AN44063A
37V/0.8A Stepping Motor Driver
FEATURES
DESCRIPTION
• 4-phase input (W1-2phase excitation enabled;
exclusive OR function incorporated for simultaneous-ON
prevention)
• Built-in CR chopping (with frequency selected)
• Built-in thermal protection and low voltage detection circuit
• Built-in 5 V power supply
•32 pin Plastic Shrink Small Outline Package
(SSOP Type)
AN44063A is a two channels H-bridge driver LSI.
Bipolar stepping motor can be controlled by a single
driver LSI.
2-phase,1-2(type 2) phase, W1-2 phase can be
selected.
APPLICATIONS
• LSI for stepping motor drives
SIMPLIFIED APPLICATION
0.01 μF
BC1 18
BC2 17
PHA1 25
PHB1 26
IN0 27
IN1 28
IN2 29
16 VPUMP
0.01 μF
Motor Current Waveform
3 BOUT2
5 RCSB
7 BOUT1
15 VM2 0.1 μF
IN3 30
I_AOUT1
(500mA/div)
47 μF
+
ENABLEA 31
1 VM1
TJMON 32
PWMSW 24
VREFA 19
VREFB 20
VCC 21
0.1 μF
9 AOUT2
I_BOUT1
(500mA/div)
11 RCSA
20ms/div
13 AOUT1
23 GND
Condition:
VM=24V
Peak motor current:600mA
excitation mode ：W1-2 phase drive
S5VOUT 22
Notes)
This application circuit is an example. The operation of mass
production set is not guaranteed. You should perform enough
evaluation and verification on the design of mass production set.
You are fully responsible for the incorporation of the above
application circuit and information in the design of your equipment.
Publication date: November 2012
1
Ver. BEB
AN44063A
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Rating
Unit
Note
Supply voltage1 (Pin 1, 15)
VM
37
V
*3
Supply voltage2 (Pin 21)
VCC
– 0.3 to + 6
V
*3
Power dissipation
PD
0.427
W
*1
Operating ambient temperature
Topr
–20 to + 70
°C
*2
Operating junction temperature
Tj
–20 to + 150
°C
*2
Storage temperature
Tstg
–55 to + 150
°C
*2
Output pin voltage (Pin 3, 7, 9, 13)
VOUT
37
V
*3
Motor drive current (Pin 3, 7, 9, 13)
IOUT
± 0.8
A
*3
If
0.8
A
*3
VRCSA,VRCSB
-0.5 to 1.5
V
—
VVPUMP
(VM-1) to 43
V
—
VBC2
(VM-1) to 43
V
—
VBC1
VM+0.3
V
—
VVREFA,VVREFB
-0.3 to 6
V
—
IS5VOUT
-7 to 0
mA
—
VPHA1,VPHB1
-0.3 to 6
V
—
VPWMSW
-0.3 to 6
V
—
VIN0~IN3
-0.3 to 6
V
—
VENABLEA
-0.3 to 6
V
—
HBM (Human
Body Model)
±1
kV
—
CDM (Charge
Device Model)
±1
kV
—
Flywheel diode current (Pin 3, 7, 9, 13)
Input Voltage Range
ESD
Notes). This product may sustain permanent damage if subjected to conditions higher than the above stated absolute maximum
rating. This rating is the maximum rating and device operating at this range is not guaranteeable as it is higher than our
stated recommended operating range.
When subjected under the absolute maximum rating for a long time, the reliability of the product may be affected.
*1: The power dissipation shown is the value at Ta = 70°C for the independent (unmounted) LSI package without a heat sink.
When using this LSI, refer to the PD-Ta diagram of the package standard page 4 and use under the condition not
exceeding the allowable value.
*2: Except for the storage temperature, operating ambient temperature, and power dissipation all ratings are for Ta = 25°C.
Refer to the package power dissipation prepared else and use under the condition not exceeding the allowable value.
*3: Do not apply current or voltage from outside to any pin not listed above.
In the circuit current, (+) means the current flowing into LSI and (–) means the current flowing out of LSI.
