ADP51B61

Circuit Components Catalog Pressure sensor Built-in amplifier and compensating circuit S Package M Package New L Package P Package RoHS compliant PS-A PRESSURE SENSOR FEATURES TYPICAL APPLICATIONS 1. Contains built-in amplification and temperature compensation circuit. Circuit design and adjustment of characteristics are not required by users. 2. High-level precision and high reliability realized. • Overall accuracy is ±1.25% FS (Standard type) • Overall accuracy is ±4% FS (Economy type) • Overall accuracy is ±2.5% FS (Low pressure type) 3. Compact pressure sensor unit that saves space. Same size and as previous PS pressure sensor. (Standard/Economy type, S and M Packages) (Please evaluate under actual conditions before using.) • Industrial use: pressure switches and pneumatic devices, etc. • Medical use: blood pressure monitors, compressed air pressure measurement, air beds, etc. • Other pneumatically operated pressure devices Low pressure type 1. Water level detection for household appliances Washing machines and dishwashers. 2. Medical applications Respiratory pressure measuring instrument, etc. ORDERING INFORMATION ADP5 1 1: DIP terminal 0: ±100 kPa 1: –100 kPa 2: 25 kPa 3: 50 kPa 4: 100 kPa 5: 200 kPa 6: 500 kPa 7: 1,000 kPa A: 40 kPa B6: 6 kPa (Low pressure type) 0: S Package length: 3 mm .118 inch, diameter: 3 mm .118 inch 1: M Package length: 5 mm .197 inch, diameter: 3 mm .118 inch 2: L Package (Only low pressure type) length: 13.5 mm .531 inch, diameter: 5.45 mm .215 inch 3: P Package (Only low pressure type) length: 15.6 mm .614 inch, diameter: 5.45 mm .215 inch Nil: With glass base (Standard type/Low pressure type) 1: Without glass base (Economy type) Note: Some part numbers may not be available depending on the combination. Please refer to the Table of PRODUCT TYPES on the next page. 2013.04 industrial.panasonic.com/ac/e/ © Panasonic Corporation 2013 ASCTB244E 201303-T PS-A (ADP5) PRODUCT TYPES Part No. Package (Pressure inlet hole length) Pressure Standard type S Package (3mm .118inch) Economy type (without glass base) Low pressure type Low pressure type L Package (13.5mm .531inch) M Package (5mm .197inch) P Package (15.6mm .614inch) Terminal DIP terminal Standard type (with glass base) Standard/Economy type M Package (5mm .197inch) DIP terminal DIP terminal DIP terminal DIP terminal ±100kPa –100kPa 25kPa 50kPa 100kPa 200kPa 500kPa 1,000kPa ADP5100 ADP5110 ADP5120 ADP5130 ADP5140 ADP5150 ADP5160 ADP5170 ADP5101 ADP5111 ADP5121 ADP5131 ADP5141 ADP5151 ADP5161 ADP5171 — — — — — — — — — — — — — — — — — — — — — — — — 40kPa — ADP51A11 — — — 6kPa — — ADP51B61 ADP51B62 ADP51B63 Standard packing: Carton: 100 pcs.; Case: 1,000 pcs. RATING 1. Standard type Item Type of pressure Pressure medium Rated pressure Standard type (with glass base) Gauge pressure Remarks Air ±100 Unit: kPa –100 25 Max. applied pressure Drive voltage Temperature compensation range Offset voltage Rated output voltage 50 Note*1 100 200 500 Twice the rated pressure 2.5±0.05V 4.5±0.05V (when +100kPa) 1,000 1.5 times the rated pressure 5±0.25V DC 0 to 50°C 32 to 122°F 0.5±0.05V Note*2, 3 4.5±0.05V Note*2, 3 ±1.25%FS Note*3 Note*4 Note*2, 3 Note*2 Note*2, 3 Note*2, 3 Overall accuracy Current consumption Output impedance Source current Sink current Max. 10mA 15Ω (Typical) Max. 0.2mA Max. 2mA Notes: 1. Please consult us for pressure media other than air. 2. Indicates output when temperature is 25°C 77°F. 3. Indicates output when drive voltage is 5 V. Although output fluctuates due to fluctuations in the drive voltage, this is not included. 