For board-to-FPC
S35 Series
Narrow Pitch Connectors
(0.35mm pitch)
FEATURES
1. 1.7 mm wide slim two-piece type
connector
Mated height 0.6 mm
Smaller compared to A4F series
• Width: Approx. 44% down
New
Socket
m
m
7m
1.
5m
1.
Mated
height
0.6mm
S35
Approx. 44%
down
3. Slim, low-profile construction with
proprietary
construction for both high contact
reliability and easy implementation.
S35 (h = 0.6 mm)
Socket
s)
Header
m
5m
Width: 1.7mm (S35)
Width: 3.0mm (A4F)
Mated height 0.8 mm
Smaller compared to A35S/A4S series
• Width: Approx. 32% down
h
itc
1.7
mm
5
0.3
mm
(p
2-point soldering
s)
Header
S35
8.4
)
RoHS compliant
Mated
height
0.8mm
pin
(34
Approx. 32%
down
Width: 1.7mm (S35)
1.5
mm
5
0.3
5
0
mm
) 7.7
tch
mm
mm
(pi
(34
pin
S35 (h = 0.8 mm)
Width: 2.5mm (A35S/A4S)
Socket
s)
2. Low profile body: 0.6mm and 0.8mm
mated height
8.3
)
tch
1.7
m
mm
(pi
(34
pin
5m
0.3
2-point soldering
s)
Header
m
)
1.5
m
mm
ch
pit
(34
pin
0m
7.6
(
5m
0.3
4. For 0.6 mm mated height, thanks to
our proprietary “Fine fitting structure”,
high removability with a nice click feel
is maintained while being low profile.
APPLICATIONS
All types of board-to-FPC connection
applications for miniature mobile
devices such as wearable devices.
–1–
ACCTB66E 201408-T
Narrow pitch connectors S35 (0.35mm pitch)
ORDERING INFORMATION
■ 0.6mm
■ 0.8mm
AXG
1
4
4
AXG
2
2
1: Socket
2: Header
1: Socket
2: Header
Number of pins (2 digits)
Number of pins (2 digits)
Mated height
/
1: 0.6 mm
Mated height
/
2: 0.8 mm
Functions
4: Without positioning bosses / Fine fitting structure
Functions
2: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
4: Base: Ni plating, Surface: Au plating (for Ni barrier available)
4: Base: Ni plating, Surface: Au plating
Surface treatment (Contact portion / Terminal portion)
4: Base: Ni plating, Surface: Au plating (for Ni barrier available)
4: Base: Ni plating, Surface: Au plating
4
PRODUCT TYPES
Mated height
0.6mm
0.8mm
Number of pins
6
10
12
16
20
24
30
34
40
44
50
54
60
12
24
34
44
Part number
Socket
AXG106144
AXG110144
AXG112144
AXG116144
AXG120144
AXG124144
AXG130144
AXG134144
AXG140144
AXG144144
AXG150144
AXG154144
AXG160144
AXG112224
AXG124224
AXG134224
AXG144224
Packing
Header
AXG206144
AXG210144
AXG212144
AXG216144
AXG220144
AXG224144
AXG230144
AXG234144
AXG240144
AXG244144
AXG250144
AXG254144
AXG260144
AXG212224
AXG224224
AXG234224
AXG244224
Inner carton (1-reel)
Outer carton
15,000 pieces
30,000 pieces
15,000 pieces
30,000 pieces
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
Samples for mounting check: 50-connector units. Please contact our sales office.
Samples: Small lot orders are possible. Please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
–2–
ACCTB66E 201408-T
Narrow pitch connectors S35 (0.35mm pitch)
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Specifications
Each pin: Max. 0.3 A (All pins can carry: Max. 5A)
60V AC/DC
Breakdown voltage
150V AC for 1 minute
Insulation resistance
Min. 1,000MΩ (Initial stage)
Contact resistance
Max. 90mΩ
Composite insertion force
Composite removal force
Ambient temperature
Conditions
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Using 250V DC megger (applied for 1 minute)
According to the contact resistance measurement method of
JIS C 5402
• h = 0.6 mm 20 or less contacts: Max. 26.0N, Over
22 contacts: Max. 1. 300 N/contact × Number of
contacts (Initial stage)
• h = 0.8 mm Max. 1. 300 N/contact × Number of
contacts (Initial stage)
Min. 0.215N/contact × Number of contacts
–55°C to +85°C
No freezing at low temperatures. No dew condensation.
