AN41406A-PB

Product Standards AN41406A 1-ch motor driver IC  Overview AN41406A is a 1-ch motor driver IC. This IC features a low ON resistance and a wide operating supply voltage range of power supply for motor drive. Adopting an wafer level chip size package (WLCSP) makes it possible to shrink the mounting area.  Features • • • • 1-ch motor driver IC Forward reverse drive is possible It is possible to drive not only a motor but also an actuator Low ON resistance: 0.19 Ω (upper and lower) • Operating supply voltage range: Supply voltage range for control 2.7 V to 5.5 V, Supply voltage range for drive 4.0 V to 13.8 V • Downsizing by adopting an wafer level chip size package • Additional features: Built-in stand-by function Thermal shutdown circuit Low voltage detection circuit  Applications • DC brush motor, actuator, etc.  Package • 17 pin wafer level chip size package (WLCSP) Size: 2.41 x 1.91 mm Pitch: 0.5 mm  Type • Bi-CDMOS IC Page 1 of 22 Panasonic Corporation Product Standards AN41406A Contents  Overview …………………………………………………………………………………………………………….....1  Features ……………………………………………………………………………………………………………......1  Applications ……………………………………………………………………………………………………..…......1  Package ……………………………………………………………………………………………………………......1  Type ……...………………………………………………………………………………………………………….....1  Application Circuit Example (Block Diagram) ……………………………………………………………….......... 3  Pin Descriptions ……………………………………………………………………………………………………….4  Pin Configuration ………………………………………………………………………………………………………4  Absolute Maximum Ratings …………………………………………………………………………………………. 5  Operating Supply Voltage Range …………………………………………………………………………….......... 5  Allowable Current and Voltage Range ……………………………………………………………………………...6  Electrical Characteristics ……………………………………………………………………………………………7  Electrical Characteristics (Reference values for design) ………………………………………………………...8  Control Pin Mode Table……………………………………………………………………………………………...9  Test Circuit Diagram ………………………………………………………………………………………………..10  Electrical Characteristics Test Procedures ………………………………………………………………………..13  Technical Data………………………………………………………………………………………………………..16 • I/O block circuit diagrams and pin function descriptions ………………………………………………………..16 • Reference data ………………………………………………………………………………………………….....18  Package information ………………………………………………………………………………………….19  Usage Notes ………………………………………………………………………………………………………….20 • Special attention and precaution in using ………………………………………………………………………20 • Notes of Power IC ..…………………………………………………………………………………………………21 • Notes of this IC ……………………………………………………………………………………………………22 Page 2 of 22 Panasonic Corporation Product Standards AN41406A  Application Circuit Example (Block Diagram) 5V 47 µF VDD A4 STBY B1 A3 VPUMP Mode Select Low Voltage Detector 0.1 µF (Strength voltage ≥ VM + 6 V) A1 BC1 OSC Charge pump A2 BC2 0.01 µF (Strength voltage ≥ VM + 6 V) Thermal shut down D3 VM1 VPUMP INA B5 Logic INB B4 Predrive 47 µF 8 V C3 VM2 DMOS Hbridge C2 FO1 C1 FO2 C5 RO1 C4 RO2 Output Error Detection GND A5 D5 PG1 D4 PG2 D1 PG3 Notes: • This block diagram is for explaining functions. Part of the block diagram may be omitted, or it may be simplified. • This application circuit is shown as an example but does not guarantee the design for mass production set. Page 3 of 22 Panasonic Corporation Product Standards AN41406A  Pin Descriptions Pin No. Pin name Type Description A1 BC1 Output Charge pump capacitor connection 1 A2 BC2 Output Charge pump capacitor connection 2 A3 VPUMP Output Charge pump output A4 VDD Power supply A5 GND Ground B1 STBY Input Total shutdown input B4 INB Input Inverting input B5 INA Input Non-inverting input C1 FO2 Output