For board-to-FPC
To Be Discontinued
Last time buy: September 30, 2019
A35US
High Current Connectors
With Power Terminal
4. Power terminal type means power line is ensured without
having to use signal line. Contributes to space savings
Power terminals
Specification:
3 A in two locations
New
m
2m
2.
2.
Socket
1.
8m
2m
m
m
1.
Socket
8m
m
Header
Header
Example; Charging current: Max. 3.0 A (0.3 A/pin, Pitch: 0.35 mm)
Product without
power terminals
RoHS compliant
20 pins signal
terminals used
With power
terminal
3.5mm
3 A power terminals
20 pins signal
terminals can
be reduced.
–3.5mm
FEATURES
1. 0.6 mm Mated Height with 2.2 mm width.
2. Supports 3A power terminals
3. “
” structure provides a slim and
low-profile design resistant to various environmental
conditions.
APPLICATIONS
Multiple connection of power signal between USB and
battery in portable terminals such as smartphones and
tablet PCs
ORDERING INFORMATION
AXG
0
J
7: Socket
8: Header
Number of pins (2 digits)
Mated height
/
0: 0.6 mm
Functions
J: 3A type Power terminal
Surface treatment (Contact portion / Terminal portion)
7: Base: Ni plating, Surface: Au plating (for Ni barrier available)
4: Base: Ni plating, Surface: Au plating
–1–
ACCTB78E 201809-T
To Be Discontinued
Last time buy: September 30, 2019
High current connectors A35US with power terminal (0.35mm pitch)
PRODUCT TYPES
Number of pins
Mated height
0.6mm
Part number
Packing
10
Socket
AXG7100J7
Header
AXG8100J4
12
16
20
24
30
34
40
44
50
60
70
AXG7120J7
AXG7160J7
AXG7200J7
AXG7240J7
AXG7300J7
AXG7340J7
AXG7400J7
AXG7440J7
AXG7500J7
AXG7600J7
AXG7700J7
AXG8120J4
AXG8160J4
AXG8200J4
AXG8240J4
AXG8300J4
AXG8340J4
AXG8400J4
AXG8440J4
AXG8500J4
AXG8600J4
AXG8700J4
Inner carton (1-reel)
Outer carton
10,000 pieces
20,000 pieces
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
Item
Rated voltage
Specifications
3.0A/pin contact (power terminal)
0.30A/pin contact (signal terminal): Max. 5 A at total
pin contacts
60V AC/DC
Dielectric strength
150V AC for 1 min.
Rated current
Electrical
characteristics
Insulation resistance
Contact resistance
Mechanical
characteristics
Composite insertion force
Composite removal force
Contact holding force
(Socket signal terminal,
Header power terminal)
Ambient temperature
Storage temperature
Conditions
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Using 250V DC megger (applied for 1 min.)
Min. 1,000MΩ (initial)
Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal)
1.300N/pin contacts × pin contacts
0.165N/pin contacts × pin contacts
Based on the contact resistance measurement method
specified by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
Min. 0.20N/pin contacts
–55°C to +85°C
No icing or condensation.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
No icing or condensation.
Conformed to MIL-STD-202F, method 107G
Thermal shock resistance
(header and socket mated)
Environmental
characteristics
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H2S resistance
(header and socket mated)
Lifetime
characteristics
Insertion and removal life
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 30mΩ (power terminal)
max. 90mΩ (signal terminal)
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 30mΩ (power terminal)
max. 90mΩ (signal terminal)
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 30mΩ (power terminal)
max. 90mΩ (signal terminal)
48 hours,
contact resistance max. 30mΩ (power terminal)
max. 90mΩ (signal terminal)
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
saltwater concentration 5%±1%
30 times
Soldering heat resistance
The initial specification must be satisfied electrically
and mechanically
Unit weight
60 pin contacts: Socket 0.02g Header 0.01g
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Repeated insertion and removal speed of max. 200 times/
hours
Infrared reflow soldering: Peak temperature: 260°C or less
(on the surface of the PC board
around the connector terminals)
Soldering iron: 300°C within 5 sec.
