High Current Connectors
【For board-to-FPC】
A35UH
( 0.35 mm pitch) )
Product Catalog
2022.4
High Current Connectors For board-to-FPC
A35UH
(0.35 mm pitch)
Supports 5 A for power terminal. Reduce number of pins is available.
FEATURES
Supports 5 A for power terminals
With power terminal, so number of pins can be
reduced
“TOUGH CONTACT” construction provides high
resistance to various environmental.
2.2mm
Socket
1.8mm
Header
TYPICAL APPLICATIONS
Smartphones, tablet PCs and other mobile devices
DETAILS FEATURES
AX. 5 A can be supplied to the power terminals. This allows for a reduction in the number of power line and
M
contributes to space savings
Power terminals
Specification:
5 A in two locations
Example; Charging current: Max. 5 A (0.3 A/pin, Pitch: 0.35 mm)
S35
34 pins signal terminals used
Socket
5.95mm
2.2mm
5 A power terminals
A35UH
Header
Space saving
34 pins signal terminals can
be reduced
1.8mm
‒5.95mm
ORDERING INFORMATION (PART NO.)
AXF
1 2
5D: Socket
6D: Header
Number
of pins
(2 digits)
Mated height
(Socket/Header)
1: 0.6 mm
(Socket/Header)
2: (Fixed)
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Panasonic Industry Co., Ltd. 2022
ACCTB100E 202204
High Current Connectors A35UH (0.35 mm pitch)
PRODUCT TYPES
Mated height
Number of pins
0.6 mm
Part No.
Standard packing
Socket
Header
10
AXF5D1012
AXF6D1012
12
AXF5D1212
AXF6D1212
16
AXF5D1612
AXF6D1612
20
AXF5D2012
AXF6D2012
24
AXF5D2412
AXF6D2412
30
AXF5D3012
AXF6D3012
34
AXF5D3412
AXF6D3412
40
AXF5D4012
AXF6D4012
44
AXF5D4412
AXF6D4412
50
AXF5D5012
AXF6D5012
54
AXF5D5412
AXF6D5412
60
AXF5D6012
AXF6D6012
70
AXF5D7012
AXF6D7012
Inner carton (1-reel)
Outer carton
15,000 pcs.
30,000 pcs.
Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units. For samples, please contact our sales representative.
2. Please contact our sales representative for connectors having a number of pins other than those listed above.
SPECIFICATIONS
Characteristics
Item
Rated
current
Electrical
characteristics
Mechanical
characteristics
5.0 A/pin contact
Signal contact
0.3 A/pin contact (Max. 5 A at total pin contacts)
Rated voltage
30 V AC/DC
Dielectric strength
150 V AC for 1 min.
Insulation resistance
Min. 1,000 MΩ (initial)
Using 250V DC megger (applied for 1 min.)
Contact resistance
Max. 30 mΩ (power terminal)
Max. 90 mΩ (signal terminal)
Based on the contact resistance measurement
method specified by JIS C 5402.
No short-circuiting or damage at a detection current
of 1 mA when the specified voltage is applied for one
minute.
Composite insertion force
1.300 N/pin contact × pin contacts
Composite removal force
0.165 N/pin contact × pin contacts
Ambient temperature
–55 to +85°C
Include the calorification from the connector. No
icing. No condensation.
Soldering heat resistance
The initial specification must be satisfied
electrically and mechanically
Reflow soldering:
Peak temperature: 260°C or less
(on the surface of the PC board around the
connector terminals)
Soldering iron: 300°C within 5 sec., 350°C within 3 sec.
Storage temperature
–55 to +85°C (product only)
–40 to +50°C (emboss packing)
No icing. No condensation.
