This product complies with the RoHS Directive (EU 2002/95/EC).
Transistors
2SD2259
Silicon NPN epitaxial planar type
For low-frequency amplification
Unit: mm
2.5±0.1
(0.8)
■ Features
• High forward current transfer ratio hFE
• Low collector-emitter saturation voltage VCE(sat)
• Allowing supply with the radial taping
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14.5±0.5
(1.0)
0.65 max.
■ Absolute Maximum Ratings Ta = 25°C
Parameter
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
20
V
Collector-emitter voltage (Base open)
VCEO
20
V
Emitter-base voltage (Collector open)
VEBO
15
V
0.7
A
1.5
A
Collector current
IC
Peak collector current
ICP
Collector power dissipation
*
PC
Junction temperature
Tj
Storage temperature
Tstg
(0.5)
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0.7
(1.0)
(0.2)
4.5±0.1
6.9±0.1
4.0
1
W
150
°C
−55 to +150
°C
0.45+0.10
–0.05
2.5±0.5
1
1.05±0.05
0.45+0.10
–0.05
2.5±0.5
2
1: Emitter
2: Collector
3: Base
MT-2-A1 Package
3
cm2
Note) *: Printed circuit board: Copper foil area of 1
or more, and the
board thickness of 1.7 mm for the collector portion
ue
■ Electrical Characteristics Ta = 25°C ± 3°C
Symbol
ce
/D
isc
on
tin
Parameter
Conditions
Min
Typ
Max
Unit
VCBO
IC = 10 µA, IE = 0
20
V
Collector-emitter voltage (Base open)
VCEO
IC = 1 mA, IB = 0
20
V
Emitter-base voltage (Collector open)
VEBO
IE = 10 µA, IC = 0
15
Collector-base cutoff current (Emitter open)
ICBO
VCB = 15 V, IE = 0
Collector-emitter cutoff current (Base open)
ICEO
VCE = 15 V, IB = 0
Forward current transfer ratio *
hFE
VCE = 10 V, IC = 150 mA
VCE(sat)
IC = 500 mA, IB = 50 mA
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Collector-base voltage (Emitter open)
Collector-emitter saturation voltage
*
Transition frequency
Collector output capacitance
(Common base, input open circuited)
fT
Cob
V
1 000
0.15
VCB = 20 V, IE = −20 mA, f = 200 MHz
55
VCB = 10 V, IE = 0, f = 1 MHz
10
1
µA
10
µA
2 500
0.40
V
MHz
15
pF
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Pulse measurement
Publication date: January 2003
SJC00254BED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
2SD2259
PC Ta
IC VCE
1.0
IC VBE
200
Copper plate at the collector
is more than 1 cm2 in area,
1.7 mm in thickness
Ta = 25°C
Collector current IC (mA)
IB = 100 µA
90 µA
80 µA
120
70 µA
60 µA
80
1.6
25°C
Ta = 75°C
0.4
50 µA
40 µA
30 µA
40
0.2
−25°C
1.2
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0.6
VCE = 10 V
2.0
160
0.8
2.4
Collector current IC (A)
Collector power dissipation PC (W)
1.2
0.8
0.4
20 µA
0
0
20
40
60
80 100 120 140 160
Forward current transfer ratio hFE
1
Ta = 75°C
25°C
−25°C
0.1
1
10
Cob VCB
en
an
IE = 0
f = 1 MHz
Ta = 25°C
int
20
Ma
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
2 500
2 000
1 500
16
12
10
0
−25°C
500
0
0.01
0.1
1
Collector current IC (A)
100
SJC00254BED
0.4
0.8
1.2
1.6
2.0
Base-emitter voltage VBE (V)
fT I E
300
25°C
Collector-base voltage VCB (V)
2
0
12
Ta = 75°C
4
1
10
VCE = 10 V
8
0
8
1 000
ce
/D
isc
on
tin
Collector current IC (A)
24
6
hFE IC
10
0.01
0.01
4
3 000
IC / IB = 10
ue
Collector-emitter saturation voltage VCE(sat) (V)
VCE(sat) IC
0.1
2
Collector-emitter voltage VCE (V)
Ambient temperature Ta (°C)
100
0
Transition frequency fT (MHz)
0
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10 µA
10
VCB = 10 V
Ta = 25°C
250
200
150
100
50
0
−1
−10
−100
Emitter current IE (mA)
−1 000
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
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(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
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(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
