For board-to-FPC
A35P
High Current Connectors
• Rated current
Number of power
contacts
Max. 4 pins
Max. 8 pins
New
Power contact
1.5 A/pin
1.25 A/pin
Rated current
Signal contact
Total
0.5 A/pin
Max. 12 A
Number of power contacts: 1.5 A/pin x 4 pins or 1.25 A/pin x 8 pins can be used
m
Socket
0m
2.
m
5m
2.
3. Increased design freedom (pin layout and multiple high
current lines)
Any pin contact can be used as a power contact.
Any layout is possible for the power supply line.
Header
Sample layout
RoHS compliant
1.5A
1.5A
FEATURES
1. High current rating 5 A (using 1.25 A/pin × 8 pins)
2. Support of high current means number of pins can be
reduced and design with space saving requirements.
• Reduced space with decrease in number of pins used for
power contacts.
Example: Power line Max. 3 A (Pitch: 0.35 mm)
Previous
product
Required number of pins
3 A: 0.25 A/pin × 24 pins
3A
(12 pins)
A35P
3A
(2 pins)
Max. 0.25 A/pin
4. Terminal pitch: 0.35 mm, width: 2.5 mm and Mated height:
0.8 mm
• Connections between PC boards where there is a
tendency for increased number of pins with the increase in
charging current.
• Connection section of all modules where power
consumption increases.
Max. 0.5 A/pin
Space
reduction
3A
(2 pins)
1.5A
APPLICATIONS
Max. 0.25 A/pin
3A
(12 pins)
1.5A
* For 1.5 A/pin power contact
Other pin contacts can be up to max. 0.5 A
(total of pin is max. 12 A).
Required number of pins
3 A: 1.5 A/pin × 4 pins
Max. 0.5 A/pin
ORDERING INFORMATION
AXF
1
2
5A: Socket
6A: Header
Number of pins (2 digits)
Mated height
/
1: 0.8 mm
Functions
2: Without positioning bosses
–1–
ACCTB81E 201602-T
High current connectors A35P (0.35mm pitch)
PRODUCT TYPES
Mated height
Number of pins
0.8mm
10
12
16
20
24
30
34
40
44
50
54
60
64
70
80
100
Part number
Socket
AXF5A1012
AXF5A1212
AXF5A1612
AXF5A2012
AXF5A2412
AXF5A3012
AXF5A3412
AXF5A4012
AXF5A4412
AXF5A5012
AXF5A5412
AXF5A6012
AXF5A6412
AXF5A7012
AXF5A8012
AXF5A0012
Packing
Header
AXF6A1012
AXF6A1212
AXF6A1612
AXF6A2012
AXF6A2412
AXF6A3012
AXF6A3412
AXF6A4012
AXF6A4412
AXF6A5012
AXF6A5412
AXF6A6012
AXF6A6412
AXF6A7012
AXF6A8012
AXF6A0012
Inner carton (1-reel)
Outer carton
5,000 pieces
10,000 pieces
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
Item
Rated voltage
Specifications
1.5 A/pin contact × 4 pin contacts or
1.25 A/pin contact × 8 pin contacts (as power contact)
0.5 A/pin contact (as signal contact)
(Max. 12 A at total pin contacts)
30V AC/DC
Dielectric strength
150V AC for 1 min.
Insulation resistance
Min. 1,000MΩ (initial)
Contact resistance
Max. 30mΩ
Composite insertion force
Composite removal force
Contact holding force
(Socket contact)
Ambient temperature
Max. 0.981N/pin contact × pin contacts (initial)
Min. 0.165N/pin contact × pin contacts
Rated current
Electrical
characteristics
Mechanical
characteristics
Soldering heat resistance
Storage temperature
Conditions
No short-circuiting or damage at a detection current of
1 mA when the specified voltage is applied for one minute.
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No icing or condensation.
Min. 0.20N/pin contact
–55°C to +85°C
Peak temperature: 260°C or less (on the surface of the
PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Infrared reflow soldering
Soldering iron
No icing or condensation.
