For board-to-FPC
Stacking Connector
for High Current
B01
FEATURES
New
1. High current rating: 6.0 A (3.0 A/pin
× 2 pin)
2.4
6A
6A
3.0A
3.0A
1.8
0m
APPLICATIONS
0m
m
Socket
m
3. High removal force
4. Helps make mobile devices thinner
thanks to its low profile height of
0.6 mm/0.8 mm.
Header
Battery section of miniature mobile
devices such as smartphones,
wearable terminals and tablet PCs
RoHS compliant
3.0A
3.0A
2. Miniature and low space
requirement
Socket
m
5m
4.4
2.4
0m
m
Header
m
6m
3.7
1.8
0m
m
ORDERING INFORMATION
AXF
6
5
0
0
3: Socket
4: Header
Number of contacts (1 digit)
6: 6 contacts (Power contact and signal contact)
Stacking height
/
1: 0.6 mm
3: 0.8 mm
Current capacity
5: 3.0 A/Power pin
Function
0: No polarity
–1–
ACCTB71E 201412-T
Stacking connector for high current B01
PRODUCT TYPES
Stacking height
Number of contacts
0.6mm
0.8mm
6
6
Part number
Socket
AXF361500
AXF363500
Packing
Header
AXF461500
AXF463500
Inner carton (1-reel)
15,000 pieces
15,000 pieces
Outer carton
30,000 pieces
30,000 pieces
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
Item
Specifications
Rated voltage
Insulation resistance
3.0 A/pin (Power contact)
0.3 A/pin (Signal contact)
30V AC/DC
Min. 1,000MΩ (Initial stage)
Breakdown voltage
150V AC for 1 minute
Rated current
Electrical
characteristics
Contact resistance
Mechanical
characteristics
Composite insertion force
Composite removal force
Ambient temperature
Storage temperature
Conditions
Using 250V DC megger (applied for 1 minute)
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
According to the contact resistance measurement method of
JIS C 5402
Power contact: Max. 20mΩ
Signal contact: Max. 90mΩ
Max. 40 N
Min. 10 N (H: 0.6, Initial stage)
–55°C to +85°C
No freezing at low temperatures or condensation
–55°C to +85°C (Products only)
–40°C to +50°C (Packaging structure)
No freezing at low temperatures or condensation
Conformed to MIL-STD-202F, method 107G
Thermal shock resistance
(Header and socket mated)
Environmental
characteristics
Humidity resistance
(Header and socket mated)
Salt water spray resistance
(Header and socket mated)
H2S resistance
(Header and socket mated)
Life characteristics
Insertion and removal life
with no load
After 5 cycles
Insulation resistance: Min. 100MΩ,
Contact resistance
Power contact: Max. 20mΩ
Signal contact: Max. 90mΩ
After 120 hours
Insulation resistance: Min. 100MΩ,
Contact resistance
Power contact: Max. 20mΩ
Signal contact: Max. 90mΩ
After 24 hours
Insulation resistance: Min. 100MΩ,
Contact resistance
Power contact: Max. 20mΩ
Signal contact: Max. 90mΩ
After 48 hours
Contact resistance
Power contact: Max. 20mΩ
Signal contact: Max. 90mΩ
30 times
• Contact resistance
Power contact: Max. 20mΩ
Signal contact: Max. 90mΩ
• Composite removal force: Min. 7 N
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to IEC60068-2-78
Bath temperature 40±2°C,
Humidity 90 to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35±2°C,
Salt water concentration 5±1%
Conformed to JEIDA-38-1984
Bath temperature 40±2°C, Gas concentration 3±1 ppm,
Humidity 75 to 80% R.H.
Repeated insertion and removal cycles of max. 200 times/
hour
Max. peak temperature of 260°C
Infrared reflow soldering (PC board surface temperature
near connector terminals)
The initial specification must be satisfied electrically
and mechanically
Soldering iron
300°C within 5 sec.
350°C within 3 sec.