2
Ver. BEB
AN44063A
POWER DISSIPATION RATING
θ JA
PD (Ta=25 °C)
PD (Ta=70 °C)
Mount on PWB *1
96.9 °C/W
1290mW
825mW
Without PWB
187.1 °C/W
668mW
427mW
Condition
Note). For the actual usage, please refer to the PD-Ta characteristics diagram in the package specification, supply
voltage, load and ambient temperature conditions to ensure that there is enough margin follow the power and
the thermal design does not exceed the allowable value.
*1: Glass-Epoxy: 50×50×0.8 (mm)
CAUTION
Although this has limited built-in ESD protection circuit, but permanent damage may occur on it.
Therefore, proper ESD precautions are recommended to avoid electrostatic damage to the MOS gates
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min.
Typ.
Max.
Unit
Note
VM1,VM2
16
24
34
V
*1
VCC
4.5
5
5.5
V
*1
VPWMSW
0
-
VCC
V
—
VPHA1,VPHB1
0
-
VCC
V
—
VIN0~IN3
0
-
VCC
V
—
VENABLEA
0
-
VCC
V
—
VVREFA,VVREFB
0
-
5
V
—
CBC
-
0.01
-
μF
—
CVPUMP
-
0.01
-
μF
—
CS5VOUT
-
0.1
-
μF
—
Operating ambient temperature
Taopr
-20
-
70
°C
—
Operating junction temperature
Tjopr
-
-
120
°C
—
Supply voltage range
Input Voltage Range
External Constants
Note) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
3
Ver. BEB
AN44063A
ELECRTRICAL CHARACTERISTICS
VM=24V,Ta = 25°C±2°C unless otherwise noted.
Parameter
*1 ：Typical Value checked by design.
Symbol
Condition
Min
Limits
Typ
Max
Unit Note
Output Drivers
High-level output saturation voltage
VOH
I = – 0.5 A
Low-level output saturation voltage
VOL
Flywheel diode forward voltage
VDI
Output leakage current
Supply current (with two circuits
turned off)
ILEAK
IM
VM– 0.47
VM– 0.31
—
V
—
I = 0.5 A
—
0.47
0.71
V
—
I = 0.5 A
0.5
1.0
1.5
V
—
VM = VOUT = 37 V,
VRCS = 0 V
—
10
50
μA
—
ENABLEA = 5 V
—
4
6
mA
—
Output slew rate 1
VTr
Rising edge
—
270
—
V/μs
*1
Output slew rate 2
VTf
Falling edge
—
330
—
V/μs
*1
Dead time
TD
—
2.8
—
μs
*1
—
1.4
2.2
mA
—
—
I/O Block
Supply current(with two circuits
turned off)
ICC
High-level IN input voltage
VINH
—
2.2
—
VCC
V
—
Low-level IN input voltage
VINL
—
0
—
0.6
V
—
High-level IN input current
IINH
IN0 = IN1 = IN2
= IN3 = 5 V
–10
―
10
μA
—
Low-level IN input current
IINL
IN0 = IN1 = IN2
= IN3 = 0 V
–15
―
15
μA
—
ENABLEA = 5 V
High-level PHA1/PHB1 input
voltage
VPHAH
VPHBH
—
2.2
—
VCC
V
—
Low-level PHA1/PHB1 input
voltage
VPHAL
VPHBL
—
0
—
0.6
V
—
High-level PHA1/PHB1 input
current
IPHAH
IPHBH
PHA1 = PHB1 = 5 V
25
50
100
μA
—
Low-level PHA1/PHB1 input
current
IPHAL
IPHBL
PHA1 = PHB1 = 0 V
–15
―
15
μA
—
High-level ENABLEA input voltage
VENABLEAH
—
2.2
—
VCC
V
—
Low-level ENABLEA input voltage
VENABLEAL
—
0
—
0.6
V
—
High-level ENABLEA input current
IENABLEAH
ENABLEA = 5 V
–10
―
10
μA
—
Low-level ENABLEA input current
IENABLEAL
ENABLEA = 0 V
–15
―
15
μA
—
High-level PWMSW
input voltage
Low-level PWMSW
input voltage
VPWMSWH
—
2.2
—
VCC
V
—
VPWMSWL
—
0
—
0.6
V
—
4
Ver. BEB
AN44063A
ELECRTRICAL CHARACTERISTICS （continued）
VM=24V,Ta = 25°C±2°C unless otherwise noted.