350°C within 3 sec.
2. Material and surface treatment
Part name
Molded
portion
Contact and
Post
Material
LCP resin
(UL94V-0)
Copper alloy
Surface treatment
—
Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Power terminals: Sockets: Base: Ni plating, Surface: Au plating (except the terminal tips)
Headers: Base: Ni plating, Surface: Au plating
–2–
ACCTB78E 201809-T
To Be Discontinued
Last time buy: September 30, 2019
High current connectors A35US with power terminal (0.35mm pitch)
DIMENSIONS (Unit: mm)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Socket (Mated height: 0.6 mm)
Terminal coplanarity
A
B±0.1
0.35±0.05
0.12±0.03
0.59
2.20
Dimension table (mm)
Power terminal
Signal terminal
(0.55)
2.20
Y (Note)
0.08
(Contact and Power terminal)
1.96
0.60 (Suction face)
CAD Data
0.66
Z (Note)
0.30±0.03
C±0.1
Number of pins/
dimension
10
4.25
1.40
3.45
12
16
20
24
30
34
40
44
50
60
70
4.60
5.30
6.00
6.70
7.75
8.45
9.50
10.20
11.25
13.00
14.75
1.75
2.45
3.15
3.85
4.90
5.60
6.65
7.35
8.40
10.15
11.90
3.80
4.50
5.20
5.90
6.95
7.65
8.70
9.40
10.45
12.20
13.95
B
C
A
B
C
General tolerance: ±0.2
Note: Since power terminals are built into the body, the Y and Z parts are connected electrically.
Header (Mated height: 0.6 mm)
Terminal coplanarity
A
B±0.1
0.35±0.05
0.12±0.03
0.46
0.08
(Post and Power terminal)
1.42
1.80
0.80 (Suction face)
CAD Data
0.08±0.03
C±0.1
0.48
0.32
1.28
(Power terminal)
Signal terminal
Power terminal
Dimension table (mm)
Number of pins/
dimension
10
3.55
1.40
3.17
12
16
20
24
30
34
40
44
50
60
70
3.90
4.60
5.30
6.00
7.05
7.75
8.80
9.50
10.55
12.30
14.05
1.75
2.45
3.15
3.85
4.90
5.60
6.65
7.35
8.40
10.15
11.90
3.52
4.22
4.92
5.62
6.67
7.37
8.42
9.12
10.17
11.92
13.67
A
General tolerance: ±0.2
Header
0.60±0.1
Socket and Header are mated
Socket
–3–
ACCTB78E 201809-T
To Be Discontinued
Last time buy: September 30, 2019
High current connectors A35US with power terminal (0.35mm pitch)
EMBOSSED TAPE DIMENSIONS (Unit: mm)
• Specifications for taping
(In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.)
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Tape I
(A +0.3
−0.1 )
(C±1)
Label
380 dia.
Top cover tape
(4.0)
Leading direction after packaging
(B)
(1.75)
Embossed carrier tape
(2.0)
Embossed mounting-hole
4.0
Taping reel
.1
+0 0
5
1.
a.
di
• Dimension table (Unit: mm)
Socket
Header
Number of pins
Max. 30
Type of taping
Tape I
A
16.0
B
7.5
C
17.4
Quantity per reel
10,000
34 to 70
Tape I
24.0
11.5
25.4
10,000
Number of pins
Max. 34
40 to 70
Type of taping
Tape I
Tape I
A
16.0
24.0
B
7.5
11.5
C
17.4
25.4
Quantity per reel
10,000
10,000
• Connector orientation with respect to embossed tape feeding direction
Type
Common for A35US with power terminal
Direction
of tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
–4–
ACCTB78E 201809-T
To Be Discontinued
Last time buy: September 30, 2019
High current connectors A35US with power terminal (0.35mm pitch)
NOTES
12
0.60±0.03
1.325±0.03
: Insulatin
area
(0.50)
0.90±0.03
1.20±0.03
2.20±0.03
(0.39)
0.70±0.03
0.35±0.03
0.20±0.03
: Insulatin
area
0.26±0.03
1.045±0.03
0.60±0.01
1.325±0.01
1.42±0.01
(0.39)
0.35±0.01
0.18±0.01
(0.39)
15
0.