6 pins Socket h = 0.6 mm: 0.010 g h = 0.8 mm: 0.013 g
6 pins Header h = 0.6 mm: 0.004 g h = 0.8 mm: 0.005 g
Soldering heat resistance
Unit weight
2. Material and surface treatment
Part name
Material
Surface treatment
Molded portion
Heat resistant plastic (LCP resin)
(UL94V-0)
—
Contact and Post
Copper alloy
Contact portion (Main): Au plating (Min. 0.1μm) over nickel
Contact portion (Sub): Au plating (Min. 0. 05μm) over nickel
Terminal portion: Au plating over nickel (except for top of the terminal)
Soldering terminals (Socket): Pd + Au flash plating over nickel (except for top of the terminal)
Soldering terminals (Header): Au plating over nickel (except for top of the terminal)
–2–
ACCTB71E 201412-T
Stacking connector for high current B01
DIMENSIONS (Unit: mm)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Socket (Mated height: 0.6 mm and 0.8 mm)
CAD Data
0.50 (Suction face)
A
B±0.1
0.14±0.03
0.58±0.03
The degree of terminal flat
E
0.08
2.16
(Contact and soldering terminals)
C±0.1
D±0.1
0.86
2.40
0.18±0.03
0.20±0.03
Y (Note 1)
Z (Note 1)
Signal contact (2 pins)
Mated height/
dimension
0.6mm
0.59
0.8mm
0.79
E
Dimension table (mm)
Number of pins/
dimension
6
A
B
C
D
4.45
1.60
3.85
3.12
A
B
C
3.76
1.60
3.26
Power contact (4 pins)
General tolerance: ±0.2
Note: 1. Because the soldering terminal Y and Z are the unified structure, they are connected electrically.
Header (Mated height: 0.6 mm and 0.8 mm)
0.70 (Suction face)
CAD Data
A
B±0.1
0.14±0.03
0.70±0.03
The degree of terminal flat
D
0.08
(Post and soldering terminals)
Signal contact (2 pins)
Power contact (4 pins)
(0.34)
0.88
1.51
(Soldering
terminal)
C±0.1
0.20±0.03
Mated height/
dimension
0.6mm
0.47
0.8mm
0.65
D
Dimension table (mm)
Number of pins/
dimension
6
General tolerance: ±0.2
Socket
Header
0.80±0.1
Header
0.60±0.1
Socket and Header are mated
Socket
–3–
ACCTB71E 201412-T
Stacking connector for high current B01
EMBOSSED TAPE DIMENSIONS (Unit: mm)
• Specifications for taping
(In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.)
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Tape I
(A +0.3
−0.1 )
(C±1)
Label
Top cover tape
380 dia.
(4.0)
Leading direction after packaging
(B)
(1.75)
Embossed carrier tape
(2.0)
Embossed mounting-hole
4.0
Taping reel
1.
5
+0
0 .1
di
a.
• Dimension table (Unit: mm)
Type/Mated height
Common for socket and headers
0.6mm and 0.8mm
Number of pins
Type of taping
A
B
C
Quantity per reel
6
Tape I
16.0
7.5
17.4
15,000
• Connector orientation with respect to embossed tape feeding direction
Type
Common for B01
Direction
of tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
–4–
ACCTB71E 201412-T
Stacking connector for high current B01
NOTES
1. Design of PC board patterns
Conduct the recommended foot pattern design, in order to
preserve the mechanical strength of terminal solder areas.
2. Recommended PC board and metal mask patterns
In order to reduce solder and flux rise, solder bridges and other
issues make sure the proper levels of solder is used.
The figures to the right are recommended metal mask patterns.
Please use them as a reference.