Parameter
Symbol
Condition
Min
Limits
Typ
Max
Unit Note
I/O Block （Continued)
High-level PWMSW
input current
Low-level PWMSW
input current
IPWMSWH
PWMSW = 5 V
25
50
100
μA
—
IPWMSWL
PWMSW = 0 V
–15
—
15
μA
—
Torque Control Block
Input bias current
IREFA
IREFB
VREFA = 5 V
VREFB = 5 V
70
100
130
μA
—
PWM frequency1
fPWM1
PWMSW = 0 V
34
52
70
kHz
—
PWM frequency2
fPWM2
PWMSW = 5 V
17
26
35
kHz
—
VREFA = VREFB = 0 V
0.38
0.75
1.12
μs
—
Pulse blanking time
TB
Cmp threshold H (100%)
VTH
IN0 = IN1 = 0 V
IN2 = IN3 = 0 V
475
500
525
mV
—
Cmp threshold C (67%)
VTC
IN0 = 5 V, IN1 = 0 V
IN2 = 5 V, IN3 = 0 V
308
333
359
mV
—
Cmp threshold L (33%)
VTL
IN0 = 0 V, IN1 = 5 V
IN2 = 0 V, IN3 = 5 V
151
167
184
mV
—
Reference Voltage Block
Reference voltage
VS5 VOUT
IS5 VOUT = – 2.5 mA
4.5
5.0
5.5
V
—
Output impedance
ZS5 VOUT
IS5 VOUT = – 5 mA
—
18
27
Ω
—
5
Ver. BEB
AN44063A
ELECRTRICAL CHARACTERISTICS （continued）
VM=24V,Ta = 25°C±2°C unless otherwise noted.
Parameter
Min
Limits
Typ
Max
—
—
150
—
°C
*1
—
—
40
—
°C
*1
Symbol
Condition
Thermal protection operating
temperature
TSDon
Thermal protection hysteresis width
ΔTSD
Unit Note
Thermal Protection
Note) *1 ：Typical Value checked by design.
6
Ver. BEB
AN44063A
Top View
PIN CONFIGURATION
VM1
N.C.
BOUT2
N.C.
RCSB
N.C.
BOUT1
N.C.
AOUT2
N.C.
RCSA
N.C.
AOUT1
N.C.
VM2
VPUMP
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
TJMON
ENABLEA
IN3
IN2
IN1
IN0
PHB1
PHA1
PWMSW
GND
S5VOUT
VCC
VREFB
VREFA
BC1
BC2
PIN FUNCTIONS
Pin No.
Pin name
1
VM1
2,4,6,8,
10,12,14
N.C.
3
BOUT2
5
RCSB
7
BOUT1
Type
Description
Power supply Motor power supply 1
—
Output
No Connection
Phase B motor drive output 2
Input / Output Phase B current detection
Output
Phase B motor drive output 1
Output
Phase A motor drive output 2
9
AOUT2
11
RCSA
13
AOUT1
15
VM2
16
VPUMP
Output
Charge Pump circuit output
17
BC2
Output
Charge Pump capacitor connection 2
18
BC1
Output
Charge Pump capacitor connection 1
19
VREFA
Input
Phase A torque reference voltage input
20
VREFB
Input
Phase B torque reference voltage input
Input / Output Phase A current detection
Output
Phase A motor drive output 1
Power supply Motor power supply 2
21
VCC
22
S5VOUT
Power supply Signal power supply
Output
Internal reference voltage (5V output)
23
GND
Ground
Signal ground
24
PWMSW
Input
PWM frequency selection input
25
PHA1
Input
Phase A phase selection input
26
PHB1
Input
Phase B phase selection input
27
IN0
Input
Phase A output torque control 1
28
IN1
Input
Phase A output torque control 2
29
IN2
Input
Phase B output torque control 1
30
IN3
Input
Phase B output torque control 2
31
ENABLEA
Input
Phase A/B Enable/Disable CTL
32
TJMON
Output
VBE monitor use
Notes) Concerning detail about pin description, please refer to OPERATION and APPLICATION INFORMATION section.
