Transistors
2SC4808
Silicon NPN epitaxial planar type
For UHF band low-noise amplification
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Unit: mm
0.2+0.1
–0.05
■ Features
0.15+0.1
–0.05
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
15
V
Collector-emitter voltage (Base open)
VCEO
10
V
Emitter-base voltage (Collector open)
VEBO
2
V
Collector current
IC
80
mA
Collector power dissipation
PC
125
mW
Junction temperature
Tj
125
°C
Storage temperature
Tstg
−55 to +125
°C
0.75±0.15
Symbol
0 to 0.1
5˚
Parameter
(0.3)
■ Absolute Maximum Ratings Ta = 25°C
2
0.45±0.1
1
(0.5) (0.5)
1.0±0.1
1.6±0.1
(0.4)
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0.2±0.1
0.8±0.1
1.6±0.15
• Low noise figure NF
• High forward transfer gain S21e2
• High transition frequency fT
• SS-Mini type package, allowing downsizing of the equipment
and automatic insertion through the tape packing
1˚
3
1: Base
2: Emitter
3: Collector
EIAJ: SC-75
SSMini3-G1 Package
Marking Symbol: 3M
Symbol
Collector-base voltage (Emitter open)
VCBO
IC = 10 µA, IE = 0
15
V
VCEO
IC = 100 µA, IB = 0
10
V
Collector-base cutoff current (Emitter open)
ICBO
VCB = 10 V, IE = 0
1
µA
Emitter-base cutoff current (Collector open)
IEBO
VEB = 2 V, IC = 0
1
µA
Forward current transfer ratio *
hFE
VCE = 8 V, IC = 20 mA
50
150
Transition frequency
fT
VCE = 8 V, IC = 15 mA, f = 0.8 GHz
5
6
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Collector output capacitance
(Common base, input open circuited)
Forward transfer gain
Maximum unilateral power gain
Noise figure
Cob
Conditions
Min
VCB = 10 V, IE = 0, f = 1 MHz
Typ
0.7
Max
300
Unit
GHz
1.2
pF
S21e2
VCE = 8 V, IC = 15 mA, f = 0.8 GHz
14
dB
GUM
VCE = 8 V, IC = 15 mA, f = 0.8 GHz
15
dB
NF
VCE = 8 V, IC = 7 mA, f = 0.8 GHz
1.3
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Collector-emitter voltage (Base open)
ue
Parameter
Di
sc
■ Electrical Characteristics Ta = 25°C ± 3°C
11
2.0
dB
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Pulse measurement
Publication date: February 2003
SJC00170BED
1
2SC4808
PC Ta
IC VCE
IC VBE
24
Ta = 25°C
IB = 200 µA
Collector current IC (mA)
20
100
180 µA
160 µA
16
140 µA
120 µA
VCE = 8 V
100
Collector current IC (mA)
125
120
25°C
Ta = 75°C
80
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Collector power dissipation PC (mW)
150
50
25
80 µA
8
60 µA
40 µA
0
40
80
120
0
160
Forward current transfer ratio hFE
Ta = 75°C
25°C
−25°C
0.1
1
0
0
2
4
6
8
10
12
0
0.4
0.8
10
Ta = 75°C
300
25°C
200
−25°C
100
0
0.1
100
1
10
2.0
10
8
6
4
2
0
0.1
100
VCE = 8 V
f = 800 MHz
Ta = 25°C
1
10
100
Collector current IC (mA)
Collector current IC (mA)
1.6
te
na
2.0
0.8
0.4
0
0.1
1
10
Collector-base voltage VCB (V)
2
20
16
12
100
8
10
VCE = 8 V
(Rg = 50 Ω)
f = 800 MHz
Ta = 25°C
8
6
4
2
4
0
0.1
NF IC
12
VCE = 8 V
f = 800 MHz
Ta = 25°C
Pl
1.2
GUM IC
24
Noise figure NF (dB)
Di
sc
nc
e/
IE = 0
f = 1 MHz
Ta = 25°C
M
ain
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
Cob VCB
2.4
Maximum unilateral power gain GUM (dB)
on
tin
ue
Collector current IC (mA)
500
1.6
fT I C
12
VCE = 8 V
400
1.2
Base-emitter voltage VBE (V)
hFE IC
10
0.01
0.1
20 µA
600
IC / IB = 10
1
40
Collector-emitter voltage VCE (V)
VCE(sat) IC
100
60
20
4
Ambient temperature Ta (°C)
Collector-emitter saturation voltage VCE(sat) (V)
100 µA
Transition frequency fT (GHz)
0
12
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75
−25°C
1
10
Collector current IC (mA)
SJC00170BED
100
0
0.1
1
10
Collector current IC (mA)
100
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
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(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