Conformed to MIL-STD-202F, method 107G
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
Lifetime
characteristics
Unit weight
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 30mΩ
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 30mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 30mΩ
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 30mΩ
Insertion and removal life
30 times
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
saltwater concentration 5%±1%
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Repeated insertion and removal speed of max. 200 times/
hours
60 pin contact Socket 0.03 g Header 0.02 g
–2–
ACCTB81E 201602-T
High current connectors A35P (0.35mm pitch)
2. Material and surface treatment
Part name
Molded
portion
Contact and
Post
Material
LCP resin
(UL94V-0)
Surface treatment
—
Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating, Surface: Au plating (except the terminal tips)
Copper alloy
DIMENSIONS (Unit: mm)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Socket (Mated height: 0.8 mm)
0.70 (Suction face)
CAD Data
Terminal coplanarity
A
0.77
B±0.1
0.35±0.05
0.08
(Contact and soldering terminals)
2.50
2.20
0.12±0.03
(0.90)
2.50
Y note
1.06
Z note
0.30±0.03
C±0.1
General tolerance: ±0.2
Note: Since the soldering terminals has a single-piece construction, sections Y and Z are electrically connected.
Dimension table (mm)
Number of pins/
dimension
10
4.10
1.40
3.00
12
16
20
24
30
34
40
44
50
54
60
64
70
80
100
4.45
5.15
5.85
6.55
7.60
8.30
9.35
10.05
11.10
11.80
12.85
13.55
14.60
16.35
19.85
1.75
2.45
3.15
3.85
4.90
5.60
6.65
7.35
8.40
9.10
10.15
10.85
11.90
13.65
17.15
3.35
4.05
4.75
5.45
6.50
7.20
8.25
8.95
10.00
10.70
11.75
12.45
13.50
15.25
18.75
A
B
C
Header (Mated height: 0.8 mm)
0.70 (Suction face)
CAD Data
Terminal coplanarity
0.65
A
B±0.1
0.08
(Post and soldering terminals)
0.35±0.05
0.12±0.03
0.84
0.12±0.03
(0.31)
1.46
Soldering terminals
Soldering terminals
1.42
2.00
Dimension table (mm)
C±0.1
General tolerance: ±0.2
Number of pins/
dimension
10
A
B
C
3.40
1.40
2.80
12
16
20
24
30
34
40
44
50
54
60
64
70
80
100
3.75
4.45
5.15
5.85
6.90
7.60
8.65
9.35
10.40
11.10
12.15
12.85
13.90
15.65
19.15
1.75
2.45
3.15
3.85
4.90
5.60
6.65
7.35
8.40
9.10
10.15
10.85
11.90
13.65
17.15
3.15
3.85
4.55
5.25
6.30
7.00
8.05
8.75
9.80
10.50
11.55
12.25
13.30
15.05
18.55
Header
0.80±0.1
• Socket and Header are mated
Socket
–3–
ACCTB81E 201602-T
High current connectors A35P (0.35mm pitch)
EMBOSSED TAPE DIMENSIONS (Unit: mm)
• Specifications for taping
(In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.)
(A±0.3)
(B)
(D±1)
Label
Top cover tape
Embossed carrier tape
(2.0)
(4.0)
(C)
(1.75)
(2.0)
Leading direction after packaging
(C)
(1.75)
380 dia.
Tape II
(A +0.3
−0.1 )
(4.0)
Tape I
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Embossed mounting-hole
8.0
8.0
Taping reel
1.
1.
5 +0
5 +0
0 .1
0 .1
di
di
a.
a.
• Dimension table (Unit: mm)
Type/Mated height
Number of pins
Type of taping
A
B
C
D
Quantity per reel
Common for sockets and headers
0.8mm
10 to 24
30 to 80
100
Tape I
Tape I
Tape II
16.0
24.0
32.0
—
—
28.4
7.5
11.5
14.2
17.4
25.4
33.4
5,000
5,000
5,000
• Connector orientation with respect to embossed tape feeding direction
Type
Common for A35P
Direction
of tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
–4–
ACCTB81E 201602-T
High current connectors A35P (0.35mm pitch)
NOTES
• Header (Mated height: 0.8 mm)
2.40±0.03
(0.65)
1.10±0.03
0.35±0.03
0.20±0.03
(0.53)
0.60±0.03
Recommended PC board pattern (TOP VIEW)
1.66±0.03
Design of PC board patterns
Conduct the recommended foot pattern design, in order to
preserve the mechanical strength of terminal solder areas.
