AN44070A-VF

DATA SHEET Part No. AN44070A Package Code No. HSOP034-P-0300A Publication date: May 2011 Ver. AEB 1 AN44070A Contents „ Overview ……………………………………………………………………………………………………………. 3 „ Features …………………………………………………………………………………………………………….. 3 „ Applications ………………………………………………………………………………………………………… 3 „ Package ……………………………………………………………………………………………………………. 3 „ Type …………………………………...……………………………………………………………………………. 3 „ Application Circuit Example ………………………………………………………………………………………. 4 „ Pin Descriptions ……………………………………………………………………………………………………. 5 „ Absolute Maximum Ratings ………………………………………………………………………………………. 6 „ Operating Supply Voltage Range ……………..…………………………………………………………………. 6 „ Allowed Voltage and Current Ranges …………………………………………………………………………… 7 „ Electrical Characteristics …………………………………………………………………………………………. 8 „ Electrical Characteristics (Reference values for design) ………………………………………………………. 10 „ Technical Data ……………………………………………………………………………………………………… 11 y Circuit diagrams of the input/output part and pin function descriptions ……………………………………… 11 y Control mode (truth table) ………………………………………………………………………………………... 15 y PD ⎯ Ta diagram …………………………………………………………………………………………………. 16 „ Usage Notes ……………………………………………………………………………………………………… 17 Ver. AEB 2 AN44070A AN44070A Driver IC for DC Motor „ Overview AN44070A is a two channels H-bridge driver IC. 2-ch. DC motor can be controlled by a single driver IC. „ Features y Built-in thermal protection and low voltage detection circuit y Built-in Over Current Protection (when external resistance is added to Pin8 and Pin10.) y Built-in 5 V power supply „ Applications y IC for DC motor drives „ Package y 34 pin Plastic Small Outline Package with Back Heat Sink (SOP Type) „ Type y Bi-CDMOS IC Ver. AEB 3 AN44070A „ Application Circuit Example BC1 14 0.01 μF 17 VPUMP CHARGE PUMP BC2 15 0.01 μF L：Charge Pump off BSTBY 34 50 kΩ 50 kΩ BIN2(BBR) 32 BIN1(BFR) 31 50 kΩ Gate Circuit 8 RCSB S R Q 5 BOUT2 M 50 kΩ ref IFSEL 25 6 BOUT1 3 VM2 50 kΩ TJMON 1 23 VCC BPWM 33 APWM 19 PWM OSC TSD UVLO BLANK 16 VM1 12 AOUT2 Q S R 10 RCSA M ref 50 kΩ 13 AOUT1 AIN1(AFR) 20 AIN2(ABR) 21 ASTBY 18 S5VOUT 24 Gate Circuit 50 kΩ 27 GND 50 kΩ VREF VM 50 kΩ 0.1 μF Ver. AEB 4 AN44070A „ Pin Descriptions Pin No. Pin name Type Output Description 1 TJMON 2 N.C. — 3 VM2 Power supply 4 N.C. — 5 BOUT2 Output Ch. B motor drive output 2 6 BOUT1 Output Ch. B motor drive output 1 7 N.C. 8 RCSB Input / Output 9 GND Ground 10 RCSA Input / Output 11 N.C. 12 AOUT2 Output Ch. A motor drive output 2 13 AOUT1 Output Ch. A motor drive output 1 14 BC1 Output Charge Pump capacitor connection 1 15 BC2 Output Charge Pump capacitor connection 2 16 VM1 Power supply 17 VPUMP Output 18 ASTBY Input Ch. A Standby input 19 APWM Input Ch. A PWM input 20 AIN1 Input Ch. A Forward – Reverse input1 (IFSEL = Low or OPEN) 21 AIN2 Input Ch. A Forward – Reverse input2 (IFSEL = Low or OPEN) / Ch. A Brake Mode input (IFSEL = High) 22 N.C. — 23 VCC Power supply 24 S5VOUT 25 IFSEL Input 26 GND Ground Die pad ground 27 GND Ground Signal ground 28 N.C. — — 29 N.C. — — 30 N.C. — — 31 BIN1 Input Ch. B Forward – Reverse input1 (IFSEL = Low or OPEN) 32 BIN2 Input Ch. B Forward – Reverse input2 (IFSEL = Low or OPEN) / Ch. B Brake Mode input (IFSEL = High) 33 BPWM Input Ch. B PWM input 34 BSTBY Input Ch. B Standby input — — Output VBE monitor use — Motor power supply 2 — — Ch. B current detection Die pad ground Ch. A current detection — Motor power supply 1 Charge Pump circuit output — Signal power supply Internal reference voltage (5 V output) Input Mode select Ver. AEB 5 AN44070A „ Absolute Maximum Ratings A No. Parameter Symbol Rating Unit Note 1 Supply voltage1 (Pin3, Pin16) VM 37 V *1 2 Supply voltage2 (Pin23) VCC − 0.3 to +6 V *1 3 Power