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Part No.
Publication date: October 2008
AN17820B
Package Code No.
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DATA SHEET
HSIP012-P-0000L
SDB00167BEB
1
AN17820B
Contents
Overview ………………………………………………….…………………………………………………………. 3
Features ………………………………………………….…………………………………………………………. 3
Applications ……….………………………………………………………………………………………………… 3
Package ……………………………………………………………………………………………………………. 3
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Type …………………………………...……………………………………………………………………………. 3
Application Circuit Example ……………………………………………………………………………………… 4
…………………………………….……………………………………………………………… 4
Pin Descriptions
…………………..………………………………………………………………………………. 5
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Block Diagram
Absolute Maximum Ratings ……………………..……………..…………………………………………………. 6
Operating Supply Voltage Range …………..……………………………………………………………………. 6
Electrical Characteristics
………………….………………….………………….………………………………. 7
Electrical Characteristics (Reference values for design) ………………….………………….………………. 7
Technical Data …………………………………….………………….……………………………………………. 8
• I/O block circuit diagrams and pin function descriptions
…………........……………………………………. 8
• Application information …........................………………..………….…………………………………………. 10
• PD ⎯ Ta diagram
…………........………….………………….…………………………………………………. 13
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Usage Notes ……….…..…………………….………………….…………………………………………………. 14
SDB00167BEB
2
AN17820B
AN17820B
Dual channel BTL 7.5 W audio power amplifier with volume and standby
control
Overview
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AN17820B is a monolithic integrated circuit designed for 7.5 W × 2-ch (8 Ω) output audio power amplifier. It is a dual channel
BTL IC suitable for stereo operation in TV application.
y Built-in stand-by circuit
y Built-in volume circuit
Applications
y ICs for low frequency amplifier
Package
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Features
y 12 pin plastic single inline package with heat sink (SIP type)
Type
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y Silicon monolithic bipolar IC
SDB00167BEB
3
AN17820B
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Application Circuit Example
1
2
3
4
5
6
7
8
C4
1.0 μF
R2
270 kΩ
C3
10 μF
C2
100 nF
SP 8 Ω
10
11
12
C5
1.0 μF
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C1
470 μF
9
R3
10 kΩ
R4
10 kΩ
SP 8 Ω
68 kΩ
VCC
Standby
Vin1
Vin2
Volume
5V
0V
Standby pin
IC
0V
Off
5V
On
1.25 V
0V
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Note) This application circuit is shown as an example but does not guarantee the design for mass production set.
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Block Diagram
+
1
VCC
_
2
_
3
+
+
4
5
6
Output
GND
7
Input
GND
8
9
_
10
_
11
+
12
Output
GND
Note) This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be simplified.
SDB00167BEB
4
AN17820B
Pin Descriptions
Pin No.
Pin name
Type
Description
1
VCC
2
OUT1(+)
Output
Channel 1 positive phase output
3
GND(OUT1)
Ground
GND for channel 1 output
4
OUT1(–)
Output
Channel 1 negative phase output
VCC
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Power supply
5
Standby
Input
Standby
6
IN1
Input
Channel 1 input
7
GND (Input)
8
IN2
Input
Channel 2 input
9
Volume
Input
Volume
10
OUT2(–)
Output
Channel 2 negative phase output
11
GND(OUT2)
Ground
GND for channel 2 output
12
OUT2(+)
Output
Channel 2 positive phase output
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Input GND
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Ground
SDB00167BEB
5
AN17820B
Absolute Maximum Ratings
A No.
Parameter
Symbol
Rating
Unit
Note
Supply voltage
VCC
24.0
V
*1, *2
2
Supply current
ICC
4.0
A
—
3
Power dissipation
PD
1 904
mW
*3
4
Operating ambient temperature
Topr
–25 to +70
°C
*4
5
Storage temperature
Tstg
–55 to +150
°C
*4
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Note) *1: The range under absolute maximum ratings, power dissipation.
*2: No signal input.
