PhotoMOS
GE
1 Form B
Normally closed type with reinforced insulation
FEATURES
8.8
8.8
6.4
1 Form B output type
60V type couples high capacity (0.55A) with low onresistance (Typ. 1Ω)
Low on-resistance
Controls low-level analog signals
High sensitivity and low on-resistance
Low-level off-state leakage current
Reinforced insulation: 5,000 V
6.4
3.6
3.9
(Height includes standoff)
1
6
2
5
3
4
TYPICAL APPLICATIONS
Power supply
Measuring equipment
Security equipment
Telephone equipment
Sensing equipment
(Unit: mm)
Note: Please contact our sales representative for automotive applications of PhotoMOS.
TYPES
Output rating*1
Category
I/O isolation
voltage
AC/DC
5,000 Vrms
dual use (Reinforced)
Load
voltage
Load
current
Part No.
Through hole
terminal
Packing quantity
Surface mount terminal
Tape and reel
Tape and reel
packing style X*2 packing style Z*2
Tube packing style
60 V
550 mA
AQV412EH
AQV412EHA
AQV412EHAX
AQV412EHAZ
350 V
130 mA
AQV410EH
AQV410EHA
AQV410EHAX
AQV410EHAZ
400 V
120 mA
AQV414EH
AQV414EHA
AQV414EHAX
AQV414EHAZ
Tube
Tape and reel
1-tube: 50 pcs.
1-reel: 1,000 pcs.
Outer carton: 500 pcs. Outer carton: 1,000 pcs.
Note: The surface mount terminal shape indicator “A” and the packing style indicator “X” or “Z” are not marked on the device.
(Ex. the label for product number AQV412EHAX is AQV412EH.)
*1.Indicate the peak AC and DC values.
*2.Tape and reel packing style X: picked from the 1/2/3-pin side, tape and reel packing style Z: picked from the 4/5/6-pin side.
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Panasonic Corporation 2019
ASCTB127E 201912
PhotoMOS GE 1 Form B
RATING
Absolute maximum ratings (Ambient temperature: 25°C)
Output
Input
Item
Type of
connection
Symbol
AQV412EH (A)
AQV410EH (A)
LED forward current
IF
50 mA
LED reverse voltage
VR
5V
Peak forward current
IFP
Power dissipation
Pin
Load voltage (peak AC)
VL
Continuous load current
Ipeak
Power dissipation
Pout
Remarks
f = 100 Hz,
Duty Ratio = 0.1%
1A
-
75 mW
IL
Peak load current
AQV414EH (A)
60 V
350 V
400 V
A
0.55 A
0.13 A
0.12 A
B
0.65 A
0.15 A
0.13 A
C
0.8 A
0.17 A
0.15 A
1.5 A
0.4 A
0.3 A
A connection:
Peak AC, DC
B, C connection: DC
A connection:
100 ms (1 shot),
VL = DC
500 mW
550 mW
Total power dissipation
PT
I/O isolation voltage
Viso
Ambient temperature (Operating)
Topr
–40 to +85°C
Ambient temperature (Storage)
Tstg
–40 to +100°C
-
5,000 Vrms
(Avoid icing and
condensation)
Electrical characteristics (Ambient temperature: 25°C)
Item
Input
LED operate
(OFF) current
LED reverse (ON)
current
LED dropout
voltage
Typical
Maximum
Minimum
Typical
Typical
Maximum
Typical
Output
Maximum
On resistance
Typical
Maximum
Typical
Maximum
Transfer characteristics
Off state leakage
current
Maximum
Typical
Operate (OFF)
time*
Maximum
Reverse (ON)
time*
Maximum
I/O capacitance
Initial I/O isolation
resistance
Typical
Typical
Maximum
Minimum
Symbol
Type of
connection
IFoff
-
IFon
-
VF
-
Ron
A
Ron
B
Ron
C
ILeak
-
Toff
-
Ton
-
Ciso
-
Riso
-
AQV412EH (A)
AQV410EH (A)
AQV414EH (A)
1.9 mA
IL = Max.
3 mA
0.4 mA
IL = Max.
1.8 mA
1.25 V (1.14 V at IF = 5 mA)
IF = 50 mA
1.5 V
1Ω
18 Ω
25.2 Ω
2.5 Ω
35 Ω
50 Ω
0.55 Ω
13 Ω
19 Ω
1.3 Ω
17.5 Ω
25 Ω
0.3 Ω
6.5 Ω
10 Ω
0.7 Ω
8.8 Ω
12.5 Ω
1.5 ms
8 ms
IF = 0 mA
IL = Max.
Within 1 s
IF = 0 mA
IL = Max.
Within 1 s
IF = 0 mA
IL = Max.
Within 1 s
IF = 5 mA
VL = Max.
10 μA
3 ms
Condition
1.3 ms
3 ms
0.3 ms
1.5 ms
0.8 pF
IF = 0 mA→5 mA
IL = Max.
IF = 5 mA→0 mA
IL = Max.
1.5 pF
f = 1 MHz
VB = 0 V
1,000 MΩ
500 V DC
*Operate/Reverse time
Input
Output
10%
90%
Toff
Ton
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Panasonic Corporation 2019
ASCTB127E 201912
PhotoMOS GE 1 Form B
Recommended operating conditions (Ambient temperature: 25°C)
Please use under recommended operating conditions to obtain expected characteristics.
Item
Symbol
Min.
