AQY212FG2S

PhotoMOS GU SOP 1 Form A High Capacity Voltage-sensitive Space-saving SOP4-pin high capacity type with built-in input registor FEATURES Built-in input resistor means less man-hours when mounting (recommended input voltage is 5V) Saves space on PC board Since the small package size remains the same while including a built-in input resistor, space on the PC board is saved. Continuous load current of 1.25A 4.4 2.1 4.3 1 4 TYPICAL APPLICATIONS Measuring and testing equipment Semiconductor testing equipment, Probe cards, Datalogger, Board tester and other testing equipment. Telecommunication, Broadcasting, and Medical equipment 3 2 Note: Please contact our sales representative for automotive applications of PhotoMOS. (Unit: mm) TYPES Part No. Output rating*1 Category AC/DC dual use Load voltage Load current 60 V 1.25 A Packing quantity Tube packing style Tape and reel packing style X*2 Tape and reel packing style Z*2 AQY212FG2S AQY212FG2SX AQY212FG2SZ Tube Tape and reel 1-tube: 100 pcs. 1-reel: 1,000 pcs. Outer carton: 2,000 pcs. Outer carton: 1,000 pcs. Note: For space reasons, the three initial letters of the part number “AQY”, the package (SOP) indicator “S” and the packing style indicator “X” or “Z” are not marked on the device. (Ex. the label for product number AQY212FG2SX is 212FG2.) *1.Indicate the peak AC and DC values. *2.Tape and reel packing style X: picked from the 1/2-pin side, tape and reel packing style Z: picked from the 3/4-pin side. RATING Symbol AQY212FG2S Input Input voltage VIN 6V Input reverse voltage VRIN 5V Power dissipation Pin 65 mW Load voltage (peak AC) VL 60 V Output Absolute maximum ratings (Ambient temperature: 25°C) Item Load current IL 1.25 A Peak load current Ipeak 3A Power dissipation Pout 400 mW Total power dissipation PT 450 mW I/O isolation voltage Viso 500 Vrms Ambient temperature (Operating) Topr -40 to +85°C Ambient temperature (Storage) Tstg -40 to +100°C 2019.12 industrial.panasonic.com/ac/e/ ー1ー Remarks Peak AC, DC 100 ms (1 shot), VL = DC (Avoid icing and condensation) Panasonic Corporation 2019 ASCTB131E 201912 PhotoMOS GU SOP 1 Form A High Capacity Voltage-sensitive Electrical characteristics (Ambient temperature: 25°C) Item Symbol Input Operate voltage Turn off voltage Input current Output Maximum Minimum Typical Typical Typical On resistance Maximum Off state leakage current Maximum Typical Turn on time* Maximum Typical Turn off time* Transfer characteristics Typical Maximum AQY212FG2S VFon 4V IL = 100 mA 0.8 V VFoff 1.4 V IIN Ron 8.5 mA VIN = 5 V 0.2 Ω VIN = 5 V IL = Max. Within 1 s 0.5 Ω VIN = 0 V VL = Max. 1 μA ILeak 0.7 ms Ton VIN = 5 V IL = 100 mA VL = 10 V 5 ms 0.1 ms Toff 0.5 ms Typical I/O capacitance Condition 1.4 V 0.8 pF f = 1 MHz VB = 0 V 1.5 pF f = 1 MHz VB = 0 V 500 V DC Ciso Maximum Initial I/O isolation resistance Minimum Riso 1,000 MΩ Max.operating frequency Maximum − 5 cps VIN = 5 V duty = 50% VL×IL = 75 V·A *Turn on/Turn off time Input 90% 10% Output Ton Toff Recommended operating conditions (Ambient temperature: 25°C) Please use under recommended operating conditions to obtain expected characteristics. Item Symbol Min. Max. Unit Input voltage VIN 4.5 5.5 V Load voltage (Peak AC) VL - 48 V Continuous load current IL - 1.25 A AQY212FG2S REFERENCE DATA 1.Load current vs. ambient temperature characteristics Allowable ambient temperature: –40 to +85°C 1.0 5 0.8 4 Turn on time (ms) On resistance (Ω) 1.0 3.Turn on time vs. ambient temperature characteristics Input voltage: 5 V; Load voltage: 10 V (DC); Continuous load current: 100 mA (DC) Measured portion: between terminals 3 and 4 Input voltage: 5 V; Load voltage: Max. (DC); Continuous load current: Max. (DC) 1.5 Load current (A) 2.On resistance vs. ambient temperature characteristics 0.6 0.4 3 2 0.5 1 0.2 0 -40 -20 0 20 40 60 Ambient temperature (°C) 8085 100 0 -40 -20 0 20 Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 40 60 Ambient temperature (°C) ー2ー 80 85 0 -40 0 -20 20 40 60 8085 Ambient temperature (°C) Panasonic Corporation 2019 ASCTB131E 201912 PhotoMOS GU SOP 1 Form A High Capacity Voltage-sensitive 4.Turn off time vs. ambient temperature characteristics Load