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*3: Power dissipation shows the value of only package at Ta = 70°C.
When using this IC, refer to the • PD – Ta diagram in the Technical Data and use under the condition not exceeding the allowable value.
*4: Expect for the storage temperature and operating ambient temperature, all ratings are for Ta = 25°C.
Operating Supply Voltage Range
Parameter
Supply voltage range
Symbol
Range
Unit
Note
VCC
5.0 to 18.0
V
—
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Note) The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
SDB00167BEB
6
AN17820B
Electrical Characteristics at VCC = 12.0 V
Note) Unless otherwise specified, Ta = 25°C±2°C, Frequency = 1 kHz, RL = 8 Ω.
B
No.
Parameter
Symbol
Conditions
Limits
Min
Typ
Max
Unit
No
te
Quiescent circuit current
ICQ
Vin = 0 V, Vol = 0 V
—
45
100
mA
—
2
Standby current
ISTB
Vin = 0 V, Vol = 0 V
—
1
10
μA
—
3
Output noise voltage
VNO
Vol = 0 V, Rg = 10 kΩ
—
0.25
0.6
mV[rms]
*
4
Voltage gain
GV
PO = 1.0 W, Vol = 1.25 V
38
40
42
dB
—
5
Total harmonic distortion
THD
PO = 1.0 W, Vol = 1.25 V
—
0.15
0.5
%
—
6
Maximum power output 1
PO1
THD = 10%, Vol = 1.25 V
6.0
7.5
—
W
—
7
Maximum power output 2
PO2
VCC = 15 V,
THD = 10%, Vol = 1.25 V
10.0
12.5
—
W
—
8
Ripple rejection ratio
RR
Rg = 10 kΩ, Vol = 0 V,
Vr = 1 V[rms], fr = 120 Hz
30
50
—
dB
*
9
Output offset voltage
VOFF
Vol = 0 V, Rg = 10 kΩ
–350
0
350
mV
—
10
Volume attenuation ratio
Att
PO = 1.0 W, Vol = 0 V
70
80
—
dB
*
11
Channel balance 1
CB1
PO = 1.0 W, Vol = 1.25 V
–1
0
1
dB
—
12
Channel balance 2
CB2
PO = 1.0 W, Vol = 0.6 V
–2
0
2
dB
—
13
Middle voltage gain
Gvm
PO = 1.0 W, Vol = 0.6 V
26.5
29.5
32.5
dB
—
14
Channel crosstalk
CT
PO = 1.0 W, Vol = 1.25 V
40
55
—
dB
—
Unit
No
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Note) *: For this measurement, use the BPF = 15 Hz to 30 kHz (12 dB/OCT).
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Electrical Characteristics (Reference values for design) at VCC = 12.0 V
B
No.
Parameter
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Note) Unless otherwise specified, Ta = 25°C±2°C, Frequency = 1 kHz, RL = 8 Ω.
The characteristics listed below are reference values for design of the IC and are not guaranteed by inspection.
If a problem does occur related to these characteristics, Panasonic will respond in good faith to user concerns.
Symbol
Limits
Conditions
Min
Typ
Max
15
Standby pin current
ISTB2
Vin = 0 V, VSTB = 3.0 V
—
—
25
μA
—
16
Volume pin current
IVOL
Vin = 0 V, Vol = 0 V
–12
—
—
μA
—
17
Input impedance
Vin = ±0.3 VDC
24
30
36
kΩ
—
Zi
SDB00167BEB
7
AN17820B
Technical Data
• I/O block circuit diagrams and pin function descriptions
Note) The characteristics listed below are reference values based on the IC design and are not guaranteed.
Pin
No.
DC bias
Internal circuit
1
12 V typ.
—
Description
Power supply pin.
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1
Driver Cct
Pre Amp
VCC / 2
Channel 1 positive output pin
500
3
29k
VCC / 2
3
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2
2
—
0V
Ground for channel 1 output
1
Driver Cct
Pre Amp
4
VCC / 2
4
Channel 1 negative output pin
500
3
29k
ue
VCC / 2
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1
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5 V typ.
