AXG124144

For board-to-FPC S35 Narrow Pitch Connectors (0.35mm pitch) Excellent contact reliability and mating in a super miniature size (width 1.7 mm) FEATURES 1. Slim: width 1.7mm 2. Low profile construction: mated height 0.6 mm/0.8 mm 3. “TOUGH CONTACT” construction withstands tough environments despite being slim and low profile. 4. For 0.6mm mated height, thanks to our proprietary “Fine fitting” construction, high removability with a nice click feel is maintained while being low profile. 1.5mm 1.7mm Socket APPLICATIONS Header Wearable devices, smartphones and hearable devices DETAILED FEATURES Proprietary “TOUGH CONTACT” construction for both high contact reliability and good workability while being slim and low profile Mated height 0.6mm Width 1.7mm slim and two-piece type connector Mated height 0.6mm Smaller compared to A35US; Width: approx. 23% down 2-point soldering Mated height 0.6mm S35 Socket Approx. 23% down Header 0.35mm (pitch) 0.35mm (pitch) 7.75mm (34 pins) 1.5mm 1.7mm 1.7mm（S35） 8.45mm (34 pins) 2.2mm（A35US） Mated height 0.8mm Mated height 0.8mm Smaller compared to A35S/A4S; Width: approx. 32% down 2-point soldering Mated height 0.8mm S35 Socket Approx. 32% down Header 0.35mm (pitch) 1.7mm 1.7mm（S35） 8.30mm (34 pins) 0.35mm 7.60mm (pitch) (34 pins) 1.5mm 2.5mm（A35S／A4S） –1– ACCTB66E 201803-T Narrow pitch connectors S35 (0.35mm pitch) ORDERING INFORMATION Mated height: 0.6mm AXG 1: Socket 2: Header 1 4 4 Number of pins (2 digits) Mated height (Socket/Header) 1: 0.6 mm Surface treatment (Contact portion / Terminal portion) (Socket) 4: Base: Ni plating, Surface: Au plating/Base: Ni plating, Surface: Au plating (Header) 4: Base: Ni plating, Surface: Au plating/Base: Ni plating, Surface: Au plating 4: (Fixed) Mated height: 0.8mm AXG 1: Socket 2: Header 2 2 4 Number of pins (2 digits) Mated height (Socket/Header) 2: 0.8 mm 2: (Fixed) Surface treatment (Contact portion / Terminal portion) (Socket) 4: Base: Ni plating, Surface: Au plating/Base: Ni plating, Surface: Au plating (Header) 4: Base: Ni plating, Surface: Au plating/Base: Ni plating, Surface: Au plating PRODUCT TYPES Mated height 0.6mm 0.8mm Number of pins 6 10 12 16 20 24 30 34 40 44 50 54 60 12 24 34 44 Part number Socket AXG106144 AXG110144 AXG112144 AXG116144 AXG120144 AXG124144 AXG130144 AXG134144 AXG140144 AXG144144 AXG150144 AXG154144 AXG160144 AXG112224 AXG124224 AXG134224 AXG144224 Packing Header AXG206144 AXG210144 AXG212144 AXG216144 AXG220144 AXG224144 AXG230144 AXG234144 AXG240144 AXG244144 AXG250144 AXG254144 AXG260144 AXG212224 AXG224224 AXG234224 AXG244224 Inner carton (1-reel) Outer carton 15,000 pieces 30,000 pieces 15,000 pieces 30,000 pieces Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units. For samples, please contact our sales office. 2. Please contact our sales office for connectors having a number of pins other than those listed above. –2– ACCTB66E 201803-T Narrow pitch connectors S35 (0.35mm pitch) SPECIFICATIONS 1. Characteristics Electrical characteristics Mechanical characteristics Item Rated current Rated voltage Specifications Max. 0.3 A/pin contact (Max. 5 A at total pin contacts) 60V AC/DC Dielectric strength 150V AC for 1 min. Insulation resistance Min. 1,000MΩ (Initial) Contact resistance Max. 90mΩ Composite insertion force Composite removal force Ambient temperature Conditions No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for 1 min. Using 250V DC megger (applied for 1 min.) According to the contact resistance measurement method of JIS C 5402 h = 0.6 mm 20 or less pins: Max. 26.0N, pin contact Over 22 pins: Max. 1. 300 N/pin contact × pin contacts (Initial stage) h = 0.8 mm Max. 1. 