Narrow pitch connectors For board-to-FPC
S35
(0.35 mm pitch)
Excellent contact reliability and mating in a super miniature size (width 1.7 mm)
FEATURES
Slim: width 1.7 mm
Low profile construction: mated height 0.6 mm/0.8
mm
“TOUGH CONTACT” construction withstands tough
environments despite being slim and low profile.
For 0.6 mm mated height, thanks to our proprietary
“Fine fitting” construction, high removability with a
nice click feel is maintained while being low profile.
1.7mm
Socket
1.5mm
Header
TYPICAL APPLICATIONS
Wearable devices, smartphones and hearable
devices
DETAILS FEATURES
Width 1.7 mm slim and two-piece type connector
roprietary “TOUGH CONTACT” construction for
P
both high contact reliability and good workability
while being slim and low profile
Mated height 0.6 mm
Smaller compared to A35UH; Width: approx. 23% down
Mated height 0.6 mm
2-point soldering
Mated
height
0.6mm
S35
Socket
Approx.
23% down
Header
0.35mm 8.45mm
(34 pins)
(pitch)
(pitch)
7.75mm
(34 pins)
1.5mm
1.7mm
1.7mm（S35）
0.35mm
2.2mm（ A35UH）
Mated height 0.8 mm
Smaller compared to A35S/A4S; Width: approx. 32% down
Mated height 0.8 mm
2-point soldering
Mated
height
0.8mm
S35
Socket
Approx.
32% down
1.7mm（S35）
Header
0.35mm 8.30mm
(34 pins)
(pitch)
1.7mm
0.35mm 7.60mm
(pitch) (34 pins)
1.5mm
2.5mm（ A35S／A4S）
2021.10
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Panasonic Corporation 2021
ACCTB66E 202110
Narrow pitch connectors S35 (0.35 mm pitch)
ORDERING INFORMATION (PART NO.)
Mated height: 0.6 mm
AXG
1: Socket
2: Header
1 4 4
Number of pins
(2 digits)
Mated height
(Socket/Header)
1: 0.6 mm
4: (Fixed)
Surface treatment (Contact portion / Terminal portion)
(Socket)
4: Base: Ni plating, Surface: Au plating/Base: Ni plating, Surface: Au plating
(Header)
4: Base: Ni plating, Surface: Au plating/Base: Ni plating, Surface: Au plating
2: (Fixed)
Surface treatment (Contact portion / Terminal portion)
(Socket)
4: Base: Ni plating, Surface: Au plating/Base: Ni plating, Surface: Au plating
(Header)
4: Base: Ni plating, Surface: Au plating/Base: Ni plating, Surface: Au plating
Mated height: 0.8 mm
2 2 4
AXG
1: Socket
2: Header
Number of pins
(2 digits)
Mated height
(Socket/Header)
2: 0.8 mm
PRODUCT TYPES
Mated height
0.6 mm
0.8 mm
Number of pins
Part No.
Standard packing
Socket
Header
6
AXG106144
AXG206144
10
AXG110144
AXG210144
12
AXG112144
AXG212144
16
AXG116144
AXG216144
20
AXG120144
AXG220144
24
AXG124144
AXG224144
30
AXG130144
AXG230144
34
AXG134144
AXG234144
40
AXG140144
AXG240144
44
AXG144144
AXG244144
50
AXG150144
AXG250144
54
AXG154144
AXG254144
60
AXG160144
AXG260144
12
AXG112224
AXG212224
24
AXG124224
AXG224224
34
AXG134224
AXG234224
44
AXG144224
AXG244224
Inner carton (1-reel)
Outer carton
15,000 pcs.
30,000 pcs.
15,000 pcs.
30,000 pcs.
Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units. For samples, please contact our sales representative.
2. Please contact our sales representative for connectors having a number of pins other than those listed above.
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Panasonic Corporation 2021
ACCTB66E 202110
Narrow pitch connectors S35 (0.35 mm pitch)
SPECIFICATIONS
Characteristics
Item
Electrical
characteristics
Mechanical
characteristics
Rated voltage
60 V AC/DC
Dielectric strength
150 V AC for 1 min.
No short-circuiting or damage at a detection current of
1 mA when the specified voltage is applied for 1 min.
Insulation resistance
Min. 1,000 MΩ (Initial)
Using 250 V DC megger (applied for 1 min.)
