POG5AN

This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 APPLICATION MANUAL This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 Contents 1. Features of Murata Chip Trimmer Potentiometers 2. Specifications 1. Precautions in Storage 1. Considerations in Design 2. Standard Land Patterns 1. One Side Chip Mounting 2. Both Side Chip Mounting 3. Mixed Mounting of Chip Components and Leaded Components 1. Solder Paste Stenciling 2. Mounting the Product 3. Compatibility with Chip Placers 4. Sensor Level Adjustment 5. Reflow Soldering 6. Adhesive Application and Curing Types and Characteristics of Adhesive 7. Flux Coating Types and Characteristics of Flux 8. Wave Soldering 9. Soldering and Resoldering with a Soldering Iron 10. Cleaning 1. Adjustments 2. Automatic Adjustments 3. Lock Painting Ex.1. Poor Contact Caused by Flux Adhesion Ex.2. Cracking of the Substrate Ex.3. Poor Contact Caused by a Deformed Driver Plate This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 1. Features of Murata Chip Trimmer Potentiometers POZ3 Series POZ3AN (Top adjustment type for reflow soldering) Driver plate Wiper Terminal (2) Resistive element (carbon) Resin substrate Terminal (1) Terminal (3) POZ3KN (Rear adjustment type for reflow soldering) Driver plate Terminal (1) Terminal (2) Wiper Terminal (3) Resistive element (carbon) Resin substrate RVG3 Series RVG3S08 (for reflow soldering) Driver plate Wiper Stopper Stopper Terminal (2) Resistive element (cermet) Terminal (1) Ceramic substrate Terminal (3) This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 RVG3A08 (for flow and reflow soldering) Driver plate Wiper Terminal (2) Resistive element (cermet) Terminal (1) Ceramic substrate Terminal (3) RVG4M Series RVG4M (for flow and reflow soldering) Terminal (2) Driver plate Wiper Rubber Ceramic substrate Terminal (1) Terminal (3) Resistive element (cermet) POG5 Series POG5 (for reflow soldering) Gear Case Terminals(1) and (3) Adjustment screw Terminal (2) Wiper Ceramic substrate Resistive element (cermet) This is the PDF file of catalog No.R82E-2. 82E2.pdf 97.09.29 2. Specifications POZ3 Series Series 08 RV G3 S0 8 08 58 N 3K N 3A N G5 A RVG3 Series RVG4M Series POG5 Series RV RV Resistive element material Terminal layout No. of terminals Adjustment method Cermet Carbon Triangular 3 (divider type) Automatic Manual 1 Soldering Reflow soldering Flow soldering Gold plating(nickel undercoating) Electrode surface treatment Solder plating (nickel undercoating) Solder plating (copper undercoating) 3 mm square 3 3 3 Size 4 mm square 5 mm square 1.50mm 1.85mm Product thickness 2.00mm 2.10mm 3.70mm 5.00mm 0.040g(40mg) Product weight 0.080g(80mg) 0.180g(180mg) Cleaning Necessary 2 Not necessary Lock painting Possible Not possible 250 pcs./reel Taping packaging (reel with a diameter of 180 mm) 500 pcs./reel 1500 pcs./reel 2000 pcs./reel 2500 pcs./reel (2) (3) They can be used as the rheostat type by connecting lands (2) and (3). (2 terminals (rheostat type) (1) 1 (1) 2 Cleaning is needed only when there is an adhesion of foreign matter such as flux on the resistive element. 3 Only terminal (2) is gold-plated with a nickel undercoat. (2) ) RV 3 PO Item PO G5 H G4 M PO Z PO Z G4 M G3 A N This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 1. Precautions in Storage Electrode Surface Treatment Series POZ3 RVG3 RVG4M POG5 Electrode surface treatment Gold plating (nickel undercoating) Terminals (1) & (3): Solder plating (nickel undercoating) Terminal (2) : Gold plating (nickel undercoating) Solder plating (copper undercoating) Storage Environment Storage Method Storage Period This is the PDF file of catalog No.R82E-2. 