dissipation PD 0.466 W *2 4 Operating ambient temperature Tstg −20 to +70 °C *3 5 Storage temperature Topr −55 to +150 °C *3 6 Output pin voltage (Pin5, 6, 12, 13) VOUT 37 V *4 7 Motor drive current (Pin5, 6, 12, 13) IOUT ±2.5 A *4, *5 8 Flywheel diode current (Pin5, 6, 12, 13) Ifl 2.5 A *4, *5 Notes) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2 : The power dissipation shown is the value at Ta = 70°C for the independent (unmounted) IC package without a heat sink. When using this IC, refer to the PD-Ta diagram in the „ Technical Data standard and use under the condition not exceeding the allowable value. *3 : Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25°C. *4 : Do not apply current or voltage from outside to any pin not listed above. In the circuit current, (+) means the current flowing into IC and (−) means the current flowing out of IC. *5 : Four-layer PCB with 1 500 mm2 of copper ground area on second-layer and third-layer connected with thermal vias and to device exposed pad. If exposed thermal pad is not connected copper ground area, current rating is 1.5 A. „ Operating Supply Voltage Range Parameter Symbol Range Unit Note Operating supply voltage range1 VM 10.0 to 34.0 V ∗ Operating supply voltage range2 VCC 3.0 to 5.5 V ∗ Note) * : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. Ver. AEB 6 AN44070A „ Allowed Voltage and Current Ranges Notes) y Rating Voltage is voltage of pin on GND y Do not apply current or voltage from outside to any pin not listed above. Pin No. Pin name Rating Unit Note 8 RCSB + 2.5 V — 10 RCSA + 2.5 V — 14 BC1 VM + 0.3 V — 15 BC2 (VM − 1) to 43 V — 17 VPUMP (VM − 2) to 43 V — 18 ASTBY − 0.3 to 6 V — 19 APWM − 0.3 to 6 V — 20 AIN1 − 0.3 to 6 V — 21 AIN2 − 0.3 to 6 V — 24 S5VOUT −7 to 0 mA — 25 IFSEL − 0.3 to 6 V — 31 BIN1 − 0.3 to 6 V — 32 BIN2 − 0.3 to 6 V — 33 BPWM − 0.3 to 6 V — 34 BSTBY − 0.3 to 6 V — Ver. AEB 7 AN44070A „ Electrical Characteristics at VM = 24 V, VCC = 5 V Note) Ta = 25°C±2°C unless otherwise specified. B No. Parameter Symbol Conditions Limits Min Typ Max Unit Note Output Drivers 1 High-level output saturation voltage VOH I = –1.2 A VM – 0.63 VM – 0.42 — V — 2 Low-level output saturation voltage VOL I = 1.2 A — 0.55 0.825 V — 3 Flywheel diode forward voltage VDI I = 1.2 A 0.5 1.0 1.5 V — 4 Output leakage current 1 VM = VOUT = 37 V, VRCS = 0 V — 10 50 μA — ILEAK1 Power Supply 5 Supply current1 (with two circuits turned off) IM1 ASTBY = BSTBY = 0 V — 3 4.5 mA — 6 Supply current2 (with two circuits turned on) IM2 ASTBY = BSTBY = 5 V — 5.3 7.9 mA — 7 Supply current3 (with two circuits turned on) ICC ASTBY = BSTBY = 5 V — 1.4 2.2 mA — 8 Reference voltage VS5VOUT IS5VOUT = –2.5 mA 4.5 5.0 5.5 V — 9 Output impedance ZS5VOUT IS5VOUT = –5 mA — 18 27 Ω — IN input 10 High-level IN input voltage VINH — 2.2 — VCC V — 11 Low-level IN input voltage VINL — 0 — 0.6 V — 12 High-level IN input current IINH AIN1 = AIN2 = BIN1 = BIN2 =5V 70 — 130 μA — 13 Low-level IN input current IINL AIN1 = AIN2 = BIN1 = BIN2 =0V –10 — 10 μA — Standby input 14 High-level STBY input voltage VSTBYH — 2.2 — VCC V — 15 Low-level STBY input voltage VSTBYL — 0 — 0.6 V — 16 High-level STBY input current ISTBYH ASTBY = BSTBY = 5 V 70 — 130 μA — 17 Low-level STBY input current ISTBYL ASTBY = BSTBY = 0 V –10 — 10 μA — IFSEL input 18 High-level IFSEL input voltage VIFSELH — 2.2 — VCC V — 19 Low-level IFSEL input voltage VIFSELL — 0 — 0.6 V — 20 High-level IFSEL input current IIFSELH IFSEL = 5 V 70 — 130 μA — 21 Low-level IFSEL input current IIFSELL IFSEL = 0 V –10 — 10 μA — Ver. AEB 8 AN44070A „ Electrical Characteristics (continued) at VM = 24 V, VCC = 5 V Note) Ta = 25°C±2°C unless otherwise specified. B No. Parameter Symbol Conditions Limits Min