Contact resistance
Max. 90 mΩ
According to the contact resistance measurement
method of JIS C 5402
Composite insertion
force
h = 0.6 mm
20 or less pins: Max. 26.0 N, pin contact
Over 22 pins: Max. 1.300 N/pin contact × pin contacts
(Initial stage)
h = 0.8 mm Max. 1.300 N/pin contact × pin contacts
(Initial stage)
Composite removal
force
Min. 0.215 N/pin contact × pin contacts
Ambient temperature
–55 to +85°C
No icing. No condensation.
Soldering heat
resistance
The initial specification must be satisfied electrically
and mechanically.
Reflow soldering:
Peak temperature: 260°C or less
(on the surface of the PC board around the connector
terminals)
Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
Storage temperature
–55 to +85°C (Products only)
–40 to +50°C (Packaging structure)
No icing. No condensation.
Conformed to MIL-STD-202F, method 107G
Order Temperature (℃) Time (minutes)
1
30
ｰ55ｰ03
2
Max. 5
3
30
85 +30
4
Max. 5
ｰ55ｰ03
Thermal shock
resistance
(header and socket
mated)
5 cycles,
insulation resistance: Min. 100 MΩ,
contact resistance: Max. 90 mΩ
Humidity resistance
(header and socket
mated)
120 hours,
insulation resistance: Min. 100 MΩ,
contact resistance: Max. 90 mΩ
Conformed to IEC60068-2-78
Temperature 40±2°C, Humidity 90 to 95% RH
Saltwater spray
resistance
(header and socket
mated)
24 hours,
insulation resistance: Min. 100 MΩ,
contact resistance: Max. 90 mΩ
Conformed to IEC60068-2-11
Temperature 35±2°C, Salt water concentration 5±1%
～
Lifetime
characteristics
Conditions
Max. 0.3 A/pin contact (Max. 5 A at total pin contacts)
～
Environmental
characteristics
Specifications
Rated current
H2S resistance (header 48 hours,
and socket mated)
contact resistance: Max. 90 mΩ
Temperature 40±2°C, Gas concentration 3±1 ppm,
Humidity 75 to 80% RH
Insertion and removal
life
Repeated insertion and removal cycles of Max. 200
times/hour
Unit weight
30 times
34 pins Socket
h = 0.6 mm: 0.01 g, h = 0.8 mm: 0.02 g
34 pins Header
h = 0.6 mm: 0.01 g, h = 0.8 mm: 0.01 g
Material and surface treatment
Part name
Material
Surface treatment
Molded portion
LCP resin (UL94V-0)
—
Contact and Post
Copper alloy
Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers
(exposed nickel portions).
Soldering terminals
Copper alloy
Sockets:
Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips)
Headers:
Base: Ni plating, Surface: Au plating (except the terminal tips)
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Panasonic Corporation 2021
ACCTB66E 202110
Narrow pitch connectors S35 (0.35 mm pitch)
DIMENSIONS
Unit: mm
CAD The CAD data of the products with a “CAD” mark can be downloaded from our Website.
Socket (Mated height: 0.6 mm)
CAD
External dimensions
Terminal coplanarity
0.59
0.08
(Contact and soldering
terminals)
1.64
0.40
(Suction face)
A
B±0.1
0.35±0.05
0.12±0.03
Y※
Z※
0.24±0.03
C±0.1
0.46
1.70
(0.825)
General tolerance: ±0.2
※Because the soldering terminal Y and Z are the unified structure,
they are connected electrically.
Dimension table
Dimensions
Number
of pins
6
A
B
C
3.55
0.70
2.95
10
4.25
1.40
3.65
12
4.60
1.75
4.00
16
5.30
2.45
4.70
20
6.00
3.15
5.40
24
6.70
3.85
6.10
30
7.75
4.90
7.15
34
8.45
5.60
7.85
40
9.50
6.65
8.90
44
10.20
7.35
9.60
50
11.25
8.40
10.65
54
11.95
9.10
11.35
60
13.00
10.15
12.40
Header (Mated height: 0.6 mm)
CAD
A
B±0.1
0.35±0.05
0.12±0.03
0.46
Terminal coplanarity
0.08
(Post and soldering
terminals)
1.12
0.62
(Suction face)
External dimensions
0.76
1.50
(Soldering
terminals-part)
0.12±0.03
C±0.1
(0.37)
Soldering terminals
General tolerance: ±0.2
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Dimension table
Dimensions
Number
of pins
6
A
B
C
2.85
0.70
2.10
10
3.55
1.40
2.80
12
3.90
1.75
3.15
16
4.60
2.45
3.85
20
5.30
3.15
4.55
24
6.00
3.85
5.25
30
7.05
4.90
6.30
34
7.75
5.60
7.00
40
8.80
6.65
8.05
44
9.50
7.35
8.75
50
10.55
8.40
9.80
54
11.25
9.10
10.50
60
12.30
10.15
11.55
Panasonic Corporation 2021
ACCTB66E 202110
Narrow pitch connectors S35 (0.35 mm pitch)
Socket (Mated height: 0.8 mm)
CAD
External dimensions
Terminal coplanarity
0.79
0.08
(Contact and soldering
terminals)
1.64
0.50
(Suction face)
A
B±0.1
0.35±0.05
0.12±0.03
Z※
Dimension table
0.46
1.70
(0.80)
Y※
0.24±0.03
C±0.1
General tolerance: ±0.2
※Because the soldering terminal Y and Z are the unified structure,
they are connected electrically.
