AXK5F40547YG

Narrow pitch connectors For board-to-FPC/For board-to-board P5KF (0.5 mm pitch) 0.5 mm pitch and 1.5 to 2.5 mm mated height available FEATURES Wide lineup for pin counts “TOUGH CONTACT” construction provides high resistance to various environmental. Simple lock mechanism provides tactile feedback to ensure excellent mating/unmating operation feel. Effective mating length 0.55 mm 3.3mm 5.8mm TYPICAL APPLICATIONS Header Socket Mobile devices and industrial equipment DETAILS FEATURES Simple lock mechanism Superior mating operation with click feel to indicate successful mating The construction of prevents for contact and shorts between the PC board and metal terminals on the bottom of connector. Benefits to flexibility of pattern wiring and make PC board’s smaller. Simple lock mechanism Effective mating length 0.55 mm Low profile (from 1.5 to 2.5 mm between PC boards). The effective mating length is long and there is enough space for mating. 0.55mm Insulation area Insulation area Connector bottom : Create any thru-hole and pattern wiring. ORDERING INFORMATION (PART NO.) AXK 5F: Socket 6F: Header Mated height (Socket) 3: For mated height 1.5 mm 5: For mated height 2.0 mm and 2.5 mm (Header) 3: For mated height 1.5 mm and 2.0 mm 5: For mated height 2.5 mm Number of pins (2 digits) 2020.04 4 7 Y G industrial.panasonic.com/ac/e/ Surface treatment (Contact portion / Terminal portion) 7: Base: Ni plating, Surface: Au plating/ Base: Ni plating, Surface: Au plating Functions 3: With positioning bosses 4: Without positioning bosses ー1ー Packing G: 2,000 pieces embossed tape and plastic reel × 2 reels Y: (Fixed) Panasonic Corporation 2020 ACCTB23E 202003 Narrow pitch connectors P5KF (0.5 mm pitch) PRODUCT TYPES Mated height 1.5 mm 2.0 mm 2.5 mm Number of pins Part No. Standard packing Socket Header 10 AXK5F10347YG AXK6F10347YG 12 AXK5F12347YG AXK6F12347YG 16 AXK5F16347YG AXK6F16347YG 20 AXK5F20347YG AXK6F20347YG 24 AXK5F24347YG AXK6F24347YG 30 AXK5F30347YG AXK6F30347YG 34 AXK5F34347YG AXK6F34347YG 40 AXK5F40347YG AXK6F40347YG 50 AXK5F50347YG AXK6F50347YG 60 AXK5F60347YG AXK6F60347YG 80 AXK5F80347YG AXK6F80347YG 10 AXK5F10547YG AXK6F10347YG 12 AXK5F12547YG AXK6F12347YG 16 AXK5F16547YG AXK6F16347YG 20 AXK5F20547YG AXK6F20347YG 24 AXK5F24547YG AXK6F24347YG 30 AXK5F30547YG AXK6F30347YG 34 AXK5F34547YG AXK6F34347YG 40 AXK5F40547YG AXK6F40347YG 50 AXK5F50547YG AXK6F50347YG 60 AXK5F60547YG AXK6F60347YG 80 AXK5F80547YG AXK6F80347YG 100 AXK5F00547YG AXK6F00347YG 10 AXK5F10547YG AXK6F10547YG 12 AXK5F12547YG AXK6F12547YG 16 AXK5F16547YG AXK6F16547YG 20 AXK5F20547YG AXK6F20547YG 24 AXK5F24547YG AXK6F24547YG 30 AXK5F30547YG AXK6F30547YG 34 AXK5F34547YG AXK6F34547YG 40 AXK5F40547YG AXK6F40547YG 50 AXK5F50547YG AXK6F50547YG 60 AXK5F60547YG AXK6F60547YG 80 AXK5F80547YG AXK6F80547YG 100 AXK5F00547YG AXK6F00547YG Inner carton (1-reel) Outer carton 2,000 pcs. 4,000 pcs. Notes: 1. Order unit: Please make orders in outer carton units. For samples, please contact our sales office. 2. The standard type comes without positioning bosses. Connectors with positioning bosses are available for on-demand production. Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ ー2ー Panasonic Corporation 2020 ACCTB23E 202003 Narrow pitch connectors P5KF (0.5 mm pitch) SPECIFICATIONS Characteristics Item Electrical characteristics Mechanical characteristics Rated voltage 60 V AC/DC Dielectric strength 150 V AC for 1 minute No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute. Insulation resistance Min. 1,000 MΩ (initial) Using 500 V DC megger (applied for 1 min.) Contact resistance Max. 90 mΩ Based on the contact resistance measurement method specified by JIS C 5402. Composite insertion force Max. 0.981 N/pin contacts × pin contacts (initial) Composite removal force Min. 0.0588 N/pin contacts × pin contacts Ambient temperature –55 to +85°C No icing. No condensation. Soldering heat resistance The initial specification must be satisfied electrically and mechanically. Reflow soldering: Peak temperature: 260°C or