Recommended PC board and metal mask patterns
Connectors are mounted with high pitch density, intervals of 0.35
mm, 0.4 mm or 0.5 mm.
In order to reduce solder and flux rise, solder bridges and other
issues make sure the proper levels of solder is used.
The figures to the right are recommended metal mask patterns.
Please use them as a reference.
0.45±0.03
0.70±0.03
• Socket (Mated height: 0.8 mm)
Recommended metal mask pattern
2.40±0.01
(0.61)
0.18±0.01
1.18±0.01
0.35±0.01
(0.53)
1.66±0.01
0.60±0.01
Metal mask thickness: When 100μm
(Terminal opening ratio: 84%)
(Metal-part opening ratio: 100%)
1.90±0.03
(0.50)
0.35±0.03
0.20±0.03
0.20±0.03
1.06±0.03
(0.92)
2.90±0.03
Recommended PC board pattern (TOP VIEW)
C
30
0.
0.90±0.03
1.35±0.03
: insulation
area
0.45±0.01
0.70±0.01
Recommended metal mask pattern
2.90±0.01
(0.47)
0.18±0.01
Please refer to the latest product specifications when
designing your product.
1.96±0.01
0.35±0.01
(0.49)
1.92±0.01
2.90±0.01
Metal mask thickness: When 100μm
(Terminal opening ratio: 85%)
(Metal-part opening ratio: 50%)
C
30
0.
0.90±0.01
1.35±0.01
–5–
ACCTB81E 201602-T
For board-to-board/board-to-FPC
Notes on Using Narrow pitch Connectors/
High Current Connectors
About safety Remarks
1) Do not use these connectors beyond
the specification sheets. The usage
outside of specified rated current,
dielectric strength, and environmental
conditions and so on may cause circuitry
damage via abnormal heating, smoke,
and fire.
2) In order to avoid accidents, your
thorough specification review is
appreciated.
Please contact us if your usage is out of
the specifications. Otherwise, Panasonic
Corporation cannot guarantee the quality
and reliability.
3) Panasonic Corporation is consistently
striving to improve quality and reliability.
However, the fact remains that electrical
components and devices generally cause
failures at a given statistical probability.
Furthermore, their durability varies with
use environments or use conditions. In
this respect, please check for actual
electrical components and devices under
actual conditions before use.
Continued usage in a state of degraded
condition may cause the deteriorated
insulation, thus result in abnormal heat,
smoke or firing. Please carry out safety
design and periodic maintenance
including redundancy design, design for
fire spread prevention, and design for
malfunction prevention so that no
accidents resulting in injury or death, fire
accidents, or social damage will be
caused as a result of failure of the
products or ending life of the products.
Regarding the design of devices and PC board patterns
1) When using the board to board
connectors, do not connect a pair of
board with multiple connectors.
Otherwise, misaligned connector
positions may cause mating failure or
product breakage.
2) With mounting equipment, there may
be up to a ±0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
5) PC board
Control the thicknesses of the coverlay
and adhesive to prevent poor soldering.
This connector has no stand-off.
Therefore, minimize the thickness of the
coverlay, etc. so as to prevent the
occurrence of poor soldering.
6) For all connectors of the narrow pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
Example) Secure in place with screws
Screw
Connector
Spacer
PC board
Spacer
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
7) When mounting connectors on a FPC
board:
• When the connector soldered to FPC is
mated or unmated, solder detachment
may occur by the force to the terminals.
Connector handling is recommended in
the condition when the reinforcing plate is
attached to the backside of FPC where
the connector is mounted. The external
dimension of the reinforcing plate is
recommended to be larger than the
dimension of “PC board recommended
process pattern” (extended dimension of
one side is approximately 0.5 to 1.0 mm).
The materials and thickness of the
reinforcing plate are glass epoxy or
polyimide (thickness 0.2 - 0.3 mm) or
SUS (thickness 0.1 - 0.2 mm).