voltage: 10 V (DC); Continuous load current: 100 mA (DC) Input voltage: 5 V; Load voltage: 10 V (DC); Continuous load current: 100 mA (DC) 0.3 0.2 3 2 1 0.1 -40 -20 0 20 40 60 0 8085 -40 -20 7.Input current vs. ambient temperature characteristics 20 40 60 0 8085 8.Current vs. voltage characteristics of output at MOS portion Current (A) 15 -0.6 10 -0.4 5 20 40 60 8085 20 40 60 8085 20 -0.2 0.2 0 Ambient temperature: 25°C (Recommended input voltage: 5 ±0.5 V) 0.4 0.6 Voltage (V) 0 -20 9.Input current vs. input voltage characteristics 1 0 -20 -40 Ambient temperature (°C) 2 20 Input current (mA) 0 Measured portion: between terminals 3 and 4 Ambient temperature: 25°C Input voltage: 5 V -40 2 Ambient temperature (°C) Ambient temperature (°C) 1 3 1 Input current (mA) 0 4 Turn off voltage (V) Turn on voltage (V) 0.4 6.Turn off voltage vs. ambient temperature characteristics Load voltage: 10 V (DC); Continuous load current: 100 mA (DC) 4 0.5 Turn off time (ms) 5.Turn on voltage vs. ambient temperature characteristics 15 10 -1 5 -2 0 3 4 Ambient temperature (°C) 5 6 7 Input voltage (V) 10.Off state leakage current vs. load voltage characteristics 11.Turn on time vs. input voltage characteristics Measured portion: between terminals 3 and 4 Ambient temperature: 25°C 12.Turn off time vs. input voltage characteristics Measured portion: between terminals 3 and 4 Load voltage: 10 V (DC); Continuous load current: 100 mA (DC); Ambient temperature: 25°C 5 Measured portion: between terminals 3 and 4 Load voltage: 10 V (DC); Continuous load current: 100 mA (DC); Ambient temperature: 25°C 0.5 0.4 10-6 10-8 Turn off time (ms) 4 Turn on time (ms) Off state leakage current (A) 10-4 3 2 0.3 0.2 10-10 0.1 1 10-12 0 10 20 30 40 50 60 0 3 4 Load voltage (V) 5 Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 6 7 0 3 4 Input voltage (V) ー3ー 5 6 7 Input voltage (V) Panasonic Corporation 2019 ASCTB131E 201912 PhotoMOS GU SOP 1 Form A High Capacity Voltage-sensitive 13.Output capacitance vs. applied voltage characteristics 14.Max. operating frequency vs. load voltage and load current characteristics Measured portion: between terminals 3 and 4 Frequency: 1 MHz, 30 mVrms; Ambient temperature: 25°C Input voltage: 5 V Ambient temperature: 25°C 50 Max. operating frequency (cps) Output capacitance (pF) 500 400 300 200 40 30 20 10 100 0 duty = 50% 0 10 20 30 40 50 0 60 25 0 DIMENSIONS 50 75 100 Load voltage (V) × Load current (A) Applied voltage (V) Unit: mm CAD The CAD data of the products with a “CAD” mark can be downloaded from our Website. External dimensions Recommended mounting pad (TOP VIEW) 0.5 4.3±0.2 0.8 2±0.2 2.54 0.4 Tolerance: ±0.1 0.1 0.4 6 1.2 6.8 ±0.4 4.4±0.2 0.5 CAD 2.54 Terminal thickness: t = 0.15 General tolerance: ±0.1 SCHEMATIC AND WIRING DIAGRAMS Output configuration Schematic 1 Load type Connection Wiring diagram 4 1 Form A 2 AC/DC - VIN 1 4 2 3 4 IF IL 3 VL (AC, DC) 3 Load IL VL (AC, DC) Load SAFETY STANDARDS UL (Recognized) Part No. AC/DC dual use AQY212FG2S File No. (Standard No.) E191218 (UL1577) CSA (Certified) Contact rating 1.25A 60V AC (peak) 1.25A 60V DC File No. (Standard No.) Contact rating (Certified by C-UL) Remarks VDE approved (Nr. 40003143) Note: For the latest information on compliance with safety standards, please refer to our website. Please refer to "the latest product specifications" when designing your product. •Requests to customers: https://industrial.panasonic.com/ac/e/salespolicies/ Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ ー4ー Panasonic Corporation 2019 ASCTB131E 201912 PhotoMOS® Cautions for Use SAFETY WARNINGS  o not use the product under conditions that exceed the range D of its specifications. It may cause overheating, smoke, or fire. Do not touch the recharging unit while the power is on. There is a danger of electrical shock. Be sure to turn off the power when performing mounting, maintenance, or repair operations on the device (including connecting parts such as the terminal board and socket).  