AQY221N5VW

C✕R3 type, SSOP package, 20 V load voltage RF SSOP 1 Form A C×R3 (AQY22❍❍❍V) FEATURES New 2.65 .104 1. Miniature SSOP package (Compared to SOP 4-pin models, volume ratio can be reduced by approximately 53%.) 2. Load voltage: 20 V 3. Low C×R (C×R3) Output capacitance: 1.1 pF (typical), On resistance: 2.8Ω (typical) 4.45 .175 1.80 .071 mm inch 1 4 2 3 TYPICAL APPLICATIONS 1. Measuring and testing equipment IC tester, Probe card, Board tester and other testing equipment 2. Telecommunication equipment *Does not support automotive applications. RoHS compliant TYPES Type AC/DC dual use Output rating*1 Load voltage Load current New 20 V Part No. (Tape and reel packing style)*2 Picked from the 1 and 4-pin side Picked from the 2 and 3-pin side 180 mA AQY221N5VY Packing quantity in the tape and reel AQY221N5VW 3,500 pcs. Notes: *1. Indicate the peak AC and DC values. *2. Only tape and reel package is available. Packing quantity of 1,000 pieces is possible. Please consult us. For space reasons, the three initial letters of the part number “AQY”, the package (SSOP) indication “V”, and the packaging style “Y” or “W” are not marked on the device. RATING 1. Absolute maximum ratings (Ambient temperature: 25°C 77°F) Item LED forward current LED reverse voltage Input side Peak forward current Power dissipation Load voltage (peak AC) Continuous load current Output side Peak load current Power dissipation Total power dissipation I/O isolation voltage Operating temperature Storage temperature Symbol IF VR IFP Pin VL IL Ipeak Pout PT Viso Topr Tstg AQY221N5V 50 mA 5V 1A 75 mW 20 V 0.18 A 0.3 A 250 mW 300 mW 1,500 V AC –40°C to +85°C –40°F to +185°F –40°C to +100°C –40°F to +212°F –1– Remarks f = 100 Hz, Duty factor = 0.1% Peak AC, DC 100 ms (1shot), VL = DC Non-condensing at low temperatures ASCTB350E 201407-T RF SSOP 1 Form A C×R3 (AQY22❍❍❍V) 2. Electrical characteristics (Ambient temperature: 25°C 77°F) Item LED operate current Input LED turn off current LED dropout voltage On resistance Output Output capacitance Off state leakage current Turn on time** Transfer characteristics Turn off time** I/O capacitance Initial I/O isolation resistance Symbol Typical Maximum Minimum Typical Typical Maximum Typical Maximum Typical Maximum Typical Maximum Typical Maximum Typical Maximum Typical Maximum Minimum IFon IFoff VF Ron Cout ILeak Ton Toff Ciso AQY221N5V 0.8 mA 3 mA 0.2 mA 0.7 mA 1.35 V (1.14 V at IF = 5 mA) 1.5 V 2.8Ω 4.5Ω 1.1 pF 1.5 pF 0.01 nA 10 nA* 0.02 ms 0.2 ms 0.01 ms 0.2 ms 0.8 pF 1.5 pF Riso 1,000 MΩ Condition IL = 80 mA IF = 50 mA IF = 5 mA, IL = 80 mA Within 1 s on time IF = 0 mA, VB = 0 V, f = 1 MHz IF = 0 mA, VL = Max. IF = 5 mA, VL = 10 V, RL = 125Ω f = 1 MHz, VB = 0 V 500 V DC Notes: 1. Please refer to the “Schematic and Wiring Diagrams” for connection method. 2. Variation possible through combinations of output capacitance and on resistance. For more information, please contact our sales office in your area. *Available as custom orders (1 nA or less) **Turn on/Turn off time Input 90% 10% Output Toff Ton RECOMMENDED OPERATING CONDITIONS Please obey the following conditions to ensure proper this device operation and resetting. Item Input LED forward current Symbol IF Recommended value 5 Unit mA –2– ASCTB350E 201407-T RF SSOP 1 Form A C×R3 (AQY22❍❍❍V) REFERENCE DATA 1. Load current vs. ambient temperature characteristics 2. Load current vs. load voltage characteristics Ambient temperature: 25°C 77°F Measured portion: between terminals 3 and 4 LED current: 5 mA; Load voltage: 10V (DC) Continuous load current: 80mA (DC) 250 10 200 200 8 150 100 50 On resistance, Ω 250 Load current, mA Load current, mA Allowable ambient temperature: –40°C to +85°C –40°F to +185°F 3. On resistance vs. ambient temperature characteristics 150 100 50 0 -40 -20 0 20 40 60 0 80 85 100 6 4 2 0 5 10 Ambient temperature, °C 15 20 0 25 -40 -20 0 20 40 60 5. Turn off time vs. ambient temperature characteristics 6. LED operate current vs. ambient temperature characteristics LED current: 5 mA; Load voltage: 10V (DC); Continuous load current: 80mA (DC) LED current: 5 mA; Load voltage: 10V (DC); Continuous load current: 80mA (DC) Load voltage: 10V (DC); Continuous load current: 80mA (DC) 0.08 0.08 0.06 0.04 0.02 0 5 LED operate current, mA 0.1 Turn off time, ms Turn on time, ms 4. Turn on time vs. ambient temperature characteristics 0.1 0.06 0.04 0.02 -40 -20 0 20 40 60 0 80 85 80 