7
Ver. BEB
AN44063A
FUNCTIONAL BLOCK DIAGRAM
BC1 18
BC2 17
CHARGE
PUMP
16 VPUMP
PHB1 26
Gate Circuit
IN3 30
3 BOUT2
R
SQ
IN2 29
5 RCSB
7 BOUT1
VREFB 20
15 VM2
TJMON 32
21 VCC
PWMSW 24 PWMSW
OSC
TSD
UVLO
BLANK
VREFA 19
1 VM1
9 AOUT2
S
Q
R
11 RCSA
IN1 28
13 AOUT1
IN0 27
ENABLEA 31
Gate Circuit
PHA1 25
S5 VOUT 22
Note)
VREF
VM
23 GND
This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be
simplified.
8
Ver. BEB
AN44063A
OPERATION
1. Control mode
1) Truth table
ENABLEA
PHA1/PHB1
AOUT1/BOUT1
AOUT2/BOUT2
"L"
"H"
"H"
"L"
"L"
"L"
"L"
"H"
"H"
—
OFF
OFF
IN0/IN2
IN1/IN3
Output Current
"L"
"L"
(VREF / 10) × (1 / Rs) = IOUT
"H"
"L"
(VREF / 10) × (1 / Rs) × (2 / 3) = IOUT
"L"
"H"
(VREF / 10) × (1 / Rs) × (1 / 3) = IOUT
"H"
"H"
0
Note1) Rs : current detection region
Note2) When ENABLEA = "H" or IN0 = IN1 = "H"/IN2 = IN3 = "H", all output transistors switch off at the same time.
9
Ver. BEB
AN44063A
OPERATION ( continued )
1. Control mode (continued)
2) Drive of full step (4steps sequence)
(IN0 to IN3 = const.)
1
2
3
4
1
VPHB1
VPHB1
FWD
flow-in
flow-out
B-ch.
Motor current
4
flow-in
flow-in
flow-out
B-ch.
Motor current
A-ch.
Motor current
flow-in
A-ch.
Motor current
3
flow-out
VPHA1
flow-out
VPHA1
2
REV
10
Ver. BEB
AN44063A
OPERATION ( continued )
1. Control mode(continued)
3) Drive of half step (8steps sequence)
(Ex.)
1 2 3 4 5 6 7 8
1 2 3 4 5 6 7 8
VPHA1
VPHB1
VPHB1
VIN0
VIN0
VIN1
VIN1
VIN2
VIN2
VIN3
VIN3
flow-out
flow-out
VPHA1
A-ch.
Motor current
flow-out
flow-out
flow-in
flow-in
A-ch.
Motor current
B-ch.
Motor current
flow-in
flow-in
B-ch.
Motor current
FWD
REV
REV
FWD
11
Ver. BEB
AN44063A
OPERATION ( continued )
1. Control mode(continued)
4) 1-2 phase excitation (8steps sequence)
(Ex.)
1
2
3
4
5
6
7
8
1
VPHA1
VPHB1
VPHB1
VIN0
VIN0
VIN1
VIN1
VIN2
VIN2
VIN3
VIN3
3
4
5
6
7
8
flow-out
flow-out
VPHA1
2
A-ch.
Motor current
flow-out
flow-out
flow-in
flow-in
A-ch.
Motor current
B-ch.
Motor current
flow-in
flow-in
B-ch.
Motor current
FWD
REV
REV
FWD
12
Ver. BEB
AN44063A
OPERATION ( continued )
1. Control mode(continued)
5) W1-2 phase excitation (16steps sequence)
1 2 3 4 5 6 7 8 9 10111213141516
1 2 3 4 5 6 7 8 9 10111213141516
VPHA1
VPHB1
VPHB1
VIN0
VIN0
VIN1
VIN1
VIN2
VIN2
VIN3
VIN3
flow-out
flow-out
VPHA1
A-ch.
Motor current
flow-out
flow-out
flow-in
flow-in
A-ch.
Motor current
B-ch.
Motor current
flow-in
flow-in
B-ch.
Motor current
FWD
REV
REV
FWD
13
Ver. BEB
AN44063A
APPLICATIONS INFORMATION
1.
Usage Notes
1) In order to prevent mistakes in current detection resulting noise, this LSI is provided with a pulse blanking time of
0.75 μs (typ.).