Typ Max Unit Note PWM input 22 High-level PWM input voltage VPWMH — 2.2 — VCC V — 23 Low-level PWM input voltage VPWML — 0 — 0.6 V — 24 High-level PWM input current IPWMH APWM = BPWM = 5 V 70 — 130 μA — 25 Low-level PWM input current IPWML APWM = BPWM = 0 V –10 — 10 μA — 26 PWM Input Max frequency fPWM — — — 100 kHz — 27 Input Min pulse width tW — 5 — — μs — Ver. AEB 9 AN44070A „ Electrical Characteristics (Reference values for design) at VM = 24 V, VCC = 5 V Notes) Ta = 25°C±2°C unless otherwise specified. The characteristics listed below are reference values derived from the design of the IC and are not guaranteed by inspection. If a problem does occur related to these characteristics, we will respond in good faith to user concerns. B No. Parameter Symbol Conditions Reference Min Typ Max Unit Note Output Drivers 28 Output slew rate 1 VTr Rising edge — 150 — V/μs — 29 Output slew rate 2 VTf Falling edge — 190 — V/μs — 30 Dead time TD — — 1.1 — μs — Thermal Protection 31 Thermal protection operating temperature TSDon — — 150 — °C — 32 Thermal protection hysteresis width ΔTSD — — 40 — °C — Ver. AEB 10 AN44070A „ Technical Data y Circuit diagrams of the input/output part and pin function descriptions Note) The characteristics listed below are reference values based on the IC design and are not guaranteed. Pin No. Waveform and voltage 1 ― Inner circuit Impedance 0.8k 1 Description ― Pin1 : VBE monitor use ― Pin 5 : Ch. B motor drive output 2 6 : Ch. B motor drive output 1 8 : Ch. B current detection 12 : Ch. A motor drive output 2 13 : Ch. A motor drive output 1 10 : Ch. A current detection Pin1 TJMON 17 5 6 8 10 12 13 100k ― 100k Pin 5 BOUT2 6 BOUT1 12 AOUT2 13 AOUT1 Pin 8 RCSB 10 RCSA 4k Ver. AEB 11 AN44070A „ Technical Data (continued) y Circuit diagrams of the input/output part and pin function descriptions (continued) Note) The characteristics listed below are reference values based on the IC design and are not guaranteed. Pin No. Waveform and voltage Inner circuit Impedance Description 150 14 14 ― ― Pin14 : Charge Pump capacitor connection 1 ― Pin15 : Charge Pump capacitor connection 2 17 : Charge Pump circuit output 125 Pin14 BC1 300k 15 17 ― 15 17 125 Pin15 BC2 Pin17 VPUMP Ver. AEB 12 AN44070A „ Technical Data (continued) y Circuit diagrams of the input/output part and pin function descriptions (continued) Note) The characteristics listed below are reference values based on the IC design and are not guaranteed. Pin No. Waveform and voltage Inner circuit Impedance Description Pin18 ASTBY 25 IFSEL 34 BSTBY 18 25 34 ― 52k 19 20 21 31 32 33 52 kΩ 54k 50k Pin19 APWM 20 AIN1 21 AIN2 31 BIN1 32 BIN2 33 BPWM ― Pin 18 :Ch. A Standby / Active CTL 25 : Input mode selection input 34 : Ch. B Standby / Active CTL 54 kΩ 4k 50k Pin19 : Ch. A PWM input 20 : Ch. A Forward / Reverse input 1 21 : Ch. A Forward / Reverse input 2 31 : Ch. B Forward / Reverse input 1 32 : Ch. B Forward / Reverse input 2 33 : Ch. B PWM input 100k Ver. AEB 13 AN44070A „ Technical Data (continued) y Circuit diagrams of the input/output part and pin function descriptions (continued) Note) The characteristics listed below are reference values based on the IC design and are not guaranteed. Pin No. Waveform and voltage 24 ― Inner circuit 2k Impedance Pin24 S5VOUT ― 24 Description Pin24 : Internal reference voltage (5 V output) 102k VCC (Pin23) Sym bols VM(Pin3, Pin16) ― ― ― Diode Zener diode Ground Ver. AEB 14 AN44070A „ Technical Data (continued) y Control mode (truth table) INPUT IFSEL STBY OUTPUT IN1 IN2 PWM AOUT1 /BOUT1 AOUT2 /BOUT2 Mode "H" "H" — "H" “H" Short Brake "L" “H" "H" "L" "H" Forward "L" "H" “H" Short Brake "H" "L" "H" "H" "L" Reverse "L" "H" “H" Short Brake "L" "L" — OFF OFF Stop — — — OFF OFF