2k
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25k
15k
Standby control pin
Standby "ON" = 0 V
Standby "OFF" = 5 V
30k
Pl
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2k
7
VREF
6
28.65k
1.45 V
6
Channel 1 input pin.
1k
7
SDB00167BEB
8
AN17820B
Technical Data (continued)
• I/O block circuit diagrams and pin function descriptions (continued)
Note) The characteristics listed below are reference values based on the IC design and are not guaranteed.
Pin
No.
DC bias
Internal circuit
7
0V
—
Description
Input ground
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VREF
28.65k
1.45 V
Channel 2 input pin
1k
8
7
1
9
—
1k
9
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8
Volume control pin
Volume "OFF" = 0V
Max. Volume = 1.25 V
8k
7
ue
1
Driver Cct
isc
VCC / 2
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10
29k
Ma
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VCC / 2
—
Ground for channel 2 output
Pl
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0V
Channel 2 negative output pin
11
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500
11
10
on
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Pre Amp
Driver Cct
12
VCC / 2
Pre Amp
1
12
Channel 2 positive output pin
500
11
29k
VCC / 2
SDB00167BEB
9
AN17820B
Technical Data (continued)
y Application information
ESR
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1. Supply decoupling
To ensure a stable supply and achieve better ripple rejection, decoupling capacitors need to be connected to VCC (Pin 1).
Decoupling capacitors should have small equivalent series resistance (ESR). This is to prevent resistive losses and
introduction of undesirable phase shift to internal circuit.
A ceramic capacitor of 100 nF in parallel with a non-ceramic (tantalum or aluminum electrolytic) capacitor of 470 μF are
suggested. This combination has a small ESR over a wide frequency range.
Although small in size and ESR, large valued ceramic capacitor is not advisable to use. Current surges during power On/Off
might store energy in the inductances of the power leads, and a large voltage spike could be created when the stored energy is
transferred from the inductances to the ceramic capacitor. The amplitude of the spike could exceed twice the supply voltage.
Fig. 1. Practical capacitor
2. Standby operation
Standby pin should be connected with carefully selected components in order to avoid "pop noise" during Standby On/Off
transient.
The 68 kΩ resistor and 10 μF capacitor pair can delay the rising of voltage at pin 5 to reach the Standby threshold. When
standby is switching on together with supply, this delay would be very useful to ensure no "pop noise".
If the standby voltage is provided by a microcontroller, the suppression of "Pop" could even be better.
The microcontroller can set a delay of 100 ms to 200 ms between the supply and Standby On/Off.
The 68 kΩ and 270 kΩ resistor also from a voltage divider, which determines the Standby threshold.
5
STB
68 kΩ
10 μF
Output
Fig. 3. Standby On/Off logic
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Fig. 2. Standby circuit
STB
ue
270 kΩ
VCC
1 μF
Vin
6
10 kΩ
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3. Input DC decoupling
Before the input signal reaches differential amplifier stage, its DC component should be remove.
The capacitor of 1 μF pass only AC signal and the 10 kΩ resistor forms a DC path to ground.
The 1 nF capacitor in parallel to the 10 kΩ resistor is optional and it serves to filter out high frequency noise at the input.
1 nF
Fig. 4. Input DC decoupling
SDB00167BEB
10
AN17820B
Technical Data (continued)
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y Application information (continued)
4. Output zobel network
It should be noted that this device is designed such that the zobel network (RC pair) at the output pins is not necessary for
stable operation.
In practical application, the zobel network may be applied optionally for two reasons:
a) Ensuring stability for different PCB layout and speaker types.
b) Ability to withstand to high ESD
2
4
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Good PCB layout can improve chip's performances.
To reduce stray capacitances at the inputs and outputs, external components are to be placed as close to the pins as possible.
PCB traces conducting huge current, such as those connected to supply or outputs, should be kept short and wide. This will
keep inductances low and resistive loss to a minimum.