C
8×
0.35±0.01
0.18±0.01
1.48±0.01
Metal mask thickness: When 100μm
(Signal terminal opening ratio: 70%)
(Power terminal opening ratio: 77%)
0.70±0.01
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 46%)
(0.39)
1.82±0.01
2.60±0.01
Recommended metal mask pattern
0.20±0.01
0.885±0.01
Please refer to the latest product
specifications when designing your
product.
–5–
ACCTB78E 201809-T
2.20±0.01
×C
0.
15
0.35±0.03
0.20±0.03
1.48±0.03
Recommended PC board pattern (TOP VIEW)
(0.50)
0.20±0.03
1.60±0.03
2.60±0.03
• Header (Mated height: 0.6 mm)
Recommended PC board pattern (TOP VIEW)
2.50±0.03
1.04±0.03
(0.73)
• Socket (Mated height: 0.6 mm)
2.50±0.01
1.80±0.01
(0.35)
1. Design of PC board patterns
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
2. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
Notes on Using Narrow pitch Connectors/High Current Connectors
For board-to-board/board-to-FPC
Notes on Using Narrow pitch Connectors/
High Current Connectors
About safety remarks
Observe the following safety remarks to prevent accidents and injuries.
3) Panasonic Corporation is consistently striving to improve
1) Do not use these connectors beyond the specification sheets.
quality and reliability. However, the fact remains that electrical
The usage outside of specified rated current, dielectric strength,
components and devices generally cause failures at a given
and environmental conditions and so on may cause circuitry
statistical probability. Furthermore, their durability varies with
damage via abnormal heating, smoke, and fire.
use environments or use conditions. In this respect, please
2) In order to avoid accidents, your thorough specification review
check for actual electrical components and devices under actual
is appreciated. Please contact our sales office if your usage is
conditions before use. Continued usage in a state of degraded
out of the specifications. Otherwise, Panasonic Corporation
condition may cause the deteriorated insulation, thus result in
cannot guarantee the quality and reliability.
abnormal heat, smoke or firing. Please carry out safety design
and periodic maintenance including redundancy design, design
for fire spread prevention, and design for malfunction prevention
so that no accidents resulting in injury or death, fire accidents, or
social damage will be caused as a result of failure of the
products or ending life of the products.
Regarding the design of devices and PC board patterns
1) When using the board to board connectors, do not connect a
pair of board with multiple connectors. Otherwise, misaligned
connector positions may cause mating failure or product
breakage.
2) With mounting equipment, there may be up to a ±0.2 to 0.3
mm error in positioning. Be sure to design PC boards and
patterns while taking into consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed on the body to aid in
positioning. When using these connectors, make sure that the
PC board is designed with positioning holes to match these tabs.
4) To ensure the required mechanical strength when soldering
the connector terminals, make sure the PC board meets
recommended PC board pattern design dimensions given.
5) PC board
Control the thicknesses of the cover lay and adhesive to prevent
poor soldering. This connector has no stand-off. Therefore,
minimize the thickness of the cover lay, etc. so as to prevent the
occurrence of poor soldering.
6) For all connectors of the narrow pitch series, to prevent the
PC board from coming off during vibrations or impacts, and to
prevent loads from falling directly on the soldered portions, be
sure to design some means to fix the PC board in place.
Example) Secure in place with screws
7) When mounting connectors on a FPC
• When the connector soldered to FPC is mated or unmated,
solder detachment may occur by the force to the terminals.
Connector handling is recommended in the condition when the
reinforcing plate is attached to the backside of FPC where the
connector is mounted. The external dimension of the reinforcing
plate is recommended to be larger than the dimension of
“Recommended PC board pattern” (extended dimension of one
side is approximately 0.5 to 1.0 mm). The materials and
thickness of the reinforcing plate are glass epoxy or polyimide
(thickness 0.2 to 0.3 mm) or SUS (thickness 0.1 to 0.2 mm).
