2.6 GHz capable, 10 W
carrying power (at 2.6 GHz),
50Ω/75Ω impedance and
1 Form C relays
20.2
.795
11.2
.441
8.6
.339
11.2
.441
20.2
.795
8.6
.339
RE RELAYS (ARE)
FEATURES
TYPICAL APPLICATIONS
• Excellent high frequency
characteristics (to 2.6GHz)
• Surface-mount type also available
• Compact and slim size
Size: 20.2(L) × 11.2(W) × 8.9(H)* mm
.795(L) × .441(W) × .350(H) inch
*The height of Surface-mount type is
9.6 mm .378 inch size.
1. Broadcasting and video markets.
• Digital broadcasting equipment
• STB/tuner
2. Communications market
• Antennae switching
• All types of wireless devices
If you consider using applications with
low level loads or with high frequency
switching, please consult us.
mm inch
RoHS compliant
Protective construction: Sealed type
ORDERING INFORMATION
ARE
1
RE relays
Contact arrangement
1: 1 Form C
Operating function
0: Single side stable type (Impedance 50Ω)
3: Single side stable type (Impedance 75Ω)
Terminal shape
Nil: Standard PC board terminal
A: Surface-mount terminal
Coil voltage (DC)
03: 3V, 4H: 4.5V, 06: 6V, 09: 9V, 12: 12V, 24: 24V
(H=0.5)
Packing style
Nil: Carton packing (Standard PC board terminal only)
Tube packing (Surface-mount terminal only)
Z: Tape and reel packing (picked from 14 pin side)
(Surface-mount terminal only)
–1–
ASCTB104E 201703-T
RE (ARE)
TYPES
1. Standard PC board terminal
Rated voltage
3 V DC
4.5 V DC
6 V DC
9 V DC
12 V DC
24 V DC
Part No.
Single side stable type (Impedance 50Ω)
ARE1003
ARE104H
ARE1006
ARE1009
ARE1012
ARE1024
Standard packing
Carton
Case
Single side stable type (Impedance 75Ω)
ARE1303
ARE134H
ARE1306
ARE1309
ARE1312
ARE1324
50 pcs.
500 pcs.
2. Surface-mount terminal
1) Tube package
Rated voltage
3 V DC
4.5 V DC
6 V DC
9 V DC
12 V DC
24 V DC
Part No.
Single side stable type (Impedance 50Ω)
ARE10A03
ARE10A4H
ARE10A06
ARE10A09
ARE10A12
ARE10A24
Standard packing
Tube
Case
Single side stable type (Impedance 75Ω)
ARE13A03
ARE13A4H
ARE13A06
ARE13A09
ARE13A12
ARE13A24
25 pcs.
200 pcs.
2) Tape and reel package
Rated voltage
3 V DC
4.5 V DC
6 V DC
9 V DC
12 V DC
24 V DC
Part No.
Single side stable type (Impedance 50Ω)
ARE10A03Z
ARE10A4HZ
ARE10A06Z
ARE10A09Z
ARE10A12Z
ARE10A24Z
Single side stable type (Impedance 75Ω)
ARE13A03Z
ARE13A4HZ
ARE13A06Z
ARE13A09Z
ARE13A12Z
ARE13A24Z
Standard packing
Tape and reel
Case
400 pcs.
800 pcs.