4. Overall accuracy indicates the accuracy of the offset voltage and rated output voltage at a temperature compensation range of 0 to 50°C 32 to 122°F. 2. Economy type Item Type of pressure Pressure medium Rated pressure Unit: kPa Max. applied pressure Drive voltage Temperature compensation range Offset voltage Span voltage Offset voltage temperature characteristics Sensitivity temperature characteristics Current consumption Output impedance Source current Sink current Economy type (without glass base) Gauge pressure Air 40 Twice the rated pressure 3±0.15V DC 5 to 45°C 41 to 113°F 0.3±0.09V 2.4±0.03V Remarks ±4.0%FS Note*3, 4 1.3%FS Note*3, 4 Max. 3mA 20Ω (Typical) Max. 0.15mA Max. 1.5mA Note*2 Note*2, 3 Note*2, 3 Note*2, 3 Note*1 Note*2, 3 Note*2, 3 Notes: 1. Please consult us for pressure media other than air. 2. Indicates output when temperature is 25°C 77°F. 3. Indicates output when drive voltage is 3 V. Although output fluctuates due to fluctuations in the drive voltage, this is not included. 4. Indicates from output value at 25°C 77°F and the change of output at 5 and 45°C 41 to 113°F. Panasonic Corporation Circuit Components Buisiness Division industrial.panasonic.com/ac/e/ –2– © Panasonic Corporation 2013 ASCTB244E 201303-T PS-A (ADP5) 3. Low pressure type Item Type of pressure Pressure medium Rated pressure Unit: kPa Max. applied pressure Drive voltage Temperature compensation range Offset voltage Span voltage Overall accuracy Current consumption Output impedance Source current Sink current Low pressure type Gauge pressure Air 6 Twice the rated pressure 5±0.25V DC 0 to 70°C 32 to 158°F 0.5V (Typical) 4.0V (Typical) ±2.5%FS Max. 10mA 15Ω (Typical) Max. 0.2mA Max. 2.0mA Remarks Note*1 Note*2 Note*2 Note*2, 3, 4 Notes: 1. Please consult us for pressure media other than air. 2. Indicates output when drive voltage is 5 V. Although output fluctuates due to fluctuations in the drive voltage, this is not included. 3. Overall accuracy indicates the accuracy of the offset voltage and span voltage at temperatures between 0 to 70°C 32 to 158°F (FS=4V) 4. The initial offset voltage error is not included in the overall accuracy. * Items where no temperature is listed are specifications at 25°C 77°F. REFERENCE DATA 1. Standard type 1.-(1) Output voltage 1.-(2) Overall accuracy (Offset voltage) 1.-(3) Overall accuracy (Rated output voltage) ADP5170 Drive voltage: 5V DC Temperature: 25°C 77°F Applied pressure: 0 to +1,000kPa ADP5170 Drive voltage: 5V DC Temperature: 0 to 50°C 32 to 122°F Applied pressure: 0kPa ADP5170 Drive voltage: 5V DC Temperature: 0 to 50°C 32 to 122°F Applied pressure: +1,000kPa Accuracy, %FS Output voltage, V 4 3 2 1 0 0 500 1.25 1.25 1.00 1.00 0.75 0.75 0.50 0.50 0.25 0.00 -0.25 -0.50 0.25 0.00 -0.25 -0.50 -0.75 -0.75 -1.00 -1.00 -1.25 1000 Accuracy, %FS 5 0 32 Pressure, kPa 25 47 Temperature, °C °F -1.25 0 32 50 122 25 47 Temperature, °C °F 50 122 2.-(1) Output voltage 2.-(2) Overall accuracy (Offset voltage) 2.