Non-inverting output 2 C2 FO1 Output Non-inverting output 1 C3 VM2 Power supply C4 RO2 Output Inverting output 2 C5 RO1 Output Inverting output 1 D1 PG3 Ground Ground 3 for motor drive D3 VM1 Power supply D4 PG2 Ground Ground 2 for motor supply D5 PG1 Ground Ground 1 for motor supply Power supply for control circuit Ground for control circuit Power supply 2 for motor drive Power supply 1 for motor drive  Pin Configuration (Bottom View) D PG3 C FO2 B STBY A BC1 BC2 1 2 FO1 VM1 PG2 PG1 VM2 RO2 RO1 INB INA V PUMP VDD GND 3 4 5 Page 4 of 22 Panasonic Corporation Product Standards AN41406A  Absolute Maximum Ratings A No. Parameter Symbol Rating VDD 6.0 VM 14.0 IDD 100 IM 1 200 — *1 mA — — 93 mW — *2 Topr –30 to +85 ˚C — *3 Tstg –55 to +150 ˚C — *3 Supply voltage 2 Supply current 3 Power dissipation PD 4 Operating ambient temperature 5 Storage temperature 1 200 (DC) mA I(p) peak1 6 000 (1 ms) mA I(p) peak2 3 500 (10 ms) mA I(p) peak3 2 000 (100 ms) mA I(p) DC Drive output current Appropriate Pin No. Notes V 1 6 Unit p = C1, C2, C4, C5 *4 *5 7 Drive output voltage V(m) 14.7 V m = C1, C2, C4, C5 *5 8 Control signal input voltage V(n) GND to VDD V n = B1, B4, B5 — Notes: *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. The voltage of the charge pump circuit voltage will exceed the supply voltage. The limit voltage of the charge pump is shown on page 7. *2 : The power dissipation shown is the value at Ta = 85˚C for the independent (unmounted) IC package without a heat sink. When using this IC, refer to the PD-Ta diagram of the package standard and design the heat radiation with sufficient margin so that the allowable value might not be exceeded based on the conditions of power supply voltage, load, and ambient temperature. *3 : Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25˚C. *4 : Design the heat radiation with sufficient margin so that the allowable value might not be exceeded based on the time conditions which the drive output current 6 000 mA is allowed within1 ms and 3 500 mA is allowed within 10 ms and 2 000 mA is allowed within 100 ms. However, the output frequency f requires that f ≤ 5 Hz. *5 : Do not apply voltage or current from outside to these pin. The setting not exceeding the rating, even transiently, is required. For the circuit currents, “+” denotes current flowing into the IC, and “–” denotes current flowing out of the IC.  Operating supply voltage range Parameter Supply voltage range Symbol Min Typ Max VDD 2.7 3.3 5.5 VM 4.0 7.4 13.8 Unit Notes V *1 Note: *1: The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. Page 5 of 22 Panasonic Corporation Product Standards AN41406A  Allowable Current and Voltage Range Notes: • Allowable current and voltage ranges are limit ranges which do not result in damages to this IC, and IC operation is not guaranteed within these limit ranges. • Voltage values, unless otherwise specified, are with respect to GND. GND is voltage for GND, PG1, PG2 and PG3. GND = PG1 = PG2 = PG3 • • • • VDD is voltage for VDD. VM is voltage for VM1 and VM2. VM = VM1 = VM2 Do not apply external currents or voltages to any pin not specifically mentioned. For the circuit currents, "+“ denotes current flowing into the IC, and "-“ denotes current flowing out of the IC. Pin No. Pin name Rating Unit Notes A1 BC1 GND to VM V *1 A2 BC2 GND to 19.5 V *1 A3 VPUMP GND to 19 V *1 B1 STBY GND to VDD V — B4 INB GND to VDD V — B5 INA GND to VDD V — C1 FO2 -1.0 to 14.7 V *1 C2 FO1 -1.0 to 14.7 V *1 C4 RO2 -1.0 to 14.7 V *1 C5 RO1 -1.0 to 14.7 V *1 Note: *1: Do not apply external voltage to this pin. The setting not exceeding the rating, even transiently, is required. Page 6 of 22 