2SB0709AQL

2SB0709AQL

  • 厂商:

    NAIS(松下)

  • 封装:

    SOT-23

  • 描述:

    TRANS PNP 45V 0.1A MINI 3P

  • 数据手册
  • 价格&库存
2SB0709AQL 数据手册
This product complies with the RoHS Directive (EU 2002/95/EC). Transistors 2SB0709A (2SB709A) Silicon PNP epitaxial planar type For general amplification Complementary to 2SD0601A (2SD601A) Unit: mm M Di ain sc te on na tin nc ue e/ d 0.40+0.10 –0.05 0.16+0.10 –0.06 0.4±0.2 1.50+0.25 –0.05 5˚ d p lan inc ea se ed lud p lan m m es ht visi tp t f ed ain ain foll :// ol d d te te ow ww lo is is na n i w. win con con nce anc ng f se g U tin tin t e ou m R ue ue yp typ r P ico L d d e e ro n. ab typ ty du pa ou e pe ct d na t l life so ate cy nic st cle .co inf sta .jp orm ge /e a n/ tio . n. • High forward current transfer ratio hFE • Mini type package, allowing downsizing of the equipment and automatic insertion through the tape packing and the magazine packing. 2.8+0.2 –0.3 3 ■ Features (0.95) (0.95) 1.9±0.1 (0.65) 2 1 2.90+0.20 –0.05 ■ Absolute Maximum Ratings Ta = 25°C Unit Collector-base voltage (Emitter open) VCBO −45 V Collector-emitter voltage (Base open) VCEO −45 V Emitter-base voltage (Collector open) VEBO −7 V Collector current IC −100 mA Peak collector current ICP −200 mA Collector power dissipation PC 200 mW Junction temperature Tj 150 °C Storage temperature Tstg −55 to +150 °C 1.1+0.2 –0.1 Rating 0 to 0.1 Symbol 1.1+0.3 –0.1 10˚ Parameter 1: Base 2: Emitter 3: Collector EIAJ: SC-59 Mini3-G1 Package Marking Symbol: B Symbol Collector-base voltage (Emitter open) VCBO IC = −10 µA, IE = 0 −45 V VCEO IC = −2 mA, IB = 0 −45 V Emitter-base voltage (Collector open) VEBO IE = −10 µA, IC = 0 −7 Collector-base cutoff current (Emitter open) ICBO VCB = −20 V, IE = 0 Collector-emitter cutoff current (Base open) ICEO VCE = −10 V, IB = 0 Forward current transfer ratio * hFE VCE = −10 V, IC = −2 mA te na nc e/ on tin Collector-emitter voltage (Base open) ue Parameter Di sc ■ Electrical Characteristics Ta = 25°C ± 3°C Collector-emitter saturation voltage VCE(sat) fT M ain Transition frequency Collector output capacitance (Common base, input open circuited) Cob Conditions Min Typ 160 IC = −100 mA, IB = −10 mA − 0.3 Max Unit V − 0.1 µA −100 µA 460  − 0.5 V VCB = −10 V, IE = 1 mA, f = 200 MHz 80 MHz VCB = −10 V, IE = 0, f = 1 MHz 2.7 pF Pl Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Rank classification Rank Q R S No-rank hFE 160 to 260 210 to 340 290 to 460 160 to 460 Marking symbol BQ BR BS B Product of no-rank is not classified and have no marking symbol for rank. Note) The part number in the parenthesis shows conventional part number. Publication date: March 2003 SJD00047BED 1 This product complies with the RoHS Directive (EU 2002/95/EC). 