heck the wiring diagrams in the catalog and be sure to C connect the terminals correctly. If the device is energized with short circuit or any wrong connection, it may cause unexpected malfunction, abnormal heat or fire. PhotoMOS® Cautions for Use Derating design Derating is a significant factor for reliable design and product life. Even if the conditions of use (temperature, current, voltage, etc.) of the product are within the absolute maximum ratings, reliability may be lowered remarkably when continuously used in high load conditions (high temperature, high humidity, high current, high voltage, etc.) Therefore, please derate sufficiently below the absolute maximum ratings and evaluate the device in the actual condition. Moreover, regardless of the application, if malfunctioning can be expected to pose high risk to human life or to property, or if products are used in equipment otherwise requiring high operational safety, in addition to designing double circuits, that is, incorporating features such as a protection circuit or a redundant circuit, safety testing should also be carried out.  pplying stress that exceeds the absolute maximum A rating If the voltage or current value for any of the terminals exceeds the absolute maximum rating, internal elements will deteriorate because of the overvoltage or overcurrent. In extreme cases, wiring may melt, or silicon P/N junctions may be destroyed. Therefore, the circuit should be designed in such a way that the load never exceed the absolute maximum ratings, even momentarily. 5) When packing printed circuit boards and equipment, avoid using high-polymer materials such as foam styrene, plastic, and other materials which carry an electrostatic charge. 6) When storing or transporting PhotoMOS®, the environment should not be conducive to generating static electricity (for instance, the humidity should be between 45% and 60%), and PhotoMOS® should be protected using conductive packing materials. Unused terminals The No. 3 terminal is used with the circuit inside the device. Therefore, do not connect it to the external circuitry with either connection method A, B or C. (1 Form A 6-pin type) Short across terminals Do not short circuit between terminals when device is energized, since there is possibility of breaking of the internal IC. Surge voltages at the input If reverse surge voltages are present at the input terminals, connect a diode in reverse parallel across the input terminals and keep the reverse voltages below the reverse breakdown voltage. Typical circuits are below shown. 1) 6-pin Input voltage (for Voltage-sensitive type) For rising and dropping ratio of input voltage(dv/dt), maintain Min. 100mV/ms. Oscillation circuit and control circuit (for TSON) The oscillation circuit and control circuit of product may be destroyed by external noise, surge, static electricity and so on. For noise effect to peripheral circuits when oscillation circuit operates, please implement safety measures on the system before use by verifying operation under the actual design. 1 6 2 5 3 4 2) Power type  eterioration and destruction caused by discharge of D static electricity (for TSON/RF C×R3/RF C×R5/RF C×R10) This phenomenon is generally called static electricity destruction, and occurs when static electricity generated by various factors is discharged while the PhotoMOS® terminals are in contact, producing internal destruction of the element. To prevent problems from static electricity, the following precautions and measures should be taken when using your device. 1) Employees handling PhotoMOS® should wear anti-static clothing and should be grounded through protective resistance of 500kΩ to 1MΩ. 2) A conductive metal sheet should be placed over the worktable. Measuring instruments and jigs should be grounded. 3) When using soldering irons, either use irons with low leakage current, or ground the tip of the soldering iron. (Use of low-voltage soldering irons is also recommended.) 4) Devices and equipment used in assembly should also be grounded. Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ ー5ー 3 1 4 2 Panasonic Corporation 2020 ASCTB65E 202002 PhotoMOS® Cautions for Use  ecommended LED forward current or recommended R input voltage Output spike voltages 1) If an inductive load generates spike voltages which exceed the absolute maximum rating, the spike voltage shall be limited. Representative circuit examples of AC/DC dual use type are shown below. There are the same with DC only type. (1) 6-pin Design in accordance with the recommended operating conditions for each product. Since these conditions are affected by the operating environment, ensure conformance with all relevant specifications.  ED forward current vs. Ambient temperature L characteristics Please keep the LED forward current to within the range given below. 1 6 2 5 3 4 Clamp diode is connected in parallel with the load. 100 LED forward current (mA) Load 80 60 1 6 2 5 3 4 Load 40 CR snubber is connected in parallel with the load. 20 0 -40 -20 0 20 40 60 (2) Power type 8085 100 Ambient temperature (°C) Ripple in the input power supply 1 2 3 4 If ripple is present in the input power supply, observe the following: 1) For LED forward current at Emin, please maintain the value mentioned at “■Recommended LED forward current.” Load 2) Please make sure the LED forward current for Emax. is no higher than 50 mA. 1 2 3 4 Load 3) Please maintain the input voltage at least 4V for Emin. (GU, RF and Power voltage-sensitive type). 4) Please make sure the input voltage for Emax. is no higher than 6V (GU and RF voltage-sensitive type). 1 2 3 CR snubber is connected in parallel with the load. 4 Load 5) Please make sure the input voltage for Emax. is no higher than 30V (Power voltage-sensitive type). Clamp diode is connected in parallel with the load. A varistor is connected in parallel with PhotoMOS® (3) TSON Emin. Emax. 1 4 2 3 Clamp diode is connected in parallel with the load. 6) Please maintain the input voltage at least 3V for Emin. (for TSON) 7) Please make sure the input voltage for Emax. is no higher than 5.5V. (for TSON) 1 4 2 3 8) Please keep amplitude voltage of ripple within ±0.5V. (for TSON) Load CR snubber is connected in parallel with the load. within ±0.5 V Set voltage 2) When Clamp diode or CR Snubber is used in the circuit, the spike voltages from the load are limited. But the longer wire may become the inductance and cause the spike voltage. Keep the wire as short as possible. within ±0.5 V Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ Load ー6ー Panasonic Corporation 2020 ASCTB65E 202002 PhotoMOS® Cautions for Use Input wiring pattern Reverse voltages at the input (for TSON) 1) With AQY* or AQW* series avoid installing the input (LED side) wiring pattern to the bottom side of the package if you require the specified I/O isolation voltage (Viso) after mounting the PC board. Since part of the frame on the output side is exposed, it may cause fluctuations in the I/O isolation voltage. If reverse voltages are present at the input terminals, for example, connect a schottky barrier diode in reverse parallel across the input terminals and keep the reverse voltages below the reverse breakdown voltage. Typical circuit is shown below. 1 4 2 3 Portion of output side frame (Output terminal side) Continual DC bias (AQV259 and AQV258) If a continual DC bias will be applied between the input and output, the breakdown voltage of the switching element MOSFET on the output side may degrade. Therefore, be sure to test the product under actual conditions. Example of circuits that will cause degradation of breakdown voltage of MOSFET is given below. E IF 1 6 2 5 3 4 Input wiring pattern (Input terminal side) May not allow the prescribed I/O withstand voltage (Viso) to be achieved * Excluding reinforced insulation products and SSOP, SON, and TSON packages IL Load Cleaning solvents compatibility Cleaning the solder flux should use the immersion washing with an organic solvent. If you have to use ultrasonic cleaning, please adopt the following conditions and check that there are no problems in the actual usage. • Frequency: 27 to 29kHz • Ultrasonic output: No greater than 0.25W/cm2* • Cleaning time: 30s or less • Cleanser used: Asahiklin AK-225 • Others: Float PCB and the device in the cleaning solvent to prevent from contacting the ultrasonic vibrator 2) Exposed terminals are electrically connected to internal elements. Be aware that contact with external circuits may cause deterioration of insulation between input and output, leading to destruction of internal elements. 