82E2.pdf 97.09.29 1. Considerations in Design Land Pattern Area Both Side Chip Mounting PCB Layout Through hole 10 mm or more 10 mm or more Other Considerations 10 mm or more 2. Standard Land Patterns POZ3AN 3.1 1.15 2.2 3.0 2. 4 0. 1 0.25 0.1 1.85 0.1 0.1max. 1.1 (2) 1.0 (2) 3. 6 0. 5 0. 1 3. 2 (1) 0.75 1.0 (3) 0.75 (1) (3) 1.0 0.7 1.0 0.3 ( Standard tolerance: mm) in 1. 9 3. 8 1 4 0.1 ( Standard tolerance: mm) in This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 POZ3KN 1.1 Part to be soldered 1.15 2.2 3.0 0. 5 0. 1 2. 4 0. 1 2.1 1.85 0.1 0.25 0.1 5. 4 4. 4 1. 0 3.0 0 1.5 (2) 0.85 0.9 0.85 3.1 (2) (1) 3. 2 (3) 1. 0 3. 0 1.25 0.5 1.25 0.3 ( Standard tolerance:in mm) (3) (1) 0.1 ( Standard tolerance:in mm) RVG3S08 3.0 2.3 0.1 1.0 (2) 2 1.2 3.0 1.5 1.25 4.1 1 1.6 (2) 3. 9 0. 5 0. 1 (1) 1.1 (3) 1.5 0.85 0.9 2. 2 1 Driver plate rotation area Part to be soldered (1) 1. 1 0. 8 (3) 1.1 0.8 1.1 (0.3) 1. 75 0.7 1.1 0.7 0.3 ( Standard tolerance:in mm) 0.1 ( Standard tolerance:in mm) RVG3A08 2.2 1.2 3.0 3.0 2.4 0.1 (2) 1.6 (2) 90 4 1.85 0.1 0.3 0.1 0.7 3. 5 0. 5 0. 1 0. 65 1.5 0.6 (1) #2 (3) 1. 1 1. 75 #1 CLOCKWISE #3 1.1 0.8 1.1 (0.3) 0.3 ( Standard tolerance: mm ) in 0.9 0.1 ( Standard tolerance: mm ) in 2. 2 4. 6 (1) 0.7 1.1 0.7 (3) 0.7 1. 5 4. 6 0.3 0.1 1. 5 6. 0 This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 RVG4M08/58 4.0 (2) 1.5 3.8 2.0 0.2 0.7 2. 7 0. 1 4. 7 1 4 M (2.4) 1.7 (2) 1. 8 0.75 6. 4 (1) (3) 1.1 1.1 1.6 (1) (3) 0.55 0.1 0.35 0.1 Depth 1.7 0.6 (0.3) 2. 4 1. 5 0.85 1.8 0.85 0.3 ( Standard tolerance: mm) in 1. 2 3. 2 0.1 ( Standard tolerance: mm) in POG5ANtype 4. 8 Electric adjustment section Diameter : 1.5 Slot width : 0.6 Slot depth : 0.5 3-1.3 2.4 1.2 2. 6 3. 5 5.0 3-0.8 3-0.9 3-0.7 (2) 0. 5 3-1.6 (1) (3) 2. 9 (2) 3. 9 (3) (1) 2.5 2.5 0.2 0.3 ( Standard tolerance: mm) in 0.1 ( Standard tolerance: mm) in POG5HNtype 3. 7 4.9 1.2 3 -1.3 (2) (1) 0. 5 (3) 2. 6 3-0.7 3-0.8 3-1.6 3-0.9 2. 3 (3) (2) (1) 0.1 ( Standard tolerance: mm) in 0.3 ( Standard tolerance: mm) in 2. 3 Electric adjustment section Diameter : 1.5 Slot width : 0.6 Slot depth : 0.5 4. 8 2.4 4.0 This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 1. One Side Chip Mounting Reflow Soldering System PCB Solder Paste Stenciling Chip Placing Check Reflow Soldering Cleaning Inspection Flow Soldering System PCB Adhesive Application Chip Placing Check Adhesive Setting PCB Reversing Flux Application Flow Soldering Cleaning Inspection 2. Both Side Chip Mounting PCB Solder Paste Stenciling Chip Placing Check Reflow Soldering PCB Reversing Adhesive Application One Side Reflow/ One Side Flow System Chip Placing Check Adhesive Setting PCB Reversing Flux Application Flow Soldering Cleaning Inspection Both Side Reflow System PCB Solder Paste Stenciling Adhesive Application Chip Placing Check Reflow Soldering PCB Reversing Solder Paste Stenciling Chip Placing Check Reflow Soldering Cleaning Inspection 3. Mixed Mounting of Chip Components and Leaded Components PCB Solder Paste Stenciling Chip Placing Check Reflow Soldering Insertion of Leaded Components PCB Reversing Adhesive Application Chip Placing Check Adhesive Setting Flux Application PCB Reversing Flow