• As this connector has temporary locking structure, the
connector mating may be separated by the dropping impact
depend on the size, weight or bending force of the FPC. Please
consider the measures at usage to prevent the mating
separation.
8) The narrow pitch connector series is designed to be compact
and thin. Although ease of handling has been taken into
account, take care when mating the connectors, as
displacement or angled mating could damage or deform the
connector.
Screw
↓
↓
Spacer
Connector
PC board
Spacer
When connecting PC boards, take appropriate measures to
prevent the connector from coming off.
–6–
ACCTB48E 201803-T
Notes on Using Narrow pitch Connectors/High Current Connectors
Regarding the selection of the connector placement machine and the mounting
procedures
1) Select the placement machine taking into consideration the
connector height, required positioning accuracy, and packaging
conditions.
2) Be aware that if the chucking force of the placement machine
is too great, it may deform the shape of the connector body or
connector terminals.
3) Be aware that during mounting, external forces may be
applied to the connector contact surfaces and terminals and
cause deformations.
4) Depending on the size of the connector being used, self
alignment may not be possible. In such cases, be sure to
carefully position the terminal with the PC board pattern.
5) The positioning bosses give an approximate alignment for
positioning on the PC board. For accurate positioning of the
connector when mounting it to the PC board, we recommend
using an automatic positioning machine.
6) In case of dry condition, please note the occurrence of static
electricity. The product may be adhered to the embossed carrier
tape or the cover tape in dry condition. Recommended humidity
is from 40 to 60%RH and please remove static electricity by
ionizer in manufacturing process.
Regarding soldering
Reflow soldering
1) Measure the recommended profile temperature for reflow
soldering by placing a sensor on the PC board near the
connector surface or terminals. (Please refer to the specification
for detail because the temperature setting differs by products.)
2) As for cream solder printing, screen printing is recommended.
3) When setting the screen opening area and PC board foot
pattern area, refer the recommended PC board pattern and
window size of metal mask on the specification sheet, and make
sure that the size of board pattern and metal mask at the base of
the terminals are not increased.
4) Please pay attentions not to provide too much solder. It
makes miss mating because of interference at soldering portion
when mating.
Terminal
Paste solder
PC board foot pattern
5) When mounting on both sides of the PC board and the
connector is mounting on the underside, use adhesives or other
means to ensure the connector is properly fixed to the PC board.
(Double reflow soldering on the same side is possible.)
6) The condition of solder or flux rise and wettability varies
depending on the type of solder and flux. Solder and flux
characteristics should be taken into consideration and also set
the reflow temperature and oxygen level.
Hand soldering
1) Set the soldering iron so that the tip temperature is less than
that given in the table below.
Table A
Product name
Soldering iron temperature
SMD type connectors all products
300°C within 5 sec.
350°C within 3 sec.
180℃
150℃
Peak temperature
Preheating
220℃
200℃
25 sec.
60 to 120 sec.
70 sec.
Upper limited
(Solder heat resistance)
Lower limited
(Solder wettability)
Time
For products other than the ones above, please refer to the
latest product specifications.
9) The temperature profiles given in this catalog are values
measured when using the connector on a resin-based PC
board. When performed reflow soldering on a metal board (iron,
aluminum, etc.) or a metal table to mount on a FPC, make sure
there is no deformation or discoloration of the connector before
mounting.
10) Please contact our sales office when using a screen-printing
thickness other than that recommended.
4) Be aware that soldering while applying a load on the
connector terminals may cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on the contact surfaces
during soldering operations. After soldering, carefully check the
contact surfaces and clean off any solder before use.
7) These connector is low profile type. If too much solder is
supplied for hand soldering, It makes miss mating because of
interference at soldering portion. Please pay attentions.