Soldering heat resistance
The initial specification must be satisfied electrically
and mechanically
Max. peak temperature of 260°C
Infrared reflow soldering (PC board surface temperature
near connector terminals)
Soldering iron
300°C within 5 sec.
350°C within 3 sec.
Storage temperature
–55°C to +85°C (Products only)
–40°C to +50°C (Packaging structure)
No freezing at low temperatures. No dew condensation.
Conformed to MIL-STD-202F, method 107G
Environmental
characteristics
Thermal shock resistance
(Header and socket mated)
Humidity resistance
(Header and socket mated)
Salt water spray resistance
(Header and socket mated)
H2S resistance
(Header and socket mated)
Lifetime
characteristics
Insertion and removal life
Unit weight
After 5 cycles
Insulation resistance: Min. 100MΩ,
Contact resistance: Max. 90mΩ
After 120 hours
Insulation resistance: Min. 100MΩ,
Contact resistance: Max. 90mΩ
After 24 hours
Insulation resistance: Min. 100MΩ,
Contact resistance: Max. 90mΩ
After 48 hours
Contact resistance: Max. 90mΩ
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to MIL-STD-1344A, method 1002
Bath temperature 40±2°C,
Humidity 90 to 95% R.H.
Conformed to MIL-STD-1344A, method 1001
Bath temperature 35±2°C,
Salt water concentration 5±1%
Conformed to JEIDA-38-1984
Bath temperature 40±2°C, Gas concentration 3±1 ppm,
Humidity 75 to 80% R.H.
30 times
• Contact resistance: Max. 90mΩ
Repeated insertion and removal cycles of max. 200 times/
• Composite removal force: Min. 0. 215 N/contact ×
hour
Number of contacts.
34 pins Socket h = 0.6 mm: 0.01g, h = 0.8 mm: 0.02g
34 pins Header h = 0.6 mm: 0.01g, h = 0.8 mm: 0.01g
2. Material and surface treatment
Part name
Material
Molded portion
Heat resistant plastic (LCP resin)
(UL94V-0)
Contact and Post
Copper alloy
Surface treatment
—
Contact portion (Main): Au plating (Min. 0.1μm) over nickel
Contact portion (Sub): Au plating (Min. 0. 05μm) over nickel
Terminal portion: Au plating over nickel (except for top of the terminal)
Soldering terminals (Socket): Pd + Au flash plating over nickel (except for top of the terminal)
Soldering terminals (Header): Au plating over nickel (except for top of the terminal)
–3–
ACCTB66E 201408-T
Narrow pitch connectors S35 (0.35mm pitch)
DIMENSIONS (Unit: mm)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Socket (Mated height: 0.6 mm)
0.40 (Suction face)
CAD Data
A
B±0.1
0.35±0.05
0.12±0.03
The degree of terminal flat
0.59
0.08
1.64
(Contact and soldering terminals)
Dimension table (mm)
(0.825)
Z (Note 1)
0.24±0.03
C±0.1
0.46
1.70
Y (Note 1)
General tolerance: ±0.2
Number of pins/
dimension
6
3.55
0.70
2.95
10
12
16
20
24
30
34
40
44
50
54
60
4.25
4.60
5.30
6.00
6.70
7.75
8.45
9.50
10.20
11.25
11.95
13.00
1.40
1.75
2.45
3.15
3.85
4.90
5.60
6.65
7.35
8.40
9.10
10.15
3.65
4.00
4.70
5.40
6.10
7.15
7.85
8.90
9.60
10.65
11.35
12.40
B
C
A
B
C
Note: 1. Because the soldering terminal Y and Z are the unified structure, they are connected electrically.
