AN17808B

Panasonic Semiconductor Singapore A Division of Panasonic Semiconductor Asia Pte Ltd Company Registration No. 197803125E 22, Ang Mo Kio Industrial Park 2, Singapore 569506. Tel: (65)64818811 Fax: (65)64816486 DOCUMENT COVER PAGE Note: This cover page establishes the Doc No., Title and current status of the attached document. Doc No. SDSC-PSE-AN17808B Doc Title Product Specifications for AN17808B Issue Level 1 Rev 4 Total no. of pages (excluding this page) Eff Date 28-MAR-05 14 Revision History Issue Rev Eff Date S/N Page 1 2 3 4-NOV-04 15-DEC-04 Change Details Remarks Added this cover page. 1 - 2 7A Added this page for leadfree specification. 1 2 7 7A Removed this page. Amended Outer Lead Surface Process & Chip Mounting Method. 4 28-MAR-05 1 6 Removed physical product marking indications. FMSC-GEN-M1-01 Prepared Lim Fuey Sheen Checked Kenneth Law Product Specifications AN17808B Approved Yasuo Higuchi Package Name 12-SIL(FP) Ref No. E Total Page 14 Page No. 6 FP-12S Unit : mm 6.4 ± 0.3 7.7 ± 0.3 7.8 ± 0.3 *4 Eff. Date Eff. Date Eff. Date 29.6 ± 0.3 3.5 ± 0.3 1.2 ± 0.1 +0.1 0.25 -0.05 1 2.54 0.6 R1.8 0.6 ± 0.1 20.0±0.1 28.0 ± 0.3 29.96 ± 0.3 12 ∅ 3.6 Eff. Date 28-MAR-05 FMSC-PSDA-002-01 REV 1 Semiconductor Company, Matsushita Electric Industrial Co., Ltd. Prepared Lim Fuey Sheen Checked Kenneth Law Product Specifications (Leadfree) AN17808B Approved Yasuo Higuchi Ref No. F Total Page 14 Page No. 7A (Structure Description) Chip surface passivation SiN, PSG, Others ( ) 1 Lead frame material Fe group, Cu group, Others ( ) 2 , 6 Inner lead surface process Ag plating, Au plating, Others ( ) 2 *3 Outer lead surface process Solder plating (98Sn-2Bi), Solder dip, Others ( ) 6 *3 Chip mounting method Ag paste, Wire bonding method Solder (95.5Pb-2.5Ag-2Sn)** 3 Thermalsonic bonding, Others ( ) 4 Wire material Au, Others ( ) 4 Mold material Epoxy, Others ( ) 5 Molding method Transfer mold, Multiplunger mold, Others ( ) 5 Fin material Cu group, Others ( ) 7 Package FP-12S Au-Si alloy, **Under RoHS exemption clause, Lead (Pb) in high melting temperature type solder (i.e. tin-lead solder alloys containing more than 85% of lead), is exempted until 2010. 1 5 6 3 4 2 7 *3 Eff. Date Eff. Date FMSC-PSDA-002-01 REV 1 - Eff. Date Eff. Date 4-NOV-04 15-DEC-04 Semiconductor Company, Matsushita Electric Industrial Co., Ltd.