300 N/pin contact × pin contacts (Initial stage) Min. 0.215N/pin contact × pin contacts –55 to +85°C No icing. No condensation. Soldering heat resistance The initial specification must be satisfied electrically and mechanically. Reflow soldering: Peak temperature: 260°C or less (on the surface of the PC board around the connector terminals) Soldering iron: 300°C within 5 sec. 350°C within 3 sec. Storage temperature –55 to +85°C (Products only) –40 to +50°C (Packaging structure) No icing. No condensation. Conformed to MIL-STD-202F, method 107G Environmental characteristics Thermal shock resistance (Header and socket mated) H2S resistance (Header and socket mated) 120 hours, insulation resistance: Min. 100MΩ, contact resistance: Max. 90mΩ 24 hours, insulation resistance: Min. 100MΩ, contact resistance: Max. 90mΩ 48 hours, contact resistance: Max. 90mΩ Insertion and removal life 30 times Humidity resistance (Header and socket mated) Salt water spray resistance (Header and socket mated) Lifetime characteristics 5 cycles, insulation resistance: Min. 100MΩ, contact resistance: Max. 90mΩ Order Temperature (°C) 1 –55 −30 2 3 85 +30 4 –55 −30 Time (minutes) 30 Max. 5 30 Max. 5 Conformed to IEC60068-2-78 Temperature 40±2°C, Humidity 90 to 95% R.H. Conformed to IEC60068-2-11 Temperature 35±2°C, Salt water concentration 5±1% Temperature 40±2°C, Gas concentration 3±1 ppm, Humidity 75 to 80% R.H. Repeated insertion and removal cycles of max. 200 times/ hour 34 pins Socket h = 0.6 mm: 0.01g, h = 0.8 mm: 0.02g 34 pins Header h = 0.6 mm: 0.01g, h = 0.8 mm: 0.01g Unit weight 2. Material and surface treatment Part name Molded portion Material LCP resin (UL94V-0) Contact and Post Copper alloy Soldering terminals Copper alloy Surface treatment — Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Sockets: Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips) Headers: Base: Ni plating, Surface: Au plating (except the terminal tips) –3– ACCTB66E 201803-T Narrow pitch connectors S35 (0.35mm pitch) DIMENSIONS (Unit: mm) The CAD data of the products with a mark can be downloaded from: http://industrial.panasonic.com/ac/e/ Socket (Mated height: 0.6 mm) A B±0.1 0.35±0.05 0.12±0.03 Terminal coplanarity 0.59 0.08 (Contact and soldering terminals) 1.64 0.40 (Suction face) External dimensions 0.46 Z※ 0.24±0.03 1.70 (0.825) Y※ C±0.1 General tolerance: ±0.2 ※Because the soldering terminal Y and Z are the unified structure,  they are connected electrically. Dimension table Dimensions Number of pins 6 10 12 16 20 24 30 34 40 44 50 54 60 A B C 3.55 4.25 4.60 5.30 6.00 6.70 7.75 8.45 9.50 10.20 11.25 11.95 13.00 0.70 1.40 1.75 2.45 3.15 3.85 4.90 5.60 6.65 7.35 8.40 9.10 10.15 2.95 3.65 4.00 4.70 5.40 6.10 7.15 7.85 8.90 9.60 10.65 11.35 12.40 A B C 2.85 3.55 3.90 4.60 5.30 6.00 7.05 7.75 8.80 9.50 10.55 11.25 12.30 0.70 1.40 1.75 2.45 3.15 3.85 4.90 5.60 6.65 7.35 8.40 9.10 10.15 2.10 2.80 3.15 3.85 4.55 5.25 6.30 7.00 8.05 8.75 9.80 10.50 11.55 Header (Mated height: 0.6 mm) A B±0.1 0.35±0.05 0.12±0.03 Terminal coplanarity 0.46 0.08 1.12 (Post and soldering terminals) Soldering terminals 0.12±0.03 C±0.1 (0.37) 0.76 1.50 (Soldering terminals-part) 0.62 (Suction face) External dimensions General tolerance: ±0.2 –4– Dimension table Dimensions Number of pins 6 10 12 16 20 24 30 34 40 44 50 54 60 ACCTB66E 201803-T Narrow pitch connectors S35 (0.35mm pitch) Socket (Mated height: 0.8 mm) A B±0.1 0.35±0.05 0.12±0.03 Terminal coplanarity 0.79 0.08 (Contact and soldering terminals) 1.64 0.50 (Suction face) External dimensions Dimension table 0.46 1.70 (0.80) Y※ Dimensions Z※ 0.24±0.03 Ｃ±0.1 General tolerance: ±0.2 ※Because the soldering terminal Y and Z are the unified structure,  they are connected electrically. Number of pins 12 24 34 44 A B C 4.45 6.55 8.30 10.05 1.75 3.85 5.60 7.35 3.85 5.95 7.70 9.45 A B C 3.75 5.85 7.60 9.35 1.75 3.85 5.60 7.35 3.15 5.25 7.00 8.75 Header (Mated height: 0.8 mm) Terminal coplanarity 0.65 0.08 (Post and soldering terminals) 1.11 0.62 (Suction face) External dimensions A B±0.1 0.35±0.05 0.12±0.03 Soldering terminals Dimension table 0.12±0.03 C±0.1 (0.36) 