Max.
Unit
LED current
IF
5
30
mA
Load voltage (Peak AC)
VL
-
48
V
Continuous load current
(A connection)
IL
-
0.55
A
Load voltage (Peak AC)
VL
-
280
V
Continuous load current
(A connection)
IL
-
0.13
A
Load voltage (Peak AC)
VL
-
320
V
Continuous load current
(A connection)
IL
-
0.12
A
AQV412EH (A)
AQV410EH (A)
AQV414EH (A)
REFERENCE DATA
1-1.Load current vs. ambient temperature
characteristics
Allowable ambient temperature: –40 to +85°C
Type of connection: A
50
700
600
AQV414E（H）
Load current (mA)
Load current (mA)
120
100
80
60
AQV412EH
40
500
400
300
AQV414E（H）
20
AQV410EH
10
100
20
0
-40
-20
0
20
40
60
0
-40
80 85 100
0
-20
20
40
3.Operate (OFF) time vs. ambient
temperature characteristics
4.Reverse (ON) time vs. ambient
temperature characteristics
LED current: 5 mA; Load voltage: Max. (DC);
Continuous load current: Max. (DC)
LED current: 5 mA; Load voltage: Max. (DC);
Continuous load current: Max. (DC)
5
AQV410EH
AQV414EH
AQV410EH
AQV414EH
AQV412EH
0.2
1
-40
-20
0
20
40
60
Ambient temperature (°C)
80 85
0
60
80 85
4
3
2
1
-40
-20
0
20
40
60
Ambient temperature (°C)
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40
5
0.6
0.4
20
Sample: All types;
Load voltage: Max. (DC);
Continuous load current: Max. (DC)
LED operate (OFF) current (mA)
Reverse (ON) time (ms)
3
0
-20
5.LED operate (OFF) current vs. ambient
temperature characteristics
AQV412EH
2
AQV412EH
-40
Ambient temperature (°C)
0.8
4
0
80 85 100
60
Ambient temperature (°C)
Ambient temperature (°C)
Operate (OFF) time (ms)
30
200
40
0
Measured portion: between terminals 4 and 6;
LED current: 0 mA; Load voltage: Max. (DC);
Continuous load current: Max. (DC)
Allowable ambient temperature: –40 to +85°C
Type of connection: A
AQV410EH
2.On resistance vs. ambient temperature
characteristics
On resistance (Ω)
140
1-2.Load current vs. ambient temperature
characteristics
ー3ー
80 85
0
-40
0
-20
20
40
60
80 85
Ambient temperature (°C)
Panasonic Corporation 2019
ASCTB127E 201912
PhotoMOS GE 1 Form B
6.LED reverse (ON) current vs. ambient
temperature characteristics
7.LED dropout voltage vs. ambient
temperature characteristics
Sample: All types;
LED current: 5 to 50 mA
Sample: All types;
Load voltage: Max. (DC);
Continuous load current: Max. (DC)
Measured portion: between terminals 4 and 6;
Ambient temperature: 25°C
140
120
100
80
60
40
20
-3.0 -2.5-2.0 -1.5-1.0-0.5
Current (mA)
1.5
1.4
4
LED dropout voltage (V)
3
2
1
1.3
1.2
1.1
1.0
-40
0
-20
20
40
60
0
80 85
-40
0
-20
8-2.Current vs. voltage characteristics of
output at MOS portion
80 85
Sample: All types;
Measured portion: between terminals 4 and 6;
LED current: 5 mA; Ambient temperature: 25°C
0.6
10.Operate (OFF) time vs. LED forward
current characteristics
Measured portion: between terminals 4 and 6;
Load voltage: Max. (DC); Continuous load current:
Max. (DC); Ambient temperature: 25°C
10
10-3
0.4
0.2
AQV412EH
0
0
1.0
0.5
Voltage (V)
-0.2
Off state leakage current (A)
Current (A)
60
9.Off state leakage current vs. load voltage
characteristics
Measured portion: between terminals 4 and 6;
Ambient temperature: 25°C
-0.5
40
AQV414EH
Ambient temperature (°C)
Ambient temperature (°C)
-1.0
20
AQV410EH
0.5 1.0 1.5 2.0 2.5 3.0
-20
Voltage (V)
-40
-60
-80
-100
-120
-140
50 ｍA
30 ｍA
20 ｍA
10 ｍA
5 ｍA
AQV412EH
10-6
Operate (OFF) time (ms)
LED reverse (ON) current (mA)
5
0
8-1.Current vs. voltage characteristics of
output at MOS portion
AQV414EH
AQV410EH
10-9
8
AQV410EH
AQV414EH
6
4
AQV412EH
2
-0.4
10-12
-0.6
0
20
40
60
80
100
0
0
10
20
Load voltage (V)
11.Reverse (ON) time vs. LED forward
current characteristics
Output capacitance (pF)
Reverse (ON) time (ms)
AQV410EH, AQV414EH
AQV412EH
0.2
400
300
AQV412EH
200
100
0.1
10
20
30
40
50
60
0
AQV410EH, AQV414EH
0
10
20
LED forward current (mA)
30
40
50
60
Applied voltage (V)
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60
500
0.4
0
50
Measured portion: between terminals 4 and 6;
Frequency: 1 MHz;
Ambient temperature: 25°C
0.5
0
40
12.Output capacitance vs. applied voltage
characteristics
Measured portion: between terminals 4 and 6;
Load voltage: Max. (DC); Continuous load current:
Max. (DC); Ambient temperature: 25°C
0.3
30
LED forward current (mA)
ー4ー
Panasonic Corporation 2019
ASCTB127E 201912
PhotoMOS GE 1 Form B
DIMENSIONS
CAD
Surface mount terminal type
External dimensions
Max.10°
6-0.8 dia.
