This product complies with the RoHS Directive (EU 2002/95/EC).
Transistors
2SD1820
Silicon NPN epitaxial planar type
For general amplification
Complementary to 2SB1219
Package
Low collector-emitter saturation voltage VCE(sat)
S-Mini type package, allowing downsizing of the equipment and automatic
insertion through the tape packing.
Code
SMini3-G1
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Features
Parameter
Symbol
Collector-base voltage (Emitter open)
VCBO
Collector-emitter voltage (Base open)
VCEO
Emitter-base voltage (Collector open)
VEBO
Collector current
IC
Peak collector current
ICP
Collector power dissipation
PC
Junction temperature
Tj
Storage temperature
Tstg
Electrical Characteristics Ta = 25°C±3°C
Parameter
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Absolute Maximum Ratings Ta = 25°C
Pin Name
1. Base
2. Emitter
3. Collector
Rating
Unit
30
V
25
V
5
V
500
mA
1
A
150
mW
150
°C
–55 to +150
°C
Symbol
Marking Symbol: W
Conditions
Min
Typ
Max
Unit
VCBO
IC = 10 mA, IE = 0
30
V
Collector-emitter voltage (Base open)
VCEO
IC = 2 mA, IB = 0
25
V
VEBO
IE = 10 mA, IC = 0
5
V
ICBO
VCB = 20 V, IE = 0
on
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Collector-base voltage (Emitter open)
isc
Emitter-base voltage (Collector open)
an
Forward current transfer ratio *1
ce
/D
Collector-base cutoff current (Emitter open)
hFE1
*2
en
hFE2
Collector-emitter saturation voltage *1
Ma
int
VCE(sat)
Transition frequency
fT
Collector output capacitance
(Common base, input open circuited)
Cob
VCE = 10 V, IC = 150 mA
85
VCE = 10 V, IC = 500 mA
40
0.1
340
IC = 300 mA, IB = 30 mA
0.35
VCB = 10 V, IE = –50 mA, f = 200 MHz
200
VCB = 10 V, IE = 0, f = 1 MHz
6
0.60
15
mA
V
MHz
pF
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *1: Pulse measurement
*2: Rank classification
Rank
Q
R
S
No-rank
hFE1
85 to 170
120 to 240
170 to 340
85 to 340
Marking symbol
WQ
WR
WS
Product of no-rank is not classified and have no marking symbol for rank.
Publication date : October 2008
SJC00227DED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
2SD1820
PC Ta
IC VCE
Collector current IC (mA)
160
120
80
IB = 10 mA
9 mA
8 mA
7 mA
6 mA
5 mA
4 mA
600
500
400
3 mA
300
VCE = 10 V
Ta = 25°C
700
2 mA
200
1 mA
Collector current IC (mA)
700
200
800
Ta = 25°C
600
500
400
300
200
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Collector power dissipation PC (mW)
IC IB
800
240
40
120
IC / IB = 10
1
Ta = 75°C
25°C
−25°C
0.1
1
10
160
int
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200
120
80
40
0
−1
−10
Emitter current IE (mA)
2
16
0
20
0
2
4
−100
6
8
250
10
200
1 Ta = −25°C
25°C
150
10
Base current IB (mA)
hFE IC
300
IC / IB = 10
VCE = 10 V
Ta = 75°C
25°C
−25°C
75°C
100
0.1
50
0.01
0.01
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VCB = 10 V
Ta = 25°C
Ma
Transition frequency fT (MHz)
isc
fT IE
12
100
ue
Collector current IC (A)
240
8
VBE(sat) IC
10
0.01
0.01
4
0.1
1
0
0.01
10
Collector current IC (A)
Cob VCB
12
IE = 0
f = 1 MHz
Ta = 25°C
10
80
6
60
4
40
2
20
1
10
100
Collector-base voltage VCB (V)
SJC00227DED
0
1
1
10
VCER RBE
IC = 2 mA
Ta = 25°C
100
8
0
0.1
Collector current IC (A)
120
CER
Collector-emitter saturation voltage VCE(sat) (V)
VCE(sat) IC
0.1
0
Collector-emitter voltage VCE (V)
Ambient temperature Ta (°C)
100
0
160
FE
80
100
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Collector-emitter voltage V
b
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p
Forward
current
transfer
ratio
(V)
p
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(Resistor between B and E)
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Base-emitter saturation voltage VBE(sat) (V)
0
Collector output capacitance
(Common base, input open circuited) Cob (pF)
0
100
10
100
1000
Base-emitter resistance RBE (kΩ)
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3
1
2
(0.65)
(0.65)
1.3 ±0.1
2.0 ±0.2
10 °
+0.2
−0.1
±0.1
(0.425)
SMini3-G1
0.3 −0.0
+0.1
SJC00227DED
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±0.1
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This product complies with the RoHS Directive (EU 2002/95/EC).
2SD1820
Unit: mm
0.15 −0.05
+0.10
3
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
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(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
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(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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