0.78 1.50 (Soldering terminals-part) Dimensions General tolerance: ±0.2 Number of pins 12 24 34 44 Header 0.80±0.1 Header 0.60±0.1 Socket and Header are mated Socket Socket –5– ACCTB66E 201803-T Narrow pitch connectors S35 (0.35mm pitch) EMBOSSED TAPE DIMENSIONS (Unit: mm) Specifications for taping In accordance with JIS C 0806-3:1999. However, not applied to the mounting-hole pitch of some connectors. Specifications for the plastic reel In accordance with EIAJ ET-7200B. Tape I +0.3 C±1 Label Top cover tape Embossed carrier tape φ380 （4.0） Leading direction after packaging -0.1 （A ） （B） （1.75） （2.0） Embossed mounting-hole （4.0） Taping reel φ1.5+0.1 0 Dimension table Type/Mated height Number of pins Type of taping A B C Quantity per reel Socket 0.6mm and 0.8mm Max. 30 34 to 60 Tape I Tape I 16.0 24.0 7.5 11.5 17.4 25.4 15,000 15,000 Type/Mated height Number of pins Type of taping A B C Quantity per reel Header 0.6mm and 0.8mm Max. 34 40 to 60 Tape I Tape I 16.0 24.0 7.5 11.5 17.4 25.4 15,000 15,000 Connector orientation with respect to embossed tape feeding direction There is no indication on this product regarding top-bottom or left-right orientation. Type Direction of tape progress Common for S35 Socket Header –6– ACCTB66E 201803-T Narrow pitch connectors S35 (0.35mm pitch) NOTES (Unit: mm) Design of PC board patterns Conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. 0.40±0.03 0.50±0.03 0.80±0.03 1.275±0.03 ：Insulation area (0.31) 0.35±0.01 0.18±0.01 2.00±0.03 1.38±0.01 2.00±0.01 1.72±0.01 (0.26) 2.00±0.01 1.20±0.01 (0.40) (0.31) 1.38±0.01 2.00±0.01 2.00±0.01 1.20±0.01 (0.40) 1.64±0.01 (0.22) ：Insulation area Recommended metal mask pattern Metal mask thickness: When 100μm (Terminal opening ratio: 70%) (Metal-part opening ratio: 100%) Recommended metal mask pattern Metal mask thickness: When 100μm (Terminal opening ratio: 70%) (Metal-part opening ratio: 100%) 0.35±0.01 0.18±0.01 (0.40) 1.72±0.03 2.00±0.03 1.20±0.03 (0.40) 0.20±0.03 1.64±0.03 0.40±0.03 0.49±0.03 0.85±0.03 1.35±0.03 0.35±0.03 0.20±0.03 0.20±0.03 1.20±0.03 Socket (Mated height: 0.8 mm) Recommended PC board pattern (TOP VIEW) Socket (Mated height: 0.6 mm) Recommended PC board pattern (TOP VIEW) 0.35±0.03 0.20±0.03 The figures are recommended patterns. Please use them as a reference. 0.40±0.01 0.50±0.01 0.80±0.01 1.275±0.01 0.40±0.01 0.49±0.01 0.85±0.01 1.35±0.01 –7– ACCTB66E 201803-T Narrow pitch connectors S35 (0.35mm pitch) 0.35±0.03 0.20±0.03 0.28±0.03 0.70±0.03 (0.40) 0.66±0.03 1.00±0.03 1.80±0.03 1.80±0.03 1.00±0.03 (0.40) Header (Mated height: 0.6 mm and 0.8 mm) Recommended PC board pattern (TOP VIEW) ：Insulation area 0.35±0.01 0.18±0.01 (0.31) 1.18±0.01 1.80±0.01 1.80±0.01 1.00±0.01 (0.40) Recommended metal mask pattern Metal mask thickness: When 100μm (Terminal opening ratio: 70%) (Metal-part opening ratio: 100%) 0.28±0.01 0.70±0.01 Please refer to the latest product specifications when designing your product. –8– ACCTB66E 201803-T For board-to-board/board-to-FPC Notes on Using Narrow pitch Connectors/ High Current Connectors About safety remarks Observe the following safety remarks to prevent accidents and injuries. 3) Panasonic Corporation is consistently striving to improve 1) Do not use these connectors beyond the specification sheets. quality and reliability. However, the fact remains that electrical The usage outside of specified rated current, dielectric strength, components and devices generally cause failures at a given and environmental conditions and so on may cause circuitry statistical probability. Furthermore, their durability varies with damage via abnormal heating, smoke, and fire. use environments or use conditions. In this respect, please 2) In order to avoid accidents, your thorough specification review check for actual electrical components and devices under actual is appreciated. Please contact our sales office if your usage