Dimensions
Number
of pins
12
A
B
C
4.45
1.75
3.85
24
6.55
3.85
5.95
34
8.30
5.60
7.70
44
10.05
7.35
9.45
Header (Mated height: 0.8 mm)
CAD
A
B±0.1
0.35±0.05
0.12±0.03
0.65
1.11
0.62
(Suction face)
External dimensions
Terminal coplanarity
0.08
(Post and soldering
terminals)
Soldering
terminals
0.12±0.03
C±0.1
(0.36)
0.78
1.50
(Soldering
terminals-part)
Dimension table
General tolerance: ±0.2
Dimensions
Number
of pins
12
A
B
C
3.75
1.75
3.15
24
5.85
3.85
5.25
34
7.60
5.60
7.00
44
9.35
7.35
8.75
0.60±0.1
0.80±0.1
Socket and Header are mated
Header
Header
Socket
Socket
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Panasonic Corporation 2021
ACCTB66E 202110
Narrow pitch connectors S35 (0.35 mm pitch)
EMBOSSED TAPE DIMENSIONS
Unit: mm
Specifications for taping
Specifications for the plastic reel
In accordance with EIAJ ET-7200B.
C±1
Label
Top cover tape
Embossed carrier tape
（4.0）
φ380
Tape I
（A +0.3
ｰ ）
0.1
（B）
（1.75）
Embossed mounting-hole
（2.0）
Taping reel
（4.0）
Leading direction after packaging
In accordance with JIS C 0806-3:1999. However, not applied
to the mounting-hole pitch of some connectors.
φ1.5+0.1
0
Dimension table
Type/Mated height
Number of pins
Type of taping
A
B
C
Quantity per reel
Socket
0.6 mm, 0.8 mm
Max. 30
Tape I
16.0
7.5
17.4
15,000
34 to 60
Tape I
24.0
11.5
25.4
15,000
Type/Mated height
Number of pins
Type of taping
A
B
C
Quantity per reel
Header
0.6 mm, 0.8 mm
Max. 34
Tape I
16.0
7.5
17.4
15,000
40 to 60
Tape I
24.0
11.5
25.4
15,000
Connector orientation with respect to embossed tape feeding direction
There is no indication on this product regarding top-bottom or left-right orientation.
Direction
of tape progress
Type
Common for S35
Socket
Header
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Panasonic Corporation 2021
ACCTB66E 202110
Narrow pitch connectors S35 (0.35 mm pitch)
NOTES
Unit: mm
Design of PC board patterns
Conduct the recommended foot pattern design, in order to
preserve the mechanical strength of terminal solder areas.
Recommended PC board and metal mask patterns
Connectors are mounted with high pitch density, intervals of
0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and
flux rise, solder bridges and other issues make sure the proper
levels of solder is used.
The figures are recommended patterns. Please use them as a
reference.