Conformed to MIL-STD-202F, method 107G
Order Temperature (℃) Time (minutes)
1
30
ｰ55ｰ03
2
Max. 5
3
30
85 +30
4
Max. 5
ｰ55ｰ03
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance Min. 100 MΩ,
contact resistance Max. 30 mΩ (power terminal)
Max. 90 mΩ (signal terminal)
Humidity resistance
(header and socket mated)
120 hours,
insulation resistance Min. 100 MΩ,
contact resistance Max. 30 mΩ (power terminal)
Max. 90 mΩ (signal terminal)
Conformed to IEC60068-2-78
Temperature 40±2°C, humidity 90 to 95% RH
Saltwater spray resistance
(header and socket mated)
24 hours,
insulation resistance Min. 100 MΩ,
contact resistance Max. 30 mΩ (power terminal)
Max. 90 mΩ (signal terminal)
Conformed to IEC60068-2-11
Temperature 35±2°C, saltwater concentration 5±1%
H2S resistance
(header and socket mated)
48 hours,
contact resistance Max. 30 mΩ (power terminal)
Max. 90 mΩ (signal terminal)
Temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% RH
Insertion and removal life
30 times
Repeated insertion and removal speed of Max. 200
times/hours
Unit weight
～
Lifetime
characteristics
Power contact
Conditions
～
Environmental
characteristics
Specifications
60 pins Socket: 0.02 g Header: 0.01 g
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Panasonic Industry Co., Ltd. 2022
ACCTB100E 202204
High Current Connectors A35UH (0.35 mm pitch)
Material and surface treatment
Part name
Material
Surface treatment
Molded portion
LCP resin (UL94V-0)
−
Contact and Post
Power terminal
Copper alloy
DIMENSIONS
Contact portion: Base: Ni plating Surface: Au plating
Terminal portion:
Base: Ni plating Surface: Au plating (except the terminal tips)
The terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Unit: mm
CAD The CAD data of the products with a “CAD” mark can be downloaded from our Website.
Socket (Mated height: 0.6 mm)
CAD
Terminal coplanarity
0.59
A
B±0.1
0.35±0.05
0.12±0.03
0.08
(Contact and power
terminals)
2.20
Dimension table
1.96
0.60
(Suction face)
External dimensions
※2
※2
Power Signal
terminal terminal
Ｚ※1
0.30±0.03
C±0.1
0.66
2.20
Y※1
（0.55）
General tolerance: ±0.2
※1: Since power terminals are built into the body, the Y and Z parts are
connected electrically.
※2: Excluding the terminal section, a difference may occur in the exposure of the
power terminals.
Please do not use this part for product inspection.
Dimensions
Number
of pins
10
A
B
C
4.25
1.40
3.45
12
4.60
1.75
3.80
16
5.30
2.45
4.50
20
6.00
3.15
5.20
24
6.70
3.85
5.90
30
7.75
4.90
6.95
34
8.45
5.60
7.65
40
9.50
6.65
8.70
44
10.20
7.35
9.40
50
11.25
8.40
10.45
54
11.95
9.10
11.15
60
13.00
10.15
12.20
70
14.75
11.90
13.95
Header (Mated height: 0.6 mm)
CAD
A
B±0.1
0.35±0.05
0.12±0.03
0.08±0.03
C±0.1
0.08
(Post and power
terminals)
1.80
Power
terminal
0.48
0.32
1.28
(Power
terminals)
Signal
terminal
Terminal coplanarity
0.46
1.42
0.80
(Suction face)
External dimensions
General tolerance: ±0.2
Dimension table
Dimensions
Number
of pins
10
A
B
C
3.55
1.40
3.17
12
3.90
1.75
3.52
16
4.60
2.45
4.22
20
5.30
3.15
4.92
24
6.00
3.85
5.62
30
7.05
4.90
6.67
34
7.75
5.60
7.37
40
8.80
6.65
8.42
44
9.50
7.35
9.12
50
10.55
8.40
10.17
10.87
54
11.25
9.10
60
12.30
10.15
11.92
70
14.05
11.90
13.67
Header
0.60±0.1
Socket and Header are mated
Socket
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Panasonic Industry Co., Ltd. 2022
ACCTB100E 202204
High Current Connectors A35UH (0.35 mm pitch)
EMBOSSED TAPE DIMENSIONS
Unit: mm
Specifications for taping
Specifications for the plastic reel
In accordance with JIS C 0806-3:1999. However, not applied
to the mounting-hole pitch of some connectors.