is conditions before use. Continued usage in a state of degraded out of the specifications. Otherwise, Panasonic Corporation condition may cause the deteriorated insulation, thus result in cannot guarantee the quality and reliability. abnormal heat, smoke or firing. Please carry out safety design and periodic maintenance including redundancy design, design for fire spread prevention, and design for malfunction prevention so that no accidents resulting in injury or death, fire accidents, or social damage will be caused as a result of failure of the products or ending life of the products. Regarding the design of devices and PC board patterns 1) When using the board to board connectors, do not connect a pair of board with multiple connectors. Otherwise, misaligned connector positions may cause mating failure or product breakage. 2) With mounting equipment, there may be up to a ±0.2 to 0.3 mm error in positioning. Be sure to design PC boards and patterns while taking into consideration the performance and abilities of the required equipment. 3) Some connectors have tabs embossed on the body to aid in positioning. When using these connectors, make sure that the PC board is designed with positioning holes to match these tabs. 4) To ensure the required mechanical strength when soldering the connector terminals, make sure the PC board meets recommended PC board pattern design dimensions given. 5) PC board Control the thicknesses of the cover lay and adhesive to prevent poor soldering. This connector has no stand-off. Therefore, minimize the thickness of the cover lay, etc. so as to prevent the occurrence of poor soldering. 6) For all connectors of the narrow pitch series, to prevent the PC board from coming off during vibrations or impacts, and to prevent loads from falling directly on the soldered portions, be sure to design some means to fix the PC board in place. Example) Secure in place with screws 7) When mounting connectors on a FPC • When the connector soldered to FPC is mated or unmated, solder detachment may occur by the force to the terminals. Connector handling is recommended in the condition when the reinforcing plate is attached to the backside of FPC where the connector is mounted. The external dimension of the reinforcing plate is recommended to be larger than the dimension of “Recommended PC board pattern” (extended dimension of one side is approximately 0.5 to 1.0 mm). The materials and thickness of the reinforcing plate are glass epoxy or polyimide (thickness 0.2 to 0.3 mm) or SUS (thickness 0.1 to 0.2 mm). • As this connector has temporary locking structure, the connector mating may be separated by the dropping impact depend on the size, weight or bending force of the FPC. Please consider the measures at usage to prevent the mating separation. 8) The narrow pitch connector series is designed to be compact and thin. Although ease of handling has been taken into account, take care when mating the connectors, as displacement or angled mating could damage or deform the connector. Screw ↓ ↓ Spacer Connector PC board Spacer When connecting PC boards, take appropriate measures to prevent the connector from coming off. –1– ACCTB48E 201803-T Notes on Using Narrow pitch Connectors/High Current Connectors Regarding the selection of the connector placement machine and the mounting procedures 1) Select the placement machine taking into consideration the connector height, required positioning accuracy, and packaging conditions. 2) Be aware that if the chucking force of the placement machine is too great, it may deform the shape of the connector body or connector terminals. 3) Be aware that during mounting, external forces may be applied to the connector contact surfaces and terminals and cause deformations. 4) Depending on the size of the connector being used, self alignment may not be possible. In such cases, be sure to carefully position the terminal with the PC board pattern. 