Tolerance: ±0.1
1
8.8 ±0.05
3.4
Recommended mounting pad
(TOP VIEW)
3.4
0.47
1.25
0.47
1.25
0.47
1.25
1.25
1.25
2.54 2.54
1.25
2.54 2.54
0.47
8.3
1.9
0.47
ｰ0
0.2 +0.2
3
3.4
3.9 ±0.2
8.8±0.05
0.47
2.54
6.4
7.6
6.4 ±0.05
7.62 ±0.05
5.08
Max.10°
Max.10°
6.4±0.05
PC board pattern
(BOTTOM VIEW)
2.54
7.62
Through hole terminal type
External dimensions
CAD
Unit: mm
CAD The CAD data of the products with a “CAD” mark can be downloaded from our Website.
Terminal thickness: t = 0.25
General tolerance: ±0.1
Terminal thickness: t = 0.25
General tolerance: ±0.1
1.5
2.542.54
Tolerance: ±0.1
SCHEMATIC AND WIRING DIAGRAMS
Output
configuration
Schematic
Load
type
AC/DC
Connection
A
Wiring diagram
E1
IF
1
6
2
5
3
4
6
VL (AC, DC)
IL
4
Load
VL (AC, DC)
IL
Load
E1
1
6
2
5
3
1 Form B
DC
B
4
E1
IF
IF
*
1
6
2
5
3
4
1
6
2
5
3
4
Load
+
IL
VL (DC)
6
+
IL VL (DC)
5
Load
5
IL
Load
VL (DC)
+
Load
4
IL
VL (DC)
+
Can be also connected as 2 Form B type. (However, the sum of the continuous load current
should not exceed the absolute maximum rating.)
DC
C
E1
IF
1
6
Load
2
5
IL
3
4
+
VL (DC)
6
+
5
IL
4
Load
VL (DC)
*Terminal 3 cannot be used, since it is in the internal circuit of the device.
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ASCTB127E 201912
PhotoMOS GE 1 Form B
SAFETY STANDARDS
UL (Recognized)
Part No.
File No.
(Standard No.)
AQV410EH (A)
AQV414EH (A)
Contact rating
Contact rating
0.55A 60V AC (peak) A connection
0.55A 60V DC A connection
0.65A 60V DC B connection
0.8A 60V DC C connection
AQV412EH (A)
AC/DC dual use
CSA (Certified)
File No.
(Standard No.)
E191218
(UL1577)
0.13A 350V AC (peak) A connection
0.13A 350V DC A connection
0.15A 350V DC B connection
0.17A 350V DC C connection
Remarks
VDE approved
(Nr. 40012839)
(Certified by C-UL)
BSI approved
(EN62368-1)
No.VC649393
0.12A 400V AC (peak) A connection
0.12A 400V DC A connection
0.13A 400V DC B connection
0.15A 400V DC C connection
Note: For the latest information on compliance with safety standards, please refer to our website.
Please refer to "the latest product specifications"
when designing your product.
•Requests to customers:
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PhotoMOS® Cautions for Use
SAFETY WARNINGS
o not use the product under conditions that exceed the range
D
of its specifications. It may cause overheating, smoke, or fire.
Do not touch the recharging unit while the power is on. There
is a danger of electrical shock. Be sure to turn off the power
when performing mounting, maintenance, or repair operations
on the device (including connecting parts such as the terminal
board and socket).
heck the wiring diagrams in the catalog and be sure to
C
connect the terminals correctly. If the device is energized
with short circuit or any wrong connection, it may cause
unexpected malfunction, abnormal heat or fire.
PhotoMOS® Cautions for Use
Derating design
Derating is a significant factor for reliable design and product life.
Even if the conditions of use (temperature, current, voltage, etc.) of
the product are within the absolute maximum ratings, reliability may
be lowered remarkably when continuously used in high load
conditions (high temperature, high humidity, high current, high
voltage, etc.) Therefore, please derate sufficiently below the
absolute maximum ratings and evaluate the device in the actual
condition.
Moreover, regardless of the application, if malfunctioning can be
expected to pose high risk to human life or to property, or if products
are used in equipment otherwise requiring high operational safety, in
addition to designing double circuits, that is, incorporating features
such as a protection circuit or a redundant circuit, safety testing
should also be carried out.
pplying stress that exceeds the absolute maximum
A
rating
If the voltage or current value for any of the terminals exceeds the
absolute maximum rating, internal elements will deteriorate because
of the overvoltage or overcurrent. In extreme cases, wiring may
melt, or silicon P/N junctions may be destroyed.
Therefore, the circuit should be designed in such a way that the load
never exceed the absolute maximum ratings, even momentarily.
5) When packing printed circuit boards and equipment, avoid using
high-polymer materials such as foam styrene, plastic, and other
materials which carry an electrostatic charge.
6) When storing or transporting PhotoMOS®, the environment should
not be conducive to generating static electricity (for instance, the
humidity should be between 45% and 60%), and PhotoMOS®
should be protected using conductive packing materials.