• As this connector has temporary locking
structure, the connector mating may be
separated by the dropping impact
depend on the size, weight or bending
force of the FPC. Please consider the
measures at usage to prevent the mating
separation.
8) The narrow pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
Regarding the selection of the connector placement machine and the mounting
procedures
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the chucking force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
4) Depending on the size of the
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
–1–
6) In case of dry condition, please note
the occurrence of static electricity.
The product may be adhered to the
embossed carrier tape or the cover tape
in dry condition.
Recommended humidity is from 40%RH
to 60%RH and please remove static
electricity by ionizer in manufacturing
process.
ACCTB48E 201606-T
Notes on Using Narrow pitch Connectors/High Current Connectors
Regarding soldering
Terminal
Paste
solder
PC board
foot pattern
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) The condition of solder or flux rise and
wettability varies depending on the type
of solder and flux. Solder and flux
characteristics should be taken into
consideration and also set the reflow
temperature and oxygen level.
7) Do not use resin-containing solder.
Otherwise, the contacts might be firmly
fixed.
8) Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
Apply the solder
wire here
Upper limited (Solder heat resistance)
Lower limited (Solder wettability)
Terminal
Temperature
Peak temperature 260°C
230°C
180°C
150°C
So
ld
iro erin
n g
■ Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals.
(Please refer to the specification for detail
because the temperature setting differs
by products.)
2) As for cream solder printing, screen
printing is recommended.
3) When setting the screen opening area
and PC board foot pattern area, refer the
recommended PC board pattern and
window size of metal mask on the
specification sheet, and make sure that
the size of board pattern and metal mask
at the base of the terminals are not
increased.
4) Please pay attentions not to provide
too much solder. It makes miss mating
because of interference at soldering
portion when mating.
Small angle as
possible up to
45 degrees
Peak temperature
Preheating
220°C
200°C
PC board
25 sec.
60 to 120 sec.
70 sec.
Time
For products other than the ones above,
please refer to the latest product
specifications.
9) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector before
mounting.
10) Consult us when using a screenprinting thickness other than that
recommended.
■ Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
Table A
Product name
Soldering iron temperature
SMD type connectors
300°C within 5 sec.
350°C within 3 sec.
Pattern
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) These connector is low profile type. If
too much solder is supplied for hand
soldering, It makes miss mating because
of interference at soldering portion.
Please pay attentions.
■ Solder reworking
1) Finish reworking in one operation.
2) In case of soldering rework of bridges.
Don’t use supplementary solder flux.
Doing so may cause contact problems by
flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
Handling Single Components
1) Make sure not to drop or allow parts to
fall from work bench.
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
3) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
Precautions for mating
This product is designed with ease of
handling. However, in order to prevent the
deformation or damage of contacts and
molding, take care and do not mate the
connectors as shown right.
Press-fitting while the mating
inlets of the socket and
header are not matched.
Strongly pressed and twisted
Tilted mating
–2–
ACCTB48E 201606-T
Notes on Using Narrow pitch Connectors/High Current Connectors
Cleaning flux from PC board
There is no need to clean this product.
If cleaning it, pay attention to the
following points to prevent the negative
effect to the product.
1) Keep the cleaning solvent clean and
prevent the connector contacts from
contamination.
2) Some cleaning solvents are strong and
they may dissolve the molded part and
characters, so pure water passed liquid
solvent is recommended.
Handling the PC board after mounting the connector
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
The soldered areas should not be subjected to force.
Storage of connectors
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage. This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
5) There may be variations in the colors
of products from different production lots.
This is normal.
6) The connectors are not meant to be
used for switching.
7) Product failures due to condensation
are not covered by warranty.
Other Notes
1) Do not remove or insert the electrified
connector (in the state of carrying current
or applying voltage).
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
Regarding sample orders to confirm proper mounting
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Please refer to the latest product
specifications when designing your
product.
Condition when delivered from manufacturing
Reel
Embossed tape
amount required for
the mounting
Required number
of products for
sample production
(Delivery can also be made on a reel by
customer request.)
(Unit 50 pcs.)
–3–
ACCTB48E 201606-T