Soldering Cleaning Inspection This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 1. Solder Paste Stenciling The Amount of Solder Paste Electrode Solder Series POZ3AN, RVG3A, RVG4M, POG5 POZ3KN Standard applying thickness 150 200 m 100 150 m 2. Mounting the Product Dimensions of the Positioning Claws Recommended Thickness of the Positioning Claws Claw Product Claw T= 2.0 mm or more Width of the Positioning Claws Product Claw Terminal (3) W Terminal (1) W= 4.0 mm or more Correct Incorrect Dimensions of the Pick-up Nozzle Recommended for the POZ3 and RVG3 Series 2.5— 2.8mm 2.0mm Recommended for the RVG4M and POG5 Series 4.0mm 2.0mm Pressure A nozzle whose suction surface is flat and free of notches or V grooves is recommended. This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 Adjustment of the Pick-up Nozzle Bottom Dead Point Precautions in Mounting the Product 3. Compatibility with Chip Placers When Using Commercial Chip Placers Position Detection Methods Employed by Various Commercial Chip Placers Detection method Typical model Manufacturer Pulsar 100 series 120C, 140C, CKD 135C Panasert MIC, MID, MA, MF Vacuum sensor system ECM series OCM-8000 series AM100 series Vacuum sensor photocell system Photocell (line sensor) system CM-60F, -62F, -60P, -62P, -92P TCM-40, -41, -60 Panasert MK , MK , MKH, MQ, MQ1, MQ2 Bulser 200 series Panasert MSH, MSH- , MV , MV -F, MPA-V TCM-1000, -1200, -3000 CP-6, CP -3 CM86C, 85C, 82C PANASONIC MAMIYA ELECTRONICS OKANO ELECTRIC MATSUSHITA ELECTRIC WORKS KYUSHU MATSUSHITA ELECTRIC SANYO PANASONIC CKD PANASONIC SANYO FUJI MACHINERY KYUSHU MATSUSHITA ELECTRIC Pitch 8mm 4mm 4mm 12mm 8mm Image processing (CCD camera) system Taping Versions Series RVG4M POZ3AN RVG3 POZ3KN POG5AN POG5HN Tape width 12mm 08mm 12mm 16mm 12mm This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 4. Sensor Level Adjustment Adjusting Procedure Single-line circuit Vacuum gauge VACUUM Vacuum pump Vacuum sensor Pick-up nozzle Double-line circuit Vacuum sensor for rectangular chips VACUUM Changeover valve Vacuum sensor for special shape chips Vacuum gauge Pick-up nozzle Chip Placer Positioning Claws Positioning claws Product Claws not provided Claws provided 5. Reflow Soldering Soldering Conditions Standard Soldering Conditions Preheating (in the air) 230 Tem perature (˚C) 200 Soldering Gradual cooling (in the air) 100 0 60— 120 sec. 30 sec. or less (Solder melting zone) This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 6. Adhesive Application and Curing The Amount of Adhesive to Be Applied Standard Amounts of Adhesive Applied Typical adhesives MR-8153RA NF-3000 Standard amounts of application 0.6 0.9mg 0.8 1.1mg Viscosity of Adhesive Points of Application Adhesive 0.3 mm or more 0.3 mm or more Land PCB Control of Adhesive Curing 2-point application Types and Characteristics of Adhesive (1) Types of Adhesive (3)Adhesive Application Methods (2) Required Characteristics of Adhesive Application method Dispenser Features A sequential application method which allows control of the amount of adhesive according to the type and shape of components. A system in which adhesive is applied at a stroke through a screen. This method can save time required for application, though it requires set-up change when PCBs are changed. In this method, no coating is allowed after components are mounted. The application of adhesive is completed at once with transfer