Header (Mated height: 0.6 mm)
A
B±0.1
0.35±0.05
0.12±0.03
The degree of terminal flat
0.46
1.12
0.62 (Suction face)
CAD Data
0.08
(Post and soldering terminals)
Dimension table (mm)
1.50
(Soldering terminal)
0.76
0.12±0.03
C±0.1
(0.37)
Soldering terminals
Number of pins/
dimension
6
2.85
0.70
2.10
10
12
16
20
24
30
34
40
44
50
54
60
3.55
3.90
4.60
5.30
6.00
7.05
7.75
8.80
9.50
10.55
11.25
12.30
1.40
1.75
2.45
3.15
3.85
4.90
5.60
6.65
7.35
8.40
9.10
10.15
2.80
3.15
3.85
4.55
5.25
6.30
7.00
8.05
8.75
9.80
10.50
11.55
A
General tolerance: ±0.2
–4–
ACCTB66E 201408-T
Narrow pitch connectors S35 (0.35mm pitch)
Socket (Mated height: 0.8 mm)
0.50 (Suction face)
CAD Data
A
B±0.1
0.35±0.05
0.12±0.03
The degree of terminal flat
0.79
0.08
1.64
(Contact and soldering terminals)
(0.80)
Dimension table (mm)
Y (Note 1)
0.46
1.70
Z (Note 1)
0.24±0.03
C±0.1
Number of pins/
dimension
12
4.45
1.75
3.85
24
34
44
6.55
8.30
10.05
3.85
5.60
7.35
5.95
7.70
9.45
B
C
A
B
C
General tolerance: ±0.2
Note: 1. Because the soldering terminal Y and Z are the unified structure, they are connected electrically.
Header (Mated height: 0.8 mm)
0.62 (Suction face)
CAD Data
The degree of terminal flat
A
B±0.1
0.35±0.05
0.12±0.03
0.65
0.08
1.12
(Post and soldering terminals)
Soldering terminals
0.12
C±0.1
(0.36)
0.78
1.50
(Soldering terminal)
Dimension table (mm)
Number of pins/
dimension
12
3.75
1.75
3.15
24
34
44
5.85
7.60
9.35
3.85
5.60
7.35
5.25
7.00
8.75
A
General tolerance: ±0.2
Header
0.80±0.1
Header
0.60±0.1
Socket and Header are mated
Socket
Socket
–5–
ACCTB66E 201408-T
Narrow pitch connectors S35 (0.35mm pitch)
EMBOSSED TAPE DIMENSIONS (Unit: mm)
• Specifications for taping
(In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.)
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Tape I
(C±1)
Label
Top cover tape
380 dia.
(4.0)
Leading direction after packaging
(A +0.3
−0.1 )
(B)
1.75
(2.0)
Embossed carrier tape
Embossed mounting-hole
4.0
Taping reel
.1
+0 0
5
1.
a.
di
• Dimension table (Unit: mm)
Type/Mated height
Socket: 0.6mm and 0.8mm
Header: 0.6mm and 0.8mm
Number of pins
Max. 30
34 to 60
Max. 34
40 to 60
Type of taping
Tape I
Tape I
Tape I
Tape I
A
16.0
24.0
16.0
24.0
B
7.5
11.5
7.5
11.5
C
17.4
25.4
17.4
25.4
Quantity per reel
15,000
15,000
15,000
15,000
• Connector orientation with respect to embossed tape feeding direction
Type
Common for S35
Direction
of tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
–6–
ACCTB66E 201408-T
Narrow pitch connectors S35 (0.35mm pitch)
NOTES
1. Design of PC board patterns
Conduct the recommended foot pattern design, in order to
preserve the mechanical strength of terminal solder areas.
2. Recommended PC board and metal mask patterns
Connectors are mounted with high pitch density, intervals of 0.35
mm, 0.4 mm or 0.5 mm.
In order to reduce solder and flux rise, solder bridges and other
issues make sure the proper levels of solder is used.