5) The positioning bosses give an approximate alignment for positioning on the PC board. For accurate positioning of the connector when mounting it to the PC board, we recommend using an automatic positioning machine. 6) In case of dry condition, please note the occurrence of static electricity. The product may be adhered to the embossed carrier tape or the cover tape in dry condition. Recommended humidity is from 40 to 60%RH and please remove static electricity by ionizer in manufacturing process. Regarding soldering Reflow soldering 1) Measure the recommended profile temperature for reflow soldering by placing a sensor on the PC board near the connector surface or terminals. (Please refer to the specification for detail because the temperature setting differs by products.) 2) As for cream solder printing, screen printing is recommended. 3) When setting the screen opening area and PC board foot pattern area, refer the recommended PC board pattern and window size of metal mask on the specification sheet, and make sure that the size of board pattern and metal mask at the base of the terminals are not increased. 4) Please pay attentions not to provide too much solder. It makes miss mating because of interference at soldering portion when mating. Terminal Paste solder PC board foot pattern 5) When mounting on both sides of the PC board and the connector is mounting on the underside, use adhesives or other means to ensure the connector is properly fixed to the PC board. (Double reflow soldering on the same side is possible.) 6) The condition of solder or flux rise and wettability varies depending on the type of solder and flux. Solder and flux characteristics should be taken into consideration and also set the reflow temperature and oxygen level. Hand soldering 1) Set the soldering iron so that the tip temperature is less than that given in the table below. Table A Product name Soldering iron temperature SMD type connectors all products 300°C within 5 sec. 350°C within 3 sec. 180℃ 150℃ Peak temperature Preheating 220℃ 200℃ 25 sec. 60 to 120 sec. 70 sec. Upper limited (Solder heat resistance) Lower limited (Solder wettability) Time For products other than the ones above, please refer to the latest product specifications. 9) The temperature profiles given in this catalog are values measured when using the connector on a resin-based PC board. When performed reflow soldering on a metal board (iron, aluminum, etc.) or a metal table to mount on a FPC, make sure there is no deformation or discoloration of the connector before mounting. 10) Please contact our sales office when using a screen-printing thickness other than that recommended. 4) Be aware that soldering while applying a load on the connector terminals may cause improper operation of the connector. 5) Thoroughly clean the soldering iron. 6) Flux from the solder wire may get on the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any solder before use. 7) These connector is low profile type. If too much solder is supplied for hand soldering, It makes miss mating because of interference at soldering portion. Please pay attentions. S iro old n eri Apply the solder wire here Temperature Peak temperature 260℃ 230℃ ng 2) Do not allow flux to spread onto the connector leads or PC board. This may lead to flux rising up to the connector inside. 3) Touch the soldering iron to the foot pattern. After the foot pattern and connector terminal are heated, apply the solder wire so it melts at the end of the connector terminals. 7) Do not use resin-containing solder. Otherwise, the contacts might be firmly fixed. 8) Soldering conditions Please use the reflow temperature profile conditions recommended below for reflow soldering. Please contact our sales office before using a temperature profile other than that described below (e.g. lead-free solder) Small angle as possible up to 45 degrees Terminal PC board Pattern –2– ACCTB48E 201803-T Notes on Using Narrow pitch Connectors/High Current Connectors Solder reworking 1) Finish reworking in one operation. 