-(3) Overall accuracy (Rated output voltage) ADP5100 Drive voltage: 5V DC Temperature: 25°C 77°F Applied pressure: –100 to +100kPa ADP5100 Drive voltage: 5V DC Temperature: 0 to 50°C 32 to 122°F Applied pressure: 0kPa ADP5100 Drive voltage: 5V DC Temperature: 0 to 50°C 32 to 122°F Applied pressure: +100kPa Accuracy, %FS Output voltage, V 4 3 2 1.25 1.25 1.00 1.00 0.75 0.75 0.50 0.50 Accuracy, %FS 5 0.25 0.00 -0.50 0 -100 0 Pressure, kPa 100 -0.50 -0.75 -0.75 -1.00 -1.00 -1.25 0 32 25 47 Temperature, °C °F Panasonic Corporation Circuit Components Buisiness Division industrial.panasonic.com/ac/e/ 0.00 -0.25 -0.25 1 0.25 –3– 50 122 -1.25 0 32 © Panasonic Corporation 2013 25 47 Temperature, °C °F 50 122 ASCTB244E 201303-T PS-A (ADP5) 2. Low pressure type 2. THB (high temperature high humidity bias test) ADP51B61 Drive voltage: 5V Temperature: 25°C 77°F Applied pressure: 0 to 6kPa ADP51B61 Within 85°C 185°F and 85% RH 5 V applied between No. 2 (Vdd) and No. 3 (GND) Applied pressure: 0kPa 1.00 4.5 4.0 0.80 4.3 3.0 2.0 Span voltage, V 5.0 Offset voltage, V Output voltage, V 1. Output voltage 0.60 0.40 0.20 1.0 0.0 0.0 3.0 Applied pressure, kPa 3.9 3.7 0.00 6.0 4.1 3.5 intial 100h 500h intial 100h 500h 4. Shock test Ambient temperature: 25°C 77°F → 0°C 32°F → 10°C 50°F → 60°C 140°F → 70°C 158°F ADP51B61 Shock applied: 981 m/s2, 3 times in x, y and z directions Applied pressure: 0kPa 4.50 1.00 0.80 4.30 0.80 0.60 0.40 0.20 Offset voltage, V 1.00 Span voltage, V Offset voltage, V 3. Ambient temperature characteristics 4.10 3.90 25 77 0 10 60 32 50 140 Temperature, °C °F 3.50 70 158 0.40 0.20 3.70 0.00 0.60 0.00 25 77 0 10 60 32 50 140 Temperature, °C °F 70 158 intial after test 5. Vibration test 1.00 4.50 4.30 0.80 4.30 4.10 3.90 3.70 Span voltage, V 4.50 Offset voltage, V Span voltage, V ADP51B61 Vibration applied: 10 to 55 Hz, amplitude: 1.5mm .059inch, x, y and z directions, 2 hrs each Applied pressure: 0kPa 0.60 0.40 0.20 3.50 after test 3.90 3.70 0.00 intial 4.10 3.50 intial after test intial after test intial 10cyc 6. Temperature/humidity cycle test ADP51B61 Exposed to 10 cycles in the temperature and humidity conditions given below. Applied pressure: 0kPa 1.00 4.50 0.80 4.30 25°C 77°F 2.5h 3h 2.5h 2.5h 3h 2.5h 1.5h −10°C 14°F 3.5h Time


95% RH 0% RH 25°C 77°F 3h Span voltage, V 65°C 149°F Offset voltage, V 1 cycle (24h) Temp. 65°C 149°F 0.60 0.40 0.20 3.90 3.70 0.00 3.50 intial 10cyc Panasonic Corporation Circuit Components Buisiness Division industrial.panasonic.com/ac/e/ 4.10 –4– © Panasonic Corporation 2013 ASCTB244E 201303-T PS-A (ADP5) 3. Evaluation test Endurance characteristics Tested condition Soldering resistance Passed Passed Passed Passed Temperature/humidity: 40°C 104°F, 90% RH; Operation times: 106, rated voltage applied Passed Dropping resistance Terminal strength Double amplitude: 1.5 mm .059 inch; Vibration: 10 to 55 Hz; Applied vibration direction: X, Y, Z 3 directions; Times: 2 hrs each Dropping height: 75 cm 29.528 inch; Times: 2 times Pulling strength: 9.8 N {1 kgf}, 10 sec.; Bending strength: 4.9 N {0.5 kgf}, left and right 90° 1 time Soldered in DIP soldering bath Temperature (DIP) Temperature: 230°C 446°F; Time: 5 sec. Temperature: 260°C 500°F; Time: 10 sec. Vibration resistance Mechanical characteristics Result Temperature: Left in a 85°C 185°F constant temperature bath; Time: 100 hrs. Temperature: Left in a –20°C –4°F constant temperature bath; Time: 100 hrs. Temperature/humidity: Left at 40°C 104°F, 90% RH; Time: 100 hrs. Temperature: –20°C to 85°C –4°F to 185°F; 1 cycle: 30 min.; Times of cycle: 100 The CAD data of the products with a CAD Data DIMENSIONS (mm inch) 1. Standard type S Package (Pressure inlet hole length: 3mm .118inch) ADP51∗0 CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/ General tolerance: ±0.3 ±.012 Recommended PC board pattern 6-0.9 dia. 6-.035 dia. Pressure inlet hole 2.2 