pins. The amount of adhesive cannot be controlled in this method. Screen Printing Transfer Pin This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 Commercial Chip Mounting Adhesives Name MR-8153RA NF-1000-6R Polyester resin NF-3000 JU-8V JU-8VD JT-5S ULTRADYNE #5111 ULTRADYNE #5111-W5 Single liquid type Ingredients Acrylic resin Viscosity 5500ps 1800ps 2200ps(H) 1800ps(M) 1300ps(L) 400ps Curing temp. and time UV• • • • • • • • • • • • • • • • • • • • • 10" 150˚C • • • • • • • • • • • • • • • • 10"min. UV• • • • • • • • • • • • • • • • • • • • • 10 15" 140 150˚C • • • • • • • 10"min. UV• • • • • • • • • • • • • • • • • • • • • 10 15" 140 150˚C • • • • • • • 30"min. UV• • • • • • • • • • • • • • • • • • • • • 10"min. 140˚C• • • • • • • • • • • • • • • • 10"min. 140˚C • • • • • • • • • • • • • • • • 2.5'min. 130˚C• • • • • • • • • • • • • • • • 15' 1300ps Pot life 2 mos.(30˚C) Application method Dispenser Screen printing 3 mos.(20˚C) Epoxy acrylate resin Epoxy resin 1 mos.(20˚C) 3 mos.(20˚C) 1.5 mos.(20˚ C) 200ps 500ps Epoxy resin 7. Flux Coating Coating Thickness Ingredients Types and Characteristics of Flux (1) Functions of Flux (3) Cautions in Use (2) Types of Flux (4) Typical Commercial Flux Flux name CF-210V CF-220V GX-15T AGF-150X Gammalux D-350 Chlorine content 0.08wt% 0.09wt% 0.09wt% 0.10wt% 0.08wt% This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 8. Flow Soldering Soldering Conditions Standard Soldering Conditions Preheating (in the air) Soldering Gradual cooling (in the air) Tem perature (˚C) 250 200 100 0 60— 120 sec. 5 sec. or less Cautions in Soldering This part tends to remain unwet. Terminations Direction of move PCB Product Solder flow 9. Soldering and Resoldering with a Soldering Iron Soldering iron Product Land Correct PCB Incorrect Soldering Conditions This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 10. Cleaning Cautions in Cleaning POG5 Series RVG4M Series Recommended Cleaning Time Range for the RVG4M Series Room temperature dipping Conditions Hot dipping Ultrasonic (below 20W/ ) Steam cleaning Method 1 Method 2 Method 3 Method 4 Method 5 5 min. or less 2 min. or less 1 min. or less 1 min. or less 1 min. or less 1 min. or less (30 sec. or less recommended ) 30 sec. or less 30 sec. or less POZ3 and RVG3 Series This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 1. Adjustments Adjuster and Load Inspection of the Adjuster Range of Rotation of the Adjuster Types of Adjuster Recommended Adjusters for Manual Adjustments Series Recommended adjusters Manufacturer VESSEL MFG. POZ3 TORAY INDUSTRIES, INC. VESSEL MFG. RVG3S08/3A08 TORAY INDUSTRIES, INC. VESSEL MFG. VESSEL MFG. POG5 FUTABA TOOL MFG. Trade name NO.9000 1.7 30 TORAY TORAYCERAM ADJUSTER SA-2225 NO.9000 1.7 30 TORAY TORAYCERAM ADJUSTER SA-2225 NO.9000 NO.9000 DA54 2.6 30 1.3 30 MURATA's trade name KMPOT12V KMPOT13T KMPOT12V KMPOT13T KMPOT15V KMPOT16V Head shape Cross Flat blade (semicircular end) Cross Flat blade (semicircular end) Flat blade Flat blade Flat blade RVG4M This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 2. Automatic Adjustments Guiding Mechanism for Position Error Correction Bit for automatic adjustment (JB-2225) Product PCB Design position Actual position 0.7mm (Offset from the bit center) Errors up to correctable 0.7 mm PCB Recommended Bit for Automatic Adjustments TORAY TORAYCERAM ADJUSTER JB-2225 Dimensions 1.0 R1.20 0.05 2.2 0. 7 5 20 1.0 1. 