3) If installed in proximity to other device, take care to avoid short circuits between device, which may occur if exposed frames of adjacent device come too close. * Applies to unit area ultrasonic output for ultrasonic baths Notes for mounting 1) When different kinds of packages are mounted on PC boad, temperature rise at soldering lead is highly dependent on package size. Therefore, please set the lower temperature soldering condition than the conditions of item “■Soldering”, and confirm the temperature condition of actual usage before soldering. 2) When soldering condition exceeds our recommendation, the PhotoMOS® characteristics may be adversely affected. It may occur package crack or bonding wire breaking because of thermal expansion unconformity and resin strength reduction. Please contact our sales office about the propriety of the condition. 3) Please confirm the heat stress by using actual board because it may be changed by board condition or manufacturing process condition. 4) Solder creepage, wettability, or soldering strength will be affected by the soldering condition or used soldering type. Please check them under the actual production condition in detail. 5) Please apply coating when the device returns to a room temperature. ー7ー Panasonic Corporation 2020 ASCTB65E 202002 PhotoMOS® Cautions for Use  bout the exposed terminals on the sides of the A package (for VSSOP) Soldering 1) Example of surface-mount terminal recommended conditions (1) IR (Infrared reflow) soldering method In case of automatic soldering, following conditions should be observed. (recommended condition reflow: Max. 2 times, measurement point: soldering lead) For VSSOP type, as shown in the following figure, part of the input and output frames are exposed on the sides of the package. Due to this, please be keep in mind the cautions listed below. 1) Take care to avoid short circuits between exposed terminals, which may cause insulation deterioration between input and output, leading to destruction of internal elements. 2) Since the exposed terminals are connected electrically to the internal element, please refer to the item “■Deterioration and destruction caused by discharge of static electricity”, and implement sufficient measures to control static electricity. 3) When installing the devices in the vicinity, please keep in mind that if the exposed frames of adjacent devices get too close, a short between devices may occur. t3 T1 = 150 to 180°C T2 = 230°C T3 = 240 to 250°C* t1 = 60 to 120 s t2 = Within 30 s t3 = Within 10 s T3 T2 T1 *240 to 245°C for SON, VSSOP and TSON package t1 t2 Part of frame on output side (2) Other soldering methods Other soldering methods (VPS, hot-air, hot plate, laser heating, pulse heater, etc.) affect the PhotoMOS® characteristics differently, please evaluate the device under the actual usage. (3) Manual soldering method Temperature: 350 to 400°C, within 3s, electrical power 30 to 60W Part of frame on input side Adjacent mounting When several PhotoMOS® are mounted closely each other or heat-generating components are mounted close to the PhotoMOS®, the abnormal heating may occur. This abnormal heat may be caused by the internal element when energized or thermal interference between the devices. The degree of temperature rise depends on the mounting layout of the devices and usage condition, therefore please be sure to use PhotoMOS® with reduced load current after testing under the worst condition of the actual usage. 