dia. .087 dia. 7.0 .276 GND NU NU 7.2 .283 2.5 .098 4-R0.7 4-R.028 1 2 3 Vcc (5V DC) Vout 0.5 .020 2.5 .098 Atmospheric pressure inlet hole C GND 9.5 .374 2.5 .098 6 5 4 0.25 .010 GND NU NU JAPAN Terminal No. 1 2 3 4 5 6 7.2 .283 Vcc NU Vout 7.0 .276 2. Standard/Economy type M Package (Pressure inlet hole length: 5mm .197inch) ADP51∗1/ADP51A11 CAD Data Name Vcc (Power supply [+]) NU (Not usable) Vout (Output) NU (Not usable) NU (Not usable) GND (Ground) Recommended PC board pattern Vcc NU Vout ia. .9 d ia. 6-0.035 d 6 Pressure inlet hole 2.2 dia. .087 dia. 7.0 .276 GND NU NU 3.0 dia. .118 dia. 2.5 .098 Terminal connection diagram R0.2 1.8 R.008 .071 3.0 6.5 .118 .256 Passed Passed Passed Passed Vcc NU Vout 3.0 dia. .118 dia. Passed 7.5 .295 Environmental characteristics Tested item Storage at high temperature Storage at low temperature Humidity resistance Temperature cycle High temperature/high humidity operation 7.2 .283 2.5 .098 4-R0.7 4-R.028 R0.2 R.008 5.0 8.5 .197 .335 2.5 .098 7.5 .295 Classification Terminal connection diagram 1 2 3 Vcc (5V DC) Vout 1.8 .071 C 0.5 .020 2.5 .098 Atmospheric pressure inlet hole 2.5 .098 0.25 .010 GND NU NU JAPAN GND 7.2 .283 Vcc NU Vout 7.0 .276 Panasonic Corporation Circuit Components Buisiness Division industrial.panasonic.com/ac/e/ 6 5 4 9.5 .374 –5– Terminal No. 1 2 3 4 5 6 © Panasonic Corporation 2013 Name Vcc (Power supply [+]) NU (Not usable) Vout (Output) NU (Not usable) NU (Not usable) GND (Ground) ASCTB244E 201303-T PS-A (ADP5) 3. Low pressure type M Package (Pressure inlet hole length: 5mm .197inch) ADP51B61 General tolerance: ±0.3 ±.012 Recommended PC board pattern CAD Data 2.54 .100 P2.54×3=7.62 P.100×3=.300 P2.54×3=7.62 P.100×3=.300 8-1.2 dia. 8-.047 dia. Pressure inlet hole 13.97 .550 10.4 .409 2.54 .100 10.4 .409 Terminal connection diagram 3.0 dia. .118 dia. 14.0 .551 8 7 6 5 R0.5 R.020 P/N,Lot 1B61 70124 5.0 .197 10.7 .421 JAPAN 0.25 .010 0.76 .030 2.7 .106 1 2 3 4 0.01 µF 1.0 µF NU Vcc Gnd Vout Atmospheric pressure inlet hole Terminal No. 1 2 3 4 5 6 7 8 NU NU NU NU 4. Low pressure type L Package (Pressure inlet hole length: 13.5mm .531inch) ADP51B62 Name NU (Not usable) Vcc (Power supply [+]) GND (Ground) Vout (Output) NU (Not usable) NU (Not usable) NU (Not usable) NU (Not usable) Recommended PC board pattern CAD Data 2.54 .100 P2.54×3=7.62 P.100×3=.300 P2.54×3=7.62 P.100×3=.300 8-1.2 dia. 8-.047 dia. Pressure inlet hole 13.97 .550 10.4 .409 2.54 .100 10.4 .409 14.0 .551 R0.5 R.020 C0.3 R.012 8 7 6 5 (13.6) (.535) 19.3 .760 P/N,Lot Terminal connection diagram 5.45 dia. .215 dia. 1B61 70124 JAPAN 1 2 3 4 0.25 .010 0.76 .030 2.7 .106 0.01 µF 1.0 µF NU Vcc Gnd Vout Terminal No. 1 2 3 4 5 6 7 8 Atmospheric pressure inlet hole NU NU NU NU Panasonic Corporation Circuit Components Buisiness Division industrial.panasonic.com/ac/e/ –6– © Panasonic Corporation 2013 Name NU (Not usable) Vcc (Power supply [+]) GND (Ground) Vout (Output) NU (Not usable) NU (Not usable) NU (Not usable) NU (Not usable) ASCTB244E 201303-T PS-A (ADP5) 5. Low pressure type P Package (Pressure inlet hole length: 15.6mm .614inch) ADP51B63 General tolerance: ±0.3 ±.012 Recommended PC board pattern CAD Data P2.54×3=7.62 P.100×3=.300 2.54 .100 Pressure inlet hole Atmospheric pressure inlet hole P2.54×3=7.62 P.100×3=.300 8-1.2 dia. 8-.047 dia. 13.97 .550 10.4 .409 2.54 .100 10.4 .409 Terminal connection diagram 8 7 6 5 14.0 .551 5.45 dia. .215 dia. 3 dia. .118 dia. 20.2 .795 P/N, Lot 15.6 .614 5.6 .220 1 2 3 4 