S
iro old
n eri
Apply the solder
wire here
Temperature
Peak temperature 260℃
230℃
ng
2) Do not allow flux to spread onto the connector leads or PC
board. This may lead to flux rising up to the connector inside.
3) Touch the soldering iron to the foot pattern. After the foot
pattern and connector terminal are heated, apply the solder wire
so it melts at the end of the connector terminals.
7) Do not use resin-containing solder. Otherwise, the contacts
might be firmly fixed.
8) Soldering conditions
Please use the reflow temperature profile conditions
recommended below for reflow soldering. Please contact our
sales office before using a temperature profile other than that
described below (e.g. lead-free solder)
Small angle as
possible up to
45 degrees
Terminal
PC board
Pattern
–7–
ACCTB48E 201803-T
Notes on Using Narrow pitch Connectors/High Current Connectors
Solder reworking
1) Finish reworking in one operation.
2) In case of soldering rework of bridges. Do not use
supplementary solder flux. Doing so may cause contact
problems by flux.
3) Keep the soldering iron tip temperature below the
temperature given in Table A.
Handling single components
1) Make sure not to drop or allow parts to fall from work bench.
2) Excessive force applied to the terminals could cause warping,
come out, or weaken the adhesive strength of the solder. Handle
with care.
3) Do not insert or remove the connector when it is not soldered.
Forcibly applied external pressure on the terminals can weaken
the adherence of the terminals to the molded part or cause the
terminals to lose their evenness.
Precautions for mating
This product is designed with ease of handling. However, in
order to prevent the deformation or damage of contacts and
molding, take care and do not mate the connectors as shown
right.
Press-fitting while the mating
Strongly pressed and
inlets of the socket and
twisted
header are not matched.
Tilted mating
Cleaning flux from PC board
There is no need to clean this product.
If cleaning it, pay attention to the following points to prevent the
negative effect to the product.
1) Keep the cleaning solvent clean and prevent the connector
contacts from contamination.
2) Some cleaning solvents are strong and they may dissolve the
molded part and characters, so pure water passed liquid solvent
is recommended.
Handling the PC board
Handling the PC board after mounting the connector
When cutting or bending the PC board after mounting the
connector, be careful that the soldered sections are subjected to
excessive force.
The soldered areas should not be subjected to force.
Storage of connectors
1) To prevent problems from voids or air pockets due to heat of
reflow soldering, avoid storing the connectors in areas of high
humidity.
2) Depending on the connector type, the color of the connector
may vary from connector to connector depending on when it is
produced. Some connectors may change color slightly if
subjected to ultraviolet rays during storage. This is normal and
will not affect the operation of the connector.
3) When storing the connectors with the PC boards assembled
and components already set, be careful not to stack them up so
the connectors are subjected to excessive forces.
4) Avoid storing the connectors in locations with excessive dust.
The dust may accumulate and cause improper connections at
the contact surfaces.
Other Notes
1) Do not remove or insert the electrified connector (in the state
of carrying current or applying voltage).
2) Dropping of the products or rough mishandling may bend or
damage the terminals and possibly hinder proper reflow
soldering.
3) Before soldering, try not to insert or remove the connector
more than absolutely necessary.
4) When coating the PC board after soldering the connector to
prevent the deterioration of insulation, perform the coating in
such a way so that the coating does not get on the connector.
5) There may be variations in the colors of products from
different production lots. This is normal.
6) The connectors are not meant to be used for switching.
7) Product failures due to condensation are not covered by
warranty.
–8–
ACCTB48E 201803-T
Notes on Using Narrow pitch Connectors/High Current Connectors
Regarding sample orders to confirm proper mounting
When ordering samples to confirm proper mounting with the
placement machine, connectors are delivered in 50-piece units
in the condition given right. Consult a sale representative for
ordering sample units.
Condition when delivered from manufacturing
Embossed tape
amount required
for the mounting
Required number
of products for
sample production
Reel
Delivery can also be made on a reel
by customer request.
(Unit 50 pcs.)
Please refer to the latest product specifications when
designing your product.
–9–
ACCTB48E 201803-T