2) Example of through hole terminal recommended conditions (1) DWS soldering method In case of automatic soldering, following conditions should be observed. (recommended condition number of times: Max. 1 time, measurement point: soldering lead *1) T2 T1 = 120°C T2 = Max. 260°C t1 = within 60 s t2+t3 = within 5 s T1 t1 t2 Transportation and storage t3 *1 Solder temperature: Max. 260°C (2) Other soldering method (recommended condition: 1 time) Preheating: Max. 120°C, within 120s, measurement point: soldering lead Soldering: Max. 260°C, within 10s, measurement area: soldering temperature (3) Manual soldering method Temperature: 350 to 400°C, within 3s, electrical power 30 to 60W 1) Extreme vibration during transport may deform the lead or damage the PhotoMOS® characteristics. Please handle the outer and inner boxes with care. 2) Inadequate storage condition may degrade soldering, appearance, and characteristics. The following storage conditions are recommended: • Temperature: 0 to 45°C • Humidity: Max. 70%RH • Atmosphere: No harmful gasses such as sulfurous acid gas, minimal dust. 3) Storage before TSON, VSSOP, SON, SSOP, or SOP processing In case the heat stress of soldering is applied to the PhotoMOS® which absorbs moisture inside of its package, the evaporation of the moisture increases the pressure inside the package and it may cause the package blister or crack. This device is sensitive to moisture and it is packed in the sealed moisture-proof package. Please make sure the following condition after unsealing. * Please use the device immediately after unsealing. (Within 30 days at 0 to 30°C and Max. 70%RH) * If the device will be kept for a long time after unsealing, please store in the another moisture-proof package containing silica gel. (Please use within 90 days.) Water condensation Water condensation occurs when the ambient temperature changes suddenly from a high temperature to low temperature at high humidity, or the device is suddenly transferred from a low ambient temperature to a high temperature and humidity. Condensation causes the failures such as insulation deterioration. Panasonic Corporation does not guarantee the failures caused by water condensation. The heat conduction by the equipment the PhotoMOS® is mounted may accelerate the water condensation. Please confirm that there is no condensation in the worst condition of the actual usage. (Special attention should be paid when high temperature heating parts are close to the PhotoMOS®.) Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ ー8ー Panasonic Corporation 2020 ASCTB65E 202002 PhotoMOS® Cautions for Use Packing format 1) Tape and reel Tape dimensions Dimensions of tape reel 21±0.8 1.2 1.05±0.1dia. 4±0.1 5.5±0.1 Device mounted on tape ±0.3 180±3dia. 12 ±0.3 TSON 4-pin 2±0.5 60 ±3dia. 4±0.1 2.2±0.2 2.4±0.2 0.2 ±0.05 1.75±0.1 Direction of picking Tractor feed holes 1.5 +0.5 -0 dia. 2±0.1 13±0.5 dia. (1) When picked from 1/2-pin side: Part No. AQY2C1R*PX (Shown above) (2) When picked from 3/4-pin side: Part No. AQY2C1R*PZ 13±1.5 *Quality of material: Polystyrene (PS) 1.2±0.5 4.0 ±0.1 2.4±0.2 VSSOP 4-pin 12.0 ±0.3 2.5±0.2 0.4 ±0.05 1.75±0.1 Direction of picking Tractor feed holes 1.5 +0.5 ｰ0 dia. 1±0.1dia. 3.3±0.3 8±0.1 2±0.1 5.5±0.1 Device mounted on tape (1) When picked from 1 and 4-pin side: Part No. AQY*TY (Shown above) (2) When picked from 2 and 3-pin side: Part No. AQY*TW ±0.3 3.6±0.2 21±0.8 80 ±1dia. 12 Device mounted on tape 4±0.1 1.5±0.1dia. 2±0.3 2±0.1 5.5±0.1 SON 4-pin 4±0.1 2.8±0.2 2±0.5 80 ±1 dia. (1) When picked from 1 and 4-pin side: Part No. AQY*MY (Shown above) (2) When picked from 2 and 3-pin side: Part No. AQY*MW 250 ±2dia. 0.3±0.05 1.75±0.1 Direction of picking Tractor feed holes 1.5 +0.5 ｰ0 dia. 3.0 ±0.1 4.0±0.1 4.0±0.1 5.5±0.1 Device mounted on tape 2.7±0.3 1.5+0.1 ｰ 0 dia. 12.0±0.3 5.1±0.2 0.3±0.05 SSOP 4-pin 1.75±0.1 Direction of picking Tractor feed holes 1.50 +0.5 ｰ 0 dia. *Quality of material: Paper 13 ±0.5dia. 14±1.5 2 ±0.5 Device mounted on tape 2.8±0.3 12±0.1 4±0.1 2±0.1 12 7.2±0.1 ±0.3 1.55±0.05dia. 5.5±0.1 SOP 4-pin Direction of picking Tractor feed holes 4.7±0.1 0.3±0.05 1.75±0.1 (1) When picked from 1 and 4-pin side: Part No. AQY*VY, APV2111VY (Shown above) (2) When picked from 2 and 3-pin side: Part No. AQY*VW, APV2111VW 1.55±0.1dia. (1) When picked from 1/2-pin side: Part No. AQY*SX, APV**21SX (Shown above) (2) When picked from 3/4-pin side: Part No. AQY*SZ, APV**21SZ Note: “ * ” indicates characters of number or alphabet. ー9ー Panasonic Corporation 2020 ASCTB65E 202002 PhotoMOS® Cautions for Use Tape dimensions 1.75±0.1 12±0.1 1.55±0.1dia. 2±0.1 7.5±0.1 Device mounted on tape 12±0.1 14±1.5 13 ±0.5dia. ±0.1 2 2±0.5 Device mounted on tape 2.8±0.3 *Quality of material: Paper 13 ±0.5dia. 17.5±1.5 2±1 1.55±0.1dia. 4±0.1 2±0.1 12±0.1 16±0.3 1.75±0.1 7.5±0.1 7.5±0.1 1.55±0.05dia. 11.15±0.1 SOP 16-pin Direction of picking Tractor feed holes 80 ±1dia. (1) When picked from 1/2/3/4-pin side: Part No. AQW*SX (Shown above) (2) When picked from 5/6/7/8-pin side: Part No. AQW*SZ 0.3±0.05 2 ±0.5 21±0.8 80 ±1dia. 1.55±0.1dia. 4±0.1 2.8±0.3 16±0.3 1.55±0.05dia. 7.5±0.1 SOP 8-pin Direction of picking Tractor feed holes 10.15±0.1 0.3±0.05 *Quality of material: Paper 1.75±0.1 (1) When picked from 1/2/3-pin side: Part No. AQV*SX (Shown above) (2) When picked from 4/5/6-pin side: Part No. AQV*SZ 250 ±2 dia. 2.8 80 ±1 dia. Device mounted on tape ±0.3 2±0.5 250 ±2dia. 7.2±0.1 12 4 1.55±0.05dia. 21±0.8 80 ±1dia. ±0.3 SOP 6-pin Direction of picking Tractor feed holes ±0.1 6.9 ±0.1 5.5±0.1 0.3±0.05 Dimensions of tape reel (1) When picked from 1/2/3/4/5/6/7/8-pin side: Part No. AQS*SX (Shown above) (2) When picked from 9/10/11/12/13/14/15/16-pin side: Part No. AQS*SZ 21±0.8 80 ±1dia. 1.75±0.1 12±0.1 4.2±0.3 80 ±1dia. Device mounted on tape 2±0.5 300 ±2 dia. 10.2±0.1 12±0.3 4 1.5+0.1 ｰ0 dia. 5.5±0.1 DIP 4-pin Surface mount terminal Direction of picking Tractor feed holes ±0.1 5.25±0.1 0.3±0.05 1.55±0.1dia. 2±0.1 (1) When picked from 1/2-pin side: Part No. AQY*HAX, AQY210HLAX (Shown above) (2) When picked from 3/4-pin side: Part No. AQY*HAZ, AQY210HLAZ *Quality of material: Paper 13.5±2.0 13±0.5dia. 2±0.5 21±0.8 80 ±1dia. 4.5±0.3 12±0.1 16 ±0.3 80±1dia. 2±0.5 300±2dia. Device mounted on tape 7.5±0.1 10.1±0.1 1.5+0.1 ｰ0 dia. 9.2±0.1 DIP 6-pin Surface mount terminal Tractor feed holes 1.75±0.1 Direction of picking 0.3±0.05 1.6±0.1dia. 4±0.1 2±0.1 (1) When picked from 1/2/3-pin side: Part No. AQV*AX (Shown above) (2) When picked from 4/5/6-pin side: Part No. AQV*AZ *Quality of material: Paper 13 ±0.5dia. 17.5±2 2±0.5 Note: “ * ” indicates characters of number or alphabet. Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ ー 10 ー Panasonic Corporation 2020 ASCTB65E 202002 PhotoMOS® Cautions for Use Tape dimensions 1.75±0.1 10.1±0.1 7.5±0.1 Device mounted on tape 21±0.8 80 ±1dia. 1.55±0.1dia. 2±0.1 12±0.1 4.5±0.3 16 DIP 8-pin Surface mount terminal (Basic insulation type) 4 1.5+0.1 ｰ0 dia. ±0.3 0.3 Direction of picking Tractor feed holes ±0.1 10.2±0.1 ±0.05 Dimensions of tape reel 10.2±0.1 Device mounted on tape 12±0.1 4.2±0.3 2±0.1 16±0.3 80±1dia. 1.75±0.1 4±0.1 10.3±0.1 DIP 8-pin Surface mount terminal (Reinforced insulation type Direction of picking 1.5 +0.1 ｰ0 dia. 7.5±0.1 Tractor feed holes 0.3±0.05 300±2dia. 2±0.5 (1) When picked from 1/2/3/4-pin side: Part No. AQW*AX (Shown above) (2) When picked from 5/6/7/8-pin side: Part No. AQW*AZ 13 ±0.5dia. *Quality of material: Paper 17.5±2 2±0.5 1.55±0.1dia. (1) When picked from 1/2/3/4-pin side: Part No. AQW*EHAX, AQW210HLAX (Shown above) (2) When picked from 5/6/7/8-pin side: Part No. AQW*EHAZ, AQW210HLAZ 21±0.8 100±1dia. 16.0±0.1 4.5±0.3 2.0±0.1 1.75 100±1dia. 330±2 dia. 1.55±0.1 dia. (1) When picked from 1/2-pin side: Part No. AQY*AX (Shown above) (2) When picked from 3/4-pin side: Part No. AQY*AZ 12±0.1 4.5 4±0.1 16 80±1dia. Device mounted on tape ±0.3 1.7±0.8 2±0.5 ±0.3 10.1±0.1 1.5+0.1 ｰ0 dia. 7.5±0.1 DIP 6-pin Surface mount terminal (Photovoltaic MOSFET driver) Tractor feed holes 9.2±0.1 0.3±0.05 25.5±2 21±0.8 80 ±1dia. 1.75±0.1 Direction of picking 13 ±0.5dia. *Quality of material: Paper 1.6±0.1dia. 300±2dia. Device mounted on tape 2±0.5 24.0 ±0.3 Power-DIP 4-pin SMD 12.6±0.1 4.0±0.1 1.55+0.05 ｰ 0.05 dia. 9.7±0.1 11.5 ±0.1 0.3±0.05 ±0.1 Direction of picking Tractor feed holes 2±0.1 (1) When picked from 1/2/3-pin side: Part No. APV1122AX (Shown above) (2) When picked from 4/6-pin side: Part No. APV1122AZ 13 ±0.5dia. *Quality of material: Paper 17.5±2 2±0.5 Note: “ * ” indicates characters of number or alphabet. 2) Tube Devices are packaged in a tube so that 1-pin is on the stopper B side. Observe correct orientation when mounting them on PC boards. (PD type) Stopper B (SOP type) Stopper A Stopper B (green) (DIP type) Stopper B Stopper A (gray) (Power type) Stopper A Green Stopper B ー 11 ー Gray Stopper A Panasonic Corporation 2020 ASCTB65E 202002 PhotoMOS® Cautions for Use Adjacent mounting (for Power type) Current limit function (output current control) 1) When devices are mounted close together with the heatgenerated devices, ambient temperature may rise abnormally. Mounting layout and ventilation should be considered. 