Panasonic Corporation Product Standards AN41406A  Electrical Characteristics at VDD = 3.3 V, VM = 7.4 V , STBY = 3.3 V Note: Ta = 25 ˚C  2 ˚C unless otherwise specified. B No. Parameter Symbol Test circuits Limits Conditions Min Typ Max Unit Notes COMMON BLOCK Supply Current 1 Drive power supply current in standby mode IVM 1 STBY = Low — — 800 nA — 2 Control power supply current in standby mode IDDS 1 STBY = Low — — 800 nA — 3 Control power supply current under no input IDDA 1 INA = INB = Low — 1.4 2.0 mA — Standby Operation 4 STBY high level input voltage VSBH 1 — 2.2 — ― V *1 5 STBY low level input voltage VSBL 1 — — — 0.5 V *1 6 STBY pull-down resistance RSTBY 1 — 100 200 300 kΩ — Charge Pump Circuit 7 Charge pump voltage VPUMP 1 IPUMP = 0 A 11.4 12.4 13.4 V — 8 Charge pump current capability VPUMPL 1 IPUMP = –500 µA 10.4 11.4 13.4 V — VINH 1 — 2.2 — — V *1 10 INA, INB low level input voltage VINL 1 — — — 0.5 V *1 11 INA, INB high level input current IINH 1 INA = INB = 3.3 V 8.3 16.5 33 µA — 12 INA, INB low level input current IINL 1 — –1.0 — — µA — RON 2 — 0.19 0.24 Ω — 14 Rise time TR 3 — — 0.1 0.2 µs — 15 Fall time TF 3 — — 0.1 0.2 µs — 16 Turn on time TPLH 3 — — 0.4 1.0 µs — 17 Turn off time TPHL 3 — — 0.2 0.5 µs — Driver Block 9 13 Note: INA, INB high level input voltage Output ON resistance (Upper and Lower) Iout = 500 mA *1: Refer to page 9 for the mode setting. Page 7 of 22 Panasonic Corporation Product Standards AN41406A  Electrical Characteristics (Reference values for design) at VDD = 3.3 V, VM = 7.4 V , STBY = 3.3 V Notes: Ta = 25 ˚C  2 ˚C unless otherwise specified. The characteristics listed below are reference values derived from the design of the IC and are not guaranteed by inspection. If a problem does occur related to these characteristics, we will respond in good faith to user concerns. B No. Parameter 18 Input signal frequency Reference values Test circuits Conditions fmax — VLVD Symbol Unit Notes 300 kHz — 2.4 — V — — 0.2 — V — Min Typ Max — — — — — — ∆VLVD — — Operation of low voltage detection 19 Operating voltage of low voltage detection 20 Hysteresis width Thermal Shutdown 21 Thermal shutdown operating temperature TTSD — — — 160 — ˚C — 22 Thermal shutdown hysteresis temperature ∆TTSD — — — 35 — ˚C — Page 8 of 22 Panasonic Corporation Product Standards AN41406A  Control Pin Mode Table Input Logic STBY VDD > 2.4 V High < 160˚C > 2.4 V ≥ 160˚C — — Charge Pump Circuit Mode INA INB FO RO High High Low Low Brake High Low High Low Normal rotation Low High Low High Low Low ≤ 2.4 V Low Output State Temperature — — Z* Active Reverse rotation Mute Low voltage detection Z* Thermal shutdown Mute Standby Note *: Z means that output is Hi-Z Page 9 of 22 Panasonic Corporation Product Standards AN41406A  Test Circuit Diagram 1. Test Circuit 1 A IPUMP 0.01 µF V PG1 PG2 VM1 PG3 D5 D4 D3 D1 7.4 V BC1 A1 C5 RO1 BC2 A2 C4 RO2 VPUMP A3 C3 VM2 VDD A4 C2 FO1 GND A5 C1 FO2 V 0.1 µF A B1 B4 B5 STBY INB INA 3.3 V A A V A Page 10 of 22 Panasonic Corporation Product Standards AN41406A  Test Circuit Diagram (continued) 2. Test Circuit 2 0.01 µF PG1 PG2 VM1 PG3 D5 D4 D3 D1 7.4 V BC1 A1 C5 RO1 BC2 A2 C4 RO2 IRO 2 1 VPUMP A3 C3 VM2 VDD A4 C2 FO1 GND A5 C1 FO2 0.1 µF S2 S1 V 2 1 IFO B1 B4 B5 STBY INB INA 3.3 V 3.3 V Page 11 of 22 Panasonic Corporation Product Standards AN41406A  Test Circuit Diagram (continued) 3. Test Circuit 3 PG1 PG2 VM1 PG3 D5 D4 D3 D1 7.4 V BC1 A1 C5 RO1 BC2 A2 C4 RO2 VPUMP A3 C3 VM2 VDD A4 C2 FO1 GND A5 C1 FO2 V 30 Ω 12.4 V B4 B5 INB INA ST BY B1 3.3 V V 3.3 V Page 12 of 22 Panasonic Corporation Product Standards AN41406A  Electrical Characteristics Test Procedures 1. Test Circuit 1 Input C No. Output Parameter Pin No. Conditions Pin No. Conditions COMMON BLOCK Supply Current 1 Drive power supply current in standby mode B1 STBY = 0 V C3, D3 — 2 Control power supply current in standby mode B1 STBY = 0 V A4 — 3 Control power supply current under no input B1 STBY = 3.3 V A4 — Standby Operation 4 STBY high level input voltage B1 STBY = variable — Refer to remarks 1. 