AQV258HAXC88

TITLE SPECIFICATIONS NAME PhotoMOS PAGE AQV258HAX C88 1. TYPE HE 1 Form A SMD type 2. PART NO. AQV258HAX C88 3. DRAWING NO.; AQV258HAX C88 4. USAGE 1/8 BMS voltage monitoring and insulation detection (Spec Review No. PM20210426a-3) 6 l 、1_1 ＋ 5. CHARACTERISTICS 5 — 1 Equivalent circuit — 2 3 4 5- 2 Absolute maximum ratings (Ta= 25 ° C) Item Symbol Value Unit LED forward current IF 50 mA LED reverse voltage VR 5 V Peak forward current *l IFP 1 A Power dissipation P in 75 mW Load voltage (Peak AC) VL 1500 V Continuous load current *2 吕 Peak load current *3 IL 20 mA Ipeak 60 mA P。ut 360 mW PT 410 mW Viso 5000 T。pr Tstg -40 to 85 V rms oc 巨 ＿ 已 卫 。 Power dissipation Total power dissipation I/0 isolation voltage Ambient temperature *l *2 *3 *4 Operating *4 Storage f=lOO Hz, Duty factor=O. 1 % Peak AC/DC 100 ms (1 shot), VL=DC Non-icing at low temperatures Panasonic Corporation —40 to 100 CHECKED ENACTED oc TITLE SPECIFICATIONS NAME PhotoMOS PAGE 2/8 AQV258HAX C88 5- 3 Recommended operating conditions (Ta=25 ° C) Symbol Min. Item LED forward current IF VL Load voltage (Peak AC) 5 Typ. 10 Max. Unit 900 V 20 mA mA 10 Continuous load current IL Please use under recommended operating conditions to obtain expected performance. Additionally, please check the other conditions in this specification sheet because they are affected by the actual usage. 5- 4 Electrical characteristics (Ta=25 ° C) Item Symbol Test conditions h=Max. LED operate current IFon 且 LED turn off current 三 七 VF On resistance .s q 匕已口户”心 IFoff LED dropout voltage *l 』 h=Max. R。n IF=5OrnA h=lO mA, Turn off time *2 T 。ff Ciso h=lO mA, h=Max. h=lO mA, h=Max. f=l MHz, VB=O V Riso 500 V DC T 。n I/0 capacitance isolation resistance *l Typ. 1.17 V at h=lO mA *2 Turn on/Turn off time 荔 ° 总Initial I/0 立 七 产七; “Q } Input ................................................... Output 0.2 0.7 Within 1 s Ir=O mA, VL=Max. ILeak Turn on time *2 Typ. h=Max. Off state leakage current Switching speed Min. /··· ···-···················· Ton 0.8 3 Unit mA mA 1. 35 1.5 305 500 Q 10 1 µA ms 1.5 pF 0.14 0.1 0.8 1000 Max. 0.5 V ms MQ 90% . . . . .. .· - 10% Toff · ························.............. -y 5- 5 The terminal leads receive solder plating. I DATE: Jun. 9, 2021 Panasonic Corporation TITLE SPECIFICATIONS NAME PhotoMOS PA j S G:QV258:� C88 ＼ 6. MAXIMUM CURRENT VS. AMBIENT TEMPERATURE CHARACTERISTICS 6- 1 Continuous load current vs. Ambient temperature characteristics 2 。 25 V三 5 l 0 l 5 +U8.I .I D8 pB01 个 _ 。 -40 -20 — 0 20 40 60 85 80 100 Ambient temperature, °C 6- 2 LED forward current vs. Ambient temperature characteristics 100 80 ［甘 60 飞:s:: 三 40 .....:i 台 20 Q 。 ＼ -40 -20 — o 20 40 60 85 so~~ 100 Ambient temperature, °C I DATE: Jun. Pa Panasonic Corporation 9, 2021 TITLE SPECIFICATIONS NAME PhotoMOS PAGE 4/8 AQV258HAX C88 7. USING METHODS 7- 1 Wiring diagram E 。 三 RIN PhotoMOS 1 vL （Ac ， Dc ） 4 3 E : h: VL : h: RI',: ------1 l Load: ;1 _____..: Power source at input side LED forward current Load voltage Load current Current limit resistor 7— 2 Examples of each input power supply and the current limit resistor (l p= lO mA) RIN E 1 PhotoMOS 10 6 E RIN 5 V Approx. 350 Q --zJ2 15 V Approx. 1.4 k Q 3 24 V Approx. 2. 3 k Q When the h is not 10 rnA, please decide the appropriate value of the current limit resistor (RIN) in consideration of the LED dropout voltage (VF). 8. CAUTIONS FOR USE Please use our products in the conditions described in our specification sheet. Panasonic Corporation does not guarantee any failure caused by the usage in the conditions beyond the specifications. Additionally, please evaluate the device in the worst condition of your actual usage to ensure the reliability. 