AXE140124

For board-to-FPC Narrow pitch connectors ADVANCED Series 0.4mm pitch 2.2 mm Ultra-slim body with the inherited high reliability 2011.07 panasonic-electric-works.net/ac AXE1/AXE2 For board-to-FPC Narrow pitch connectors (0.4mm pitch) A4US Series FEATURES 1. Ultra-slim (Mated width: 2.2 mm and Mated height: 0.8 mm, 1.0 mm and 1.5 mm) The footprint when mated is down approx. 12% from our existing A4S model (50 contacts), contributing to the functionality enhancement and size reduction of target equipment. New 3. “ ” structure adopted to ensure high resistance to various environments in spite of the ultra-slim space-saving body. Ni barrier construction Bellows contact construction (Tough against solder rise!) (Tough against dropping!) Soldering terminals at the four corners Socket Header Porosity treatment Suction face: 0.6mm* (Tough against corrosive gases!) ts) c nta Compliance with RoHS Directive .5 12 mm 2. (50 co V notch and Double contact constructions Socket 2m m (Tough against foreign particles and flux!) Soldering terminals at the four corners Suction face: 0.7mm* ) cts nta o 0c .8 11 1. mm (5 Header 8m m * Suction face size for the 1.0 mm/1.5 mm mated height type: Socket — 0.64 mm, Header — 0.76 mm 2. Improving the degree of design freedom (Mated height of 0.8 mm, 1.0 mm, or 1.5 mm with the same foot pattern) 4. The simple lock structure for high mating/unmating operation feel. 5. The contact at the four corners enhance the mounting strength. 6. The gull-wing-shaped terminals facilitate imaging inspections. APPLICATIONS • Particularly suitable for board-to-FPC connections in ultra-compact mobile equipment that requires size and thickness reduction and functionality enhancement ORDERING INFORMATION AXE 1 2 4 1: Socket 2: Header Number of contacts (2 digits) Mated height 1: 0.8 mm 2: 1.0 mm/1.5 mm 1: 0.8 mm 2: 1.0 mm 3: 1.5 mm Functions 2: Without positioning bosses Surface treatment (Contact portion / Terminal portion) 4: Base: Ni plating, Surface: Au plating (for Ni barrier available) 4: Base: Ni plating, Surface: Au plating 2 ACCTB4E 201107-T AXE1/AXE2 PRODUCT TYPES Mated height Number of contacts 10 14 20 24 30 36 40 50 60 70 80 20 34 60 80 20 60 80 0.8mm 1.0mm 1.5mm Part number Socket AXE110124 AXE114124 AXE120124 AXE124124 AXE130124 AXE136124 AXE140124 AXE150124 AXE160124 AXE170124 AXE180124 AXE120224 AXE134224 AXE160224 AXE180224 AXE120224 AXE160224 AXE180224 Packing Header AXE210124 AXE214124 AXE220124 AXE224124 AXE230124 AXE236124 AXE240124 AXE250124 AXE260124 AXE270124 AXE280124 AXE220224 AXE234224 AXE260224 AXE280224 AXE220324 AXE260324 AXE280324 Inner carton (1-reel) Outer carton 5,000 pieces 10,000 pieces Notes: 1. Order unit: For mass production: in 1-inner carton (1-reel) units Samples for mounting check: in 50-connector units. Please contact our sales office. 2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our sales office. 3. Please contact us for connectors having a number of contacts other than those listed above. SPECIFICATIONS 1. Characteristics Electrical characteristics Mechanical characteristics Item Rated current Rated voltage Specifications 0.30A/contact (Max. 5 A at total contacts) 60V AC/DC Breakdown voltage 150V AC for 1 min. Insulation resistance Min. 1,000MΩ (initial) Contact resistance Max. 90mΩ Composite insertion force Composite removal force Contact holding force (Socket contact) Ambient temperature Max. 0.981N/contacts × contacts (initial) Min. 0.165N/contacts × contacts Soldering heat resistance Storage temperature Environmental characteristics Thermal shock resistance (header and socket mated) Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) H2S resistance (header and socket mated) Lifetime characteristics Insertion and removal life Unit weight Conditions No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute. Using 250V DC megger (applied for 1 min.) Based on the contact resistance measurement method specified by JIS C 5402. Measuring the maximum force. As the contact is axially pull out. No freezing at low temperatures. No dew condensation. Min. 0.20N/contacts –55°C to +85°C Peak temperature: 260°C or less (on the surface of the PC board around the connector terminals) 300°C within 5 sec. 350°C within 3 sec. –55°C to +85°C (product only) –40°C to +50°C (emboss packing) Infrared reflow soldering Soldering iron No freezing at low temperatures. No dew condensation. Sequence 1. –55 −30 °C, 30 minutes 2. ~ , Max. 5 minutes 3. 85 +30 °C, 30 minutes 4. ~ , Max. 5 minutes Bath temperature 40±2°C, humidity 90 to 95% R.H. Bath temperature 35±2°C, saltwater concentration 5±1% 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ Bath temperature 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. Repeated insertion and removal speed of max. 200 times/ 30 times hours 60 contacts Socket (h = 0.8mm: 0.03g, h = 1.0/1.5mm: 0.04g) Header (h = 0.8mm: 0.01g, h = 1.0mm: 0.02g, h = 1.5mm: 0.03g) 48 hours, contact resistance max. 90mΩ 2. Material and surface treatment Part name Molded portion Contact and Post Material LCP resin (UL94V-0) Copper alloy ACCTB4E 201107-T Surface treatment — Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips) Headers: Base: Ni plating, Surface: Au plating (except the terminal tips) 3 AXE1/AXE2 DIMENSIONS (Unit: mm) 0.60 (Suction face) Socket (Mated height: 0.8 mm) Terminal coplanarity A B±0.1 0.40±0.05 0.15±0.03 0.77 0.08 1.90 (Contact and soldering terminals) Dimension table (mm) (0.80) Z (Note) 1.24 2.20 Y (Note) 0.30±0.03 C±0.1 General tolerance: ±0.2 Number of contacts/ dimension 10 4.5 1.6 3.6 14 20 24 30 36 40 50 60 70 80 5.3 6.5 7.3 8.5 9.7 10.5 12.5 14.5 16.5 18.5 2.4 3.6 4.4 5.6 6.8 7.6 9.6 11.6 13.6 15.6 4.4 5.6 6.4 7.6 8.8 9.6 11.6 13.6 15.6 17.6 B C A B C Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically. A B±0.1 0.40±0.05 0.15±0.03 Terminal coplanarity 0.65 0.08 (Post and soldering terminals) X 1.28 0.70 (Suction face) Header (Mated height: 0.8 mm) Dimension table (mm) Soldering terminals 0.15±0.03 C±0.1 (0.54) (0.72) 1.80 (Soldering terminals portion) X Number of contacts/ dimension 10 3.8 1.6 3.2 14 20 24 30 36 40 50 60 70 80 4.6 5.8 6.6 7.8 9.0 9.8 11.8 13.8 15.8 17.8 2.4 3.6 4.4 5.6 6.8 7.6 9.6 11.6 13.6 15.6 4.0 5.2 6.0 7.2 8.4 9.2 11.2 13.2 15.2 17.2 A General tolerance: ±0.2 4 ACCTB4E 201107-T AXE1/AXE2 Terminal coplanarity A B±0.1 0.97 0.08 (Contact and soldering terminals) 0.40±0.05 0.15±0.03 1.96 0.64 (Suction face) Socket (Mated height: 1.0 mm and 1.5 mm) (0.80) Dimension table (mm) Z (Note) 0.30±0.03 C±0.1 1.30 2.20 Y (Note) General tolerance: ±0.2 Number of contacts/ dimension 20 A B C 6.5 3.6 5.6 34 60 80 9.3 14.5 18.5 6.4 11.6 15.6 8.4 13.6 17.6 B C Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically. Terminal coplanarity A B±0.1 0.85 0.40±0.05 0.15±0.03 0.08 (Post and soldering terminals) Soldering terminals 0.15±0.03 C±0.1 (0.46) 1.36 (0.88) 1.80 (Soldering terminals portion) 0.76 (Suction face) Header (Mated height: 1.0 mm) Dimension table (mm) General tolerance: ±0.2 Number of contacts/ dimension 20 5.8 3.6 5.2 34 60 80 8.6 13.8 17.8 6.4 11.6 15.6 8.0 13.2 17.2 B C A A B±0.1 Terminal coplanarity 1.35 0.40±0.05 0.15±0.03 0.08 (Post and soldering terminals) Soldering terminals 0.15±0.03 C±0.1 (0.46) (0.88) 1.80 (Soldering terminals portion) 1.36 0.76 (Suction face) Header (Mated height: 1.5 mm) General tolerance: ±0.2 Dimension table (mm) Number of contacts/ dimension 20 5.8 3.6 5.2 60 80 13.8 17.8 11.6 15.6 13.2 17.2 A Socket ACCTB4E 201107-T Socket Header 1.50±0.1 Header 1.00±0.1 Header 0.80±0.1 Socket and Header are mated Socket 5 AXE1/AXE2 EMBOSSED TAPE DIMENSIONS (Unit: mm) • Specifications for taping (In accordance with JIS C 0806-3:1999. However, not applied