• Socket (Mated height: 0.6 mm and 0.8 mm)
• Header (Mated height: 0.6 mm and 0.8 mm)
Recommended PC board pattern (TOP VIEW)
3.30±0.03
1.60±0.03
2.20±0.03
: Insulation area
: Insulation area
0.80±0.03
1.08±0.03
2.80±0.03
1.71±0.03
0.74±0.03
0.20±0.03
0.22±0.03
0.78±0.03
0.32±0.03
1.70±0.03
2.80±0.03
1.70±0.03
0.70±0.03
0.22±0.03
0.66±0.03
0.20±0.03
3.56±0.03
1.60±0.03
Recommended PC board pattern (TOP VIEW)
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Power contact opening ratio: 88%)
(Signal contact opening ratio: 83%)
(Metal-part opening ratio: 100%)
Metal mask thickness: When 100μm
(Power contact opening ratio: 73%)
(Signal contact opening ratio: 75%)
(Metal-part opening ratio: 100%)
1.80±0.03
1.80±0.03
2.20±0.03
0.20±0.03
0.76±0.03
1.28±0.03
1.36±0.03
0.32±0.03
2.80±0.03
2.80±0.03
1.70±0.03
0.70±0.03
3.30±0.03
1.60±0.03
0.20±0.03
0.64±0.03
1.71±0.03
0.74±0.03
3.56±0.03
1.60±0.03
Please refer to the latest product
specifications when designing your
product.
–5–
ACCTB71E 201412-T
Notes on Using Narrow pitch Connectors/Stacking Connectors for High Current
Notes on Using Narrow pitch Connectors/
Stacking Connectors for High Current
About safety remarks
1) Do not use these connectors beyond
the specified ranges. The use of the
product out of the specified rated current
and breakdown voltage ranges may
cause abnormal heating, smoke, and fire.
2) In order to avoid accidents, make sure
you have thoroughly reviewed the
specifications and the operation manual
before use. Consult us if you plan to use
the product in a way not covered by the
specifications. Otherwise, the quality
cannot be guaranteed.
3) We are consistently striving to improve
quality and reliability. However, the fact
remains that electrical components and
devices generally cause failures at a
given statistical probability. Furthermore,
their durability varies with use
environments or use conditions. In this
respect, we ask you to check for actual
electrical components and devices under
actual conditions before use without fail.
Continuously using them in a state of
degraded performance may cause
deterioration in insulation performance,
thus resulting in abnormal heat
generation, smoke generation, or firing.
To avoid that, we ask you to carry out
safety design including redundancy
design, design for fire spread prevention,
and design for malfunction prevention as
well as periodic maintenance so that no
accidents resulting in injury or death, fire
accidents, or social damage will be
caused as a result of our product failure
or service life.
Regarding the design of devices and PC board patterns
■ Restriction on the quantity of
connector
1) When using the board to board
connectors, do not connect a pair of
board with multiple connectors.
Otherwise, misaligned connector
positions may cause mating failure or
product breakage.
2) With mounting equipment, there may
be up to a ±0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
5) PC board or FPC board specifications
Control the thicknesses of the coverlay
and adhesive to prevent poor soldering.
This connector has no stand-off.
Therefore, minimize the thickness of the
coverlay, etc. so as to prevent the
occurrence of poor soldering.
6) For all connectors of the narrow pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
Example) Secure in place with screws
Screw
Spacer
Connector
PC board
Spacer
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
7) Notes when using a FPC.
• Due to its flexibility, a FPC board may
make the connector terminal soldering
connection weak.
In order to strengthen the connection and
prevent the peeling off of terminal
soldering, a stiffener is strongly
recommended to be attached to the
backside of the connector area.
The size of stiffener should be bigger
than the recommended PC board pattern
area shown in the drawing. (Outward
dimension + approximate 0.5 to 1.0 mm)
Recommended material of reinforcement
is Glass-Fiber board, Polyimide board
(0.2 to 0.3 mm thickness) or SUS (0.1 to
0.2 mm thickness).
• However, connecter would be taken off
due to size, weight or bending force of
FPC at dropping condition.
Please check the connector not to be
taken off at real equipment.
In order to secure connector’s connection
even when a shock applied, please take
measures against taking off of the
connector.
8) The narrow pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
Regarding the selection of the connector placement machine and the mounting
procedures
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the catching force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
4) Depending on the size of the
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
–6–
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
6) Excessive mounter chucking force may
deform the molded or metal part of the
connector. Consult us in advance if
chucking is to be applied.