Unused terminals
The No. 3 terminal is used with the circuit inside the device.
Therefore, do not connect it to the external circuitry with either
connection method A, B or C. (1 Form A 6-pin type)
Short across terminals
Do not short circuit between terminals when device is energized,
since there is possibility of breaking of the internal IC.
Surge voltages at the input
If reverse surge voltages are present at the input terminals, connect
a diode in reverse parallel across the input terminals and keep the
reverse voltages below the reverse breakdown voltage.
Typical circuits are below shown.
1) 6-pin
Input voltage (for Voltage-sensitive type)
For rising and dropping ratio of input voltage(dv/dt), maintain Min.
100mV/ms.
Oscillation circuit and control circuit (for TSON)
The oscillation circuit and control circuit of product may be destroyed
by external noise, surge, static electricity and so on.
For noise effect to peripheral circuits when oscillation circuit
operates, please implement safety measures on the system before
use by verifying operation under the actual design.
1
6
2
5
3
4
2) Power type
eterioration and destruction caused by discharge of
D
static electricity (for TSON/RF C×R3/RF C×R5/RF
C×R10)
This phenomenon is generally called static electricity destruction,
and occurs when static electricity generated by various factors is
discharged while the PhotoMOS® terminals are in contact, producing
internal destruction of the element.
To prevent problems from static electricity, the following precautions
and measures should be taken when using your device.
1) Employees handling PhotoMOS® should wear anti-static clothing
and should be grounded through protective resistance of 500kΩ
to 1MΩ.
2) A conductive metal sheet should be placed over the worktable.
Measuring instruments and jigs should be grounded.
3) When using soldering irons, either use irons with low leakage
current, or ground the tip of the soldering iron. (Use of low-voltage
soldering irons is also recommended.)
4) Devices and equipment used in assembly should also be
grounded.
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1
4
2
Panasonic Corporation 2020
ASCTB65E 202002
PhotoMOS® Cautions for Use
ecommended LED forward current or recommended
R
input voltage
Output spike voltages
1) If an inductive load generates spike voltages which exceed the
absolute maximum rating, the spike voltage shall be limited.
Representative circuit examples of AC/DC dual use type are
shown below. There are the same with DC only type.
(1) 6-pin
Design in accordance with the recommended operating conditions
for each product.
Since these conditions are affected by the operating environment,
ensure conformance with all relevant specifications.
ED forward current vs. Ambient temperature
L
characteristics
Please keep the LED forward current to within the range given
below.
1
6
2
5
3
4
Clamp diode is
connected in parallel
with the load.
100
LED forward current (mA)
Load
80
60
1
6
2
5
3
4
Load
40
CR snubber is
connected in parallel
with the load.
20
0
-40
-20
0
20
40
60
(2) Power type
8085 100
Ambient temperature (°C)
Ripple in the input power supply
1
2
3
4
If ripple is present in the input power supply, observe the following:
1) For LED forward current at Emin, please maintain the value
mentioned at “■Recommended LED forward current.”
Load
2) Please make sure the LED forward current for Emax. is no higher
than 50 mA.
1
2
3
4
Load
3) Please maintain the input voltage at least 4V for Emin. (GU, RF
and Power voltage-sensitive type).
4) Please make sure the input voltage for Emax. is no higher than 6V
(GU and RF voltage-sensitive type).
1
2
3
CR snubber is
connected in parallel
with the load.
4
Load
5) Please make sure the input voltage for Emax. is no higher than 30V
(Power voltage-sensitive type).
Clamp diode is
connected in parallel
with the load.
A varistor is
connected in parallel
with PhotoMOS®
(3) TSON
Emin.
Emax.
1
4
2
3
Clamp diode is
connected in parallel
with the load.
6) Please maintain the input voltage at least 3V for Emin. (for TSON)
7) Please make sure the input voltage for Emax. is no higher than 5.5V.
(for TSON)
1
4
2
3
8) Please keep amplitude voltage of ripple within ±0.5V. (for TSON)
Load
CR snubber is
connected in parallel
with the load.
within ±0.5 V
Set voltage
2) When Clamp diode or CR Snubber is used in the circuit, the spike
voltages from the load are limited. But the longer wire may
become the inductance and cause the spike voltage. Keep the
wire as short as possible.
within ±0.5 V
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Load
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ASCTB65E 202002
PhotoMOS® Cautions for Use
Input wiring pattern
Reverse voltages at the input (for TSON)
1) With AQY* or AQW* series avoid installing the input (LED side)
wiring pattern to the bottom side of the package if you require the
specified I/O isolation voltage (Viso) after mounting the PC board.
Since part of the frame on the output side is exposed, it may
cause fluctuations in the I/O isolation voltage.
If reverse voltages are present at the input terminals, for example,
connect a schottky barrier diode in reverse parallel across the input
terminals and keep the reverse voltages below the reverse
breakdown voltage. Typical circuit is shown below.
1
4
2
3
Portion of output side frame
(Output terminal side)
Continual DC bias (AQV259 and AQV258)
If a continual DC bias will be applied between the input and output,
the breakdown voltage of the switching element MOSFET on the
output side may degrade. Therefore, be sure to test the product
under actual conditions. Example of circuits that will cause
degradation of breakdown voltage of MOSFET is given below.