In accordance with EIAJ ET-7200B.
C±1
Tape I
Label
Top cover tape
（B）
（1.75）
（4.0）
φ380
Embossed carrier tape
Embossed mounting-hole
（2.0）
Taping reel
（4.0）
Leading direction after packaging
（A +0.3
ｰ ）
0.1
φ1.5+0.1
0
Dimension table
Type/Mated height
Number of pins
Type of taping
A
B
C
Quantity per reel
Socket
0.6 mm
Max. 30
Tape I
16.0
7.5
17.4
15,000
34 to 70
Tape I
24.0
11.5
25.4
15,000
Type/Mated height
Number of pins
Type of taping
A
B
C
Quantity per reel
Header
0.6 mm
Max. 34
Tape I
16.0
7.5
17.4
15,000
40 to 70
Tape I
24.0
11.5
25.4
15,000
Connector orientation with respect to embossed tape feeding direction
There is no indication on this product regarding top-bottom or left-right orientation.
Direction
of tape progress
Type
Common for A35UH
Socket
Header
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Panasonic Industry Co., Ltd. 2022
ACCTB100E 202204
High Current Connectors A35UH (0.35 mm pitch)
NOTES
Unit: mm
Design of PC board patterns
Conduct the recommended foot pattern design, in order to
preserve the mechanical strength of terminal solder areas.
Recommended PC board and metal mask patterns
Connectors are mounted with high pitch density, intervals of
0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and
flux rise, solder bridges and other issues make sure the proper
levels of solder is used.
The figures are recommended patterns. Please use them as a
reference.
Socket (Mated height: 0.6 mm)
Header (Mated height: 0.6 mm)
0.28±0.03
0.435±0.03
0.26±0.03
1.045±0.03
: Resist on
pattern
: Insulation area
0.60±0.01
1.325±0.01
0.24±0.01
0.435±0.01
(0.50)
0.90±0.03
1.20±0.03
2.20±0.03
: Resist on
pattern
: Insulation area
Recommended metal mask pattern
Metal mask thickness: When 100 μm
(Signal terminal opening ratio: 70%)
(Power terminal opening ratio: 77%)
1.48±0.01
0.70±0.01
(0.39)
(0.39)
1.82±0.01
2.60±0.01
2.50±0.01
1.80±0.01
(0.35)
2.18±0.01
1.56±0.01
(0.31)
Recommended metal mask pattern
Metal mask thickness: When 100 μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 46%)
0.35±0.01
0.18±0.01
0.35±0.03
0.20±0.03
0.35±0.01
0.18±0.01
(0.39)
1.42±0.01
2.20±0.01
0.60±0.03
1.325±0.03
0.35±0.03
0.20±0.03
1.48±0.03
0.70±0.03
(0.39)
12×Ｃ0.15
Recommended PC board pattern
(TOP VIEW)
(0.50)
0.20±0.03
1.60±0.03
2.60±0.03
2.50±0.03
1.04±0.03
(0.73)
2.18±0.03
1.42±0.03
(0.38)
Recommended PC board pattern
(TOP VIEW)
0.20±0.01
0.885±0.01
8×Ｃ0.15
Please refer to "the latest product specifications"
when designing your product.
•Requests to customers:
https://industrial.panasonic.com/ac/e/salespolicies/
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ー5ー
Panasonic Industry Co., Ltd. 2022
ACCTB100E 202204
For board-to-board/board-to-FPC
Notes on Using Narrow pitch Connectors/High Current Connectors
About safety remarks
Observe the following safety remarks to prevent accidents
and injuries.