ACCTB48E 201412-T
Notes on Using Narrow pitch Connectors/Stacking Connectors for High Current
Regarding soldering
Terminal
8) Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
• Narrow pitch connectors
(except P8 type)
Upper limited (Solder heat resistance)
Lower limited (Solder wettability)
Temperature
Peak temperature
Peak temperature 260°C
230°C
25 sec.
60 to 120 sec.
• Narrow pitch connector (P8)
Table A
Product name
Soldering iron temperature
SMD type connectors
300°C within 5 sec.
350°C within 3 sec.
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
Temperature
Apply the solder
wire here
Peak temperature
245°C max.
200°C
155 to 165°C
Preheating
Terminal
Paste
solder
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) The condition of solder or flux rise and
wettability varies depending on the type
of solder and flux. Solder and flux
characteristics should be taken into
consideration and also set the reflow
temperature and oxygen level.
7) Do not use resin-containing solder.
Otherwise, the contacts might be firmly
fixed.
70 sec.
Time
60 to 120 sec.
PC board
foot pattern
220°C
200°C
Preheating
180°C
150°C
■ Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
So
ld
iro erin
n g
■ Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals. (The
setting for the sensor will differ depending
on the sensor used, so be sure to
carefully read the instructions that comes
with it.)
2) As for cream solder printing, screen
printing is recommended.
3) When setting the screen opening area
and PC board foot pattern area, refer the
recommended PC board pattern and
window size of metal mask on the
specification sheet, and make sure that
the size of board pattern and metal mask
at the base of the terminals are not
increased.
4) Consult us when using a screenprinting thickness other than that
recommended.
Small angle as
possible up to
45 degrees
Within 30 sec.
Time
For products other than the ones above,
please refer to the latest product
specifications.
9) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector beforehand
and then begin mounting.
10) Consult us when using a screenprinting thickness other than that
recommended.
PC board
Pattern
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) These connector is low profile type. If
too much solder is supplied for hand
soldering, It makes miss mating because
of interference at soldering portion.
Please pay attentions.
■ Solder reworking
1) Finish reworking in one operation.
2) In case of soldering rework of bridges.
Don’t use supplementary solder flux.
Doing so may cause contact problems by
flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
Handling Single Components
1) Make sure not to drop or allow parts to
fall from work bench. Excessive force
applied to the terminals could cause
warping, come out, or weaken the
adhesive strength of the solder. Handle
with care.
2) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
–7–
ACCTB48E 201412-T
Notes on Using Narrow pitch Connectors/Stacking Connectors for High Current
Precautions for mating
This product is designed with ease of
handling. However, in order to prevent the
deformation or damage of contacts and
molding, take care and do not mate the
connectors as shown below.
Press-fitting while the mating
inlets of the socket and
header are not matched.
Strongly pressed and twisted
Tilted mating
Cleaning flux from PC board
1) There is no need to clean this product.
If cleaning it, pay attention to the
following points to prevent the negative
effect to the product
2) Keep the cleaning solvent clean and
prevent the connector contacts from
contamination.
3) Some cleaning solvents are strong and
they may dissolve the molded part and
characters, so pure water passed liquid
solvent is recommended
Handling the PC board
■ Handling the PC board after
mounting the connector
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
The soldered areas should not be subjected to force.
Storage of connectors
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage. This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
5) There may be variations in the colors
of products from different production lots.
This is normal.
6) The connectors are not meant to be
used for switching.
7) Precautions for usage environment
and storage environment.
8) Product failures due to condensation
are not covered by warranty.
Other Notes
1) Do not remove or insert the electrified
connector (in the state of carrying current
or applying voltage).
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
–8–
ACCTB48E 201412-T
Notes on Using Narrow pitch Connectors/Stacking Connectors for High Current
Regarding sample orders to confirm proper mounting
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Please refer to the latest product
specifications when designing your
product.
Condition when delivered from manufacturing
Reel
Embossed tape
amount required for
the mounting
Required number
of products for
sample production
(Delivery can also be made on a reel by
customer request.)
(Unit 50 pcs.)
–9–
ACCTB48E 201412-T