E
IF
1
6
2
5
3
4
Input wiring
pattern
(Input terminal side)
May not allow the prescribed I/O withstand
voltage (Viso) to be achieved
* Excluding reinforced insulation products and SSOP, SON, and TSON packages
IL
Load
Cleaning solvents compatibility
Cleaning the solder flux should use the immersion washing with an
organic solvent. If you have to use ultrasonic cleaning, please adopt
the following conditions and check that there are no problems in the
actual usage.
• Frequency: 27 to 29kHz
• Ultrasonic output: No greater than 0.25W/cm2*
• Cleaning time: 30s or less
• Cleanser used: Asahiklin AK-225
• Others: Float PCB and the device in the cleaning solvent to
prevent from contacting the ultrasonic vibrator
2) Exposed terminals are electrically connected to internal elements.
Be aware that contact with external circuits may cause
deterioration of insulation between input and output, leading to
destruction of internal elements.
3) If installed in proximity to other device, take care to avoid short
circuits between device, which may occur if exposed frames of
adjacent device come too close.
* Applies to unit area ultrasonic output for ultrasonic baths
Notes for mounting
1) When different kinds of packages are mounted on PC boad,
temperature rise at soldering lead is highly dependent on
package size. Therefore, please set the lower temperature
soldering condition than the conditions of item “■Soldering”, and
confirm the temperature condition of actual usage before
soldering.
2) When soldering condition exceeds our recommendation, the
PhotoMOS® characteristics may be adversely affected. It may
occur package crack or bonding wire breaking because of
thermal expansion unconformity and resin strength reduction.
Please contact our sales office about the propriety of the
condition.
3) Please confirm the heat stress by using actual board because it
may be changed by board condition or manufacturing process
condition.
4) Solder creepage, wettability, or soldering strength will be affected
by the soldering condition or used soldering type. Please check
them under the actual production condition in detail.
5) Please apply coating when the device returns to a room
temperature.
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ASCTB65E 202002
PhotoMOS® Cautions for Use
Soldering
1) Example of surface-mount terminal recommended conditions
(1) IR (Infrared reflow) soldering method
In case of automatic soldering, following conditions should be
observed. (recommended condition reflow: Max. 2 times,
measurement point: soldering lead)
t3
T1 = 150 to 180°C
T2 = 230°C
T3 = 240 to 250°C*
t1 = 60 to 120 s
t2 = Within 30 s
t3 = Within 10 s
T3
T2
T1
*240 to 245°C for SON, VSSOP
and TSON package
t1
t2
Part of frame on input side
Adjacent mounting
2) Example of through hole terminal recommended conditions
(1) DWS soldering method
In case of automatic soldering, following conditions should be
observed. (recommended condition number of times: Max. 1
time, measurement point: soldering lead *1)
T1 = 120°C
T2 = Max. 260°C
t1 = within 60 s
t2+t3 = within 5 s
T1
t1
t2
For VSSOP type, as shown in the following figure, part of the input
and output frames are exposed on the sides of the package. Due to
this, please be keep in mind the cautions listed below.
1) Take care to avoid short circuits between exposed terminals,
which may cause insulation deterioration between input and
output, leading to destruction of internal elements.
2) Since the exposed terminals are connected electrically to the
internal element, please refer to the item “■Deterioration and
destruction caused by discharge of static electricity”, and
implement sufficient measures to control static electricity.
3) When installing the devices in the vicinity, please keep in mind
that if the exposed frames of adjacent devices get too close, a
short between devices may occur.
Part of frame on output side
(2) Other soldering methods
Other soldering methods (VPS, hot-air, hot plate, laser
heating, pulse heater, etc.) affect the PhotoMOS®
characteristics differently, please evaluate the device under
the actual usage.
(3) Manual soldering method
Temperature: 350 to 400°C, within 3s, electrical power 30 to
60W
T2
bout the exposed terminals on the sides of the
A
package (for VSSOP)
When several PhotoMOS® are mounted closely each other or
heat-generating components are mounted close to the PhotoMOS®,
the abnormal heating may occur. This abnormal heat may be
caused by the internal element when energized or thermal
interference between the devices. The degree of temperature rise
depends on the mounting layout of the devices and usage condition,
therefore please be sure to use PhotoMOS® with reduced load
current after testing under the worst condition of the actual usage.
Transportation and storage
t3
*1 Solder temperature: Max. 260°C
(2) Other soldering method (recommended condition: 1 time)
Preheating: Max. 120°C, within 120s, measurement point:
soldering lead
Soldering: Max. 260°C, within 10s, measurement area:
soldering temperature
(3) Manual soldering method
Temperature: 350 to 400°C, within 3s, electrical power 30 to
60W
1) Extreme vibration during transport may deform the lead or
damage the PhotoMOS® characteristics. Please handle the outer
and inner boxes with care.
2) Inadequate storage condition may degrade soldering,
appearance, and characteristics. The following storage conditions
are recommended:
• Temperature: 0 to 45°C
• Humidity: Max. 70%RH
• Atmosphere: No harmful gasses such as sulfurous acid gas,
minimal dust.
3) Storage before TSON, VSSOP, SON, SSOP, or SOP processing
In case the heat stress of soldering is applied to the PhotoMOS®
which absorbs moisture inside of its package, the evaporation of
the moisture increases the pressure inside the package and it
may cause the package blister or crack. This device is sensitive
to moisture and it is packed in the sealed moisture-proof package.
Please make sure the following condition after unsealing.
* Please use the device immediately after unsealing.
