AN41402A-PL

DATA SHEET Part No. AN41402A Package Code No. UBGA022-W-2030AEA Publication date: August 2010 Ver. AEB 1 AN41402A Contents „ Overview …………………………………………………….……………………………………………………… 3 „ Features ………………………………………………….………………………………………………………… 3 „ Applications ………………………………………………….……………………………………………………… 3 „ Package ………………………………………………….…………………………………………………………. 3 „ Type ……………………………………………………….…………………………………………………………. 3 „ Application Circuit Example (Block Diagram) …………………………………………………………………… 4 „ Pin Descriptions ………………………………………….………………………………………………………… 5 „ Pin Configuration …………………………………………………………………………………………………… 5 „ Absolute Maximum Ratings ……………………………….……………………………………………………… 6 „ Operating Supply Voltage Range …………………….…………………………………………………………… 6 „ Allowable Current and Voltage Range …………………………………………………………………………… 7 „ Electrical Characteristics …………….…………………………………………………………………………… 8 „ Electrical Characteristics (Reference values for design) ………………………………………………………. 9 „ Control Pin Mode Table ………………………….………………………………………………………………… 10 „ Technical Data ………………………………………….………………………………………………………….. 11 y I/O block circuit diagrams and pin function descriptions ………………………………………………………. 11 y Reference data ……………………………………………………………………………………………………. 13 y PD ⎯ Ta diagram …………………………………………………………………………………………………. 14 „ Usage Notes ………………………………………….……………………………………………………………. 15 y Special attention and precaution in using ……………………………………………………………………… 15 y Notes of Power LSI ………………………………………………………………………………………………. 16 y Notes of This LSI …………………………………………………………………………………………………. 17 Ver. AEB 2 AN41402A AN41402A 2-ch Motor drive IC „ Overview The AN41402A is a 2-ch motor drive IC. This IC features a low ON resistance and wide operating supply voltage range. It is possible to shrink the mounting area by adopting the wafer level chip size package. „ Features y 2-ch motor drive IC y Forward reverse drive is possible y It is possible to drive not only a motor but also an actuator y Low ON resistance : 0.4 Ω (Upper and Lower) y Operating supply voltage range : 2.7 V to 5.5 V (for control circuit) 2.0 V to 13.8 V (for motor drive) y Downsizing by adopting an Wafer Level Chip Size Package y Additional features : Built-in Standby function Thermal shutdown circuit Low voltage detection circuit „ Applications y Shutter, Mirror and Lens for Camera „ Package y 19 pin Wafer Level Chip Size Package (WLCSP) (Size : 2.41 mm × 1.91 mm, 0.5 mm Pitch) „ Type y Bi-CDMOS IC Ver. AEB 3 AN41402A „ Application Circuit Example (Block Diagram) 47 μF 3.3 V VDD STBY BC1 Low Voltage Detection Mode Select 0.01 μF (Strength voltage ≥ VM + 6 V) BC2 BC3 0.01 μF (Strength voltage ≥ VM + 6 V) BC4 GND VPUMP 0.1 μF (Strength voltage ≥ VM + 6 V) Thermal shut down Charge pump OSC VM11 VM12 47 μF VPUMP IN1A IN1B Logic Predrive 7.4 V FO1 DMOS Hbridge RO1 VM21 VM22 47 μF 7.4 V VPUMP IN2A IN2B Logic Predrive FO2 DMOS Hbridge RO2 Output Error Detection PG1 PG2 Notes) y This application circuit is an example. The operation of mass production set is not guaranteed. Perform enough evaluation and verification on the design of mass production set. y This block diagram is for explaining functions. Part of the block diagram may be omitted, or it may be simplified. Ver. AEB 4 AN41402A „ Pin Descriptions Pin No. Pin name Type Description A1 GND Ground Ground for control circuit A2 IN1A Input Ch.1 non-inverting input A3 IN2A Input Ch.2 non-inverting input A4 VM11 Power supply A5 RO1 Output Ch.1 inverting output A6 PG1 Ground Ground 1 for motor drive B1 STBY Input Total shutdown input B2 IN1B