Socket (Mated height: 0.6 mm)
Socket (Mated height: 0.8 mm)
2.00±0.01
1.20±0.01
(0.40)
1.72±0.01
(0.26)
(0.31)
1.38±0.01
2.00±0.01
2.00±0.01
1.20±0.01
(0.40)
1.64±0.01
(0.22)
: Insulation area
Recommended metal mask pattern
Metal mask thickness: When 100 μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
0.35±0.01
0.18±0.01
0.40±0.01
0.50±0.01
0.80±0.01
1.275±0.01
0.40±0.01
0.49±0.01
0.85±0.01
1.35±0.01
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(0.40)
0.20±0.03
1.20±0.03
2.00±0.03
1.72±0.03
0.40±0.03
0.50±0.03
0.80±0.03
1.275±0.03
: Insulation area
Recommended metal mask pattern
Metal mask thickness: When 100 μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
0.35±0.01
0.18±0.01
0.35±0.03
0.20±0.03
(0.31)
1.38±0.01
2.00±0.01
0.40±0.03
0.49±0.03
0.85±0.03
1.35±0.03
(0.40)
1.64±0.03
0.35±0.03
0.20±0.03
Recommended PC board pattern
(TOP VIEW)
0.20±0.03
1.20±0.03
2.00±0.03
Recommended PC board pattern
(TOP VIEW)
ー7ー
Panasonic Corporation 2021
ACCTB66E 202110
Narrow pitch connectors S35 (0.35 mm pitch)
Header (Mated height: 0.6 mm and 0.8mm)
0.35±0.03
0.20±0.03
0.28±0.03
0.70±0.03
(0.40)
0.66±0.03
1.00±0.03
1.80±0.03
1.80±0.03
1.00±0.03
(0.40)
Recommended PC board pattern
(TOP VIEW)
: Insulation area
0.35±0.01
0.18±0.01
(0.31)
1.18±0.01
1.80±0.01
1.80±0.01
1.00±0.01
(0.40)
Recommended metal mask pattern
Metal mask thickness: When 100 μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
0.28±0.01
0.70±0.01
Please refer to "the latest product specifications"
when designing your product.
•Requests to customers:
https://industrial.panasonic.com/ac/e/salespolicies/
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Panasonic Corporation 2021
ACCTB66E 202110
For board-to-board/board-to-FPC
Notes on Using Narrow pitch Connectors/High Current Connectors
About safety remarks
Observe the following safety remarks to prevent accidents
and injuries.
• Do not use these connectors beyond the specification
sheets. The usage outside of specified rated current,
dielectric strength, and environmental conditions and
so on may cause circuitry damage via abnormal heating,
smoke, and fire.
• In order to avoid accidents, your thorough specification
review is appreciated. Please contact our sales
representative if your usage is out of the specifications.
Otherwise, Panasonic Corporation cannot guarantee the
quality and reliability.
• Panasonic Corporation is consistently striving to improve
quality and reliability. However, the fact remains that
electrical components and devices generally cause failures
at a given statistical probability. Furthermore, their
durability varies with use environments or use conditions.
In this respect, please check for actual electrical
components and devices under actual conditions before
use. Continued usage in a state of degraded condition
may cause the deteriorated insulation, thus result in
abnormal heat, smoke or firing. Please carry out safety
design and periodic maintenance including redundancy
design, design for fire spread prevention, and design for
malfunction prevention so that no accidents resulting in
injury or death, fire accidents, or social damage will be
caused as a result of failure of the products or ending life
of the products.
Regarding the design of devices and PC board patterns
• When using board to board connectors, a pair of board
shaII NOT be connected with multiple connectors.
Otherwise, misaligned connector positions may
cause mating failure or product breakage. Panasonic
corporation does not guarantee the failures caused by
using the multiple connectors.
• With mounting equipment, there may be up to a ±0.2
to 0.3 mm error in positioning. Be sure to design PC
boards and patterns while taking into consideration the
performance and abilities of the required equipment.
• Some connectors have tabs embossed on the body to aid
in positioning. When using these connectors, make sure
that the PC board is designed with positioning holes to
match these tabs.
• To ensure the required mechanical strength when
soldering the connector terminals, make sure the PC
board meets recommended PC board pattern design
dimensions given.
• PC board
Control the thicknesses of the cover lay and adhesive to
prevent poor soldering. This connector has no stand-off.
Therefore, minimize the thickness of the cover lay, etc. so
as to prevent the occurrence of poor soldering.
• For all connectors of the narrow pitch series, to prevent
the PC board from coming off during vibrations or
impacts, and to prevent loads from falling directly on the
soldered portions, be sure to design some means to fix
the PC board in place.
Example ) Secure in place with screws
• When mounting connectors on a FPC
• When the connector soldered to FPC is mated or
unmated, solder detachment may occur by the force to
the terminals.