• Do not use these connectors beyond the specification
sheets. The usage outside of specified rated current,
dielectric strength, and environmental conditions and
so on may cause circuitry damage via abnormal heating,
smoke, and fire.
• In order to avoid accidents, your thorough specification
review is appreciated. Please contact our sales
representative if your usage is out of the specifications.
Otherwise, Panasonic Industry Co., Ltd. cannot guarantee
the quality and reliability.
• Panasonic Industry Co., Ltd. is consistently striving to
improve quality and reliability. However, the fact remains
that electrical components and devices generally cause
failures at a given statistical probability. Furthermore, their
durability varies with use environments or use conditions.
In this respect, please check for actual electrical
components and devices under actual conditions before
use. Continued usage in a state of degraded condition
may cause the deteriorated insulation, thus result in
abnormal heat, smoke or firing. Please carry out safety
design and periodic maintenance including redundancy
design, design for fire spread prevention, and design for
malfunction prevention so that no accidents resulting in
injury or death, fire accidents, or social damage will be
caused as a result of failure of the products or ending life
of the products.
Regarding the design of devices and PC board patterns
• When using board to board connectors, a pair of board
shaII NOT be connected with multiple connectors.
Otherwise, misaligned connector positions may cause
mating failure or product breakage. Panasonic Industry
Co., Ltd. does not guarantee the failures caused by using
the multiple connectors.
• With mounting equipment, there may be up to a ±0.2
to 0.3 mm error in positioning. Be sure to design PC
boards and patterns while taking into consideration the
performance and abilities of the required equipment.
• Some connectors have tabs embossed on the body to aid
in positioning. When using these connectors, make sure
that the PC board is designed with positioning holes to
match these tabs.
• To ensure the required mechanical strength when
soldering the connector terminals, make sure the PC
board meets recommended PC board pattern design
dimensions given.
• PC board
Control the thicknesses of the cover lay and adhesive to
prevent poor soldering. This connector has no standoff.
Therefore, minimize the thickness of the cover lay, etc. so
as to prevent the occurrence of poor soldering.
• For all connectors of the narrow pitch series, to prevent
the PC board from coming off during vibrations or
impacts, and to prevent loads from falling directly on the
soldered portions, be sure to design some means to fix
the PC board in place.
Example ) Secure in place with screws
• When mounting connectors on a FPC
• When the connector soldered to FPC is mated or
unmated, solder detachment may occur by the force to
the terminals.
Connector handling is recommended in the condition
when the reinforcing plate is attached to the backside
of FPC where the connector is mounted. The external
dimension of the reinforcing plate is recommended
to be larger than the dimension of “ Recommended
PC board pattern ” ( extended dimension of one side
is approximately 0.5 to 1.0 mm ). The materials and
thickness of the reinforcing plate are glass epoxy or
polyimide ( thickness 0.2 to 0.3 mm ) or SUS ( thickness
0.1 to 0.2 mm ).
• As this connector has temporary locking structure, the
connector mating may be separated by the dropping
impact depend on the size, weight or bending force
of the FPC. Please consider the measures at usage to
prevent the mating separation.
• The narrow pitch connector series is designed to be
compact and thin. Although ease of handling has
been taken into account, take care when mating the
connectors, as displacement or angled mating could
damage or deform the connector.
Screw
↓
↓
Spacer
Connector
Spacer
PC board
When connecting PC boards, take appropriate measures
to prevent the connector from coming off.
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Panasonic Industry Co., Ltd. 2022
ACCTB48E 202204
Notes on Using Narrow pitch Connectors/High Current Connectors
Regarding the selection of the connector placement machine and the mounting procedures
• Select the placement machine taking into consideration
the connector height, required positioning accuracy, and
packaging conditions.
• Be aware that if the chucking force of the placement
machine is too great, it may deform the shape of the
connector body or connector terminals.
