This product complies with the RoHS Directive (EU 2002/95/EC).
Power MOSFETs
2SK3277
Silicon N-channel power MOSFET
Unit: mm
6.5±0.1
5.3±0.1
4.35±0.1
2.5±0.1
• Non-contact relay
• Solenoid drive
• Motor drive
• Control equipment
• Switching mode regulator
1.0±0.1
0.1±0.05
0.5±0.1
0.75±0.1
2.3±0.1
4.6±0.1
1
2
(5.3)
(4.35)
(3.0)
3
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■ Absolute Maximum Ratings TC = 25°C
(5.5)
0.8 max.
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■ Applications
1.0±0.2
0.5±0.1
1.8±0.1
7.3±0.1
• Avalanche energy capability guaranteed
• High-speed switching
• No secondary breakdown
2.3±0.1
(1.8)
■ Features
Parameter
Symbol
Rating
Drain-source surrender voltage
VDSS
200
Gate-source surrender voltage
VGSS
±20
Drain current
ID
±2.5
Peak drain current
IDP
±5
Avalanche energy capability *
EAS
15
Power dissipation
PD
10
Ta = 25°C
1
Channel temperature
Tch
150
Storage temperature
Tstg
−55 to +150
Unit
V
V
A
A
mJ
W
1: Gate
2: Drain
3: Source
EIAJ: SC-63
U-G1 Package
Marking Symbol: K3277
Internal Connection
D
°C
°C
G
Note) *: L = 5 mH, IL = 2.5 A, 1 pulse
S
■ Electrical Characteristics TC = 25°C ± 3°C
Symbol
VDSS
IDSS
IGSS
Vth
RDS(on)
Yfs
VDF
Ciss
Short-circuit forward transfer capacitance
(Common source)
Pl
Parameter
Drain-source surrender voltage
Drain-source cutoff current
Gate-source cutoff current
Gate threshold voltage
Drain-source ON resistance
Forward transfer admittance
Diode forward voltage
Conditions
ID = 1 mA, VGS = 0
VDS = 160 V, VGS = 0
VGS = ±20 V, VDS = 0
VDS = 25 V, ID = 1 mA
VGS = 10 V, ID = 1.25 A
VDS = 25 V, ID = 1.25 A
IDR = 2.5 A, VGS = 0
VDS = 20 V, VGS = 0, f = 1 MHz
Min
200
Typ
170
Unit
V
µA
µA
V
Ω
S
V
pF
2.0
0.7
1.2
1.3
Max
10
±10
4.0
1.7
−1.4
Short-circuit output capacitance
(Common source)
Coss
25
pF
Reverse transfer capacitance
(Common source)
Crss
15
pF
18
35
200
60
ns
ns
ns
ns
°C/W
°C/W
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Thermal resistance (ch-c)
Thermal resistance (ch-a)
td(on)
tr
td(off)
tf
Rth(ch-c)
Rth(ch-a)
VDD = 100 V, ID = 1 A, RL = 100 Ω
VGS = 10 V
12.5
125
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Publication date: March 2004
SJG00028AED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
2SK3277
PD Ta
Safe operation area
102
(1) TC = Ta
(2) Without heat sink
Power dissipation PD (mW)
10
Drain current ID (A)
15
Non repetitive pulse
TC = 25°C
t = 100 µs
IDP
ID
DC
1
1 ms
10 ms
(1)
5
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10−1
10
100 ms
(2)
10−2
1
10
102
103
0
50
100
150
Ambient temperature Ta (°C)
Pl
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Drain-source voltage VDS (V)
0
2
SJG00028AED
This product complies with the RoHS Directive (EU 2002/95/EC).
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
M
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(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of
the products or technical information described in this material and controlled under the "Foreign Exchange
and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.
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(4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent
physical injury, fire, social damages, for example, by using the products.
Pl
(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually
exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP
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