85 Ambient temperature, °C Load voltage, V 4 3 2 1 -40 -20 Ambient temperature, °C 0 20 40 60 80 85 0 -40 -20 Ambient temperature, °C 0 20 40 60 80 85 Ambient temperature, °C 7. LED turn off current vs. ambient temperature characteristics 8. LED dropout voltage vs. ambient temperature characteristics 9. Current vs. voltage characteristics of output at MOS portion Load voltage: 10V (DC); Continuous load current: 80mA (DC) LED current: 5 to 50 mA Measured portion: between terminals 3 and 4; Ambient temperature: 25°C 77°F 1.5 4 3 2 1 0 -40 -20 0 20 40 60 Ambient temperature, °C 80 85 250 Current, mA LED dropout voltage, V LED turn off current, mA 5 1.4 200 150 100 50 1.3 50mA -1.5 -1.0 -0.5 1.2 30mA 20mA -100 1.1 10mA -150 5mA -200 1.0 -40 -20 0 20 40 60 80 85 100 -50 0.5 1.0 1.5 Voltage, V -250 Ambient temperature, °C –3– ASCTB350E 201407-T RF SSOP 1 Form A C×R3 (AQY22❍❍❍V) 10. Off state leakage current vs. load voltage characteristics 11. Turn on time vs. LED forward current characteristics 12. Turn off time vs. LED forward current characteristics Measured portion: between terminals 3 and 4; Ambient temperature: 25°C 77°F Measured portion: between terminals 3 and 4; Load voltage: 10V (DC); Continuous load current: 80mA (DC); Ambient temperature: 25°C 77°F Measured portion: between terminals 3 and 4; Load voltage: 10V (DC); Continuous load current: 80mA (DC); Ambient temperature: 25°C 77°F 0.1 0.1 0.08 0.08 10-6 10-9 Turn off time, ms Turn on time, ms Leakage current, A 10-3 0.06 0.04 0.02 0.06 0.04 0.02 -12 10 0 5 10 15 20 0 25 0 10 Load voltage, V 20 30 40 50 0 60 0 10 LED forward current, mA 20 30 40 50 60 LED forward current, mA 14. Isolation vs. frequency characteristics (50Ω impedance) 15. Insertion loss vs. frequency characteristics (50Ω impedance) Measured portion: between terminals 3 and 4; Frequency: 1 MHz; Ambient temperature: 25°C 77°F Measured portion: between terminals 3 and 4; Ambient temperature: 25°C 77°F Measured portion: between terminals 3 and 4; Ambient temperature: 25°C 77°F 100 4 80 3 60 2 40 1 20 0 0 5 10 15 20 2 Insertion loss, dB 5 Isolation, dB Output capacitance, pF 13. Output capacitance vs. applied voltage characteristics 106 107 0 4 10 108 105 Frequency, Hz Applied voltage, V DIMENSIONS (mm inch) 1 0.5 0 5 10 25 1.5 The CAD data of the products with a CAD Data 107 mark can be downloaded from: http://industrial.panasonic.com/ac/e/ External dimensions CAD Data 106 Frequency, Hz Recommended mounting pad (Top view) 4.45 .175 0.90 .035 0.70 .028 2.65 .104 1.27 .050 4.35 .171 Tolerance: ±0.1 ±.004 1.80 .071 0.20 .008 (4.85) (.191) 0.20 0.40 .008 .016 0.40 .016 1.27 .050 Terminal thickness = 0.15 .006 General tolerance: ±0.1 ±.004 SCHEMATIC AND WIRING DIAGRAMS E1: Power source at input side; IF: LED forward current; VL: Load voltage; IL: Load current Output configuration Schematic 1 Connection Wiring diagram 4 1a 2 Load 3 AC/DC — E1 1 4 2 3 IF 4 IL VL (AC,DC) Load IL VL (AC,DC) 3 Load –4– ASCTB350E 201407-T RF SSOP 1 Form A C×R3 (AQY22❍❍❍V) PhotoMOS® CAUTIONS FOR USE SAFETY WARNINGS • Do not use the product under conditions that exceed the range of its specifications. It may cause overheating, smoke, or fire. • Do not touch the recharging unit while the power is on. There is a danger of electrical shock. Be sure to turn off the power when performing mounting, maintenance, or repair operations on the device (including connecting parts such as the terminal board and socket). • Check the connection diagrams in the catalog and be sure to connect the terminals correctly. Erroneous connections could lead to unexpected operating errors, overheating, or fire. 1. Derating design Derating is essential in any reliable design and is a significant factor for product life. Even if the conditions of use (temperature, current, voltage, etc.) of the product fall within the absolute maximum ratings, reliability can be reduced remarkably when used under high load (high temperature, high humidity, high current, high voltage, etc.). Therefore, please derate sufficiently below the absolute maximum rating and verify operation of the actual design before use. Also, if there is the possibility that the inferior quality of this product could possibility cause great adverse affect on human life or physical property we recommend that, from the perspective of a manufacturer’s liability, sufficient amount of derating to be added to the maximum rating value and implement safety measures such as fail-safe circuit. 