Input Ch.1 inverting input B3 IN2B Input Ch.2 inverting input B4 VM12 Power supply B5 FO1 Output C1 VDD Power supply C2 BC4 Output Charge pump capacitor connection 4 C3 BC2 Output Charge pump capacitor connection 2 C4 VM21 Power supply Power supply 1 for Ch.2 motor drive C5 RO2 Output Ch.2 inverting output D1 VPUMP Output Charge pump output D2 BC3 Output Charge pump capacitor connection 3 D3 BC1 Output Charge pump capacitor connection 1 D4 VM22 Power supply Power supply 2 for Ch.2 motor drive D5 FO2 Output Ch.2 non-inverting output D6 PG2 Ground Ground 2 for motor drive Power supply 1 for Ch.1 motor drive Power supply 2 for Ch.1 motor drive Ch.1 non-inverting output Power supply for control circuit „ Pin Configuration (Bottom View) D VPU MP BC3 BC1 VM22 FO2 C VDD BC4 BC2 VM21 RO2 B STBY IN1B IN2B VM12 FO1 A GND IN1A IN2A VM11 RO1 PG1 1 2 3 4 5 6 Ver. AEB PG2 5 AN41402A „ Absolute Maximum Ratings Note) Absolute maximum ratings are limit values which do not result in damages to this IC, and IC operation is not guaranteed at these limit values. A No. 1 2 Parameter Supply voltage Supply current Symbol Rating VDD 6.0 VM1, VM2 14.0 IDD 100 IM1 700 IM2 700 Unit Appropriate Pin No. Notes V — *1 mA — — 3 Power dissipation PD 100 mW — *2 4 Operating ambient temperature Topr –30 to +85 °C — *3 5 Storage temperature Tstg –55 to +150 °C — *3 I(p) DC ±700 (DC) mA I(p) peak1 ±3 000 (1 ms) mA I(p) peak2 ±1 800 (10 ms) mA I(p) peak3 ±1 000 (100 ms) mA 6 Drive output current p = A5, B5, C5, D5 *4 *5 7 Drive output voltage V(m) 14.7 V m = A5, B5, C5, D5 *5 8 Control signal input voltage V(n) GND to VDD V n = A2, A3, B1, B2, B3 *5 Notes) *1: The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. The voltage of the charge pump circuit voltage will exceed the supply voltage. The limit voltage of the charge pump is shown on page 8. VM1 is voltage for VM11 and VM12. VM2 is voltage for VM21 and VM22. *2: The power dissipation shown is the value at Ta = 85°C for the independent (unmounted) IC package without a heat sink. When using this IC, refer to the • PD-Ta diagram in the „ Technical Data and design the heat radiation with sufficient margin so that the allowable value might not be exceeded based on the conditions of power supply voltage, load, and ambient temperature. *3: Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25°C. *4: Design the heat radiation with sufficient margin so that the allowable value might not be exceeded based on the time conditions which the drive output current ±3 000 mA is allowed within 1 ms and ±1 800 mA is allowed within 10 ms and ±1 000 mA is allowed within 100 ms. However, the output frequency f requires that f ≤ 5 Hz. *5: Do not apply voltage or current from outside to these pin. The setting not exceeding the rating, even transiently, is required. For the circuit currents, '+' denotes current flowing into the IC, and '−' denotes current flowing out of the IC. „ Operating Supply Voltage Range Parameter Supply voltage range Symbol Min Typ Max VDD 2.7 3.3 5.5 VM1, VM2 2.0 7.4 13.8 Unit Notes V *1 Note) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. Ver. AEB 6 AN41402A „ Allowable Current and Voltage Range Notes) y Allowable current and voltage ranges are limit ranges which do not result in damages to this IC, and IC operation is not guaranteed within these limit ranges. y Voltage values, unless otherwise specified, are with respect to GND. GND is voltage for GND, PG1 and PG2. GND = PG1 = PG2. y VDD is voltage for VDD. y VM2 is voltage for VM21 and VM22. VM2 = VM21 = VM22. y Do not apply external currents or voltages to any pin not specifically mentioned. Pin No. Pin name Rating Unit Notes A2 IN1A GND to VDD V — A3 IN2A GND to VDD V — A5 RO1 −1.0 to 14.7 V *1 B1 STBY GND to VDD V — B2 IN1B GND to VDD V — B3 IN2B GND to VDD V — B5 FO1 −1.0 to 14.7 V *1 C2 BC4 GND to 19.5 V *1 C3 BC2 GND to 19.5 V *1 C5 RO2 −1.0 to 14.7 V *1 D1 VPUMP GND to 18.5 V *1 D2 BC3 GND to VM2 V *1 D3 BC1 GND to VM2 V *1 D5 FO2 −1.0 to 14.7 V *1 Note) *1 : Do not apply external voltage to this pin. The setting not exceeding the rating, even transiently, is required. Ver. AEB 7 AN41402A „ Electrical Characteristics at VDD = 3.3 V, VM1 = VM2 = 7.4 V, STBY = 3.3 V Note) Ta = 25°C±2°C unless otherwise specified. B No. Parameter Symbol Conditions Limits Min Typ Max Unit Notes Common Block Supply Current 1 Drive power supply current in standby mode IVM STBY = Low — — 100 μA — 2 Control power supply current in standby mode IDDS STBY = Low — — 10 μA — 3 Control power supply current under no input IDDA IN1A = IN1B = Low IN2A = IN2B = Low — 1.7 2.2 mA — Standby Operation 4 STBY High-level input voltage VSBH — 2.2 — ― V *1 5 STBY Low-level input voltage VSBL — — — 0.5 V *1 6 STBY pull-down resistance RSTBY — 100 200 300 kΩ — 11.4 12.4 13.4 V — 10.4 11.4 13.4 V — Charge Pump Circuit 7 Charge pump voltage VPUMP IPUMP = 0 A 8 Charge pump current capability VPUMPL IPUMP = –500 μA Driver Block 9 IN1A, IN1B, IN2A, IN2B High-level input voltage VINH — 2.2 — — V *1 10 IN1A, IN1B, IN2A, IN2B Low-level input voltage VINL — — — 0.5 V *1 11 IN1A, IN1B, IN2A, IN2B High-level input current IINH 8.3 16.5 33 μA — 12 IN1A, IN1B, IN2A, IN2B Low-level input current IINL –1.0 — — μA — 13 Output ON resistance (Upper and Lower) RON — 0.4 0.5 Ω — 14 Rise time TR — — 0.1 0.2 μs — 15 Fall time TF — — 0.1 0.2 μs — 16 Turn on time TPLH — — 0.4 1.0 μs — 17 Turn off time TPHL — — 0.2 0.5 μs — IN1A = IN1B = 3.3 V IN2A = IN2B = 3.3 V — IVM1,IVM2 = 500 mA Note）*1 :Refer to page 10 for the mode setting. Ver. AEB 8 AN41402A „ Electrical Characteristics (Reference values for design) at VDD = 3.3 V, VM1 = VM2 = 7.4 V, STBY = 3.3 V Notes) Ta = 25°C±2°C unless otherwise specified. The characteristics listed below are reference values derived from the design of the IC and are not guaranteed by inspection. If a problem does occur related to these characteristics, we will respond in good faith to user concerns. B No. 18 Parameter Input signal frequency Symbol Conditions fmax Reference values Unit Notes 300 kHz — Min Typ Max — — — Operation of low voltage detection 19 Operation voltage of low voltage detection VLVD — — 2.4 — V — 20 Hysteresis width ΔVLVD — — 0.2 — V — Thermal shutdown 21 Thermal shutdown operating temperature TTSD — — 160 — °C — 22 Thermal shutdown hysteresis temperature ΔTTSD — — 35 — °C — Ver. AEB 9 AN41402A „ Control Pin Mode Table y Ch.1 motor drive Input Logic STBY VDD Temp. > 2.4 V < 160°C High Output state Charge Pump Circuit IN1B FO1 RO1 High High Low Low Brake High Low High Low Normal rotation Low High Low High Low Low Hi-Z Hi-Z Reverse rotation Active Mute Low voltage detection ≤ 2.4 V Low Mode IN1A > 2.4 V ≥ 160°C — — — — Hi-Z Hi-Z Thermal shutdown Mute Standby Charge Pump Circuit Mode y Ch.2 motor drive Input Logic STBY VDD Temp. > 2.4 V < 160°C High Output state IN2A IN2B FO2 RO2 High High Low Low Brake High Low High Low Normal rotation Low High Low High Low Low Hi-Z Hi-Z Reverse rotation Active Low voltage detection ≤ 2.4 V Low Mute > 2.4 V ≥ 160°C — — — — Hi-Z Hi-Z Thermal shutdown Mute Ver. AEB Standby 