For board-to-FPC
Narrow pitch connectors
ADVANCED Series
0.4mm pitch
2.2 mm Ultra-slim body with the inherited high reliability
2011.07
panasonic-electric-works.net/ac
AXE1/AXE2
For board-to-FPC
Narrow pitch connectors
(0.4mm pitch)
A4US Series
FEATURES
1. Ultra-slim (Mated width: 2.2 mm and
Mated height: 0.8 mm, 1.0 mm and 1.5
mm)
The footprint when mated is down
approx. 12% from our existing A4S model
(50 contacts), contributing to the
functionality enhancement and size
reduction of target equipment.
New
3. “
”
structure adopted to ensure high
resistance to various environments in
spite of the ultra-slim space-saving
body.
Ni barrier
construction
Bellows contact
construction
(Tough against solder rise!)
(Tough against dropping!)
Soldering terminals
at the four corners
Socket
Header
Porosity treatment
Suction face: 0.6mm*
(Tough against
corrosive gases!)
ts)
c
nta
Compliance with RoHS Directive
.5
12
mm
2.
(50
co
V notch and Double contact constructions
Socket
2m
m
(Tough against foreign particles and flux!)
Soldering terminals
at the four corners
Suction face: 0.7mm*
)
cts
nta
o
0c
.8
11
1.
mm
(5
Header
8m
m
* Suction face size for the 1.0 mm/1.5 mm mated
height type: Socket — 0.64 mm, Header — 0.76 mm
2. Improving the degree of design
freedom
(Mated height of 0.8 mm, 1.0 mm, or
1.5 mm with the same foot pattern)
4. The simple lock structure for high
mating/unmating operation feel.
5. The contact at the four corners
enhance the mounting strength.
6. The gull-wing-shaped terminals
facilitate imaging inspections.
APPLICATIONS
• Particularly suitable for board-to-FPC
connections in ultra-compact mobile
equipment that requires size and
thickness reduction and functionality
enhancement
ORDERING INFORMATION
AXE
1
2
4
1: Socket
2: Header
Number of contacts (2 digits)
Mated height
1: 0.8 mm
2: 1.0 mm/1.5 mm
1: 0.8 mm
2: 1.0 mm
3: 1.5 mm
Functions
2: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
4: Base: Ni plating, Surface: Au plating (for Ni barrier available)
4: Base: Ni plating, Surface: Au plating
2
ACCTB4E 201107-T
AXE1/AXE2
PRODUCT TYPES
Mated height
Number of contacts
10
14
20
24
30
36
40
50
60
70
80
20
34
60
80
20
60
80
0.8mm
1.0mm
1.5mm
Part number
Socket
AXE110124
AXE114124
AXE120124
AXE124124
AXE130124
AXE136124
AXE140124
AXE150124
AXE160124
AXE170124
AXE180124
AXE120224
AXE134224
AXE160224
AXE180224
AXE120224
AXE160224
AXE180224
Packing
Header
AXE210124
AXE214124
AXE220124
AXE224124
AXE230124
AXE236124
AXE240124
AXE250124
AXE260124
AXE270124
AXE280124
AXE220224
AXE234224
AXE260224
AXE280224
AXE220324
AXE260324
AXE280324
Inner carton (1-reel)
Outer carton
5,000 pieces
10,000 pieces
Notes: 1. Order unit:
For mass production: in 1-inner carton (1-reel) units
Samples for mounting check: in 50-connector units. Please contact our sales office.
2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our
sales office.
3. Please contact us for connectors having a number of contacts other than those listed above.
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Specifications
0.30A/contact (Max. 5 A at total contacts)
60V AC/DC
Breakdown voltage
150V AC for 1 min.
Insulation resistance
Min. 1,000MΩ (initial)
Contact resistance
Max. 90mΩ
Composite insertion force
Composite removal force
Contact holding force
(Socket contact)
Ambient temperature
Max. 0.981N/contacts × contacts (initial)
Min. 0.165N/contacts × contacts
Soldering heat resistance
Storage temperature
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H2S resistance
(header and socket mated)
Lifetime
characteristics
Insertion and removal life
Unit weight
Conditions
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No freezing at low temperatures. No dew condensation.