2. Applying stress that exceeds the absolute maximum rating If the voltage or current value for any of the terminals exceeds the absolute maximum rating, internal elements will deteriorate because of the excessive voltage or current. In extreme cases, wiring may melt, or silicon P/N junctions may be destroyed. Therefore, the circuit should be designed in such a way that the load never exceed the absolute maximum ratings, even momentarily. 3. Deterioration and destruction caused by discharge of static electricity (RF C×R3 / C×R5 / C×R10) This phenomenon is generally called static electricity destruction, and occurs when static electricity generated by various factors is discharged while the PhotoMOS® terminals are in contact, producing internal destruction of the element. To prevent problems from static electricity, the following precautions and measures should be taken when using your device. 1) Employees handling PhotoMOS® should wear anti-static clothing and should be grounded through protective resistance of 500 kΩ to 1 MΩ. 2) A conductive metal sheet should be placed over the worktable. Measuring instruments and jigs should be grounded. 3) When using soldering irons, either use irons with low leakage current, or ground the tip of the soldering iron. (Use of lowvoltage soldering irons is also recommended.) 4) Devices and equipment used in assembly should also be grounded. 5) When packing printed circuit boards and equipment, avoid using high-polymer materials such as foam styrene, plastic, and other materials which carry an electrostatic charge. 6) When storing or transporting devices, the environment should not be conducive to generating static electricity (for instance, the humidity should be between 45 and 60%), and PhotoMOS® should be protected using conductive packing materials. 4. Short across terminals Do not short circuit between terminals when PhotoMOS® is energized, since there is possibility of breaking of the internal IC. 5. Output spike voltages 1) If an inductive load generates spike voltages which exceed the absolute maximum rating, the spike voltage must be limited. Typical circuits are shown below. (Typical circuits of AC/DC dual use type are shown below. It is the same with DC only type.) 6. Ripple in the input power supply If ripple is present in the input power supply, observe the following: 1) For LED forward current at Emin, please maintain min. 5 mA. 2) Please make sure for Emax. is no higher the LED current at than 50 mA. 1 4 2 3 Emin. Emax. 7. About the exposed terminals on the sides of the package As shown in the following figure, part of the input and output frames are exposed on the sides of the package. Due to this, please be keep in mind the cautions listed below. 1) Shorting the exposed terminals may cause deterioration of the insulation between the inputs and outputs, and may damage the internal IC. 2) Since the exposed terminals are connected electrically to the internal element, please refer to item “3. Deterioration and destruction caused by discharge of static electricity”, and implement sufficient measures to control static electricity. 3) When mounting the PhotoMOS® in the vicinity, please keep in mind that if the exposed frames of adjacent PhotoMOS® get too close, a short between PhotoMOS® may occur. Part of frame of output side Load Part of frame of input side 1 4 2 3 Add a clamp diode to the load Load Add a CR snubber circuit to the load 2) Even if spike voltages generated at the load are limited with a clamp diode if the circuit wires are long, spike voltages will occur by inductance. Keep wires as short as possible to minimize inductance. –5– 8. Regarding close installations When many PhotoMOS® are mounted close to other parts, the ambient temperature may rise due to heating of the internal element when power is applied. Be sure to use with a reduced load current after testing under actual conditions, because the degree of temperature rise depends on the mounting layout of the PhotoMOS® and conditions of use. ASCTB345E 201407-T RF SSOP 1 Form A C×R3 (AQY22❍❍❍V) 9. Soldering 1) When soldering PC board terminals, keep soldering time to within 10 s at 260°C 500°F. 2) When soldering surface-mount terminals, SOP, SSOP, SON and VSSOP package, the following conditions are recommended. (1) IR (Infrared reflow) soldering method T3 T2 T1 t1 t2 T1 = 150 to 