
Plan the work so that the board does not bend when a socket is attached or removed.
Socket
2-4. Tightening Screws
The board may be bent, when tightening screws, etc. during the attachment of the board to a shield or
chassis. Pay attention to the following items before performing the work.
· Plan the work to prevent the board from bending.
· Use a torque screwdriver, to prevent over-tightening of the screws.
· The board may bend after mounting by reflow soldering, etc. Please note, as stress may be applied
to the chips by forcibly flattening the board when tightening the screws.
Screwdriver
JEMCGC-02188C
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Caution
!
Caution
■ Others
1. Under Operation of Equipment
1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock.
1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).
Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
1-3. Confirm the environment in which the equipment will operate is under the specified conditions.
Do not use the equipment under the following environments.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to ozone, ultraviolet rays, or radiation.
(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)
(5) Any vibrations or mechanical shocks exceeding the specified limits.
(6) Moisture condensing environments.
1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.
2. Others
2-1. In an Emergency
(1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment.
If the equipment is not turned off or unplugged, the hazards may be worsened by supplying continuous power.
(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be caused
by the capacitor's high temperature.
2-2. Disposal of waste
When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate
licenses.
2-3. Circuit Design
(1) Addition of Fail Safe Function
Capacitors that are cracked by dropping or bending of the board may cause deterioration of the
insulation resistance, and result in a short. If the circuit being used may cause an electrical shock,
smoke or fire when a capacitor is shorted, be sure to install fail-safe functions, such as a fuse,
to prevent secondary accidents.
(2) This series are not safety standard certified products.
2-4. Remarks
Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used.
The above notices are for standard applications and conditions. Contact us when the products are used in special
mounting conditions.
Select optimum conditions for operation as they determine the reliability of the product after assembly.
The data herein are given in typical values, not guaranteed ratings.
JEMCGC-02188C
19
Notice
■ Rating
1.Operating Temperature
1. The operating temperature limit depends on the capacitor.
1-1. Do not apply temperatures exceeding the maximum operating temperature.
It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range.
It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable
factor.
1-2. Consider the self-heating factor of the capacitor
The surface temperature of the capacitor shall not exceed the maximum operating temperature including self-heating.
2.Atmosphere Surroundings (gaseous and liquid)
1. Restriction on the operating environment of capacitors.
1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion
of the terminations and the penetration of moisture into the capacitor.
1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject
to moisture condensation.
1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal
electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents
for long periods of time.
3.Piezo-electric Phenomenon
1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates
at specific frequencies and noise may be generated.
Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur.
JEMCGC-02188C
20
Notice
■Soldering and Mounting
1.PCB Design
1. Notice for Pattern Forms
1-1. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress
on a chip is different depending on PCB material and structure.When the thermal expansion coefficient
greatly differs between the board used for mounting and the chip,it will cause cracking of the chip due to
the thermal expansion and contraction. When capacitors are mounted on a fluorine resin printed circuit
board or on a single-layered glass epoxy board, it may also cause cracking of the chip for the same reason.
2. Land Dimensions
2-1.Please refer to the land dimensions in Table 1 for ZRB series.
(1)Recommended Land Dimensions
ZRB
a
b
c
ZRB
15
1.0×0.5
0.4~0.6
0.4~0.5
0.5~0.7
ZRB
18 *
1.6×0.8
0.7~0.9
0.7~0.8
0.8~1.0
Land
c
Table1 Land Dimensions
Chip Dimension
Series
Chip(L×W)
(L/W) Code
b
(in mm)
a
* If distance between parts is too short, there is risk to cause electrical short.
Please confirm the mounting pitch (distance between centers of parts)
Solder Resist
has 1.275mm or more. (ZRB18 only)
Please confirm the suitable mounting condition by evaluating of the actual SET / PCB.
3. Board Design
When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size
and material of the board.
Relationship with amount of strain to the board thickness, length, width, etc.]
ε=
3PL
2Ewh2
Relationship between load and strain
P
Y
h
ε:Strain on center of board (μst)
L:Distance between supporting points (mm)
w :Board width (mm)
h :Board thickness (mm)
E :Elastic modulus of board (N/m2=Pa)
Y :Deflection (mm)
P :Load (N)
w
L
When the load is constant, the following relationship can be established.
· As the distance between the supporting points (L) increases,the amount of strain also increases.
→Reduce the distance between the supporting points.
· As the elastic modulus (E) decreases, the amount of strain increases.
→Increase the elastic modulus.
· As the board width (w) decreases, the amount of strain increases.
→Increase the width of the board.
· As the board thickness (h) decreases, the amount of strain increases.
→Increase the thickness of the board.
Since the board thickness is squared, the effect on the amount of strain becomes even greater.
JEMCGC-02188C
21
Notice
2.Reflow soldering
The halogen system substance and organic acid are included in solder paste, and a chip corrodes
by this kind of solder paste.
Do not use strong acid flux.
Do not use water-soluble flux.*
(*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type flux.)
3.Washing
1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality,
and select the solvent for cleaning.
2. Unsuitable cleaning solvent may leave residual flux or other foreign substances, causing deterioration of
electrical characteristics and the reliability of the capacitors.
3. Select the proper cleaning conditions.
3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the performance
of the capacitors.
4.Coating
1. Loss suppress acoustic noise may be caused in ZR□ series due to the resin during curing process.
Please contact our sales representative or product engineers on the apply to resin during curing process.
JEMCGC-02188C
22
Notice
■ Others
1.Transportation
1. The performance of a capacitor may be affected by the conditions during transportation.
1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force during transportation.
(1) Climatic condition
・ low air temperature : -40℃
・ change of temperature air/air : -25℃/+25℃
・ low air pressure : 30 kPa
・ change of air pressure : 6 kPa/min.
(2) Mechanical condition
Transportation shall be done in such a way that the boxes are not deformed and forces are not directly passed
on to the inner packaging.
1-2. Do not apply excessive vibration, shock, or pressure to the capacitor.
(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may occur
in the ceramic body of the capacitor.
(2) When the sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the surface
of the capacitor, the capacitor may crack and short-circuit.
1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.
A capacitor dropped accidentally during processing may be damaged.
2.Characteristics Evaluation in the Actual System
1. Evaluate the capacitor in the actual system,to confirm that there is no problem with the performance and specification
values in a finished product before using.
2. Since a voltage dependency and temperature dependency exists in the capacitance of high dielectric type ceramic
capacitors, the capacitance may change depending on the operating conditions in the actual system.
Therefore,be sure to evaluate the various characteristics, such as the leakage current and noise absorptivity,
which will affect the capacitance value of the capacitor.
3. In addition,voltages exceeding the predetermined surge may be applied to the capacitor by the inductance in
the actual system. Evaluate the surge resistance in the actual system as required.
JEMCGC-02188C
23
!
1.Please make sure that your product has been evaluated in view of your specifications with our
product being mounted to your product.
2.Your are requested not to use our product deviating from this product specification.
3.We consider it not appropriate to include any terms and conditions with regard to the business
transaction in the product specifications, drawings or other technical documents. Therefore,
if your technical documents as above include such terms and conditions such as warranty clause,
product liability clause, or intellectual property infringement liability clause, they will be deemed to
be invalid.
JEMCGC-02188C
24
NOTE