RATING
1. Coil data
Rated voltage
3
Pick-up voltage*
(at 20°C 68°F)
Drop-out voltage*
(at 20°C 68°F)
Rated operating current
[±10%] (at 20°C 68°F)
Coil resistance
[±10%] (at 20°C 68°F)
Rated operating power
Max. allowable voltage
10%V or more of
rated voltage
(Initial)
66.7 mA
44.4 mA
33.3 mA
22.2 mA
16.7 mA
8.3 mA
45 Ω
101 Ω
180 Ω
405 Ω
720 Ω
2,880 Ω
200 mW
110%V (at 60°C 140°F)
150%V (at 20°C 68°F)
of rated voltage
V DC
4.5 V DC
6 V DC
9 V DC
12 V DC
24 V DC
75%V or less of
rated voltage
(Initial)
* Square, pulse drive (JIS C5442)
–2–
ASCTB104E 201703-T
RE (ARE)
2. Specifications
Characteristics
Contact data
Item
Arrangement
Contact resistance (initial)
Contact material
Specifications
1 Form C
Max. 100mΩ (By voltage drop 10V AC 10mA)
Gold plating
1W (at 2.6 GHz [Impedance 50Ω, V.S.W.R. Max.1.7] [Impedance 75Ω;, V.S.W.R. Max.1.5])
10mA 24V DC
10W (at 2.6GHz [Impedance 50Ω, V.S.W.R. Max.1.7] [Impedance 75Ω, V.S.W.R. Max.1.5])
30V DC
0.5A DC
Max. 1.3 (to 900MHz), Max. 1.7 (to 2.6GHz)
Max. 0.2dB (to 900MHz), Max. 0.7dB (to 2.6GHz)
Min. 60dB (to 900MHz), Min. 30dB (to 2.6GHz)
Max. 1.2 (to 900MHz), Max. 1.5 (to 2.6GHz)
Max. 0.2dB (to 900MHz), Max. 0.5dB (to 2.6GHz)
Min. 60dB (to 900MHz), Min. 30dB (to 2.6GHz)
Min. 100MΩ (at 500V DC, Measured portion is the same as the case of dielectric voltage.)
Contact rating (resistive)
Contact input power
Max. switching voltage
Max. switching current
V.S.W.R.
High frequency
characteristics (Initial) Insertion loss
(Impedance 50Ω)
Isolation
V.S.W.R.
High frequency
characteristics (Initial) Insertion loss
(Impedance 75Ω)
Isolation
Insulation resistance (Initial)
Breakdown voltage
(Initial)
Time characteristics
Mechanical
characteristics
Between open contacts
Between contact and coil
Between contact and earth terminal
Operate time (initial)
Release time (initial)
Shock
resistance
Functional
Destructive
Vibration
resistance
Functional
Destructive
500 Vrms for 1min. (detection current: 10mA)
1,000 Vrms for 1min. (detection current: 10mA)
500 Vrms for 1min. (detection current: 10mA)
Max. 10ms (at 20°C 68°F, at rated voltage, without bounce)
Max. 5ms (at 20°C 68°F, at rated voltage, without bounce, without diode)
Min. 500 m/s2 (half-sine shock pulse: 11ms; detection time: 10μs)
Min. 1,000m/s2 (half-sine shock pulse: 6ms)
Mechanical
Expected life
Conditions
Electrical
Conditions for operation, transport and storage*
Unit weight
10 to 55 Hz at double amplitude of 3mm (detection time: 10μs)
10 to 55 Hz at double amplitude of 5mm
Min. 106 (at 180 times/min.)
Min. 3×105 (1W, 2.6GHz, [Impedance 50Ω, V.S.W.R. 1.7] [Impedance 75Ω, V.S.W.R.
Min. 3×105 (10mA 24V DC (resistive) (at 20 times/min.))
Ambient temperature: –40 to +70°C –40 to +158°F
Humidity: 5 to 85% R.H. (Not freezing and condensing at low temperature)
Approx. 5 g .18 oz
1.5])
Note: * The upper operation ambient temperature limit is the maximum temperature that can satisfy the coil temperature rise value. Refer to [6] AMBIENT ENVIRONMENT
in GENERAL APPLICATION GUIDELINES.
REFERENCE DATA
1-(1). High frequency characteristics (Impedance 50Ω) (Standard PC board terminal)
• Insertion loss characteristics
• Isolation characteristics
0
0
1.9
0.1
10
1.8
0.2
COM-NO
1.6
1.5
1.4
COM-NC
1.3
COM-NC
20
Isolation, dB
1.7
Insertion loss, dB
V.S.W.R.
• V.S.W.R. characteristics
0.3
0.4
0.5
0.6
40
50
60
0.7
1.2
70
COM-NO
0.8
0.9
90
1
1.0
100
3GHz
900MHz
COM-NO
80
1.1
900MHz
COM-NC
30
3GHz
900MHz
Frequency
Frequency
3GHz
Frequency
1-(2). High frequency characteristics (Impedance 75Ω) (Standard PC board terminal)
• Insertion loss characteristics
• Isolation characteristics
2.0
0
0
1.9
0.1
10
1.8
0.2
1.6
1.5
COM-NO
1.4
0.4
0.5
0.6
0.7
1.2
0.8
1
COM-NC
3GHz
900MHz
20
0.3
1.3
1.1
COM-NC
Isolation, dB
1.7
Insertion loss, dB
V.S.W.R.