2) In case of soldering rework of bridges. Do not use supplementary solder flux. Doing so may cause contact problems by flux. 3) Keep the soldering iron tip temperature below the temperature given in Table A. Handling single components 1) Make sure not to drop or allow parts to fall from work bench. 2) Excessive force applied to the terminals could cause warping, come out, or weaken the adhesive strength of the solder. Handle with care. 3) Do not insert or remove the connector when it is not soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. Precautions for mating This product is designed with ease of handling. However, in order to prevent the deformation or damage of contacts and molding, take care and do not mate the connectors as shown right. Press-fitting while the mating Strongly pressed and inlets of the socket and twisted header are not matched. Tilted mating Cleaning flux from PC board There is no need to clean this product. If cleaning it, pay attention to the following points to prevent the negative effect to the product. 1) Keep the cleaning solvent clean and prevent the connector contacts from contamination. 2) Some cleaning solvents are strong and they may dissolve the molded part and characters, so pure water passed liquid solvent is recommended. Handling the PC board Handling the PC board after mounting the connector When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive force. The soldered areas should not be subjected to force. Storage of connectors 1) To prevent problems from voids or air pockets due to heat of reflow soldering, avoid storing the connectors in areas of high humidity. 2) Depending on the connector type, the color of the connector may vary from connector to connector depending on when it is produced. Some connectors may change color slightly if subjected to ultraviolet rays during storage. This is normal and will not affect the operation of the connector. 3) When storing the connectors with the PC boards assembled and components already set, be careful not to stack them up so the connectors are subjected to excessive forces. 4) Avoid storing the connectors in locations with excessive dust. The dust may accumulate and cause improper connections at the contact surfaces. Other Notes 1) Do not remove or insert the electrified connector (in the state of carrying current or applying voltage). 2) Dropping of the products or rough mishandling may bend or damage the terminals and possibly hinder proper reflow soldering. 3) Before soldering, try not to insert or remove the connector more than absolutely necessary. –3– 4) When coating the PC board after soldering the connector to prevent the deterioration of insulation, perform the coating in such a way so that the coating does not get on the connector. 5) There may be variations in the colors of products from different production lots. This is normal. 6) The connectors are not meant to be used for switching. 7) Product failures due to condensation are not covered by warranty. ACCTB48E 201803-T Notes on Using Narrow pitch Connectors/High Current Connectors Regarding sample orders to confirm proper mounting When ordering samples to confirm proper mounting with the placement machine, connectors are delivered in 50-piece units in the condition given right. Consult a sale representative for ordering sample units. Condition when delivered from manufacturing Embossed tape amount required for the mounting Required number of products for sample production Reel Delivery can also be made on a reel by customer request. (Unit 50 pcs.) Please refer to the latest product specifications when designing your product. –4– ACCTB48E 201803-T