Connector handling is recommended in the condition
when the reinforcing plate is attached to the backside
of FPC where the connector is mounted. The external
dimension of the reinforcing plate is recommended
to be larger than the dimension of “ Recommended
PC board pattern ” ( extended dimension of one side
is approximately 0.5 to 1.0 mm ). The materials and
thickness of the reinforcing plate are glass epoxy or
polyimide ( thickness 0.2 to 0.3 mm ) or SUS ( thickness
0.1 to 0.2 mm ).
• As this connector has temporary locking structure, the
connector mating may be separated by the dropping
impact depend on the size, weight or bending force
of the FPC. Please consider the measures at usage to
prevent the mating separation.
• The narrow pitch connector series is designed to be
compact and thin. Although ease of handling has
been taken into account, take care when mating the
connectors, as displacement or angled mating could
damage or deform the connector.
Screw
↓
↓
Spacer
Connector
Spacer
PC board
When connecting PC boards, take appropriate measures
to prevent the connector from coming off.
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Panasonic Corporation 2021
ACCTB48E 202110
Notes on Using Narrow pitch Connectors/High Current Connectors
Regarding the selection of the connector placement machine and the mounting procedures
• Select the placement machine taking into consideration
the connector height, required positioning accuracy, and
packaging conditions.
• Be aware that if the chucking force of the placement
machine is too great, it may deform the shape of the
connector body or connector terminals.
• Be aware that during mounting, external forces may be
applied to the connector contact surfaces and terminals
and cause deformations.
• Depending on the size of the connector being used, self
alignment may not be possible. In such cases, be sure to
carefully position the terminal with the PC board pattern.
• The positioning bosses give an approximate alignment
for positioning on the PC board. For accurate positioning
of the connector when mounting it to the PC board, we
recommend using an automatic positioning machine.
• In case of dry condition, please note the occurrence of
static electricity. The product may be adhered to the
embossed carrier tape or the cover tape in dry condition.
Recommended humidity is from 40 to 60% RH and please
remove static electricity by ionizer in manufacturing
process.
Regarding soldering
■ Reflow soldering
• Measure the recommended profile temperature for
reflow soldering by placing a sensor on the PC board
near the connector surface or terminals. ( Please refer
to the specification for detail because the temperature
setting differs by products. )
• As for cream solder printing, screen printing is
recommended.
• When setting the screen opening area and PC board
foot pattern area, refer the recommended PC board
pattern and window size of metal mask on the
specification sheet, and make sure that the size of
board pattern and metal mask at the base of the
terminals are not increased.
• Please pay attentions not to provide too much solder. It
makes miss mating because of interference at soldering
portion when mating.
Terminal
Paste solder
PC board foot pattern
• When mounting on both sides of the PC board and the
connector is mounting on the underside, use adhesives
or other means to ensure the connector is properly
fixed to the PC board. ( Double reflow soldering on the
same side is possible. )
• The condition of solder or flux rise and wettability varies
depending on the type of solder and flux. Solder and
flux characteristics should be taken into consideration
and also set the reflow temperature and oxygen level.
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• Do not use resin-containing solder. Otherwise, the
contacts might be firmly fixed.
• Soldering conditions
Please use the reflow temperature profile conditions
recommended below for reflow soldering. Please
contact our sales representative before using a
temperature profile other than that described below (
e.g. lead-free solder )
Temperature
Peak temperature
260℃
230℃
Preheating
180℃
150℃
60 to 120 sec.
220℃
200℃
25 sec.
70 sec.
Upper limited
(Solder heat resistance)
Lower limited
(Solder wettability)
Time
For products other than the ones above, please refer to
the latest product specifications.
• The temperature profiles given in this catalog are values
measured when using the connector on a resin-based
PC board. When performed reflow soldering on a
metal board ( iron, aluminum, etc. ) or a metal table to
mount on a FPC, make sure there is no deformation or
discoloration of the connector before mounting.
• Please contact our sales representative when using a
screen-printing thickness other than that recommended.
Panasonic Corporation 2021
ACCTB48E 202110
Notes on Using Narrow pitch Connectors/High Current Connectors
■ Hand soldering
• Be aware that soldering while applying a load on the
connector terminals may cause improper operation of
the connector.
• Thoroughly clean the soldering iron.
• Flux from the solder wire may get on the contact
surfaces during soldering operations. After soldering,
carefully check the contact surfaces and clean off any
solder before use.
• These connector is low profile type. If too much solder
is supplied for hand soldering, It makes miss mating
because of interference at soldering portion. Please pay
attentions.
• Set the soldering iron so that the tip temperature is less
than that given in the table below.