• V.S.W.R. characteristics
COM-NC
30
40
50
60
COM-NO
70
COM-NO
80
0.9
90
1.0
100
3GHz
900MHz
Frequency
Frequency
–3–
900MHz
3GHz
Frequency
ASCTB104E 201703-T
RE (ARE)
DIMENSIONS (mm inch)
The CAD data of the products with a
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
1. Standard PC board terminal (50Ω, 75Ω type)
Schematic (Bottom view)
20.2
.795
1
7
Stand off
14 13 12 11 10 9 8
11.2
.441
Direction indication
(Deenergized condition)
PC board pattern
8.6
.339
3.0
.118
0.3
.012
2.54
.100
0.5
.020
0.3
.012
(1.49)
(.059)
9-1.00 dia.
9-.039 dia.
0.3
.012
(2.09)
(.082)
7.62
.300
2.54
.100
7.62
.300
Tolerance: ±0.3 ±.012
Tolerance: ±0.1 ±.004
2. Surface mount terminal
• 50Ω type
Schematic (Top view)
20.2 .795
14.74 .580
3.5 .138
0.5 .020
4.12 .162
1.04 .041
(0.7)
(.028)
1.04
.041
0.5
.020
0.5 .020
4.12 .162
1.04 .041
14 13 12 11 10 9 8
1.04
.041
Direction indication
1
7
(Deenergized condition)
13.2 ±0.5 11.2
.520 ±.020 .441
PC board pattern
(1.3)
(.511)
13.55 3.24
.533 .128
8.6
.339
0.3
.012
0.3
.012
0.3
.012
(1.49)
(.059)
7.62
.300
9.6
.378
3.34
.131
5-0.90
5-.035
4-1.44
4-.057
(2.09)
(.082)
Tolerance: ±0.3 ±.012
4.60
.181
10.70
.421
15.24
.600
Tolerance: ±0.1 ±.004
• 75Ω type
Schematic (Top view)
(0.7)
(.028)
20.2
.795
14 13 12 11 10 9 8
13.2 ±0.5 11.2
.520 ±.020 .441
Direction indication
1
7
(Deenergized condition)
(1.3)
(.511)
PC board pattern
0.3
.012
8.6
.339
0.3
.012
9.6
.378
13.55 3.24
.533 .128
0.3
.012
2.54
.100
0.5
.020
(1.49)
(.059)
7.62
.300
(2.09)
(.082)
Tolerance: ±0.3 ±.012
3.34
.131
9-0.90
9-.035
5.08
.200
10.16
.400
15.24
.600
Tolerance: ±0.1 ±.004
–4–
ASCTB104E 201703-T
RE (ARE)
NOTES
1. Coil operating power
Pure DC current should be applied to the coil. The wave form
should be rectangular. If it includes ripple, the ripple factor
should be less than 5%.
However, check it with the actual circuit since the characteristics
may be slightly different.
+.004
1.5+0.1
−0 .059−0
dia.
Relay polarity bar
4
.157
1.75
.069
2.0±0.15
.079±.006
0.4
.016
20.2 44±0.3
±.012
20.75.795 1.732
.817
40.4
1.591
1.7
.067
R0.75
RE Relay 20.0
.030
.787
1.5 .059
Tape coming out direction
2. Cleaning
For automatic cleaning, the boiling method is recommended.
Avoid ultrasonic cleaning which subjects the relays to high
frequency vibrations, which may cause the contacts to stick.
It is recommended that alcoholic solvents be used.
13.85
.545
10.6+0.2
−0.3
.417+.008
−.012
2) Dimensions of plastic reel
21±0.8±.031
dia.
.827
dia.
3. Soldering
(Standard PC board terminal)
1) The manual soldering shall be performed under following
condition.
Max. 260°C 500°F 10s
Max. 350°C 662°F 3s
The affect of the PCB on the relay will differ depending on the
type of PCB used. Please verify the type of PCB to be used.
Preheat according to the following conditions.
Temperature
Time
4. Packing style
1) Tape dimensions
Max. 95
3.740
380±0.2 ±.008
14.961
±0.2
13 dia.
.512±.008 dia.