• Be aware that during mounting, external forces may be
applied to the connector contact surfaces and terminals
and cause deformations.
• Depending on the size of the connector being used, self
alignment may not be possible. In such cases, be sure to
carefully position the terminal with the PC board pattern.
• The positioning bosses give an approximate alignment
for positioning on the PC board. For accurate positioning
of the connector when mounting it to the PC board, we
recommend using an automatic positioning machine.
• In case of dry condition, please note the occurrence of
static electricity. The product may be adhered to the
embossed carrier tape or the cover tape in dry condition.
Recommended humidity is from 40 to 60% RH and please
remove static electricity by ionizer in manufacturing
process.
Regarding soldering
■ Reflow soldering
• Measure the recommended profile temperature for
reflow soldering by placing a sensor on the PC board
near the connector surface or terminals. ( Please refer
to the specification for detail because the temperature
setting differs by products. )
• As for cream solder printing, screen printing is
recommended.
• When setting the screen opening area and PC board
foot pattern area, refer the recommended PC board
pattern and window size of metal mask on the
specification sheet, and make sure that the size of
board pattern and metal mask at the base of the
terminals are not increased.
• Please pay attentions not to provide too much solder. It
makes miss mating because of interference at soldering
portion when mating.
Terminal
Paste solder
PC board foot pattern
• When mounting on both sides of the PC board and the
connector is mounting on the underside, use adhesives
or other means to ensure the connector is properly
fixed to the PC board. ( Double reflow soldering on the
same side is possible. )
• The condition of solder or flux rise and wettability varies
depending on the type of solder and flux. Solder and
flux characteristics should be taken into consideration
and also set the reflow temperature and oxygen level.
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• Do not use resincontaining solder. Otherwise, the
contacts might be firmly fixed.
• Soldering conditions
Please use the reflow temperature profile conditions
recommended below for reflow soldering. Please
contact our sales representative before using a
temperature profile other than that described below (
e.g. leadfree solder )
Temperature
Peak temperature
260℃
230℃
Preheating
180℃
150℃
60 to 120 sec.
220℃
200℃
25 sec.
70 sec.
Upper limited
(Solder heat resistance)
Lower limited
(Solder wettability)
Time
For products other than the ones above, please refer to
the latest product specifications.
• The temperature profiles given in this catalog are values
measured when using the connector on a resinbased
PC board. When performed reflow soldering on a
metal board ( iron, aluminum, etc. ) or a metal table to
mount on a FPC, make sure there is no deformation or
discoloration of the connector before mounting.
• Please contact our sales representative when using a
screenprinting thickness other than that recommended.
Panasonic Industry Co., Ltd. 2022
ACCTB48E 202204
Notes on Using Narrow pitch Connectors/High Current Connectors
■ Hand soldering
• Be aware that soldering while applying a load on the
connector terminals may cause improper operation of
the connector.
• Thoroughly clean the soldering iron.
• Flux from the solder wire may get on the contact
surfaces during soldering operations. After soldering,
carefully check the contact surfaces and clean off any
solder before use.
• These connector is low profile type. If too much solder
is supplied for hand soldering, It makes miss mating
because of interference at soldering portion. Please pay
attentions.
• Set the soldering iron so that the tip temperature is less
than that given in the table below.
Table A
Product name
Soldering iron temperature
SMD type connectors all products
300℃ within 5 sec.
350℃ within 3 sec.
rin
S
iro old
n e
Apply the solder
wire here
g
• Do not allow flux to spread onto the connector leads
or PC board. This may lead to flux rising up to the
connector inside.
• Touch the soldering iron to the foot pattern. After the
foot pattern and connector terminal are heated, apply
the solder wire so it melts at the end of the connector
terminals.
Small angle as
possible up to
45 degrees
Terminal
PC board
Pattern
■ Solder reworking
• Finish reworking in one operation.