The figures to the right are recommended metal mask patterns.
Please use them as a reference.
• Socket (Mated height: 0.6 mm and 0.8 mm)
• Header (Mated height: 0.6 mm and 0.8 mm)
Recommended PC board pattern (TOP VIEW)
Recommended PC board pattern (TOP VIEW)
0.35±0.03
1.80±0.03
0.70±0.03
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
Metal mask thickness: When 100μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
0.85±0.01
0.28±0.01
1.35±0.01
0.70±0.01
1.80±0.01
(0.31)
0.18±0.01
(0.40)
1.80±0.01
1.00±0.01
2.00±0.01
1.38±0.01
(0.31)
0.18±0.01
1.18±0.01
0.35±0.01
0.35±0.01
(0.40)
1.00±0.03
: Insulatin area
0.28±0.03
: Insulatin area
1.35±0.03
2.00±0.01
(0.40)
(0.40)
0.85±0.03
1.20±0.01
0.66±0.03
1.00±0.03
1.80±0.03
2.00±0.03
1.20±0.03
(0.40)
0.20±0.03
0.20±0.03
0.35±0.03
0.20±0.03
Please refer to the latest product
specifications when designing your
product.
–7–
ACCTB66E 201408-T
Notes on Using Narrow pitch Connectors
Notes on Using Narrow pitch Connectors
Regarding the design of devices and PC board patterns
1) When connecting several connectors
together by stacking, make sure to
maintain proper accuracy in the design of
structure and mounting equipment so
that the connectors are not subjected to
twisting and torsional forces.
2) With mounting equipment, there may
be up to a ±0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
5) For all connectors of the narrow pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
Example) Secure in place with screws
Screw
Spacer
Connector
PC board
Spacer
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
6) Notes when using a FPC.
(1) When the connector is soldered to an
FPC board, during its insertion and
removal procedures, forces may be
applied to the terminals and cause the
soldering to come off. It is recommended
to use a reinforcement board on the
backside of the FPC board to which the
connector is being connected. Please
make the reinforcement board
dimensions bigger than the outer limits of
the recommended PC board pattern
(should be approximately 1 mm greater
than the outer limit).
Material should be glass epoxy or
polyimide, and the thickness should be
between 0.2 and 0.3 mm.
(2) Collisions, impacts, or turning of FPC
boards, may apply forces on the
connector and cause it to come loose.
Therefore, make to design retaining
plates or screws that will fix the connector
in place.
7) The narrow pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
Regarding the selection of the connector placement machine and the mounting
procedures
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the catching force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
4) Depending on the size of the
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
–8–
6) Excessive mounter chucking force may
deform the molded or metal part of the
connector. Consult us in advance if
chucking is to be applied.
ACCTB48E 201303-T
Notes on Using Narrow pitch Connectors
Regarding soldering
Terminal
Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
• Narrow pitch connectors
(except P8 type)
Upper limited (Solder heat resistance)
Lower limited (Solder wettability)
Temperature
PC board
foot pattern
4) Consult us when using a screenprinting thickness other than that
recommended.
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) N2 reflow, conducting reflow soldering
in a nitrogen atmosphere, increases the
solder flow too greatly, enabling wicking
to occur. Make sure that the solder feed
rate and temperature profile are
appropriate.
220°C
200°C
Preheating
180°C
150°C
25 sec.
60 to 120 sec.
70 sec.
Time
• Narrow pitch connector (P8)
Table A
Product name
Soldering iron temperature
SMD type connectors
300°C within 5 sec.
350°C within 3 sec.
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
Temperature
Apply the solder
wire here
Peak temperature
245°C max.
200°C
155 to 165°C
Paste
solder
Peak temperature
Peak temperature 260°C
230°C
2. Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
So
ld
iro erin
n g
1. Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals. (The
setting for the sensor will differ depending
on the sensor used, so be sure to
carefully read the instructions that comes
with it.)
2) As for cream solder printing, screen
printing is recommended.
