Discontinued as of September 30, 2010
AXJ5
ROBUST RECEPTACLE
STRUCTURE WITHSTANDS
ROUGH HANDLING
BY USERS
FEATURES
New
Interface connectors
Micro USB (AXJ5)
CONNECTORS
Compliance with RoHS Directive
1. Compatible with the Micro USB
standards
Compatible with the new-generation USB
connector standard, which was officially
announced at the USB Implementers
Forum in January 2007
2. Resistant to twisting
These connectors have two metal pegs
added to the foot pattern recommended
by the Micro USB connector standards to
ensure secure fixing to PC boards. Also,
the shell is made of stainless steel, and
its seam has two dovetail joints, which
provides higher resistance to the force
applied for opening the seam.
3. Resistant to forcible insertion of a
plug
The large crimped parts at the rear of the
receptacle shell securely hold the
receptacle body, providing high
resistance to the forcible insertion of a
plug.
4. Structure to prevent reverse
insertion of a plug
The Micro USB standard requires that
the AB type receptacle prevents plugs
from being inserted in reverse orientation
with a resin part in its mating section.
The reinforced joint between our
receptacle shell and body is also
resistant to a plug’s reverse insertion
force.
APPLICATIONS
Interface portion of mobile phones
and digital consumer products (e.g.
DSC, DVC and Music players, etc.)
ORDERING INFORMATION
AXJ
5
3
1
G
5: Micro USB connectors
3: Receptacle
3: Micro B right angle type
6: Micro AB right angle type
1: Standard type, with the shell mating guide
2: Terminal portion: SMD, Pegs (retention fitting):
SMD and Positioning bosses: without positioning bosses
4: Terminal portion: SMD, Pegs (retention fitting):
DIP and Positioning bosses: without positioning bosses
G: Embossed tape packaging
PRODUCT TYPES
Type
Terminal shape
Micro B
Right angle type
Receptacle
SMD terminal
Micro AB
Right angle type
Pegs
(retention fitting)
SMD
DIP
SMD
DIP
Positioning bosses
Without positioning
bosses
Part number
Packing quantity
Inner carton (1 reel)
Outer carton (2 reels)
AXJ53312G
AXJ53314G
3,000 pcs.
2,500 pcs.
6,000 pcs.
5,000 pcs.
AXJ53612G
AXJ53614G
3,000 pcs.
2,500 pcs.
6,000 pcs.
5,000 pcs.
panasonic-electric-works.net/ac
Discontinued as of September 30, 2010
AXJ5
SPECIFICATIONS
1. Characteristics
Rated current
Electrical
characteristics
Rated voltage
Contact resistance
Insulation resistance
Breakdown voltage
Specifications
Conditions
When applying current only to signal terminals:
1.0 A (for terminal No. 2, 3 and 4)
When applying current to the power terminal:
1.8 A (for terminal No. 1 and 5),
0.5 A (for terminal No. 2, 3 and 4)
30V DC/AC
Max. 30mΩ
Min. 100MΩ
100V AC
(Dielectric breakdown must not occur during a 1 min.
application)
EIA-364-23 (Inductive resistance to wire is not included)
EIA-364-21 Using 100V DC megger
EIA-364-20
Detection current: 1mA
Electrostatic capacity
Max. 2pF
EIA-364-30
(Measure it between the adjacent terminals of the unmated
connector at a frequency of 1 kHz.)
Mechanical
characteristics
Composite insertion
force (initial)
Max. 35N
EIA-364-13 Insert and remove a plug at a speed of 12.5 mm/min.
Lifetime
characteristics
Insertion and removal
life
Ambient temperature
Storage temperature
10,000 times
Contact resistance: Max. 40 mΩ
Composite insertion force: Max. 35N
Composite removal force: Min. 8 N
Appearance: No abnormality
–55°C to 85°C
–55°C to 85°C (–40°C to 50°C for packaging materials)
Vibration resistance
Discontinuity: Max. 1µs
Contact resistance: Max. 40mΩ
Appearance: No abnormality
Impact resistance
Discontinuity: Max. 1µs
Contact resistance: Max. 40mΩ
Appearance: No abnormality
Humidity resistance
(mated)
Soldering
temperature
resistance
Reflow soldering
Manual soldering
No freezing or condensation in low temperatures
No freezing or condensation in low temperatures
EIA-364-28
Apply vibration in three directions including the mating axis that
are perpendicular to one another for 15 minutes respectively with
a 100 mA DC current applied.
Cord length: 100mm Fix the cord end.
EIA-364-27
Acceleration: 294m/s2 (30G)
Duration: 11 ms,
Application directions: 6 surfaces (X, Y, and Z directions)
Number of applications: 3 times respectively (Total: 18 times)
Cord length: 100mm Fix the cord end.