8- 1 Regarding cautions for use and explanation of technical terms, please refer to our web site. 8- 2 About derating design To apply derating for reliable design is significant because it is a factor affects product life. Even if the product is used in the absolute maximum ratings of temperature, current, voltage, etc., reliability may be lowered remarkably when continuously used in high load conditions (high temperature, high humidity, high current, high voltage, etc.). Therefore, please derate sufficiently in the absolute maximum ratings and evaluate the device in the actual condition. DATE: Jun. 9, 2021 Panasonic Corporation TITLE SPECIFICATIONS NAME PhotoMOS PAGE 5/8 AQV258HAX C88 8— 3 Unused terminals Do not use terminal No. 3, because it is no connection terminal. 8- 4 Circuit connections Please check the wiring diagram in the catalog or the specification sheet, and connect the terminals correctly. If this device is energized with short-circuit or any wrong connection, that may cause inner parts destruction, unexpected malfunction, abnormal heat, fire, and so on. 1 寸 @2 o 6 8- 5 Output spike voltages 1) If an inductive load generates spike voltages which exceed the absolute maximum rating, the spike voltage shall be limited. Circuit examples are shown below. 3 Clamp diode is connected in parallel with the load 寸 @2 o 6 1 3 CR Snubber is connected in parallel with the load 2) Clamp diode or CR Snubber can limit spike voltages from the load. However, the inductance increases by long wiring and it may cause spike voltages. Please keep the wire as short as possible to minimize inductance. 8- 6 Continual DC bias In cases in which a continual DC bias is applied between the input and output, the output-side MOSFET may deteriorate due to the voltage. Therefore, please avoid to use under such the conditions. An example of a circuit that might undergo MOSFET deterioration due to voltage is given below. PhotoMOS RIN I 6 / E 士: 3 4 口 l -L- - - - -: oad l-----1 DATE: Jun. Panasonic Corporation 9, 2021 TITLE SPECIFICATIONS NAME PhotoMOS PAGE 6/8 AQV258HAX C88 8- 7 Ripple in the LED forward current If ripple is present in the input power supply, observe the following: 1) For LED forward current, please maintain min. 5 mA at Em in• 2) Please make sure the LED forward current is no higher than 50 mA at Emax• 勹 8- 8 Soldering condition 1) IR (Infrared reflow) soldering method In case of automatic soldering, following conditions should be observed. (recommended condition reflow: Max. 2 times, measurement point: soldering lead) T3 T2 Tl T1 = 150 °C to 180 °C T2= 230 °C T3= 240 °C to 250 °C t1 = 60 s to 120 s tz=Within 30 s t3=Within 10 s t1 t2 2) Other soldering methods Other soldering methods (VPS, hot-air, hot plate, laser heating, pulse heater, etc.) except for above affect the PhotoMOS characteristics differently. Please evaluate the device under the actual usage. 3) Manual soldering method Temperature: 350 °C to 400 °C Wattage : 30 W to 60 W Time : Within 3 s 8- 9 Notes for mounting 1) When different kinds of packages are mounted on PCB, temperature rise at the soldering lead is highly dependent on package size. Therefore, please set the lower temperature than above soldering condition (8 — 8), and confirm the temperature condition of actual usage before soldering. 2) When soldering condition exceeds our recommendation, it may cause package crack or bonding wire breaking because of thermal expansion unconformity and resin strength reduction. Please contact us about the propriety of the condition. 3) Please confirm the heat stress to the product by using actual board because it may be changed by board condition or manufacturing process condition 4) The change of soldering condition or the soldering material may affect soldering characteristics such as wicking property, wettabi 1 ity, or strength. Therefore, please check the adequacy under the actual production condition. 5) Please apply coating after the device returns to a room temperature. DATE: Jun. Panasonic Corporation 9, 2021 TITLE SPECIFICATIONS NAME PhotoMOS 8 — l PAGE 7 8 AQV25 8HA/ C8 8 10 Cleaning solder flux The immersion washing with an organic solvent is recommended to clean the solder flux. If you have to use ultrasonic cleaning, please adopt the following conditions and check that there are no problems in the actual usage. : 27 kHz to 29 kHz • Frequency • Ultrasonic output: No greater than 0. 