(Within 30 days at 0 to 30°C and Max. 70%RH)
* If the device will be kept for a long time after unsealing, please
store in the another moisture-proof package containing silica gel.
(Please use within 90 days.)
Water condensation
Water condensation occurs when the ambient temperature changes
suddenly from a high temperature to low temperature at high
humidity, or the device is suddenly transferred from a low ambient
temperature to a high temperature and humidity. Condensation
causes the failures such as insulation deterioration. Panasonic
Corporation does not guarantee the failures caused by water
condensation. The heat conduction by the equipment the
PhotoMOS® is mounted may accelerate the water condensation.
Please confirm that there is no condensation in the worst condition
of the actual usage. (Special attention should be paid when high
temperature heating parts are close to the PhotoMOS®.)
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ー 10 ー
Panasonic Corporation 2020
ASCTB65E 202002
PhotoMOS® Cautions for Use
Packing format
1) Tape and reel
Tape dimensions
Dimensions of tape reel
21±0.8
1.2
1.05±0.1dia.
4±0.1
5.5±0.1
Device mounted
on tape
±0.3
180±3dia.
12
±0.3
TSON
4-pin
2±0.5
60 ±3dia.
4±0.1
2.2±0.2
2.4±0.2
0.2 ±0.05
1.75±0.1
Direction of picking
Tractor feed holes 1.5 +0.5
-0 dia.
2±0.1
13±0.5 dia.
(1) When picked from 1/2-pin side: Part No. AQY2C1R*PX (Shown above)
(2) When picked from 3/4-pin side: Part No. AQY2C1R*PZ
13±1.5
*Quality of material: Polystyrene (PS)
1.2±0.5
4.0 ±0.1
2.4±0.2
VSSOP
4-pin
12.0
±0.3
2.5±0.2
0.4 ±0.05
1.75±0.1
Direction of picking
Tractor feed holes 1.5 +0.5
ｰ0 dia.
1±0.1dia.
3.3±0.3
8±0.1
2±0.1
5.5±0.1
Device mounted
on tape
(1) When picked from 1 and 4-pin side: Part No. AQY*TY (Shown above)
(2) When picked from 2 and 3-pin side: Part No. AQY*TW
±0.3
3.6±0.2
21±0.8
80 ±1dia.
12
Device mounted
on tape
4±0.1
1.5±0.1dia.
2±0.3
2±0.1
5.5±0.1
SON
4-pin
4±0.1
2.8±0.2
2±0.5
80 ±1 dia.
(1) When picked from 1 and 4-pin side: Part No. AQY*MY (Shown above)
(2) When picked from 2 and 3-pin side: Part No. AQY*MW
250 ±2dia.
0.3±0.05
1.75±0.1
Direction of picking
Tractor feed holes 1.5 +0.5
ｰ0 dia.
3.0 ±0.1
4.0±0.1
4.0±0.1
5.5±0.1
Device mounted
on tape
2.7±0.3
1.5+0.1
ｰ 0 dia.
12.0±0.3
5.1±0.2
0.3±0.05
SSOP
4-pin
1.75±0.1
Direction of picking
Tractor feed holes 1.50 +0.5
ｰ 0 dia.
*Quality of material: Paper
13 ±0.5dia.
14±1.5
2 ±0.5
Device mounted on tape
2.8±0.3
12±0.1
12
7.2±0.1
±0.3
1.55±0.05dia.
5.5±0.1
SOP
4-pin
Direction of picking
Tractor feed holes
4.7±0.1
0.3±0.05
1.75±0.1
(1) When picked from 1 and 4-pin side: Part No. AQY*VY, APV2111VY (Shown above)
(2) When picked from 2 and 3-pin side: Part No. AQY*VW, APV2111VW
1.55±0.1dia.
4±0.1
2±0.1
(1) When picked from 1/2-pin side: Part No. AQY*SX, APV**21SX (Shown above)
(2) When picked from 3/4-pin side: Part No. AQY*SZ, APV**21SZ
Note: “ * ” indicates characters of number or alphabet.
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Panasonic Corporation 2020
ASCTB65E 202002
PhotoMOS® Cautions for Use
Tape dimensions
1.75±0.1
12±0.1
1.55±0.1dia.
2±0.1
7.5±0.1
Device mounted
on tape
12±0.1
14±1.5
13 ±0.5dia.
±0.1
2
2±0.5
Device mounted
on tape
2.8±0.3
*Quality of material: Paper
13 ±0.5dia.
17.5±1.5
2±1
1.55±0.1dia.
4±0.1
2±0.1
12±0.1
16±0.3
1.75±0.1
7.5±0.1
7.5±0.1
1.55±0.05dia.
11.15±0.1
SOP
16-pin
Direction of picking
Tractor feed holes
80 ±1dia.
(1) When picked from 1/2/3/4-pin side: Part No. AQW*SX (Shown above)
(2) When picked from 5/6/7/8-pin side: Part No. AQW*SZ
0.3±0.05
2 ±0.5
21±0.8
80 ±1dia.
1.55±0.1dia.
4±0.1
2.8±0.3
16±0.3
1.55±0.05dia.
7.5±0.1
SOP
8-pin
Direction of picking
Tractor feed holes
10.15±0.1
0.3±0.05
*Quality of material: Paper
1.75±0.1
(1) When picked from 1/2/3-pin side: Part No. AQV*SX (Shown above)
(2) When picked from 4/5/6-pin side: Part No. AQV*SZ
250 ±2 dia.