Environmental
characteristics
Heat resistance
(mated)
EIA-364-09
Repeated insertion and removal speed of max. 500 times/hours
(Mechanical insertion and removal)
250 hours
Contact resistance: Max. 40mΩ
Breakdown voltage: 100V AC dielectric breakdown must
not occur during a one-minute application.
Insulation resistance: Min. 100MΩ
Appearance: No abnormality
7 cycles
Contact resistance: Max. 40mΩ
Breakdown voltage: 100V AC dielectric breakdown must
not occur during a one-minute application.
Insulation resistance: Min. 100MΩ
Appearance: No abnormality
Peak temperature: Max. 260°C
EIA-364-17
Temperature: 85±2°C
EIA-364-31 Method III
300±10°C: Max. 5 s
350±10°C: Max. 3 s
2. Material and surface treatment
Part name
Resin-molding portion
Metal parts
Material
Heat-resistant resin (UL94V-0)
Contact
Copper alloy
Shell
Stainless steel
Surface treatment
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except the cut ends)
Ni plating on base, Sn plating on surface (Except the cut ends)
panasonic-electric-works.net/ac
Interface connectors
Item
Discontinued as of September 30, 2010
AXJ5
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://panasonic-electric-works.net/ac
1. Micro B Receptacle
1) Pegs (retention fitting): SMD type
Part number
AXJ53312G
Recommended PC board pattern
(TOP VIEW)
CAD Data
7.80
7.50
3.90±0.05
2.60±0.05
1.30±0.05
0.40±0.05
.3)
(0
Note)
: PC board pattern
: Apply resist onto the PC board pattern.
When mounted on a PC board
Terminal No.5
0.15
1.30
2.60
5.20
5.40
0.95±0.05
(Resist area)
6.20±0.05
9.80±0.05
0.75
1.85
1.10
Terminal No.1
0.50±0.05
(Resist area)
PC board
edge
1.00
2.45
3.00
8.00
6.90
6.20
0.95±0.05
(Resist area)
3.35±0.05
1.35±0.05
(0.70)
2.15
5.60
5.00
0.90
Note)
0.45±0.05
1.25±0.05
2.85±0.05
8.40±0.05
5.90±0.05
1.90±0.05
1.45±0.05
DIMENSIONS (unit: mm)
Interface connectors
0.50
0.75
Shell pegs (retention fitting) (Front)
0.25±0.1
1.30±0.1
Shell pegs (retention fitting) (Back)
2.60±0.1
General tolerance: ±0.3
2) Pegs (retention fitting): DIP type
Part number
AXJ53314G
Recommended PC board pattern
(TOP VIEW)
CAD Data
Terminal No.5
6.75±0.05
Bottom view
0.80
When mounted on a PC board
2.20
0.30
0.15
1.30
2.60
5.55
4.15±0.05
PC board
edge
0.80
1.00
2.45
3.00
1.85
1.10
Terminal No.1
Top view
2.00±0.05
1.30±0.05
2.20±0.05
1.70±0.05
.4
.0
5±
0
32
R0
0.
R
6.15±0.05
6.75±0.05
0.75
8.00
6.90
6.20
5.40
0.50±0.05
3.55±0.05
4.15±0.05
4.75±0.05
5
3.30±0.05
1.35±0.05
5.60
5.00
2.20±0.05
3.90±0.05
2.60±0.05
1.30±0.05
0.40±0.05
Through hole
0.45±0.05
1.25±0.05
2.80±0.05
8.40±0.05
5.90±0.05
7.50
0.50
0.75
0.25±0.1
1.30±0.1
Shell pegs (retention fitting) (Back)
2.60±0.1
General tolerance: ±0.3
panasonic-electric-works.net/ac
Discontinued as of September 30, 2010
AXJ5
2. Micro AB Receptacle
1) Pegs (retention fitting): SMD type
Part number
AXJ53612G
Recommended PC board pattern
(TOP VIEW)
8.80
7.50
8.40±0.05
6.30±0.05
3.90±0.05
2.60±0.05
1.30±0.05
0.40±0.05
8.00
6.90
6.20
Note)
Terminal No.5
: PC board pattern
: Apply resist onto the PC board pattern.