The motor current will not be less than the current determined by blanking time. Pay utmost attention at the time of
minute current control.
The graph on the right-hand side shows the relationship between the pulse blanking time and minute current value.
The increase or decrease in the motor current is determined by the resistance of the internal winding of the motor.
RCS current waveform
while in normal operation
Set current
RCS current waveform
when the set current is less than
the minimum current
Minimum current
Set current
TB
fPWM: PWM frequency
1
fPWM
TB: Pulse blanking time
2) A high current flows into the LSI. Therefore, the common impedance of the PCB pattern cannot be ignored. Take the
following points into consideration and design the PCB pattern of the motor.
A high current flows into the line between the VM1 (Pin 1) and VM2 (Pin 15) pins. Therefore, noise is generated
with ease at the time of switching due to the inductance (L) of the line, which may result in the malfunctioning or
destruction of the LSI (see the circuit diagram on the left-hand side). As shown in the circuit diagram on the
right-hand side, the escape way of the noise is secured by connecting a capacitor to the connector close to the
VM pin of the LSI. This makes it possible to suppress the direct VM pin voltage of the LSI. Make the settings as
shown in the circuit diagram on the right-hand side as much as possible.
Noise is generated with ease
Recommended PCB
VM
Low spike amplitude
due to
the capacitance
between
the VM pin and ground pin
VM
L
LSI
C
RCS
LSI
RCS
C
GND
GND
L
VM
VM
GND
GND
14
Ver. BEB
AN44063A
APPLICATIONS INFORMATION ( continued )
1.
Usage Notes (continued)
3) In the case of measuring the chip temperature of the LSI,measure the voltage of TJMON (Pin 32) and presume chip
temperature from following data. Use the following data as reference data. Before applying the LSI to a product,
conduct a sufficient reliability test of the LSI along with the evaluation of the product with the LSI incorporated.
The temperature characteristic of TJMON
VBE[V]
ΔVBE / Δtemp = –1.82 [mV / °C]
Temp[°C]
0
150
4) Power Supply Sequence
If two types of power supply are used
Rise : This LSI is recommended rise of 5 V power supply before rise of 24 V power supply.
Fall : Although there is no particular rule, check that VM fall time is about 1sec.
When recommended sequence is difficult, take the diagram below indicates into consideration and design.
Also, rise slew rate design
VM : below 0.1 V/µs, VCC : below 0.1 V/µs
Power Supply
VM
VCC
1s
time
Delay：below 100 ms
If one type of power supply is used
Rise slew rate design
VM : below 0.1 V/µs
5) Check the risk that is caused by the failure of external components.
15
Ver. BEB
AN44063A
PACKAGE INFORMATION ( Reference Data )
Package Code:SSOP032-P-0300B
unit:mm
Body Material
:
Epoxy Resin
Lead Material
:
Cu Alloy
Lead Finish Method :
16
SnBi Plating
Ver. BEB
AN44063A
IMPORTANT NOTICE
1.The products and product specifications described in this book are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore,
ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your
requirements.
2.When using the LSI for new models, verify the safety including the long-term reliability for each product.
3.When the application system is designed by using this LSI, be sure to confirm notes in this book.
Be sure to read the notes to descriptions and the usage notes in the book.
4.The technical information described in this book is intended only to show the main characteristics and application
circuit examples of the products. No license is granted in and to any intellectual property right or other right
owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company
as to the infringement upon any such right owned by any other company which may arise as a result of the use of
technical information de-scribed in this book.
5.This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of
our company.
6.This LSI is intended to be used for general electronic equipment.
Consult our sales staff in advance for information on the following applications: Special applications in which
exceptional quality and reliability are required, or if the failure or malfunction of this LSI may directly jeopardize
life or harm the human body.
Any applications other than the standard applications intended.
(1) Space appliance (such as artificial satellite, and rocket)
(2) Traffic control equipment (such as for automobile, airplane, train, and ship)
(3) Medical equipment for life support
(4) Submarine transponder
(5) Control equipment for power plant
(6) Disaster prevention and security device
(7) Weapon
(8) Others : Applications of which reliability equivalent to (1) to (7) is required
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in
connection with your using the LSI described in this book for any special application, unless our company agrees
to your using the LSI in this book for any special application.