2.8
80 ±1 dia.
Device mounted on tape
±0.3
2±0.5
250 ±2dia.
7.2±0.1
12
4
1.55±0.05dia.
21±0.8
80 ±1dia.
±0.3
SOP
6-pin
Direction of picking
Tractor feed holes
±0.1
6.9 ±0.1
5.5±0.1
0.3±0.05
Dimensions of tape reel
(1) When picked from 1/2/3/4/5/6/7/8-pin side: Part No. AQS*SX (Shown above)
(2) When picked from 9/10/11/12/13/14/15/16-pin side: Part No. AQS*SZ
21±0.8
80 ±1dia.
1.75±0.1
12±0.1
4.2±0.3
80 ±1dia.
Device mounted on tape
2±0.5
300 ±2 dia.
10.2±0.1
12±0.3
4
1.5+0.1
ｰ0 dia.
5.5±0.1
DIP 4-pin
Surface mount
terminal
Direction of picking
Tractor feed holes
±0.1
5.25±0.1
0.3±0.05
1.55±0.1dia.
2±0.1
(1) When picked from 1/2-pin side: Part No. AQY*HAX, AQY210HLAX (Shown above)
(2) When picked from 3/4-pin side: Part No. AQY*HAZ, AQY210HLAZ
*Quality of material: Paper
13.5±2.0
13±0.5dia.
2±0.5
21±0.8
80 ±1dia.
4.5±0.3
12±0.1
16
±0.3
80±1dia.
2±0.5
300±2dia.
Device mounted on tape
7.5±0.1
10.1±0.1
1.5+0.1
ｰ0 dia.
9.2±0.1
DIP 6-pin
Surface mount
terminal
Tractor feed holes
1.75±0.1
Direction of picking
0.3±0.05
1.6±0.1dia.
4±0.1
2±0.1
(1) When picked from 1/2/3-pin side: Part No. AQV*AX (Shown above)
(2) When picked from 4/5/6-pin side: Part No. AQV*AZ
*Quality of material: Paper
13 ±0.5dia.
17.5±2
2±0.5
Note: “ * ” indicates characters of number or alphabet.
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ー 12 ー
Panasonic Corporation 2020
ASCTB65E 202002
PhotoMOS® Cautions for Use
Tape dimensions
1.75±0.1
10.1±0.1
7.5±0.1
Device mounted on tape
21±0.8
80 ±1dia.
1.55±0.1dia.
2±0.1
12±0.1
4.5±0.3
16
DIP 8-pin
Surface mount
terminal
(Basic insulation
type)
4
1.5+0.1
ｰ0 dia.
±0.3
0.3
Direction of picking
Tractor feed holes
±0.1
10.2±0.1
±0.05
Dimensions of tape reel
10.2±0.1
Device mounted on tape
12±0.1
4.2±0.3
2±0.1
16±0.3
80±1dia.
1.75±0.1
4±0.1
10.3±0.1
DIP 8-pin
Surface mount
terminal
(Reinforced
insulation type
Direction of picking
1.5 +0.1
ｰ0 dia.
7.5±0.1
Tractor feed holes
0.3±0.05
300±2dia.
2±0.5
(1) When picked from 1/2/3/4-pin side: Part No. AQW*AX (Shown above)
(2) When picked from 5/6/7/8-pin side: Part No. AQW*AZ
13 ±0.5dia.
*Quality of material: Paper
17.5±2
2±0.5
1.55±0.1dia.
(1) When picked from 1/2/3/4-pin side: Part No. AQW*EHAX,
AQW210HLAX (Shown above)
(2) When picked from 5/6/7/8-pin side: Part No. AQW*EHAZ, AQW210HLAZ
21±0.8
100±1dia.
1.75
1.55±0.1 dia.
2.0±0.1
(1) When picked from 1/2-pin side: Part No. AQY*AX (Shown above)
(2) When picked from 3/4-pin side: Part No. AQY*AZ
12±0.1
4.5
16
80±1dia.
Device mounted on tape
±0.3
1.6±0.1dia.
4±0.1
1.7±0.8
2±0.5
±0.3
10.1±0.1
1.5+0.1
ｰ0 dia.
7.5±0.1
DIP 6-pin
Surface mount
terminal
(Photovoltaic
MOSFET driver)
Tractor feed holes
9.2±0.1
0.3±0.05
25.5±2
21±0.8
80 ±1dia.
1.75±0.1
Direction of picking
13 ±0.5dia.
*Quality of material: Paper
300±2dia.
16.0±0.1
4.5±0.3
100±1dia.
330±2 dia.
Device mounted
on tape
2±0.5
24.0 ±0.3
Power-DIP
4-pin
SMD
12.6±0.1
4.0±0.1
1.55+0.05
ｰ 0.05 dia.
9.7±0.1
11.5 ±0.1
0.3±0.05
±0.1
Direction of picking
Tractor feed holes
2±0.1
(1) When picked from 1/2/3-pin side: Part No. APV1122AX (Shown above)
(2) When picked from 4/6-pin side: Part No. APV1122AZ
13 ±0.5dia.
*Quality of material: Paper
17.5±2
2±0.5
Note: “ * ” indicates characters of number or alphabet.
2) Tube
Devices are packaged in a tube so that 1-pin is on the stopper B
side. Observe correct orientation when mounting them on PC
boards.