1) Current limit function aims to increase resistance to surges when the switch is turned on. Before using this function, connect the varistor to the output as shown in the figure below. 1 2 2) When many devices are mounted close together, load current should be reduced. (Refer to the data of “Load current in adjacent mounting vs. Ambient temperature characteristics.”) 4 3 Varistor Surge: 10×160μs 1.6kV * Set the varistor voltage to 150 V or less. Recommended load voltage As a guide in selecting PhotoMOS®, please refer to the following table. 2) The current limit function capability can be lost if used longer than the specified time. Be sure to set the output loss to the Max. rate. 1) Power photoMOS® (1 Form A) Short circuit protection circuit The short circuit protection circuit is designed to protect circuits from excess current. Therefore, surge current may be detected as current overload in which case the output current will be cut and the off state maintained. For this reason, please include the inrush current in the load current and keep it below the maximum load current. Also, in order to maintain stability of internal IC operation, maintain an input current of at least 5 mA (Latch type), 10 mA (Non Latch type). Photovoltaic MOSFET driver cautions for use When two external MOSFETs are connected with a common source terminal, oscillation may occur when operation is restored. Therefore, please insert a 100 to 1,000 Ω resistor between the gate terminal of the first MOSFET and the gate terminal of the second MOSFET. A typical example of this is given in the circuit below. 1 DC type AC/ DC type Load current Recommended load voltage AQZ102 60 V DC 4.0 A DC 5, 12, 24 V DC AQZ105 100 V DC 2.6 A DC 48 V DC AQZ107 200 V DC 1.3 A DC 100 V DC AQZ104 400 V DC 0.7 A DC 200 V DC AQZ202 Peak AC, DC 60 V Peak AC, DC 3.0 A AQZ205 Peak AC, DC 100 V Peak AC, DC 2.0 A 24 V AC 48 V DC AQZ207 Peak AC, DC 200 V Peak AC, DC 1.0 A 48 V AC 100 V DC AQZ204 Peak AC, DC 400 V Peak AC, DC 0.5 A 120 V AC 200 V DC Absolute maximum rating Load voltage AC/ DC type 4 12 V AC 5, 12, 24 V DC 2) Power photoMOS® (1 Form B) 6 2 3 Absolute maximum rating Load voltage Load current Peak AC, DC 400 V Peak AC, DC 0.5 A AQZ404 Recommended load voltage 100 V AC 200 V DC 3) Power photoMOS® Voltage-sensitive type (1 Form A) Input LED current (for Standard type) Absolute maximum rating For rising and dropping ratio of input LED current (di/dt), maintain Min. 100 μA/s. Input voltage (for Power voltage-sensitive type) For rising and dropping ratio of input voltage (dv/dt), maintain Min. 100 mV/s. Load voltage Load current Recommended load voltage AQZ102D 60 V DC 3.6 A DC 5, 12, 24 V DC DC AQZ105D type AQZ107D 100 V DC 2.3 A DC 48 V DC 200 V DC 1.1 A DC 100 V DC AQZ104D 400 V DC 0.6 A DC 200 V DC AQZ202D Peak AC, DC 60 V Peak AC, DC 2.7 A 12 V AC 5, 12, 24 V DC 24 V AC AC/ AQZ205D Peak AC, DC 100 V Peak AC, DC 1.8 A 48 V DC DC type AQZ207D Peak AC, DC 200 V Peak AC, DC 0.9 A 48 V AC 100 V DC AQZ204D Peak AC, DC 400 V Peak AC, DC 0.45 A 120 V AC 200 V DC 4) Power photoMOS® High Capacity type (1 Form A) Absolute maximum rating DC type Load voltage Load current Recommended load voltage AQZ192 60 V DC 10 A DC 5, 12, 24 V DC AQZ197 200 V DC 5 A DC 100 V DC AQZ202G Peak AC, DC 60 V 12 V AC Peak AC, DC 6 A 5, 12, 24 V DC 24 V AC AC/ AQZ205G Peak AC, DC 100 V Peak AC, DC 4 A 48 V DC DC type AQZ207G Peak AC, DC 200 V Peak AC, DC 2 A 48 V AC 100 V DC AQZ206G2 Peak AC, DC 600 V Peak AC, DC 1 A Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ ー 12 ー Panasonic Corporation 2020 120, 240 V AC 200, 400 V DC ASCTB65E 202002 Please contact .......... Electromechanical Control Business Division 1006, Oaza Kadoma, Kadoma-shi, Osaka 571-8506, Japan industral.panasonic.com/ac/e/ ©Panasonic Corporation 2020 ASCTB131E 202002 Specifications are subject to change without notice.