5 STBY low level input voltage B1 STBY = variable — Refer to remarks 2. 6 STBY pull-down resistance B1 STBY = 3.3V B1 3.3 V / STBY pin current Charge Pump Circuit 7 Charge pump voltage — IPUMP = 0 mA A3 Output DC voltage 8 Charge pump current capability — IPUMP = –500 µA A3 Output DC voltage Driver Block 9 INA, INB high level input voltage B4, B5 INA = variable, INB = variable — Refer to remarks 1. 10 INA, INB low level input voltage B4, B5 INA = variable, INB = variable — Refer to remarks 1. 11 INA, INB high level input current B4, B5 INA = INB = 3.3 V B4, B5 INA, INB pin current 12 INA, INB low level input current B4, B5 INA = INB = 0 V B4, B5 INA, INB pin current Remarks: 1: No.4 STBY high level input voltage No.9 INA, INB high level input voltage No.10 INA, INB low level input voltage The conditions of following (1) and (2) must be satisfied when STBY = 2.2 V. (1) Under the conditions that INA = 2.2 V, INB = 0.5 V, FO1, FO2 pin voltage ≥ 6.4 V AND RO1, RO2 pin voltage ≤ 1 V (2) Under the conditions that INA = 0.5 V, INB = 2.2 V, RO1, RO2 pin voltage ≥ 6.4 V AND FO1, FO2 pin voltage ≤ 1 V 2: No.5 STBY low level input voltage Go through change the condition of No.4, STBY = 0.5 V. Each output pin gets into Hi-Z. Page 13 of 22 Panasonic Corporation Product Standards AN41406A  Electrical Characteristics Test Procedures (continued) 2. Test Circuit 2 Input C No. Output Parameter Pin No. Conditions Pin No. Conditions Driver Block (continued) 13 Output ON resistance (Upper and Lower) C1, C2, IFO = 500 mA, C4, C5 IRO = 500 mA C1, C2, Refer to remarks 3. C4, C5 Remarks: 3: No.13 Output ON resistance (Upper and Lower) Operate Setting1, 3 in the following table. Calculate RONU from the differential voltage between FO, RO pin and VM pin. RONFU = | VM – FO | / | IFO | RONRU = | VM – RO | / | IRO | In the same way, operate Setting 2, 4 in the following table. Calculate ROND from the differential voltage between FO, RO pin and PG pin. RONFD = | FO – PG | / | IFO | RONRD = | RO – PG | / | IRO | Due to the above parameters, calculate RON = RONFU + RONRD RON = RONRU + RONFD Setting Parameter Symbol INA INB IFO IRO S1 S2 Setting 1 FO Upper-side output ON resistance RONFU 3.3 V 0V –500 mA — 1 1 Setting 2 FO Lower-side output ON resistance RONFD 0V 3.3 V +500 mA — 1 2 Setting 3 RO Upper-side output ON resistance RONRU 3.3 V 0V — –500 mA 2 1 Setting 4 RO Lower-side output ON resistance RONRD 0V 3.3 V — +500 mA 2 2 Page 14 of 22 Panasonic Corporation Product Standards AN41406A  Electrical Characteristics Test Procedures (continued) 3. Test Circuit 3 Input C No. Output Parameter Pin No. Conditions Pin No. Conditions Driver Block (continued) 14 Rise time B4, B5 INA = variable, INB = variable C1, C2, C4, C5 Load resistance 30 Ω Refer to remarks 4. 15 Fall time B4, B5 INA = variable, INB = variable C1, C2, C4, C5 Load resistance 30 Ω Refer to remarks 4. 16 Turn on time B4, B5 INA = variable, INB = variable C1, C2, C4, C5 Load resistance 30 Ω Refer to remarks 4. 