(PD type)
Stopper B
(SOP type)
Stopper A
Stopper B (green)
(DIP type)
Stopper B
Stopper A
Green
Stopper B
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Stopper A (gray)
(Power type)
ー 13 ー
Gray
Stopper A
Panasonic Corporation 2020
ASCTB65E 202002
PhotoMOS® Cautions for Use
Adjacent mounting (for Power type)
Current limit function (output current control)
1) When devices are mounted close together with the heatgenerated devices, ambient temperature may rise abnormally.
Mounting layout and ventilation should be considered.
1) Current limit function aims to increase resistance to surges when
the switch is turned on. Before using this function, connect the
varistor to the output as shown in the figure below.
1
2
2) When many devices are mounted close together, load current
should be reduced. (Refer to the data of “Load current in adjacent
mounting vs. Ambient temperature characteristics.”)
4
3
Varistor
Surge: 10×160μs 1.6kV
* Set the varistor voltage to 150 V or less.
Recommended load voltage
As a guide in selecting PhotoMOS®, please refer to the following
table.
2) The current limit function capability can be lost if used longer than
the specified time. Be sure to set the output loss to the Max. rate.
1) Power photoMOS® (1 Form A)
Short circuit protection circuit
The short circuit protection circuit is designed to protect circuits from
excess current. Therefore, surge current may be detected as current
overload in which case the output current will be cut and the off
state maintained. For this reason, please include the inrush current
in the load current and keep it below the maximum load current.
Also, in order to maintain stability of internal IC operation, maintain
an input current of at least 5 mA (Latch type), 10 mA (Non Latch
type).
Photovoltaic MOSFET driver cautions for use
When two external MOSFETs are connected with a common source
terminal, oscillation may occur when operation is restored.
Therefore, please insert a 100 to 1,000 Ω resistor between the gate
terminal of the first MOSFET and the gate terminal of the second
MOSFET.
A typical example of this is given in the circuit below.
1
DC
type
AC/
DC
type
Load current
Recommended
load voltage
AQZ102
60 V DC
4.0 A DC
5, 12, 24 V DC
AQZ105
100 V DC
2.6 A DC
48 V DC
AQZ107
200 V DC
1.3 A DC
100 V DC
AQZ104
400 V DC
0.7 A DC
200 V DC
AQZ202
Peak AC, DC 60 V
Peak AC, DC 3.0 A
AQZ205
Peak AC, DC 100 V Peak AC, DC 2.0 A
24 V AC
48 V DC
AQZ207
Peak AC, DC 200 V Peak AC, DC 1.0 A
48 V AC
100 V DC
AQZ204
Peak AC, DC 400 V Peak AC, DC 0.5 A
120 V AC
200 V DC
Absolute maximum rating
Load voltage
AC/
DC
type
4
12 V AC
5, 12, 24 V DC
2) Power photoMOS® (1 Form B)
6
2
3
Absolute maximum rating
Load voltage
Load current
Peak AC, DC 400 V Peak AC, DC 0.5 A
AQZ404
Recommended
load voltage
100 V AC
200 V DC
3) Power photoMOS® Voltage-sensitive type (1 Form A)
Input LED current (for Standard type)
Absolute maximum rating
For rising and dropping ratio of input LED current (di/dt), maintain
Min. 100 μA/s.
Input voltage (for Power voltage-sensitive type)
For rising and dropping ratio of input voltage (dv/dt), maintain Min.
100 mV/s.
Load voltage
Load current
Recommended
load voltage
AQZ102D
60 V DC
3.6 A DC
5, 12, 24 V DC
DC AQZ105D
type AQZ107D
100 V DC
2.3 A DC
48 V DC
200 V DC
1.1 A DC
100 V DC
AQZ104D
400 V DC
0.6 A DC
200 V DC
AQZ202D
Peak AC, DC 60 V
Peak AC, DC 2.7 A
12 V AC
5, 12, 24 V DC
24 V AC
AC/ AQZ205D Peak AC, DC 100 V Peak AC, DC 1.8 A 48 V DC
DC
type AQZ207D Peak AC, DC 200 V Peak AC, DC 0.9 A 48 V AC
100 V DC
AQZ204D Peak AC, DC 400 V Peak AC, DC 0.45 A
120 V AC
200 V DC
4) Power photoMOS® High Capacity type (1 Form A)
Absolute maximum rating
DC
type
Load voltage
Load current
Recommended
load voltage
AQZ192
60 V DC
10 A DC
5, 12, 24 V DC
AQZ197
200 V DC
5 A DC
100 V DC
AQZ202G
Peak AC, DC 60 V
12 V AC
Peak AC, DC 6 A
5, 12, 24 V DC
24 V AC
AC/ AQZ205G Peak AC, DC 100 V Peak AC, DC 4 A 48 V DC
DC
type AQZ207G Peak AC, DC 200 V Peak AC, DC 2 A 48 V AC
100 V DC
AQZ206G2 Peak AC, DC 600 V Peak AC, DC 1 A
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Panasonic Corporation 2020
120, 240 V AC
200, 400 V DC
ASCTB65E 202002
Please contact ..........
Electromechanical Control Business Division
1006, Oaza Kadoma, Kadoma-shi, Osaka 571-8506, Japan
industral.panasonic.com/ac/e/
©Panasonic Corporation 2020
ASCTB127E 202002
Specifications are subject to change without notice.
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