7.This LSI is neither designed nor intended for use in automotive applications or environments unless the specific
product is designated by our company as compliant with the ISO/TS 16949 requirements.
Our company shall not be held responsible for any damage incurred by you or any third party as a result of or in
connection with your using the LSI in automotive application, unless our company agrees to your using the LSI in
this book for such application.
8.If any of the products or technical information described in this book is to be exported or provided to non-residents,
the laws and regulations of the exporting country, especially, those with regard to security export control, must be
observed.
9. Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of
controlled substances, including without limitation, the EU RoHS Directive. Our company shall not be held
responsible for any damage incurred as a result of your using the LSI not complying with the applicable laws and
regulations.
17
Ver. BEB
AN44063A
USAGE NOTES
1. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed
operating conditions (operating power supply voltage and operating environment etc.). Especially, please be
careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off
and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as
redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical
injury, fire, social damages, for example, by using the products.
2. Comply with the instructions for use in order to prevent breakdown and characteristics change due to external
factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's
process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf
life and the elapsed time since first opening the packages.
3. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuitboard), it might smoke or ignite.
4. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit
between pins. In addition, refer to the Pin Description for the pin configuration.
5. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to
problems such as a solder-bridge between the pins of the semiconductor device. Also, perform a full technical
verification on the assembly quality, because the same damage possibly can happen due to conductive
substances, such as solder ball, that adhere to the LSI during transportation.
6. The LSI is destructed under an abnormal condition, such as the short-circuiting between the output and VM pins,
output and ground pins, or output pins (i.e., load short-circuiting), in which case smoke may be generated. Pay
utmost attention to the use of the LSI.
Pay special attention to the following pins so that they are not short-circuited with the VM pin, ground pin, other
output pin, or current detection pin.
(1) AOUT1 (Pin 13), AOUT2 (Pin 9), BOUT1 (Pin 7), BOUT2 (Pin 3)
(2) BC2 (Pin 17), VPUMP (Pin 16)
(3) VM1 (Pin 1), VM2 (Pin 15), VCC(Pin 21), S5 VOUT(Pin 22)
(4) RCSA (Pin 11), RCSB (Pin 5)
The higher the current capacity of power supply is, the higher the possibility of the above destruction or smoke
generation. Therefore, it is recommended to take safety countermeasures, such as the use of a fuse.
7. The protection circuit is for maintaining safety against abnormal operation. Therefore, the protection circuit
should not work during normal operation.
Especially for the thermal protection circuit, if the area of safe operation or the absolute maximum rating is
momentarily exceeded due to output pin to VM short (Power supply fault), or output pin to GND short (Ground
fault), the LSI might be damaged before the thermal protection circuit could operate.
8. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not
applied to the pins because the device might be damaged, which could happen due to negative voltage or
excessive voltage generated during the ON and OFF timing when the inductive load of a motor coil or actuator
coils of optical pick-up is being driven.
9. The product which has specified ASO (Area of Safe Operation) should be operated in ASO.
10. Verify the risks which might be caused by the malfunctions of external components.
18
Ver. BEB
AN44063A
USAGE NOTES ( continued )
11. Perform thermal design work with consideration of a sufficient margin to keep the power dissipation based on
supply voltage, load, and ambient temperature conditions.
(The LSI is recommended that junctions are designed below 70% to 80% of Absolute Maximum Rating.)
12. Set the value of the capacitor between the VPUMP and GND pins so that the voltage on the VPUMP (Pin 16) will
not exceed 43 V in any case regardless of whether it is a transient phenomenon or not while the motor standing
by is started.
13. This LSI employs a PWM drive method that switches the high-current output of the output transistor. Therefore,
the LSI is apt to generate noise that may cause the LSI to malfunction or have fatal damage. To prevent these
problems, the power supply must be stable enough. Therefore, the capacitance between the VCC and GND pins
must be a minimum of 0.1 μF and the one between the VM and GND pins must be a minimum of 47 μF and as
close as possible to the LSI so that PWM noise will not cause the LSI to malfunction or have fatal damage.
19
Ver. BEB
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20100202