25 W/cm2 * 30 s or less • Cleaning time : Float PCB and the device in the cleaning solvent without contacting • Others the ultrasonic vibrator. * Note; Applies to unit area ultrasonic output for ultrasonic baths 9. TRANSPORTATION AND STORAGE 9- 1Extreme vibration during transport may deform the lead or damage the PhotoMOS. Please handle the outer and inner boxes with care. 9- 2Inadequate storage condition may degrade soldering, appearance, and characteristics. The following storage conditions are recommended: • Temperature: 0 °C to 45 °C • Humidity : Max. 7 0 % RH • Atmosphere : No harmful gasses such as sulfurous acid gas, minimal dust. 10. WATER CONDENSATION Water condensation occurs when the ambient temperature changes suddenly from a high temperature to low temperature at high humidity, or the device is suddenly transferred from a low ambient temperature to a high temperature and humidity. Condensation causes the failures such as insulation deterioration. Panasonic Corporation does not guarantee the failures caused by water condensation. The heat conduction by the equipment in which the PhotoMOS is installed may accelerate the water condensation. Please confirm that there is no condensation in the worst condition of the actual usage. (Special attention should be paid when high temperature heating parts are close to the PhotoMOS.) I DATE: Jun. Panasonic Corporation 9, 2021 TITLE NAME SPE CIFICATIONS l PhotoMOS 8 8 PA E G 5 AQV2 8HA/ C88 11. WARRANTY Panasonic Corporation will do our utmost to keep our product to be free from defects. However; 1) To avoid uses of the product not in accordance with its specifications, Panasonic Corporation asks the purchaser to present the purchaser's specification, the final destination, application of the final product and the method of installation of the product. 2) Please adopt the dual circuit (protection or redundant circuit) and conduct safety test when the PhotoMOS is used under the following condition. -When the significant damage to life and property are expected. -When the PhotoMOS is used in instruments required high safety. 3) Panasonic Corporation will either repair or replace any product or part after mutual consultation if it is proven to be defective against only the items written in this specification within one year from the date of products acceptance at the site of delivery unless another contract defined each other. The following are excluded from the warranty conditions: i) Any consequential damage or loss of profit is resulted from malfunctions or defects of the product. ii) The products are affected by the situation out of the specification at handling, the storage and the transport, etc. after the delivery. iii) An unforeseen situation arises which was unable to be predicted technically at the time of shipment. iv) A natural or man-made disaster which is beyond Panasonic Corporation's control occurs such as earthquake, flood, fire or social strife. Panasonic Corporation I DATE : Jun. 9, 2021 90 ·0 + !7 . ＠ 9 O g·L V258HC8 「 －-］ - L_－—-－」 Lo t No. 8 8 土0. 0 5 丿勹 ＠ 勹 ｀ INPU丁：DC+ v .C INPU丁：DC — 2 '�+ 2 .0 。 NO CONNEC丁ION 47 0.47 1 . 25 25 OU丁PU丁：AC/DC OU丁PU丁：AC/DC 25 2 2 54 54 t = 0 . 25 Instruction o u t s i d e t he tolerance: Catalog No. Name AQV258HAX PhotoMOS C88 Drawing Name Drawing No. Scale 5 : 1 DIMENSIONS AOV258HAX Un i t : mm C88 Date Drawn Panasonic (3rd Angle Svstem) 士0 Corporation Jun 9, 20 21 Ta Pe mens I On S Direction of picking 1 0 . 1 士0.1 L . ho l e s s T r ac t o r f e e d 1.5 ：： g-1 d i a. I. O; 。 3 土0.05 d (1) l €.O+9 [ I· o; S . L l .o廿2 ． - 6 Device mounted on t a P e 4 . 5 士0.3 i on t 0 f i Ck n g : 1' 2, 3-p 21 土0.8 e ! p \、/ - － J..一 ,. $OOC -——一—－仁—:——-——. 』 and de. i mens i ons I \ 厂 � Ta Pe d i a. s r ec n Reel Di 1. 6 士0. 1 d (2) o t e) p N 2 土 0. 1 12 士 0. 1 13 士0.5 d i a. 17.5 士I.5 2 土0.2 reel: 1000pcs/reel Instruction outside t he tolerance: 士0. 1 Catalog No. Name Drawn AQV***AX Drawing Name Drawing No. PhotoMOS 欠 Designed ＿． Checked 夕＿ Enacted (3rd Angle System) z Scale TAPE AND REEL DIMENSIONS AOV***AX Unit: Panasonic mm Date Corporat ion Sep 6. 199 3