The layout of test board is as shown below.
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Fig. 5. Output zobel network
SDB00167BEB
11
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Supply voltage (V)
Conditions: Frequency = 1 kHz, RL = 8 Ω
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Output power per channel (W)
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AN17820B
Technical Data (continued)
y Application information (continued)
6. Output power (W) ⎯ Supply voltage (V)
SDB00167BEB
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AN17820B
Technical Data (continued)
• PD ⎯ Ta diagram
SDB00167BEB
13
AN17820B
Usage Notes
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1. This IC is intended to be used for general electronic equipment.
Consult our sales staff in advance for information on the following applications:
x Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may
directly jeopardize life or harm the human body.
x Any applications other than the standard applications intended.
(1) Space appliance (such as artificial satellite, and rocket)
(2) Traffic control equipment (such as for automobile, airplane, train, and ship)
(3) Medical equipment for life support
(4) Submarine transponder
(5) Control equipment for power plant
(6) Disaster prevention and security device
(7) Weapon
(8) Others: Applications of which reliability equivalent to (1) to (7) is required
2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might
smoke or ignite.
3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In
addition, refer to the Pin Description for the pin configuration.
4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solderbridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because
the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during
transportation.
5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin
– VCC short (power supply fault), output pin – GND short (ground fault), output-to-output-pin short (load short), or pin shift and,
safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke
emission will depend on the current capability of the power supply.
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6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
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7. When using the LSI for new models, verify the safety including the long-term reliability for each product.
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8. When the application system is designed by using this LSI, be sure to confirm notes in this book.
Be sure to read the notes to descriptions and the usage notes in the book.
9. Ground the radiation fin so that there will be no difference in electric potential between the radiation fin and ground.
10. The thermal protection circuit operates at a Tj of approximately 150°C. The thermal protection circuit is reset automatically when
the temperature drops.
11. Make sure that the heat radiation design is effective enough if the VCC is comparatively high or the IC operates at high output
power.
12. Connect only ground pin for signal sources to the signal GND pin of the amplifier on the previous stage.
13. For installation to heat-sink, grease for heat-sink should be applied to reduce the contact heat resistance and increase the radiating
effect. Ensure that there is no foreign objects between IC and heat-sink which may cause cracks and additional stress to the IC.
SDB00167BEB
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AN17820B
Usage Notes (continued)
14. The IC should be mounted onto a flat-surfaced heat-sink first, in a manner where little stress is applied, then solder the leads on
the IC to the board.
15. If the tightening torque of the heat-sink is too low, the heat resistance will become large. If it is too high, the physical device will
be distorted which might result in a failure. The tightening torque recommended is 78.5N.cm.
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16. Fasten the heat-sink firmly on the chassis or board. Do not create a structure where the heat-sink is supported by the IC.
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17. The protection circuit is for maintaining safety against an abnormal operation. Therefore, design the protection circuit such that it
should not operate during normal operation. Especially for the over-temperature protection circuit, if the area of safe operation or
the absolute maximum rating is momentarily exceeded by output pin to VCC short, or output pin to GND short (ground fault), the
LSI might be damaged before the over-temperature protection circuit starts working.
18. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not applied to the pins
because the device might be damaged, which could happen due to negative voltage or excessive voltage generated during the ON
and OFF timing when the inductive load of a motor coil or actuator coils of optical pick-up is being driven.
19. Check the risk that is caused by the failure of external components.
20. In the event of abnormal operation condition whereby the output terminals swing towards supply / ground, the destruction of the
speaker may result. As such, please ensure that the rating of the speaker is appropriate and made of non-flammable material.
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21. In the event of abnormal condition whereby the output terminals are short-circuit to ground or VCC terminal, very high heat
dissipation may occur resulting in heat transfer directly or indirectly to peripheral components. Please consider non-flammable
materials for the peripheral components or setup including the PCB.
SDB00167BEB
15
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
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(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
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(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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