to the mounting-hole pitch of some connectors.) Tape I Tape II (A +0.3 −0.1 ) (A±0.3) (B) (D±1) (C) (1.75) 380 dia. (4.0) Top cover tape Embossed carrier tape (2.0) (2.0) (4.0) Leading direction after packaging (C) (1.75) • Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) Embossed mounting-hole 8.0 8.0 Taping reel .1 +0 0 5 1. .1 +0 0 5 1. a. di a. di • Dimension table (Unit: mm) Type/Mated height Number of contacts Type of taping A B C D Quantity per reel Common for sockets and headers: 0.8mm, 1.0mm and 1.5mm Max. 24 30 to 70 80 Tape I Tape I Tape II 16.0 24.0 32.0 — — 28.4 7.5 11.5 14.2 17.4 25.4 33.4 5,000 5,000 5,000 • Connector orientation with respect to embossed tape feeding direction Type Common for A4US Direction of tape progress Socket Header Note: There is no indication on this product regarding top-bottom or left-right orientation. NOTES 2.20±0.03 0.90±0.03 0.23±0.03 (0.65) 0.50±0.03 0.40±0.03 (0.85) 2.20±0.03 1.60±0.03 (0.50) 0.40±0.03 0.23±0.03 0.20±0.03 Recommended PC board pattern (TOP VIEW) 1.04±0.03 Recommended PC board pattern (TOP VIEW) (0.78) • Header (Mated height: 0.8 mm, 1.0 mm and 1.5 mm) 2.60±0.03 • Socket (Mated height: 0.8 mm, 1.0 mm and 1.5 mm) 0.80±0.03 1.45±0.03 30 0. C 0.28±0.03 : Insulatin area 0.80±0.03 2.07±0.01 (0.52) 0.40±0.01 0.20±0.01 1.03±0.01 (0.85) 0.50±0.01 2.20±0.01 2.50±0.01 1.70±0.01 0.40±0.01 0.20±0.01 (0.40) Metal mask thickness: When 120µm (Terminal opening ratio: 70%) (Metal-part opening ratio: 100%) (0.78) Recommended metal mask opening pattern Metal mask thickness: When 120µm (Terminal opening ratio: 70%) (Metal-part opening ratio: 100%) 1.04±0.01 Recommended metal mask opening pattern 2.60±0.01 1. Regarding the design of PC board patterns Conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas. 2. Recommended PC board and metal mask patterns Appropriate control of solder amount is required to minimize solder bridges and other defects for connectors with 0.35 mm, 0.4 mm or 0.5 mm pitch terminals, which require high-density mounting. Refer to the right-hand drawing for recommended patterns. 3. See the common “NOTES FOR USE” on the next page for other points to be noted. 30 1.45±0.01 0. C 0.80±0.01 0.28±0.01 0.80±0.01 6 ACCTB4E 201107-T AXE1/AXE2 NOTES FOR USE Terminal Paste solder PC board foot pattern • Consult us when using a screen-printing thickness other than that recommended. • Depending on the size of the connector being used, self alignment may not be possible. Accordingly, carefully position the terminal with the PC board pattern. ACCTB4E 201107-T • The recommended reflow temperature profile is given in the figure below Recommended reflow temperature profile Upper limit (Soldering heat resistance) Lower limit (Solder wettability) Temperature 260°C 230°C 180°C 150°C
When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive forces. Do not the soldered areas to be subjected to forces Peak temperature Preheating 220°C 200°C 25 sec. 60 to 120 sec. 70 sec. Time • The temperature is measured on the surface of the PC board near the connector terminal. • Some solder and flux types may cause serious solder creeping. Take the solder and flux characteristics into consideration when setting the reflow soldering conditions. 3) Reworking on a soldered portion • Finish reworking in one operation. • For reworking of the solder bridge, use a soldering iron with a flat tip. Do not add flux, otherwise, the flux may creep to the contact parts. • Use a soldering iron whose tip temperature is within the temperature range specified in the specifications.
Do not drop the product or handle it carelessly. Otherwise, the terminals may become deformed due to excessive force or the solderability during reflow soldering may degrade.
Do not insert or remove the connector when it is not soldered. Also, forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness.