Min. 0.20N/contacts
–55°C to +85°C
Peak temperature: 260°C or less (on the surface of
the PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Infrared reflow soldering
Soldering iron
No freezing at low temperatures. No dew condensation.
Sequence
1. –55 −30 °C, 30 minutes
2. ~ , Max. 5 minutes
3. 85 +30 °C, 30 minutes
4. ~ , Max. 5 minutes
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Bath temperature 35±2°C,
saltwater concentration 5±1%
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
120 hours, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
24 hours, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200 times/
30 times
hours
60 contacts Socket (h = 0.8mm: 0.03g, h = 1.0/1.5mm: 0.04g)
Header (h = 0.8mm: 0.01g, h = 1.0mm: 0.02g, h = 1.5mm: 0.03g)
48 hours, contact resistance max. 90mΩ
2. Material and surface treatment
Part name
Molded
portion
Contact and
Post
Material
LCP resin
(UL94V-0)
Copper alloy
ACCTB4E 201107-T
Surface treatment
—
Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating, Surface: Au plating (except the terminal tips)
3
AXE1/AXE2
DIMENSIONS (Unit: mm)
0.60 (Suction face)
Socket (Mated height: 0.8 mm)
Terminal coplanarity
A
B±0.1
0.40±0.05
0.15±0.03
0.77
0.08
1.90
(Contact and
soldering terminals)
Dimension table (mm)
(0.80)
Z (Note)
1.24
2.20
Y (Note)
0.30±0.03
C±0.1
General tolerance: ±0.2
Number of contacts/
dimension
10
4.5
1.6
3.6
14
20
24
30
36
40
50
60
70
80
5.3
6.5
7.3
8.5
9.7
10.5
12.5
14.5
16.5
18.5
2.4
3.6
4.4
5.6
6.8
7.6
9.6
11.6
13.6
15.6
4.4
5.6
6.4
7.6
8.8
9.6
11.6
13.6
15.6
17.6
B
C
A
B
C
Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically.
A
B±0.1
0.40±0.05
0.15±0.03
Terminal coplanarity
0.65
0.08
(Post and
soldering terminals)
X
1.28
0.70 (Suction face)
Header (Mated height: 0.8 mm)
Dimension table (mm)
Soldering terminals
0.15±0.03
C±0.1
(0.54)
(0.72)
1.80
(Soldering terminals portion)
X
Number of contacts/
dimension
10
3.8
1.6
3.2
14
20
24
30
36
40
50
60
70
80
4.6
5.8
6.6
7.8
9.0
9.8
11.8
13.8
15.8
17.8
2.4
3.6
4.4
5.6
6.8
7.6
9.6
11.6
13.6
15.6
4.0
5.2
6.0
7.2
8.4
9.2
11.2
13.2
15.2
17.2
A
General tolerance: ±0.2
4
ACCTB4E 201107-T
AXE1/AXE2
Terminal coplanarity
A
B±0.1
0.97
0.08
(Contact and
soldering terminals)
0.40±0.05
0.15±0.03
1.96
0.64
(Suction face)
Socket (Mated height: 1.0 mm and 1.5 mm)
(0.80)
Dimension table (mm)
Z (Note)
0.30±0.03
C±0.1
1.30
2.20
Y (Note)
General tolerance: ±0.2
Number of contacts/
dimension
20
A
B
C
6.5
3.6
5.6
34
60
80
9.3
14.5
18.5
6.4
11.6
15.6
8.4
13.6
17.6
B
C
Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically.