Standby "H" “L” “L” INPUT IFSEL STBY "H" “H” “L” INPUT OUTPUT IN1 IN2 PWM AOUT1 /BOUT1 AOUT2 /BOUT2 Mode — "H" "L" "H" “H" Short Brake "L" — "H" "L" "H" Forward "H" — "H" "H" "L" Reverse — "L" "L" OFF OFF Stop — — — OFF OFF Standby OUTPUT ASTBY BSTBY “H” "H" “H” “L" “L” "H" “L” “L” Charge Pump ON OFF *1 Note) *1 : Before the motor begins to rotate, install the wait time of 200μs after releasing Standby. Ver. AEB 15 AN44070A „ Technical Data (continued) y PD ⎯ Ta diagram Ver. AEB 16 AN44070A „ Usage Notes 1. Perform thermal design work with consideration of a sufficient margin to keep the power dissipation based on supply voltage, load, and ambient temperature conditions. (The IC is recommended that junctions are designed below 70 ∼ 80% of Absolute Maximum Rating.) 2. The protection circuit is incorporated for the purpose of securing safety if the IC malfunctions. Therefore, design the protection circuit so that the protection circuit will not operate under normal operating conditions. The temperature protection circuit, in particular, may be destructed before the temperature protection circuit operates if the area of safety operation of the device or the maximum rating is exceeded instantaneously due to the short-circuiting between the output pin and VM pin or a ground fault caused by the output pin and ground pin. 3. Pay utmost attention to the pattern layout in order to prevent the IC from destruction resulting from the short-circuiting of pins. See page 6 Pin Descriptions for allocations of the pins of the IC. 4. When driving a motor coil or transformer (L) load, the device may be destructed as a result of a negative or excessive voltage generated at the time of turning the load on and off. Unless otherwise provided in the specifications, do not apply any negative or excessive voltage. 5. Do not make mistakes in the PCB mounting direction. If power is supplied with the pins mounted in the wrong direction, the IC may be destructed. 6. The IC may be destructed by the solder bridge between the pins of semiconductor devices. Fully make a visual check on the PCB before supplying power. Furthermore, the IC may be destructed if conductive foreign matters like solder chips are stuck to the IC during transportation after PCB mounting. Therefore, conduct full technical verification of the mounting quality of the IC. 7. The IC is destructed under an abnormal condition, such as the short-circuiting between the output and VM pins, output and ground pins, or output pins (i.e., load short-circuiting), in which case smoke may be generated. Pay utmost attention to the use of the IC. Pay special attention to the following pins so that they are not short-circuited with the VM pin, ground pin, other output pin, or current detection pin. (1) AOUT1 (Pin13), AOUT2 (Pin12), BOUT1 (Pin6), BOUT2 (Pin5) (2) BC2 (Pin15), VPUMP (Pin17) (3) VM1 (Pin16), VM2 (Pin3), VCC(Pin23), S5VOUT(Pin24) (4) RCSA (Pin10), RCSB (Pin8) The higher the current capacity of power supply is, the higher the possibility of the above destruction or smoke generation. Therefore, it is recommended to take safety countermeasures, such as the use of a fuse. 8. When using the IC for model expansion or new sets, be sure to make full safety checks including a long-term reliability check on each set. 9. Set the value of the capacitor between the VPUMP and GND pins so that the voltage on the VPUMP pin (Pin17) will not exceed 43 V in any case regardless of whether it is a transient phenomenon or not while the motor standing by is started. 