2SB0709A IC  VCE −100 160 IC  I B −60 Ta = 25°C VCE = −5 V Ta = 25°C −50 −80 IB = −300 µA Collector current IC (mA) 200 Collector current IC (mA) −120 −40 M Di ain sc te on na tin nc ue e/ d Collector power dissipation PC (mW) PC  Ta 240 120 80 −200 µA −40 −150 µA −100 µA 80 120 160 −2 0 −4 −6 −8 −10 Collector current IC (mA) Base current IB (µA) −300 25°C Ta = 75°C −25°C −160 −250 −150 −100 −80 − 0.8 −1.2 0 −1.6 0 −300 −10 −400 IC / IB = 10 −1 Ta = 75°C 25°C − 0.4 − 0.8 −1.2 −1.6 −2.0 − 0.001 −1 −25°C −10 −100 −1 000 Collector current IC (mA) Base-emitter voltage VBE (V) Di sc hFE  IC 600 300 Ta = 75°C 25°C Cob  VCB VCB = −10 V Ta = 25°C 120 100 80 60 Pl −25°C 200 100 0 −1 40 20 −10 −100 Collector current IC (mA) 2 Transition frequency fT (MHz) nc te na 500 400 140 M ain Forward current transfer ratio hFE e/ VCE = −10 V fT  I E 160 Collector output capacitance C (pF) (Common base, input open circuited) ob on tin ue Base-emitter voltage VBE (V) −200 Base current IB (µA) − 0.01 −40 −50 −100 − 0.1 −120 −200 − 0.4 0 VCE(sat)  IC VCE = −5 V −200 0 0 −12 IC  VBE −240 VCE = −5 V Ta = 25°C −350 −10 −50 µA Collector-emitter voltage VCE (V) IB  VBE −400 −20 Collector-emitter saturation voltage VCE(sat) (V) 40 −30 d p lan inc ea se ed lud p lan m m es ht visi tp t f ed ain ain foll :// ol d d te te ow ww lo is is na n i w. win con con nce anc ng f se g U tin tin t e ou m R ue ue yp typ r P ico L d d e e ro n. ab typ ty du pa ou e pe ct d na t l life so ate cy nic st cle .co inf sta .jp orm ge /e a n/ tio . n. 0 0 Ambient temperature Ta (°C) 0 −250 µA −20 40 0 −60 −1 000 0 0.1 1 10 Emitter current IE (mA) SJC00047BED 100 8 IE = 0 f = 1 MHz Ta = 25°C 7 6 5 4 3 2 1 0 −1 −10 −100 Collector-base voltage VCB (V) This product complies with the RoHS Directive (EU 2002/95/EC). 2SB0709A NF  IE NF  IE VCB = −5 V R = 50 kΩ 18 g Ta = 25°C VCB = −5 V f = 1 kHz Rg = 2 kΩ Ta = 25°C hfe 16 14 12 f = 100 Hz hoe (µS) M Di ain sc te on na tin nc ue e/ d 4 3 2 10 1 kHz 8 10 10 kHz 6 hie (kΩ) d p lan inc ea se ed lud p lan m m es ht visi tp t f ed ain ain foll :// ol d d te te ow ww lo is is na n i w. win con con nce anc ng f se g U tin tin t e ou m R ue ue yp typ r P ico L d d e e ro n. ab typ ty du pa ou e pe ct d na t l life so ate cy nic st cle .co inf sta .jp orm ge /e a n/ tio . n. 4 1 VCE = −5 V f = 270 Hz Ta = 25°C 100 h Parameter Noise figure NF (dB) 5 Noise figure NF (dB) h Parameter  IE 20 6 2 0 0.01 0.1 1 0 0.1 10 Emitter current IE (mA) Emitter current IE (mA) h Parameter  VCE hfe IE = 2 mA f = 270 Hz Ta = 25°C hoe (µS) 10 hre (× 10−4) hie (kΩ) −10 −100 10 1 0.1 hre (× 10−4) 1 10 Emitter current IE (mA) Pl te na nc e/ Di sc on tin ue Collector-emitter voltage VCE (V) M ain h Parameter 100 1 −1 1 SJC00047BED 3 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. pla d in ea ne clu se pla m d de v ht isi ne ai ma s fo tp t f :// ol d d d nte inte llow ww lo is is na n i w. win con con nce anc ng f se g U tin tin t e ou m R ue ue yp typ r P ico L d d e e ro n. ab typ ty du pa ou e pe ct d na t l life so ate cy nic st cle .co inf sta .jp orm ge /e a n/ tio . n. M Di ain sc te on na tin nc ue e/ d (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. Pl M ain te na nc e /D isc on tin ue (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
2SB0709AQL 价格&库存

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