180°C 302 to 356°F T2 = 230°C 446°F T3 = 250°C 482°F or less* t1 = 60 to 120 s or less t2 = 30 s or less *245°C 473°F or less for SON, VSSOP package (2) Soldering iron method Tip temperature: 350 to 400°C 662 to 752°F Wattage: 30 to 60 W Soldering time: within 3 s (3) Others Check mounting conditions before using other soldering methods (DWS, VPS, hotair, hot plate, laser, pulse heater, etc.) • When using lead-free solder, we recommend a type with an alloy composition of Sn 3.0 Ag 0.5 Cu. Please inquire about soldering conditions and other details. • The temperature profile indicates the temperature of the soldered terminal on the surface of the PC board. The ambient temperature may increase excessively. Check the temperature under mounting conditions. 10. Notes for mounting 1) If many different packages are combined on a single substrate, then lead temperature rise is highly dependent on package size. For this reason, please make sure that the temperature of the terminal solder area of the PhotoMOS® falls within the temperature conditions of item “9. Soldering” before mounting. 2) If the mounting conditions exceed the recommended solder conditions in item “9. Soldering”, resin strength will fall and the nonconformity of the heat expansion coefficient of each constituent material will increase markedly, possibly causing cracks in the package, severed bonding wires, and the like. For this reason, please inquire with us about whether this use is possible. 11. Cleaning solvents compatibility We recommend cleaning with an organic solvent. If you cannot avoid using ultrasonic cleansing, please ensure that the following conditions are met, and check beforehand for defects. • Frequency: 27 to 29 kHz • Ultrasonic output: No greater than 0.25W/cm2 • Cleaning time: No longer than 30 s • Cleanser used: Asahiklin AK-225 • Others: Submerge in solvent in order to prevent the PC board and elements from being contacted directly by the ultrasonic vibrations. 12. Transportation and storage 1) Extreme vibration during transport will warp the lead or damage the PhotoMOS®. Handle the outer and inner boxes with care. 2) Storage under extreme conditions will cause soldering degradation, external appearance defects, and deterioration of the characteristics. The following storage conditions are recommended: • Temperature: 0 to 45°C 32 to 113°F • Humidity: Less than 70% R.H. • Atmosphere: No harmful gasses such as sulfurous acid gas, minimal dust. 3) PhotoMOS® implemented in VSSOP, SON, SSOP, SOP are sensitive to moisture and come in sealed moistureproof package. Observe the following cautions on storage. • After the moisture-proof package is unsealed, take the devices out of storage as soon as possible (within 1 month 45°C 32°F/70%R.H.). • If the devices are to be left in storage for a considerable period after the moistureproof package has been unsealed, it is recommended to keep them in another moisture-proof bag containing silica gel (within 3 months at the most). Note: Applies to unit area ultrasonic output for ultrasonic baths. –6– ASCTB345E 201407-T RF SSOP 1 Form A C×R3 (AQY22❍❍❍V) 13. The following shows the packaging format 1) Tape and reel (Unit: mm inch) Type Tape dimensions Tractor feed holes 1.50+0.5 −0 dia. .059+.020 dia. −0 0.40±0.05 .016±.002 2.4±0.2 .094±.008 2.5±0.2 .098±.008 Dimensions of paper tape reel Direction of picking 4.0±0.1 .157±.004 1.75±0.1 .069±.004 12.0±0.3 .472±.012 VSSOP 4-pin 3.3±0.3 .130±.012 Device mounted on tape 8±0.1 1±0.1 dia. .039±.004 dia. .315±.004 21±0.8 .827±.031 80±1 dia. 3.150±.039 dia. 2±0.1 5.5±0.1 .079±.004 .217±.004 2±0.5 .079±.020 (1) When picked from 1 and 4-pin side: Part No. AQY❍❍❍TY (Shown above) (2) When picked from 2 and 3-pin side: Part No. AQY❍❍❍TW Tractor feed holes 1.50+0.5 −0 dia. dia. .059+.020 −0 0.3±0.05 .012±.002 SSOP 4-pin 3.0±0.1 .118±.004 5.1±0.2 .201±.008 250±2 dia. 9.843±.079 dia. 80±1 dia. 3.150±.039 dia. Direction of picking 4.0±0.1 .157±.004 1.75±0.1 .069±.004 13±0.5 dia. .512±.020 dia. 14±1.5 .551±.059 2±0.5 .079±.020 12.0±0.3 ±.012 .472 Device mounted on tape 2.7±0.3 .106±.012 4.0±0.1 .157±.004 1.50+0.1 −0 dia. dia. .059+.004 −0 5.5±0.1 .217±.004 (1) When picked from 1 and 4-pin side: Part No. AQY221❇VY (Shown above) (2) When picked from 2 and 3-pin side: Part No. AQY221❇VW Notes: “❇” indicates two or more characters of number or alphabet. “❍” indicates a single-digit figure. –7– ASCTB345E 201407-T