1B63 120215 0.01 µF 1.0 µF JAPAN 0.25 .010 0.76 .030 3.3 .130 Terminal No. 1 2 3 4 5 6 7 8 1 2 3 4 NU Vcc Gnd Vout NU NU NU NU 8 7 6 5 Panasonic Corporation Circuit Components Buisiness Division industrial.panasonic.com/ac/e/ –7– © Panasonic Corporation 2013 Name NU (Not usable) Vcc (Power supply [+]) GND (Ground) Vout (Output) NU (Not usable) NU (Not usable) NU (Not usable) NU (Not usable) ASCTB244E 201303-T PS-A (ADP5) NOTES 1. Mounting Use lands on the printed-circuit boards to which the sensor can be securely fixed. 2. Soldering Due to its small size, the thermal capacity of the pressure sensor DIP type is low. Therefore, take steps to minimize the effects of external heat. Damage and changes to characteristics may occur due to heat deformation. Use a non-corrosive resin type of flux. Since the pressure sensor DIP type is exposed to the atmosphere, do not allow flux to enter inside. 1) Manual soldering • Set the soldering tip from 260 to 300°C 500 to 572°F (30W), and solder for no more than 5 seconds. • Please note that output may change if the pressure is applied on the terminals when the soldering. • Thoroughly clean the soldering iron. 2) DIP soldering (DIP terminal type) • Please keep the DIP solder bath temperature no higher than 260°C 500°F. When soldering, heat should be applied no longer than five seconds. • When mounting onto a PCB of low thermal capacity, please avoid DIP soldering as this may cause heat deformity. 3) Solder reworking • Finish reworking in one operation. • For reworking of the solder bridge, use a soldering iron with a flat tip. Please do not add more flux when reworking. • Please use a soldering iron that is below the temperature given in the specifications in order to maintain the correct temperature at the tip of the soldering iron. 4) Too much force on the terminals will cause deformation and loss in effectiveness of the solder. Therefore, please avoid dropping and careless handling of the product. 5) Please control warping of the PCB within 0.05 mm of the sensor width. 6) When cut folding the PCB after mounting the sensor, take measures to prevent stress to the soldered parts. 7) The sensor terminals are designed to be exposed, so contact of the terminals with metal shards and the like will cause output errors. Therefore, please be careful and prevent things such as metal shards and hands from contacting the terminals. 8) To prevent degradation of the PCB insulation after soldering, please be careful not to get chemicals on the sensor when coating. 9) Please consult us regarding the use of lead-free solder. 3. Connections 1) Please perform connections correctly in accordance with the terminal connection diagram. In particular, be careful not to reverse wire the power supply as this will cause damage or degrade to the product. 2) Do not connect terminals that are not used. This can cause malfunction of the sensor. 4. Cleaning 1) Since the pressure sensor chip is exposed to the atmosphere, do not allow cleaning fluid to enter inside. 2) Avoid ultrasonic cleaning since this may cause breaks or disconnections in the wiring. 5. Environment 1) Please avoid using or storing the pressure sensor chip in a place exposed to corrosive gases (such as the gases given off by organic solvents, sulfurous acid gas, hydrogen sulfides, etc.) which will adversely affect the performance of the pressure sensor chip. 2) To ensure resistance to power supply superimposed noise, you must provide a capacitor at the power supply input terminal of the sensor in order to stabilize the power supply voltage. We recommend to provide 0.1 µF and 1,000 pF capacitor in parallel. Please confirm the noise resistance with the actual equipment and choose adequate capacitor. 