Operational Amplifier
AN1101SSM
CMOS single power supply
■ Overview
0.20+0.10
-0.05
0.20
AN1101SSM is an operational amplifier with a single
power supply by CMOS diffusion process.
It has low current-consumption compared to general
purpose operational amplifier by bipolar diffusion process.
0 V to VDD is available for both input voltage and output
voltage. And this IC is widely applicable to the butterydriven equipment and to many amplifier circuits which
adopt small package products.
4
1.60±0.10
1.20±0.10
5
0.20
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3
0.50 0.50
1.00±0.10
1.60±0.10
0.60 max.
0 to 0.10
• Low current-consumption: IDD = 55 µA (typ.), VDD = 3 V
• Operating input/output voltage range: 0 V to VDD
• Small offset voltage: 0.5 mV (typ.)
• Small input bias current: 1 pA (typ.)
• Operating supply voltage range:
2.5 V to 5.5 V or ±1.25 V to ±2.75 V
■ Applications
1
0.10
1
2
5
0.08+0.10
-0.05
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■ Features
Unit: mm
0.10 M
Seating plane
3
4
SSMINI-5DA (Lead-free package)
• Various small-size general consumer electronics equipment
VDD
VIN−
5
4
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■ Block Diagram
Ma
■ Pin Descriptions
Pin No.
Symbol
1
VOUT
2
GND (VSS)
3
VIN+
Input (positive)
4
VIN−
Input (negative)
5
VDD
Power supply
1
2
3
VOUT
GND
(VSS)
VIN+
Description
Output
Ground, VSS (negative supply) at using two power supply
Note) The AN1101SSM has been designed for general consumer electronics equipment, not for the specific one requiring such a
high reliability that may prevent it from threatening the human lives.
Publication date: August 2002
SFB00001CEB
1
AN1101SSM
■ Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Supply voltage
VDD
5.6
V
Differential input voltage
DVIN
±5.6
V
VIN
VSS to VDD
V
IDD
mA
PD
50
mW
Topr
−30 to +85
°C
Tstg
−55 to +125
°C
Input voltage
Supply current
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Power dissipation
*2
Operating ambient temperature
Storage temperature
*1
*1
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Note) 1. *1: Except for the operating ambient temperature and storage temperature, all ratings are for Ta = 25°C.
*2: The value at Ta = +85°C.
2. This IC is not suitable for car electrical equipment.
■ Recommended Operating Range
Parameter
Supply voltage
Symbol
Range
Unit
VDD
2.5 to 5.5
V
±1.25 to ±2.75
■ Electrical Characteristics at VDD = 3.0 V, VSS = GND, Ta = 25°C ± 2°C
Parameter
Symbol
Input offset voltage
VIO
Common-mode input voltage
CMVIN
Conditions
Min
Typ
Max
Unit
Buffer circuit
0.5
5.5
mV
RS = 10 kΩ, RF = 10 kΩ
0
3
V
GV
f = 100 Hz
60
90
dB
Maximum output amplitude voltage 1
VOH
RL ≥ 10 kΩ
2.90
2.98
V
VOL
ue
Open-loop gain
RL ≥ 10 kΩ
0.01
0.05
V
Common-mode input voltage
rejection ratio
CMRR
VIN = 0.0 V to 3.0 V, RS = RF = 10 kΩ
50
65
dB
Supply voltage ripple rejection ratio *
SVRR
VDD = 2.5 V to 5.5 V
55
70
dB
No load
55
100
µA
en
Supply current
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Maximum output amplitude voltage 2
IDD
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Note) * : Except for the supply voltage ripple rejection ratio (SVRR), VDD = 3 V.
• Design reference data
Note) The characteristics listed below are theoretical values based on the IC design and are not guaranteed.
Parameter
2
Symbol
Conditions
Reference
Unit
Offset current
IO
1
pA
Input bias current
IIO
1
pA
Slew rate
SR
RL ≥ 10 kΩ
0.35
V/µs
Zero-cross frequency
fT
AV = 1
0.8
MHz
SFB00001CEB
AN1101SSM
■ Technical Data
• PD Ta curve of SSMINI-5DA
PD Ta
0.200
0.150
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Power dissipation PD (W)
Independent IC
without a heat sink
Rth( j-a) = 833.3°C/W
0.120
0.050
0.000
0
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0.100
25
• Main characteristics
50
100
125
Ambient temperature Ta (°C)
Supply current Supply voltage
80
Low-level output voltage Output flow-in current
60
50
40
Low-level output voltage VOL (V)
1.2
70
Buffer circuit
VIN+ = VDD / 2
No load
ue
30
20
ce
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on
tin
Supply current IDD (µA)
75 85
10
0
2.5
3
3.5
4
4.5
5
5.5
an
Supply voltage VDD (V)
1.0
0.8
0.6
0.4
0.2
0
6
0
1
2
en
int
4
5
Slew rate SR
Buffer circuit
VDD = 3 V
No load
3V
Ma
High-level output voltage VOL (V)
2.8
3
Output flow-in current IO (mA)
High-level output voltage Output flow-out current
3.0
Buffer circuit
VDD = 3 V
VIN+ = 0 V
Input
2V
2.6
1V
2.4
0V
2.2
3V
2.0
Output
Buffer circuit
VDD = 3 V
VIN+ = 3 V
1.8
2V
1V
1.6
0V
0
0
1
2
3
4
5
0
Output flow-out current −IO (mA)
10
20
30
40
50
(µs)
SFB00001CEB
3
AN1101SSM
■ Technical Data (continued)
• Main characteristics (continued)
Offset voltage Ambient temperature
Supply current Ambient temperature
3
80
Buffer circuit
VDD = 3 V
VIN+ = VDD / 2
Buffer circuit
VDD = 3 V
VIN+ = VDD / 2
Supply current IDD (µA)
70
1
60
50
M
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Offset voltage VIO (mV)
2
0
−1
−3
30
20
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−2
40
10
−50
−25
0
25
50
75
Ambient temperature Ta (°C)
0
−50
100
VDD = 3 V
AV = 40 dB
No load
50
180
135
Phase
90
Phase ( ° )
Voltage gain (dB)
40
30
45
Voltage gain
20
0
10
−45
0
−20
100 2k
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−10
10k
100k
1M
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Frequency f (Hz)
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■ Application Circuit Example
10M
VDD
0.1 µF
5
1
VIN−
4
2
VOUT
3
VIN+
GND
(VSS)
4
0
25
50
Ambient temperature Ta (°C)
Voltage gain · Phase Frequency characteristics
60
−25
SFB00001CEB
75
100
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semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
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(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
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(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.