When mounted on a PC board
0.15
1.30
2.60
5.30
7.20±0.05
9.30±0.05
0.50±0.05
(Resist area)
1.45±0.05
(Resist area)
PC board edge
1.10
1.35
2.45
3.00
1.85
Terminal No.1
1.45±0.05
(Resist area)
1.30±0.05
1.90±0.05
1.45±0.05
3.35±0.05
1.35±0.05
(0.70)
2.15
5.60
5.00
0.90
Note)
0.45±0.05
1.25±0.05
2.85±0.05
CAD Data
0.50
0.75
0.25±0.1
1.30±0.1
Interface connectors
Shell pegs (retention fitting) (Front)
Shell pegs (retention fitting) (Back)
2.60±0.1
General tolerance: ±0.3
2) Pegs (retention fitting): DIP type
Part number
AXJ53614G
8.40±0.05
6.30±0.05
3.90±0.05
2.60±0.05
1.30±0.05
0.40±0.05
3.30±0.05
1.35±0.05
0.3
2
R 0.4 5±0
.05
5.60
5.00
Through hole
R
8.00
6.90
6.20
4.30±0.05
5.80±0.05
6.40±0.05
7.80±0.05
8.40±0.05
0.50
±0.05
5.80±0.05
8.40±0.05
PC board edge
Bottom view
1.30
2.60
5.30
7.20
0.80
Terminal No.5
When mounted on a PC board
2.20
0.30
0.15
Terminal No.1
0.80
1.85
1.10
1.35
2.45
3.00
Top view
0.50
0.75
0.25±0.1
1.30±0.1
Shell pegs (retention fitting) (Back)
2.60±0.1
General tolerance: ±0.3
panasonic-electric-works.net/ac
2.20±0.05
7.50
2.00±0.05
1.30±0.05
2.20±0.05
1.70±0.05
CAD Data
0.45±0.05
1.25±0.05
2.80±0.05
Recommended PC board pattern
(TOP VIEW)
Discontinued as of September 30, 2010
AXJ5
EMBOSSED TAPE DIMENSIONS (unit: mm)
• Tape dimensions (Conforming to JIS C 0806-3 1990)
(24.0±0.3)
(11.5)
• Reel dimensions (Conforming to EIAJ ET-7200B)
1.75
(25.4±1)
380 dia.
(4.0)
(2.0)
Emboss carrier tape
(8.0)
Pull out direction
Top cover tape
1.55±0.05 dia.
Interface connectors
NOTES
1. Use of a cover is recommended
when using this device in order to
prevent scraps, dust, dirt, etc., from
getting inside of the receptacle.
2. PC board design
Please refer to the recommended PC
board pattern to ensure the strength of
soldered portion of terminals.
3. Soldering
1) Manual soldering
• Please set up temperature and applied
time of soldering iron as indicated in
specification sheet.
• Avoid an excessive amount of solder
from being applied, or it may flow into the
shell.
• Please use soldering iron after
confirming removal of dispersed solder
flux on the contact surface by use of
magnifying glass after each soldering.
• Do not apply a load to the terminals
during soldering, or the contacts may be
displaced.
• Please properly clean soldeing iron.
2) Reflow soldering
• Screen printing is recommended for
cream solder printing.
• Screen thickness of 0.12mm is
recommended for cream solder printing.
• When applying different thickness of
screen, please consult us.
• Depending upon size of connector, self
alignments may not be expected.
Please pay attention to align terminals
and soldered pads.
• The following diagram shows the
recommended reflow soldering
temperature profile.
Recommended reflow soldering
temperature profile
Temperature
Max. 260°C
Maximum temperature
200°C
150 to 175°C
Pre-heating
60 to 120 second
Max. 70 sec
Time
• The temperature measured on the PC
board surface near connector terminals.
• After reflow soldering, in case of PC
board surface the reverse side using
reflow soldering, for example an adhesive
and so on connector of fixed disposition.
3) Rework of soldering portion
• Rework is one time.
• Avoid an excessive amount of solder
from being applied, or it may flow into the
shell.
• In case of soldering rework of bridges.
Please use a flat-head soldering iron and
don’t use supplementary solder flux.
• Please use the soldering iron under
specification’s temperature
4. Since excessive force on the
terminals will cause deformation and
the integrity of the soldering will be
lost during reflow soldering, avoid
dropping or rough handling of the
product.
5. PC board warpage should be
controlled less than 0.03mm to entire
length of the connector.
6. Repeated bending of terminals and
clips (retention fitting) can result in
terminals breaking.
7. Regarding after soldering
connectors on PC boards
• After mounting connectors on PC
boards, do not apply excessive loads to
the connector by piling up the boards.
• Please do not add the force to the
connector during assembled connector
on PC board.
8. This connector has metal shell for
preventing EMI, when designing an
enclosure the followings should be
considered. Guide for plug entrance
should be arranged in order to prevent
distorted insertions. Provide a cover
to reinforce the metal shell portions of
the receptacle.
9. Others
To prevent insulation deterioration of PC
board after soldering, please avoid
adhesion coating agent to terminals in
case of coating.
For other details, please verify with
the product specification sheets.
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