10 AN41402A „ Technical Data y I/O block circuit diagrams and pin function descriptions Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed. Pin No. Waveform and voltage Internal circuit Impedance Description A1 A1, A6, D6 DC 0V A6 — A1 : Ground for control circuit A6 : Ground 1 for motor drive D6 : Ground 2 for motor drive 200 kΩ A2 : Ch.1 non-inverting input B2 : Ch.1 inverting input A3 : Ch.2 non-inverting input B3 : Ch.2 inverting input D6 A2, A3, B2, B3 — A4, B4 DC (Typ. 7.4 V) PinA2 A3 B2 B3 58k 142k A4 B4 — A4 : Power supply 1 for Ch.1 motor drive B4 : Power supply 2 for Ch.1 motor drive — B5 : Ch.1 non-inverting output A5 : Ch.1 inverting output D5 : Ch.2 non-inverting output C5 : Ch.2 inverting output VM (7.4 V) A5, B5, C5, D5 PinB5 D5 — PinA5 C5 B1 B1 — C1 DC (Typ. 3.3 V) 48k 200 kΩ 152k C1 — Ver. AEB Total shutdown input Power supply VDD for control circuit 11 AN41402A „ Technical Data (continued) y I/O block circuit diagrams and pin function descriptions (continued) Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed. Pin No. Waveform and voltage Internal circuit 10 C2 Impedance C2 25k — Description — Charge pump capacitor connection 4 — Charge pump capacitor connection 2 — C4 : Power supply 1 for Ch.2 motor drive D4 : Power supply 2 for Ch.2 motor drive — Charge pump output D2 — Charge pump capacitor connection 3 D3 — Charge pump capacitor connection 1 5k 10 C3 C3 25k — 5k C4, D4 C4 DC (Typ. 7.4 V) D4 VM (7.4 V) 300k 20 D1 DC About 12.4 V D1 25k 5k VM (7.4 V) D2 — 20 VM (7.4 V) D3 — 20 Ver. AEB 12 AN41402A „ Technical Data (continued) y Reference data Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed. Ron change rate – VDD characteristics 40 30 85°C RonRon変化率[%] change rate [%] 20 10 0 25°C -10 –30°C -20 -30 -40 2.5 3 3.5 4 4.5 5 VDD[V] VDD [V] 50 Ron change rate – VM characteristics 40 Ron change rate [%] Ron変化率[%] 30 85°C 20 10 25°C 0 -10 –30°C -20 -30 1.5 2 2.5 3 3.5 4 VM [V] VM[V] Ver. AEB 13 AN41402A „ Technical Data (continued) y PD ⎯ Ta diagram Ver. AEB 14 AN41402A „ Usage Notes y Special attention and precaution in using 1. This IC is intended to be used for general electronic equipment [Shutter, Mirror and Lens for Camera]. Consult our sales staff in advance for information on the following applications: x Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may directly jeopardize life or harm the human body. x Any applications other than the standard applications intended. (1) Space appliance (such as artificial satellite, and rocket) (2) Traffic control equipment (such as for automobile, airplane, train, and ship) (3) Medical equipment for life support (4) Submarine transponder (5) Control equipment for power plant (6) Disaster prevention and security device (7) Weapon (8) Others : Applications of which reliability equivalent to (1) to (7) is required It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the IC described in this book for any special application, unless our company agrees to your using the IC in this book for any special application. 2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might smoke or ignite. 3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In addition, refer to the Pin Description for the pin configuration. 4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solderbridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during transportation. 5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pinVCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) . And, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke emission will depend on the current capability of the power supply. 