3) To determine the relationship between
the screen opening area and the PCboard foot pattern area, refer to the
diagrams in the recommended patterns
for PC boards and metal masks. Make
sure to use the terminal tip as a reference
position when setting. Avoid an excessive
amount of solder from being applied,
otherwise, interference by the solder will
cause an imperfect contact.
Preheating
Terminal
60 to 120 sec.
Small angle as
possible up to
45 degrees
Within 30 sec.
Time
For products other than the ones above,
please refer to the latest product
specifications.
7) The temperatures are measured at the
surface of the PC board near the
connector terminals. (The setting for the
sensor will differ depending on the sensor
used, so be sure to carefully read the
instructions that comes with it.)
8) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector beforehand
and then begin mounting.
9) Consult us when using a screenprinting thickness other than that
recommended.
10) Some solder and flux types may
cause serious solder or flux creeping.
Solder and flux characteristics should be
taken into consideration when setting the
reflow soldering conditions.
–9–
PC board
Pattern
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) For soldering of prototype devices
during product development, you can
perform soldering at the necessary
locations by heating with a hot-air gun by
applying cream solder to the foot pattern
beforehand. However, at this time, make
sure that the air pressure does not move
connectors by carefully holding them
down with tweezers or other similar tool.
Also, be careful not to go too close to the
connectors and melt any of the molded
components.
8) If an excessive amount of solder is
applied during manual soldering, the
solder may creep up near the contact
points, or solder interference may cause
imperfect contact.
3. Solder reworking
1) Finish reworking in one operation.
2) For reworking of the solder bridge, use
a soldering iron with a flat tip. To prevent
flux from climbing up to the contact
surfaces, do not add more flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
ACCTB48E 201303-T
Notes on Using Narrow pitch Connectors
Handling Single Components
1) Make sure not to drop or allow parts to
fall from work bench
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
3) Repeated bending of the terminals
may cause terminals to break.
4) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
5) Excessive prying-force applied to one
end may cause product breakage and
separation of the solder joints at the
terminal.
Excessive force applied for insertion in a
pivot action as shown may also cause
product breakage.
Align the header and socket positions
before connecting them.
Cleaning flux from PC board
3) Since some powerful cleaning
solutions may dissolve molded
components of the connector and wipe
off or discolor printed letters, we
recommend aqua pura electronic parts
cleaners. Please consult us if you wish to
use other types of cleaning fluids.
4) Please note that the surfaces of
molded parts may whiten when cleaned
with alcohol.
Handling the PC board
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage. This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
5) There may be variations in the colors
of products from different production lots.
This is normal.
6) The connectors are not meant to be
used for switching.
7) Be sure not to allow external pressure
to act on connectors when assembling
PCBs or moving in block assemblies.
1) To increase the cleanliness of the
cleaning fluid and cleaning operations,
prepare equipment for cleaning process
beginning with boil cleaning, ultrasonic
cleaning, and then vapor cleaning.
2) Carefully oversee the cleanliness of
the cleaning fluids to make sure that the
contact surfaces do not become dirty
from the cleaning fluid itself.
• Handling the PC board after
mounting the connector
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
The soldered areas should not be subjected to force.
Storage of connectors
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity. When storing the
connectors for more than six months, be
sure to consider storage area where the
humidity is properly controlled.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Other Notes
1) These products are made for the
design of compact and lightweight
devices and therefore the thickness of the
molded components has been made very
thin. Therefore, be careful during
insertion and removal operations for
excessive forces applied may damage
the products.
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
–10–
ACCTB48E 201303-T
Notes on Using Narrow pitch Connectors
Regarding sample orders to confirm proper mounting
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Please refer to the latest product
specifications when designing your
product.
Condition when delivered from manufacturing
Reel
Embossed tape
amount required for
the mounting
Required number
of products for
sample production
(Delivery can also be made on a reel by
customer request.)
(Unit 50 pcs.)
–11–
ACCTB48E 201303-T
Notes on Using Narrow pitch Connectors
–12–
ACCTB48E 201303-T