3) Since the internal circuitry may be destroyed if an external surge voltages is supplied, provide an element which will absorb the surges. 4) Malfunctioning may occur if the product is in the vicinity of electrical noise such as that from static electricity, lightning, a broadcasting station, an amateur radio, or a mobile phone. 5) Since this pressure sensor chip does not have a water-proof construction, please do not use the sensor in a location where it may be sprayed with water, etc. 6) Avoid using the pressure sensors chip in an environment where condensation may form. Furthermore, its output may fluctuate if any moisture adhering to it freezes. 7) The pressure sensor chip is constructed in such a way that its output will fluctuate when it is exposed to light. Especially when pressure is to be applied by means of a transparent tube, take steps to prevent the pressure sensor chip from being exposed to light. 8) Avoid using the pressure sensor chip where it will be susceptible to ultrasonic or other high-frequency vibration. Panasonic Corporation Circuit Components Buisiness Division industrial.panasonic.com/ac/e/ –8– 6. Quality check under actual loading conditions To assure reliability, check the sensor under actual loading conditions. Avoid any situation that may adversely affect its performance. 7. Other handling precautions 1) That using the wrong pressure range or mounting method may result in accidents. 2) The only direct pressure medium you can use is dry air. The use of other media, in particular, corrosive gases (organic solvent based gases, sulfurous acid based gases, and hydrogen sulfide based gases, etc.) and media that contains moisture or foreign substances will cause malfunction and damage. Please do not use them. 3) The pressure sensor chip is positioned inside the pressure inlet hole. Never poke wires or other foreign matter through the pressure inlet hole since they may damage the chip or block the inlet hole. Avoid use when the atmospheric pressure inlet is blocked. 4) Use an operating pressure which is within the rated pressure range. Using a pressure beyond this range may cause damage. 5) Since static charge can damage the pressure sensor chip, bear in mind the following handling precautions. (1) When storing the pressure sensor chips, use a conductive material to short the pins or wrap the entire chip in aluminum foil. Plastic containers should not be used to store or transport the chips since they readily become charged. (2) When using the pressure sensor chips, all the charged articles on the bench surface and the work personnel should be grounded so that any ambient static will be safely discharged. 6) Based on the pressure involved, give due consideration to the securing of the pressure sensor DIP type and to the securing and selection of the inlet tube. Consult us if you have any queries. 7) When coating a PC board after mounting the pressure sensor, be sure to prevent the material from entering the pressure inlet hole or atmospheric pressure inlet hole. Use an elastic resin for coating to avoid expansion and contraction due to heat, which apply stress to the sensor. Please carefully examine the usability. © Panasonic Corporation 2013 ASCTB244E 201303-T