Terminal coplanarity
A
B±0.1
0.85
0.40±0.05
0.15±0.03
0.08
(Post and
soldering terminals)
Soldering terminals
0.15±0.03
C±0.1
(0.46)
1.36
(0.88)
1.80
(Soldering terminals portion)
0.76
(Suction face)
Header (Mated height: 1.0 mm)
Dimension table (mm)
General tolerance: ±0.2
Number of contacts/
dimension
20
5.8
3.6
5.2
34
60
80
8.6
13.8
17.8
6.4
11.6
15.6
8.0
13.2
17.2
B
C
A
A
B±0.1
Terminal coplanarity
1.35
0.40±0.05
0.15±0.03
0.08
(Post and
soldering terminals)
Soldering terminals
0.15±0.03
C±0.1
(0.46)
(0.88)
1.80
(Soldering terminals portion)
1.36
0.76
(Suction face)
Header (Mated height: 1.5 mm)
General tolerance: ±0.2
Dimension table (mm)
Number of contacts/
dimension
20
5.8
3.6
5.2
60
80
13.8
17.8
11.6
15.6
13.2
17.2
A
Socket
ACCTB4E 201107-T
Socket
Header
1.50±0.1
Header
1.00±0.1
Header
0.80±0.1
Socket and Header are mated
Socket
5
AXE1/AXE2
EMBOSSED TAPE DIMENSIONS (Unit: mm)
• Specifications for taping
(In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.)
Tape I
Tape II
(A +0.3
−0.1 )
(A±0.3)
(B)
(D±1)
(C)
(1.75)
380 dia.
(4.0)
Top cover tape
Embossed carrier tape
(2.0)
(2.0)
(4.0)
Leading direction after packaging
(C)
(1.75)
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Embossed mounting-hole
8.0
8.0
Taping reel
.1
+0 0
5
1.
.1
+0 0
5
1.
a.
di
a.
di
• Dimension table (Unit: mm)
Type/Mated height
Number of contacts
Type of taping
A
B
C
D
Quantity per reel
Common for sockets and headers:
0.8mm, 1.0mm and 1.5mm
Max. 24
30 to 70
80
Tape I
Tape I
Tape II
16.0
24.0
32.0
—
—
28.4
7.5
11.5
14.2
17.4
25.4
33.4
5,000
5,000
5,000
• Connector orientation with respect to embossed tape feeding direction
Type
Common for A4US
Direction
of tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
NOTES
2.20±0.03
0.90±0.03
0.23±0.03
(0.65)
0.50±0.03
0.40±0.03
(0.85)
2.20±0.03
1.60±0.03
(0.50)
0.40±0.03
0.23±0.03
0.20±0.03
Recommended PC board pattern (TOP VIEW)
1.04±0.03
Recommended PC board pattern (TOP VIEW)
(0.78)
• Header (Mated height: 0.8 mm, 1.0
mm and 1.5 mm)
2.60±0.03
• Socket (Mated height: 0.8 mm, 1.0
mm and 1.5 mm)
0.80±0.03
1.45±0.03
30
0.
C
0.28±0.03
: Insulatin area
0.80±0.03
2.07±0.01
(0.52)
0.40±0.01
0.20±0.01
1.03±0.01
(0.85)
0.50±0.01
2.20±0.01
2.50±0.01
1.70±0.01
0.40±0.01
0.20±0.01
(0.40)
Metal mask thickness: When 120µm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
(0.78)
Recommended metal mask opening pattern
Metal mask thickness: When 120µm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
1.04±0.01
Recommended metal mask opening pattern
2.60±0.01
1. Regarding the design of PC board
patterns
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
2. Recommended PC board and metal
mask patterns
Appropriate control of solder amount is
required to minimize solder bridges and
other defects for connectors with 0.35
mm, 0.4 mm or 0.5 mm pitch terminals,
which require high-density mounting.
Refer to the right-hand drawing for
recommended patterns.
3. See the common “NOTES FOR
USE” on the next page for other points
to be noted.
30
1.45±0.01
0.
C
0.80±0.01
0.28±0.01
0.80±0.01
6
ACCTB4E 201107-T
AXE1/AXE2
NOTES FOR USE
Terminal
Paste
solder
PC board
foot pattern
• Consult us when using a screen-printing
thickness other than that recommended.
• Depending on the size of the connector
being used, self alignment may not be
possible. Accordingly, carefully position
the terminal with the PC board pattern.
ACCTB4E 201107-T
• The recommended reflow temperature
profile is given in the figure below
Recommended reflow temperature profile
Upper limit (Soldering heat resistance)
Lower limit (Solder wettability)
Temperature
260°C
230°C
180°C
150°C
When cutting or bending the PC
board after mounting the connector,
be careful that the soldered sections
are subjected to excessive forces.
