2SC22950BL

2SC22950BL

  • 厂商:

    NAIS(松下)

  • 封装:

    SOT-23

  • 描述:

    TRANS NPN 20VCEO 30MA MINI-3

  • 数据手册
  • 价格&库存
2SC22950BL 数据手册
This product complies with the RoHS Directive (EU 2002/95/EC). Transistors 2SC2295 Silicon NPN epitaxial planar type For high-frequency amplification Complementary to 2SA1022 Unit: mm M Di ain sc te on na tin nc ue e/ d 0.40+0.10 –0.05 0.16+0.10 –0.06 0.4±0.2 d p lan inc ea se ed lud p lan m m es ht visi tp t f ed ain ain foll :// ol d d te te ow ww lo is is na n i w. win con con nce anc ng f se g U tin tin t e ou m R ue ue yp typ r P ico L d d e e ro n. ab typ ty du pa ou e pe ct d na t l life so ate cy nic st cle .co inf sta .jp orm ge /e a n/ tio . n. • Optimum for RF amplification of FM/AM radios • High transition frequency fT • Mini type package, allowing downsizing of the equipment and automatic insertion through the tape packing and the magazine packing 5˚ 1.50+0.25 –0.05 ■ Features 2.8+0.2 –0.3 3 (0.95) (0.95) 1.9±0.1 (0.65) 2 1 2.90+0.20 –0.05 Rating Unit VCBO 30 V Collector-emitter voltage (Base open) VCEO 20 V Emitter-base voltage (Collector open) VEBO 5 V Collector current IC 30 mA Collector power dissipation PC 200 mW Junction temperature Tj 150 °C Storage temperature Tstg −55 to +150 °C 1.1+0.2 –0.1 Symbol 0 to 0.1 Parameter Collector-base voltage (Emitter open) 1.1+0.3 –0.1 10˚ ■ Absolute Maximum Ratings Ta = 25°C 1: Base 2: Emitter 3: Collector EIAJ: SC-59 Mini3-G1 Package Marking Symbol: V ■ Electrical Characteristics Ta = 25°C ± 3°C Symbol Collector-base cutoff current (Emitter open) ICBO VCB = 10 V, IE = 0 hFE VCB = 10 V, IE = −1 mA 70 150 tin Forward current transfer ratio * ue Parameter Conditions Min Typ Max Unit 0.1 µA 220  VCB = 10 V, IE = −1 mA, f = 200 MHz VCB = 10 V, IE = −1 mA, f = 5 MHz Reverse transfer impedance Zrb VCB = 10 V, IE = −1 mA, f = 2 MHz 22 50 Ω Reverse transfer capacitance (Common emitter) Cre VCB = 10 V, IE = −1 mA, f = 10.7 MHz 0.9 1.5 pF on fT NF Di sc Transition frequency te na nc e/ Noise figure 250 2.8 MHz 4.0 dB Rank B hFE 70 to 140 Publication date: March 2003 C 110 to 220 Pl M ain Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Rank classification SJC00112BED 1 This product complies with the RoHS Directive (EU 2002/95/EC). 2SC2295 PC  Ta IC  VCE IC  I B 12 Ta = 25°C Collector current IC (mA) 10 160 VCE = 10 V Ta = 25°C IB = 100 µA 12.5 Collector current IC (mA) 200 15.0 80 µA 8 60 µA 10.0 M Di ain sc te on na tin nc ue e/ d Collector power dissipation PC (mW) 240 80 40 0 40 80 120 2 20 µA IB  VBE 0 6 12 VCE = 10 V Ta = 25°C 2.5 Collector current IC (mA) 80 60 40 0 VCE = 10 V 25°C 40 Ta = 75°C −25°C 30 20 0 0.6 0.8 1.0 0.4 0.8 40 60 80 100 Base current IB (µA) 1.2 1.6 2.0 100 IC / IB = 10 10 1 Ta = 75°C 25°C 0.1 0.01 0.1 Base-emitter voltage VBE (V) −25°C 1 10 100 Collector current IC (mA) Di sc hFE  IC 240 nc Ta = 75°C 25°C 120 80 300 200 100 VCB = 10 V f = 100 MHz Ta = 25°C 40 1 10 Collector current IC (mA) 100 0 − 0.1 Zrb  IE 60 Pl −25°C 