10. This IC employs a PWM drive method that switches the high-current output of the output transistor. Therefore, the IC is apt to generate noise that may cause the IC to malfunction or have fatal damage. To prevent these problems, the power supply must be stable enough. Therefore, the capacitance between the S5VOUT and GND pins must be a minimum of 0.1 μF and the one between the VM and GND pins must be a minimum of 47 μF and as close as possible to the IC so that PWM noise will not cause the IC to malfunction or have fatal damage. Ver. AEB 17 AN44070A „ Usage Notes (continued) 11. A high current flows into the IC. Therefore, the common impedance of the PCB pattern cannot be ignored. Take the following points into consideration and design the PCB pattern of the motor. A high current flows into the line between the VM1 (Pin16) and VM2 (Pin3) pins. Therefore, noise is generated with ease at the time of switching due to the inductance (L) of the line, which may result in the malfunctioning or destruction of the IC (see the circuit diagram on the left-hand side). As shown in the circuit diagram on the right-hand side, the escape way of the noise is secured by connecting a capacitor to the connector close to the VM pin of the IC. This makes it possible to suppress the direct VM pin voltage of the IC. Make the settings as shown in the circuit diagram on the right-hand side as much as possible. Noise is generated with ease Low spike amplitude due to the capacitance between the VM pin and ground pin Recommended PCB GND L VM IC IC C RCS C RCS VM L GND VM VM GND GND 12. In the case of measuring the chip temperature of the IC, measure the voltage of TJMON(Pin1) and presume chip temperature from following data. Use the following data as reference data. Before applying the IC to a product, conduct a sufficient reliability test of the IC along with the evaluation of the product with the IC incorporated. VBE[V] The temperature characteristic of TJMON ΔVBE / Δtemp = –1.82 [mV/°C] Temp[°C] 0 150 Ver. AEB 18 AN44070A „ Usage Notes (continued) 13. Power Supply Sequence y If two types of power supply are used Rise : This IC is recommended rise of 5 V power supply before rise of 24 V power supply. Fall : Although there is no particular rule, check that VM fall-time is about 1 s. When recommended sequence is difficult, take the diagram below indicates into consideration and design. Also, rise slew rate design VM : below 0.1V/μs, VCC : below 0.1V/μs Power Supply VM VCC 1s Delay : below 100 ms time y If one type of power supply is used Rise/Fall slew rate design, VM : below 0.1V/μs Please check that it is less than 1.0 sec between VCC falling down to 0 volt and VM falling down to 0 volt. 14. Charge pump circuit y The charge pump circuit has stopped when the Low signal is input to ASTBY(Pin18) and BSTBY(Pin34). The start time is necessary until the charge pump circuit begins operating. Please take the weight time of 200 μs until the motor starts rotating after making IC active. VM + 5 V VM – 1.4 V VPUMP Delay : more than 200 μs H L PWM input H L STBY input time 15. PWM operation y The PWM operation of this IC assumes the control by the input switching of APWM (Pin19) or BPWM (Pin33). When AN44070A is operated PWM by using other terminals, the duty of the output is extremely different from the duty of the input. Please use APWM or BPWM when AN44070A is operated PWM. y When Free Run Mode and Forward/Reverse Mode is repeated in PWM operation, the backflow current flows from GND toward VM. Please add external capacity so as not to exceed the absolute maximum rating of VM. 16. IFSEL terminal y Do not switch the terminal IFSEL(Pin25) while IC is active Mode. Please switch IFSEL after the power supply is turned off once or the Low signal is input to ASTBY and BSTBY. 17. Check the risk that is caused by the failure of external components. Ver. AEB 19 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202