17 Turn off time B4, B5 INA = variable, INB = variable C1, C2, C4, C5 Load resistance 30 Ω Refer to remarks 4. Remarks: 4: No.14 No.15 No.16 No.17 Rise time (TR) Fall time (TF) Turn on time (TPLH) Turn off time (TPHL) Measure the periods as shown in the following chart. INA Input voltage INB Input voltage 3.3 V 50% 0V 3.3 V 50% 0V TPLH 7.4 V TPHL 80% FO Output voltage 50% 20% 0V TR TF TPLH 7.4 V TPHL 80% RO Output voltage 50% 20% 0V TR TF Page 15 of 22 Panasonic Corporation Product Standards AN41406A  Technical Data • I/O block circuit diagrams and pin function descriptions Note: The characteristics listed below are reference values derived from the design of the IC and are not guaranteed. Pin No. Waveform and voltage Internal circuit Impedance Description — Charge pump capacitor connection 1 — Charge pump capacitor connection 2 — Charge pump output — Power supply for control circuit VDD — A5: Ground for control circuit D1: Ground 3 for motor drive D4: Ground 2 for motor drive D5: Ground 1 for motor drive VM (7.4 V) A1 20 — A1 10 A2 A2 25k — 5k VM (7.4 V) A3 DC approx. 12.4 V 20 300k A3 25k 5k A4 DC (Typ. 3.3 V) A4 A5 A5, D1, D4, D5 DC 0V D1 D4 D5 B1 B1 — 48k 200 kΩ Total shutdown input 152k Page 16 of 22 Panasonic Corporation Product Standards AN41406A  Technical Data (continued) • I/O block circuit diagrams and pin function descriptions (continued) Note: The characteristics listed below are reference values derived from the design of the IC and are not guaranteed. Pin No. Waveform and voltage Internal circuit PinB4 B5 B4, B5 Impedance 58k — 200 kΩ 142k Description B4: Inverting input B5: Non-inverting input VM (7.4 V) C1, C2, C4, C5 C3, D3 — DC (Typ. 7.4 V) C1 C4 C2 C5 — C1: Non-inverting output 2 C2: Non-inverting output 1 C4: Inverting output 2 C5: Inverting output 1 — C3: Power supply 2 for motor drive D3: Power supply 1 for motor drive C3 D3 Page 17 of 22 Panasonic Corporation Product Standards AN41406A  Technical Data (continued) • Reference data Note: The characteristics listed below are reference values derived from the design of the IC and are not guaranteed. Ron changing rate－VDD Characteristics 40 Ron changing rate [%] 30 85˚C 20 10 25˚C 0 –10 –30˚C –20 –30 –40 2.5 3.5 3 4 4.5 5 VDD [V] Ron changing rate－VM Characteristics 50 Ron changing rate [%] 40 30 85˚C 20 10 25˚C 0 –10 –30˚C –20 –30 3.4 4.4 5.4 6.4 7.4 VM [V] Page 18 of 22 Panasonic Corporation Product Standards AN41406A PACKAGE INFORMATION ( Reference Data ) Package Code : UBGA017-W-2025AEL unit : mm Body Material Reroute Material : Br/Sb Free Epoxy Resin : Cu Bump : SnAgCu Page 19 of 22 Panasonic Corporation Product Standards AN41406A  Usage Notes • Special attention and precaution in using 1. This IC is intended to be used for general electronic equipment [for DC motor for brush, actuator, etc.]. Consult our sales staff in advance for information on the following applications: • Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (1) Space appliance (such as artificial satellite, and rocket) (2) Traffic control equipment (such as for automobile, airplane, train, and ship) (3) Medical equipment for life support (4) Submarine transponder (5) Control equipment for power plant (6) Disaster prevention and security device (7) Weapon (8) Others: Applications of which reliability equivalent to (1) to (7) is required 2. Pay attention to the direction of IC. When mounting it in the wrong direction onto the printed-circuit-board (PCB), it might smoke or ignite. 3. Pay attention in the PCB pattern layout in order to prevent damage due to short circuit between pins. In addition, refer to the Pin Description for the pin configuration. 4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solder-bridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the IC during transportation. 