• In case of soldering rework of bridges. Do not use
supplementary solder flux. Doing so may cause contact
problems by flux.
• Keep the soldering iron tip temperature below the
temperature given in Table A.
Handling single components
• Make sure not to drop or allow parts to fall from work
bench.
• Excessive force applied to the terminals could cause
warping, come out, or weaken the adhesive strength of
the solder. Handle with care.
• Do not insert or remove the connector when it is not
soldered. Forcibly applied external pressure on the
terminals can weaken the adherence of the terminals
to the molded part or cause the terminals to lose their
evenness.
Precautions for mating
This product is designed with ease of handling. However,
in order to prevent the deformation or damage of contacts
and molding, take care and do not mate the connectors as
shown right.
Our products are symmetrical structure. Please avoid reverse
insertion of connector. Inserting a connector in a circuit
direction opposite to that you intended may cause circuitry
damage via abnormal heating, smoke, and fire.
Pressfitting while the mating
Strongly pressed and
inlets of the socket and
Tilted mating
twisted
header are not matched.
Cleaning flux from PC board
There is no need to clean this product.
If cleaning it, pay attention to the following points to
prevent the negative effect to the product.
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• Keep the cleaning solvent clean and prevent the
connector contacts from contamination.
• Some cleaning solvents are strong and they may dissolve
the molded part and characters, so pure water passed
liquid solvent is recommended.
ー8ー
Panasonic Industry Co., Ltd. 2022
ACCTB48E 202204
Notes on Using Narrow pitch Connectors/High Current Connectors
Handling the PC board
■ Handling the PC board after mounting the
connector
The soldered areas should not be subjected to force.
When cutting or bending the PC board after mounting
the connector, be careful that the soldered sections are
subjected to excessive force.
Storage of connectors
• To prevent problems from voids or air pockets due to
heat of reflow soldering, avoid storing the connectors in
areas of high humidity.
• Depending on the connector type, the color of the
connector may vary from connector to connector
depending on when it is produced. Some connectors may
change color slightly if subjected to ultraviolet rays during
storage. This is normal and will not affect the operation
of the connector.
• When storing the connectors with the PC boards
assembled and components already set, be careful not
to stack them up so the connectors are subjected to
excessive forces.
• Avoid storing the connectors in locations with excessive
dust. The dust may accumulate and cause improper
connections at the contact surfaces.
Other Notes
• Do not remove or insert the electrified connector ( in the
state of carrying current or applying voltage ).
• Dropping of the products or rough mishandling may
bend or damage the terminals and possibly hinder proper
reflow soldering.
• Before soldering, try not to insert or remove the
connector more than absolutely necessary.
• When coating the PC board after soldering the connector
to prevent the deterioration of insulation, perform the
coating in such a way so that the coating does not get on
the connector.
• There may be variations in the colors of products from
different production lots. This is normal.
• The connectors are not meant to be used for switching.
• Product failures due to condensation are not covered by
warranty.
Regarding sample orders to confirm proper mounting
When ordering samples to confirm proper mounting
with the placement machine, connectors are delivered in
50piece units in the condition given right. Consult a sale
representative for ordering sample units.
Condition when delivered from manufacturing
Embossed tape
amount required
for the mounting
Reel
Delivery can also be made on
a reel by customer request.
Required number
of products for
sample production
( Unit 50 pcs. )
Please refer to "the latest product specifications"
when designing your product.
•Requests to customers:
https://industrial.panasonic.com/ac/e/salespolicies/
Panasonic Industry Co., Ltd. Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
ー9ー
Panasonic Industry Co., Ltd. 2022
ACCTB48E 202204
Electromechanical Control Business Division
1006, Oaza Kadoma, Kadoma-shi, Osaka 571-8506, Japan
industral.panasonic.com/ac/e/
©Panasonic Industry Co., Ltd. 2022
Specifications are subject to change without notice.
ACCTB100E 202204
2022.4
工商网监
湘ICP备2023018690号