5 0. 40 0.05 0.03 (in mm) For further information on dimensions, contact TORAY INDUSTRIES, INC. Recommended Adjuster Bit for Automatic Adjustment Series POZ3 RVG3S08 RVG3A08 Recommended adjuster bit Manufacturer TORAY Trade name TORAY TORAYCERAM ADJUSTER JB-2225 MURATA's trade name KMPOT31T Head shape Flat blade (semicircular end) This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 3. Lock Painting Paint Ingredients This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 Ex.1. Poor Contact Caused by Flux Adhesion Phenomenon Prevention PCB Layout Through hole 10 mm or more 10 mm or more 10 mm or more This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 Ex.2. Cracking of the Substrate Phenomenon Prevention Perforation Slit V slot Ex.3. Poor Contact Caused by a Deformed Driver Plate Phenomenon Prevention This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 Note: 1. Export Control For customers outside Japan Murata products should not be used or sold for use in the development, production, stockpiling or utilization of any conventional weapons or mass-destructive weapons (nuclear weapons, chemical or biological weapons, or missiles), or any other weapons. For customers in Japan For products which are controlled items subject to “the Foreign Exchange and Foreign Trade Control Law” of Japan, the export license specified by the law is required for export. 2. Please contact our sales representatives or engineers before using our products listed in this catalog for the applications requiring especially high reliability what defects might directly cause damage to other party's life, body or property (listed below) or for other applications not specified in this catalog. Aircraft equipment Aerospace equipment Undersea equipment Medical equipment Transportation equipment (automobiles, trains, ships,etc.) Traffic signal equipment Disaster prevention / crime prevention equipment Data-processing equipment Applications of similar complexity or with reliability requirements comparable to the applications listed in the above 3. Product specifications in this catalog are as of September 1997, and are subject to change or stop the supply without notice. Please confirm the specifications before ordering any product. If there are any questions, please contact our sales representatives or engineers. 4. The categories and specifications listed in this catalog are for information only. Please confirm detailed specifications by checking the product specification document or requesting for the approval sheet for product specification, before ordering. 5. Please note that unless otherwise specified, we shall assume no responsibility whatsoever for any conflict or dispute that may occur in connection with the effect of our and/or third party's intellectual property rights and other related rights in consideration of your using our products and/or information described or contained in our catalogs. In this connection, no representation shall be made to the effect that any third parties are authorized to use the rights mentioned above under licenses without our consent. 6. None of ozone depleting substances (ODS) under the Montreal Protocol is used in manufacturing process of us. http://www.murata.co.jp/ 2-26-10, Tenjin Nagaokakyo-shi, Kyoto 617-8555, Japan Phone:81-75-951-9111 1874 Sumiyoshi-cho Kizuki, Nakahara-ku Kawasaki, 211-0021, Japan Phone:81-44-422-5153 Fax:81-44-433-0798