5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin-VCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) . And, safety measures such as an installation of fuses are recommended because the extent of the abovementioned damage and smoke emission will depend on the current capability of the power supply. 6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. 7. When using the IC for new models, verify the safety including the long-term reliability for each product. 8. When the application system is designed by using this IC, be sure to confirm notes in this book. Be sure to read the notes to descriptions and the usage notes in the book. 9. Due to unshielded structure of this IC, under exposure of light, function and characteristic of the product cannot be guaranteed. During normal operation or even under testing condition, ensure that IC is not exposed to light. 10. Basically, chip surface is ground potential. Design to ensure no contact between chip surface and metal shielding. Page 20 of 22 Panasonic Corporation Product Standards AN41406A  Usage Notes (continued) • Notes of Power IC 1. The protection circuit is for maintaining safety against abnormal operation. Therefore, the protection circuit should not work during normal operation. Especially for the thermal protection circuit, if the area of safe operation (ASO) or the absolute maximum rating is momentarily exceeded due to output pin to VCC short (Power supply fault), or output pin to GND short (Ground fault), the IC might be damaged before the thermal protection circuit could operate. 2. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not applied to the pins because the device might be damaged, which could happen due to negative voltage or excessive voltage generated during the ON and OFF timing when the inductive load of a motor coil or actuator coils of optical pick-up is being driven. 3. The product which has specified ASO should be operated in ASO. 4. Verify the risks which might be caused by the malfunctions of external components. Page 21 of 22 Panasonic Corporation Product Standards AN41406A  Usage Notes (continued) • Notes of this IC 1. Make sure to power on, off, and switching under the standby mode (STBY = Low). 2. Apply voltage from a low-impedance source to VDD and VM. Connect a bypass capacitor to each as near the IC as possible. 3. In case of that the output is changed into Hi-Z (INA = INB = Low) in the rotation of motor, due to the motor current to flow back into a power source, the supply voltage might rise. 4. If the error detection circuit is active, all outputs are fixed in Hi-Z during the specified time (470 µs 30%). The function is for safety improvements and is not guaranteed nondestructive control. 5. Check the characteristics carefully before using this IC. Preserve sufficient margin in consideration of dispersion of external components and our ICs including not only static characteristics but transition characteristics when using this IC changing external circuit constants. 6. Prohibit mounting with solder dipping and mounting to a flexible cable. 7. The heat thermal resistance is variable due to the mounted status of this IC. To reduce the heat thermal resistance, it is recommended that the power supply and GND pins are connected to a wide metal layer as short as possible. Refer to the following figure shown an example of a wiring pattern. Reference value: The heat thermal resistance value (for simulation) in case of the following wiring pattern example Rth(j-a) = 97˚C / W Condition: Glass-epoxy PWB, 50×50×0.8t (mm), 4-ply Example of a wiring pattern 1 2 3 4 5 A BC1 BC2 V PUMP VDD GND B STBY INB INA C FO2 VM2 RO2 RO1 D PG3 VM1 PG2 PG1 FO1 IC (Top View) …Via …Wiring Page 22 of 22 Panasonic Corporation Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202