0 0.1 2 Transition frequency fT (MHz) 160 te na 200 M ain Forward current transfer ratio hFE e/ VCE = 10 V fT  I E 400 −1 −10 Emitter current IE (mA) SJC00112BED −100 Reverse transfer impedance Zrb (Ω) on tin ue Base-emitter voltage VBE (V) 0 20 VCE(sat)  IC 10 20 0.4 0 18 50 100 0.2 5.0 IC  VBE 60 0 7.5 Collector-emitter voltage VCE (V) 120 Base current IB (µA) 40 µA 0 160 Ambient temperature Ta (°C) 0 4 Collector-emitter saturation voltage VCE(sat) (V) 0 6 d p lan inc ea se ed lud p lan m m es ht visi tp t f ed ain ain foll :// ol d d te te ow ww lo is is na n i w. win con con nce anc ng f se g U tin tin t e ou m R ue ue yp typ r P ico L d d e e ro n. ab typ ty du pa ou e pe ct d na t l life so ate cy nic st cle .co inf sta .jp orm ge /e a n/ tio . n. 120 VCB = 10 V f = 2 MHz Ta = 25°C 50 40 30 20 10 0 − 0.1 −1 Emitter current IE (mA) −10 This product complies with the RoHS Directive (EU 2002/95/EC). 2SC2295 NF  IE Noise figure NF (dB) 10 2.0 IC = 3 mA 1 mA 8 Vie = gie + jbie VCE = 10 V 20 1.5 1.0 4 2 16 100 −2 mA 58 10 0 − 0.1 100 bre  gre Forward transfer susceptance bfe (mS) − 0.1 IE = −1 mA − 0.2 − 0.3 58 − 0.4 100 − 0.5 f = 10.7 MHz − 0.1 mA 58 −1 mA 100 −20 − 0.3 8 − 0.2 − 0.1 32 40 boe  goe yoe = goe + jboe VCE = 10 V −2 mA 100 IE = −4 mA −60 58 100 −80 yfe = gfe + jbfe VCE = 10 V 0 20 40 60 80 100 Forward transfer conductance gfe (mS) IE = −1 mA 100 0.8 0.6 58 0.4 0.2 f = 10.7 MHz 0 0 0.1 0.2 0.3 0.4 0.5 Output conductance goe (mS) Pl M ain te na nc e/ Di sc on tin Reverse transfer conductance gre (mS) 24 1.0 −40 −120 0 16 1.2 58 −100 − 0.4 0 Input conductance gie (mS) 10.7 ue − 0.6 − 0.5 0 −10 bfe  gfe 0 f = 10.7 MHz yre = gre + jbre VCE = 10 V −1 f = 10.7 MHz Emitter current IE (mA) Collector-emitter voltage VCE (V) 0 8 4 Output susceptance boe (mS) 1 12 d p lan inc ea se ed lud p lan m m es ht visi tp t f ed ain ain foll :// ol d d te te ow ww lo is is na n i w. win con con nce anc ng f se g U tin tin t e ou m R ue ue yp typ r P ico L d d e e ro n. ab typ ty du pa ou e pe ct d na t l life so ate cy nic st cle .co inf sta .jp orm ge /e a n/ tio . n. 0.5 0 0.1 Reverse transfer susceptance bre (mS) 6 −7 mA −4 mA IE = −1 mA VCB = 6 V f = 100 MHz Rg = 50 Ω Ta = 25°C f = 10.7 MHz Ta = 25°C 2.5 bie  gie 24 M Di ain sc te on na tin nc ue e/ d Reverse transfer capacitance Cre (pF) (Common emitter) 12 Input susceptance bie (mS) Cre  VCE 3.0 SJC00112BED 3 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. pla d in ea ne clu se pla m d de v ht isi ne ai ma s fo tp t f :// ol d d d nte inte llow ww lo is is na n i w. win con con nce anc ng f se g U tin tin t e ou m R ue ue yp typ r P ico L d d e e ro n. ab typ ty du pa ou e pe ct d na t l life so ate cy nic st cle .co inf sta .jp orm ge /e a n/ tio . n. M Di ain sc te on na tin nc ue e/ d (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. Pl M ain te na nc e /D isc on tin ue (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
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