6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. 7. When using the LSI for new models, verify the safety including the long-term reliability for each product. 8. When the application system is designed by using this LSI, be sure to confirm notes in this book. Be sure to read the notes to descriptions and the usage notes in the book. 9. Due to unshielded structure of this IC, under exposure of light, function and characteristic of the product cannot be guaranteed. During normal operation or even under testing condition, please ensure that IC is not exposed to light. 10. Basically, chip surface is ground potential. Please design to ensure no contact between chip surface and metal shielding. Ver. AEB 15 AN41402A „ Usage Notes (continued) y Notes of Power LSI 1. The protection circuit is for maintaining safety against abnormal operation. Therefore, the protection circuit should not work during normal operation. Especially for the thermal protection circuit, if the area of safe operation or the absolute maximum rating is momentarily exceeded due to output pin to VCC short (Power supply fault), or output pin to GND short (Ground fault), the LSI might be damaged before the thermal protection circuit could operate. 2. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not applied to the pins because the device might be damaged, which could happen due to negative voltage or excessive voltage generated during the ON and OFF timing when the inductive load of a motor coil or actuator coils of optical pick-up is being driven. 3. The product which has specified ASO (Area of Safe Operation) should be operated in ASO. 4. Verify the risks which might be caused by the malfunctions of external components. Ver. AEB 16 AN41402A „ Usage Notes (continued) y Notes of This LSI 1. Make sure to power on, off, and switching under the standby mode (STBY = Low). 2. Apply voltage from a low-impedance source to VDD and VM. Connect a bypass capacitor to each as near the IC as possible. 3. In case of that the output is changed into Hi-Z (IN1A = IN1B = Low, IN2A = IN2B = Low) in the rotation of motor, due to the motor current to flow back into a power source, the supply voltage might rise. 4. If the error detection circuit is active, all outputs are fixed in Hi-Z during the specified time (470 μs ±30%). The function is for safety improvements and is not guaranteed nondestructive control. 5. Check the characteristics carefully before using this IC. Preserve sufficient margin in consideration of dispersion of external components and our ICs including not only static characteristics but transition characteristics when using this IC changing external circuit constants. 6. Prohibit mounting with solder dipping and mounting to a flexible cable. 7. The heat thermal resistance is variable due to the mounted status of this IC. To reduce the heat thermal resistance, it is recommended that the power supply and GND pins are connected to a wide metal layer as short as possible. Refer to the following figure shown an example of a wiring pattern. The heat thermal resistance value (for simulation) in case of the following wiring pattern example Rth(j-a) = 88 °C / W Condition : Glass-epoxy PWB, 50×50×0.8t (mm), 4-ply Wiring pattern example 1 2 3 4 5 6 A GND IN1A IN2A VM11 RO1 PG1 B STBY IN1B IN2B VM12 FO1 C VDD BC4 BC2 VM21 RO2 D VPU MP BC3 BC1 VM22 FO2 IC (Top View) PG2 xxxx Via xxxx Wiring Ver. AEB 17 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202