Do not the soldered areas to be subjected to forces
Peak temperature
Preheating
220°C
200°C
25 sec.
60 to 120 sec.
70 sec.
Time
• The temperature is measured on the
surface of the PC board near the
connector terminal.
• Some solder and flux types may cause
serious solder creeping. Take the solder
and flux characteristics into consideration
when setting the reflow soldering
conditions.
3) Reworking on a soldered portion
• Finish reworking in one operation.
• For reworking of the solder bridge, use
a soldering iron with a flat tip. Do not add
flux, otherwise, the flux may creep to the
contact parts.
• Use a soldering iron whose tip
temperature is within the temperature
range specified in the specifications.
Do not drop the product or handle it
carelessly. Otherwise, the terminals
may become deformed due to
excessive force or the solderability
during reflow soldering may degrade.
Do not insert or remove the
connector when it is not soldered.
Also, forcibly applied external
pressure on the terminals can weaken
the adherence of the terminals to the
molded part or cause the terminals to
lose their evenness.
Excessive prying-force applied to
one end may cause product breakage
and separation of the solder joints at
the terminal.
In particular, when removing the
connector, be sure not to tilt the
connector exceeding 15 degrees
widthwise. Excessive force applied for
insertion in a pivot action as shown
may also cause product breakage.
Align the header and socket positions
before connecting them.
Notes when using a FPC.
When the connector is soldered to an
FPC board, during its insertion and
removal procedures, forces may be
applied to the terminals and cause the
soldering to come off. It is recommended
to use a reinforcement board on the
backside of the FPC board to which the
connector is being connected. Make sure
that the reinforcing plate is larger than the
outline of the recommended PC board
pattern (Outline + approx. 1 mm). The
reinforcing plate is made of glass epoxy
or polyimide that is 0.2 to 0.3 mm thick.
This connector employs a simple locking
structure. However, the connector may
come off depending on the size and
weight of the FPC, layout and reaction
force of FPC, or by drop impact. Make
sure to fully check the equipment’s
condition. To prevent any problem with
loose connectors, adopt measures to
prevent the connector from coming off
inside the equipment.
Other Notes
When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
The connectors are not meant to be used
for switching.
When designing the target
equipment, please verify with the
latest product specifications.
15 degrees
or less
Connector mounting
When the working environment is dry, be
careful for static buildup.
The buildup of static electricity
occasionally causes the products to cling
to the taping material. To prevent static
buildup, it is recommended that you
maintain the relative humidity of your
working environment at 40 to 60%, while
eliminating static using an ionizer or other
means.
Soldering
1) Manual soldering.
• Due to the low profile, if an excessive
amount of solder is applied to this
product during manual soldering, the
solder may creep up to near the contact
points, or interference by solder may
cause imperfect contact.
• Make sure that the soldering iron tip is
heated within the temperature and time
limits indicated in the specifications.
• Flux from the solder wire may adhere to
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any flux before use.
• Be aware that a load applied to the
connector terminals while soldering may
displace the contact.
• Thoroughly clean the iron tip.
2) Reflow soldering
• Screen-printing is recommended for
printing paste solder.
• To determine the relationship between
the screen opening area and the PCboard foot pattern area, refer to the
diagrams in the recommended patterns
for PC boards and metal masks. Make
sure to use the terminal tip as a reference
position when setting.
Avoid an excessive amount of solder
from being applied, otherwise,
interference by the solder will cause an
imperfect contact.
7
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Mated
height
(mm)
Height: 3.0 to
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Width: 5.88 mm
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Height: 1.5 to 4.0 mm
Width: 5.1 mm
Height: 3.0 to 3.5 mm
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W
E
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You can specify the number of contacts.
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Head Office: 1048, Kadoma, Kadoma-shi, Osaka 571-8686, Japan
Telephone: +81-6-6908-1050
Facsimile: +81-6-6908-5781
All Rights Reserved © 2011 COPYRIGHT Panasonic Electric Works
Specifications are subject to change without notice.
Printed in Japan.
ACCTB4E 201107-3YT