Table A
Product name
Soldering iron temperature
SMD type connectors all products
300℃ within 5 sec.
350℃ within 3 sec.
rin
S
iro old
n e
Apply the solder
wire here
g
• Do not allow flux to spread onto the connector leads
or PC board. This may lead to flux rising up to the
connector inside.
• Touch the soldering iron to the foot pattern. After the
foot pattern and connector terminal are heated, apply
the solder wire so it melts at the end of the connector
terminals.
Small angle as
possible up to
45 degrees
Terminal
PC board
Pattern
■ Solder reworking
• Finish reworking in one operation.
• In case of soldering rework of bridges. Do not use
supplementary solder flux. Doing so may cause contact
problems by flux.
• Keep the soldering iron tip temperature below the
temperature given in Table A.
Handling single components
• Make sure not to drop or allow parts to fall from work
bench.
• Excessive force applied to the terminals could cause
warping, come out, or weaken the adhesive strength of
the solder. Handle with care.
• Do not insert or remove the connector when it is not
soldered. Forcibly applied external pressure on the
terminals can weaken the adherence of the terminals
to the molded part or cause the terminals to lose their
evenness.
Precautions for mating
This product is designed with ease of handling. However,
in order to prevent the deformation or damage of contacts
and molding, take care and do not mate the connectors as
shown right.
Our products are symmetrical structure. Please avoid reverse
insertion of connector. Inserting a connector in a circuit
direction opposite to that you intended may cause circuitry
damage via abnormal heating, smoke, and fire.
Press-fitting while the mating
Strongly pressed and
inlets of the socket and
Tilted mating
twisted
header are not matched.
Cleaning flux from PC board
There is no need to clean this product.
If cleaning it, pay attention to the following points to
prevent the negative effect to the product.
• Keep the cleaning solvent clean and prevent the
connector contacts from contamination.
• Some cleaning solvents are strong and they may dissolve
the molded part and characters, so pure water passed
liquid solvent is recommended.
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
ー 11 ー
Panasonic Corporation 2021
ACCTB48E 202110
Notes on Using Narrow pitch Connectors/High Current Connectors
Handling the PC board
■ Handling the PC board after mounting the
connector
The soldered areas should not be subjected to force.
When cutting or bending the PC board after mounting
the connector, be careful that the soldered sections are
subjected to excessive force.
Storage of connectors
• To prevent problems from voids or air pockets due to
heat of reflow soldering, avoid storing the connectors in
areas of high humidity.
• Depending on the connector type, the color of the
connector may vary from connector to connector
depending on when it is produced. Some connectors may
change color slightly if subjected to ultraviolet rays during
storage. This is normal and will not affect the operation
of the connector.
• When storing the connectors with the PC boards
assembled and components already set, be careful not
to stack them up so the connectors are subjected to
excessive forces.
• Avoid storing the connectors in locations with excessive
dust. The dust may accumulate and cause improper
connections at the contact surfaces.
Other Notes
• Do not remove or insert the electrified connector ( in the
state of carrying current or applying voltage ).
• Dropping of the products or rough mishandling may
bend or damage the terminals and possibly hinder proper
reflow soldering.
• Before soldering, try not to insert or remove the
connector more than absolutely necessary.
• When coating the PC board after soldering the connector
to prevent the deterioration of insulation, perform the
coating in such a way so that the coating does not get on
the connector.
• There may be variations in the colors of products from
different production lots. This is normal.
• The connectors are not meant to be used for switching.
• Product failures due to condensation are not covered by
warranty.
Regarding sample orders to confirm proper mounting
When ordering samples to confirm proper mounting
with the placement machine, connectors are delivered in
50-piece units in the condition given right. Consult a sale
representative for ordering sample units.
Condition when delivered from manufacturing
Embossed tape
amount required
for the mounting
Reel
Delivery can also be made on
a reel by customer request.
Required number
of products for
sample production
( Unit 50 pcs. )
Please refer to "the latest product specifications"
when designing your product.
•Requests to customers:
https://industrial.panasonic.com/ac/e/salespolicies/
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
ー 12 ー
Panasonic Corporation 2021
ACCTB48E 202110
Please contact ..........
Electromechanical Control Business Division
1006, Oaza Kadoma, Kadoma-shi, Osaka 571-8506, Japan
industral.panasonic.com/ac/e/
©Panasonic Corporation 2021
ACCTB66E 202110
Specifications are subject to change without notice.