±0.5
2.0
.079±.020
−0
45.5+0.2
1.791+.008
−0
Max. 51.7
2.035
120°C 248°F or less
Within 2 minute
Soldering should be done at 260±5°C 500±9°F within 6 s.
2) In case of automatic soldering, the following conditions should
be observed (Surface-mount terminal)
(1) Position of measuring temperature
A
A: Surface of PC board where relay is mounted.
5. Conditions for operation, transport and storage
conditions
1) Ambient temperature, humidity, and atmospheric pressure
during usage, transport, and storage of the relay:
(1) Temperature:
–40 to +70°C –40 to +158°F
(2) Humidity: 5 to 85% RH
(Avoid freezing and condensation.)
The humidity range varies with the temperature. Use within the
range indicated in the graph below.
(3) Atmospheric pressure: 86 to 106 kPa Temperature and
humidity range for usage, transport, and storage:
(2) IR (infrared reflow) soldering method
Humidity, %R.H.
T3
T2
T1
t1
t2
T1=155 to 165°C
311 to 329°F
T2=180 to 200°C
356 to 392°F
T3=245°C max.
473°F max.
t1= within 120s
t2= within 30s
85
Tolerance range
(Avoid freezing
when used at
temperatures
lower than
0°C 32°F)
Temperature rise of relay itself may vary according to the
mounting level or the heating method of reflow equipment.
Therefore, please set the temperature of soldering portion of
relay terminal and the top surface of the relay case not to exceed
the above mentioned soldering condition.
It is recommended to check the temperature rise of each portion
under actual mounting condition before use.
–5–
5
–40
–40
(Avoid
condensation
when used at
temperatures
higher than
0°C 32°F)
0
+32
Temperature, °C °F
70
+158
2) Condensation
Condensation forms when there is a sudden change in
temperature under high temperature and high humidity
conditions. Condensation will cause deterioration of the relay
insulation.
3) Freezing
Condensation or other moisture may freeze on the relay when
the temperature is lower than 0°C 32°F. This causes problems
such as sticking of movable parts or operational time lags.
4) Low temperature, low humidity environments
The plastic becomes brittle if the relay is exposed to a low
temperature, low humidity environment for long periods of time.
ASCTB104E 201703-T
RE (ARE)
6. Measuring method
1) 50Ω type
2) 75Ω type
1
2
Network
Analyzer
B S Parameter
A Testset
R
HP 8753ES
RF
IN
2
PORT1
PORT1
Connect connectors 1 and 2 respectively to PORT1 and PORT2.
Perform calibration using the 3.5 mm .138 inch calibration kit
(50Ω).
No. Part number
1 HP 11857D
2 HP 11533A
1
2
HP 85047A
RF
OUT
2
Network
Analyzer
1
HP 8753C
1
PORT2
PORT2
B
A
R
Description
7mm .276inch Test port, Extension cable. (APC7 connector)
Adapter APC7-SMA (Male)
Connect connectors 1 and 2 respectively to PORT1 and PORT2.
Perform calibration using the 3.5 mm .138 inch calibration kit
(70Ω).
No. Part number
Description
1 HP 11857B
75ΩF Test port, Return cable
2 85039-60011 Adapter 75ΩN (Female) – 75ΩF (Male)
After calibration, connect the D.U.T board and measure.
After calibration, connect the D.U.T board and measure.
D.U.T board
Dimension (mm inch)
D.U.T board
Dimension (mm inch)
27.2
1.071
24
.945
16
.630
27.2
1.071
16.0
.630
15.3
.602
6.0
.236
15.3
.602
2.9
.114
0.9
.035
2.0
.079
0.9
.035
6.0
.236
2.0
.079
SMA connector to be soldered
24.0
.945
4.9
.193
SMA connector to be soldered
F connector to be soldered
F connector to be soldered
Material: Glass PTFE (Double sided, Through hole)
R-4737 (Panasonic Corporation)
Thickness: t = 0.8mm .031inch
Copper thickness: 18μm
Material: Glass PTFE (Double sided, Through hole)
R-4737 (Panasonic Corporation)
Thickness: t = 0.8mm .031inch
Copper thickness: 18μm
Connector (SMA)
Product name: R125 510 (RADIALL)
Connector (F)
Product name: C05-0236 (KOMINE MUSEN DENKI)
For general cautions for use, please refer to the “General
Application Guidelines”.
–6–
ASCTB104E 201703-T