Excessive prying-force applied to one end may cause product breakage and separation of the solder joints at the terminal. In particular, when removing the connector, be sure not to tilt the connector exceeding 15 degrees widthwise. Excessive force applied for insertion in a pivot action as shown may also cause product breakage. Align the header and socket positions before connecting them.
Notes when using a FPC. When the connector is soldered to an FPC board, during its insertion and removal procedures, forces may be applied to the terminals and cause the soldering to come off. It is recommended to use a reinforcement board on the backside of the FPC board to which the connector is being connected. Make sure that the reinforcing plate is larger than the outline of the recommended PC board pattern (Outline + approx. 1 mm). The reinforcing plate is made of glass epoxy or polyimide that is 0.2 to 0.3 mm thick. This connector employs a simple locking structure. However, the connector may come off depending on the size and weight of the FPC, layout and reaction force of FPC, or by drop impact. Make sure to fully check the equipment’s condition. To prevent any problem with loose connectors, adopt measures to prevent the connector from coming off inside the equipment.
Other Notes When coating the PC board after soldering the connector to prevent the deterioration of insulation, perform the coating in such a way so that the coating does not get on the connector. The connectors are not meant to be used for switching. When designing the target equipment, please verify with the latest product specifications. 15 degrees or less
Connector mounting When the working environment is dry, be careful for static buildup. The buildup of static electricity occasionally causes the products to cling to the taping material. To prevent static buildup, it is recommended that you maintain the relative humidity of your working environment at 40 to 60%, while eliminating static using an ionizer or other means.
Soldering 1) Manual soldering. • Due to the low profile, if an excessive amount of solder is applied to this product during manual soldering, the solder may creep up to near the contact points, or interference by solder may cause imperfect contact. • Make sure that the soldering iron tip is heated within the temperature and time limits indicated in the specifications. • Flux from the solder wire may adhere to the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any flux before use. • Be aware that a load applied to the connector terminals while soldering may displace the contact. • Thoroughly clean the iron tip. 2) Reflow soldering • Screen-printing is recommended for printing paste solder. • To determine the relationship between the screen opening area and the PCboard foot pattern area, refer to the diagrams in the recommended patterns for PC boards and metal masks. Make sure to use the terminal tip as a reference position when setting. Avoid an excessive amount of solder from being applied, otherwise, interference by the solder will cause an imperfect contact. 7 For the detailed specifications of each product, access our website now! Narrow-pitch Connector Lineup Narrow-pitch Connector Search For Board-to-Board Mated height (mm) Height: 3.0 to 14.0 mm Width: 5.88 mm Lower profile Height: 4.0 to 9.0 mm Width: 5.4 mm For Board-to-FPC/For Board-to-Board Height: 1.5 to 4.0 mm Width: 5.1 mm Height: 3.0 to 3.5 mm Width: 5.8 mm Height: 1.5 to 3.0 mm Width: 3.6 mm Height: 1.5 to 2.5 mm Width: 5.8 mm Height: 1.5 mm Width: 3.6 mm Height: 1.2 mm Width: 5.8 mm Height: 0.8 to 1.5 mm Width: 2.2 mm Height: 1.0 mm Width: 3.4 mm Height: 0.8 mm Width: 2.5 mm Height: 1.0 to 1.2 mm Width: 3.6 mm Height: 0.8 to 1.0 mm Width: 2.5 mm Height: 0.9 mm Width: 5.0 mm Height: 0.6 mm Width: 3.0 mm For Board-to-FPC Pitch (mm) Narrower terminal pitch Introduction of Our Website for Dimension Search  Connector Dimensions Search Search 3D and 2D CAD data ! are also downloadable. now rch Sea ss now! Acce Screen image and Explanation Q Connector Type You can select “Socket and header are mated”, “Socket”, or “Head”. W Pitch (mm) You can specify the terminal pitch. Q W E E No. of contacts You can specify the number of contacts. R R Dimension criteria (required) You can search by specifying criteria for one or more of the dimensions, which are the “Mated height”, “Width”, and “Length”. T Search results T All connectors that meet the dimension criteria you entered will be listed. * The result list can be sorted by a dimension, part number, or other criteria. * You can add search criteria to narrow down the results. * The above image shows a sample screen when mated connectors are selected.       
  
  Head Office: 1048, Kadoma, Kadoma-shi, Osaka 571-8686, Japan Telephone: +81-6-6908-1050 Facsimile: +81-6-6908-5781    All Rights Reserved © 2011 COPYRIGHT Panasonic Electric Works Specifications are subject to change without notice. Printed in Japan. ACCTB4E 201107-3YT