less (on the surface of the PC board around the connector terminals) Soldering iron: 300°C within 5 sec. 350°C within 3 sec. Storage temperature –55 to +85°C (product only) –40 to +50°C (emboss packing) No icing. No condensation. Conformed to MIL-STD-202F, method 107G Order Temperature (℃) Time (minutes) 1 30 ｰ55ｰ03 2 Max. 5 3 30 85 +30 4 Max. 5 ｰ55ｰ03 Thermal shock resistance (header and socket mated) 5 cycles, insulation resistance Min. 100 MΩ, contact resistance Max. 90 mΩ Humidity resistance (header and socket mated) 120 hours, insulation resistance Min. 100 MΩ, contact resistance Max. 90 mΩ Conformed to IEC60068-2-78 Temperature 40±2°C, humidity 90 to 95% RH Saltwater spray resistance (header and socket mated) 24 hours, insulation resistance Min. 100 MΩ, contact resistance Max. 90 mΩ Conformed to IEC60068-2-11 Temperature 35±2°C, saltwarter concentration 5±1% ～ Lifetime characteristics Conditions 0.5 A/pin contact (Max. 10 A at total pin contacts) ～ Environmental characteristics Specifications Rated current H2S resistance (header 48 hours, and socket mated) contact resistance Max. 90 mΩ Temperature 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% RH Insertion and removal life Repeated insertion and removal speed of Max. 200 times/hour Unit weight 50 times Mated height 1.5 mm 20 pins Socket: 0.06 g, Header: 0.04 g Material and surface treatment Part name Material Surface treatment Molded portion LCP resin (UL94V-0) — Contact and Post Copper alloy Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ ー3ー Panasonic Corporation 2020 ACCTB23E 202003 Narrow pitch connectors P5KF (0.5 mm pitch) DIMENSIONS Unit: mm CAD The CAD data of the products with a “CAD” mark can be downloaded from our Website. Socket (Mated height: 1.5 mm, 2.0 mm, 2.5 mm) CAD External dimensions C 0.10 (0.80) A B±0.1 0.50±0.05 0.20±0.03 Dimensions Number of pins 10 A B 5.50 2.00 12 6.00 2.50 16 7.00 3.50 20 8.00 4.50 24 9.00 5.50 30 10.50 7.00 34 11.50 8.00 40 13.00 9.50 50 15.50 12.00 60 18.00 14.50 80 23.00 19.50 100 28.00 24.50 (0.80) 4.20 5.80 1.70 (Suction face) 4.80 0.50±0.05 Dimension table Terminal coplanarity 0.12±0.03 General tolerance: ±0.2 Dimensions Mated height C 1.5 mm 1.35 2.0 mm, 2.5 mm 1.85 Header (Mated height: 1.5 mm, 2.0 mm, 2.5 mm) CAD Dimension table External dimensions Terminal coplanarity Dimensions Number of pins 10 A B 5.50 2.00 12 6.00 2.50 16 7.00 3.50 20 8.00 4.50 24 9.00 5.50 30 10.50 7.00 34 11.50 8.00 40 13.00 9.50 50 15.50 12.00 60 18.00 14.50 80 23.00 19.50 100 28.00 24.50 1.80 3.30 (0.75) 0.10 0.12±0.03 (0.75) 0.96 (Suction face) 2.50 0.50±0.05 C A B±0.1 0.50±0.05 0.20±0.03 General tolerance: ±0.2 Dimensions Mated height C 1.5 mm, 2.0 mm 1.25 2.5 mm 1.75 Mated height 1.5 mm Mated height 2.0 mm Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ ー4ー 2.50±0.15 1.50±0.15 2.00±0.15 Socket and Header are mated Mated height 2.5 mm Panasonic Corporation 2020 ACCTB23E 202003 Narrow pitch connectors P5KF (0.5 mm pitch) EMBOSSED TAPE DIMENSIONS Unit: mm Specifications for taping Specifications for the plastic reel In accordance with JIS C 0806:1990. However, not applied to the mounting-hole pitch of some connectors. Label Top cover tape （A±0.3） （A±0.3） （B） φ380 Embossed carrier tape Embossed mounting-hole （2.0） Taping reel （12.0） （12.0） （4.0） Leading direction after packaging （4.0） （C） （1.75） （2.0） Leading direction after packaging D±1 Tape Il Tape I （C） （1.75） In accordance with EIAJ ET-7200B. φ1.5+0.1 0 φ1.5+0.1 0 Dimension table Type/Mated height Number of pins Type of taping A B C D Quantity per reel Common for sockets and headers 1.5 mm, 2.0 mm, 2.5 mm 10 to 50 Tape I 24.0 — 11.5 25.4 2,000 60 Tape II 32.0 28.4 14.2 33.4 2,000 80 to 100 Tape II 44.0 40.4 20.2 45.4 2,000 Connector orientation with respect to embossed tape feeding direction There is no indication on this product regarding top-bottom or left-right orientation. Direction of tape progress Type Common for P5KF Socket Header Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ ー5ー Panasonic Corporation 2020 ACCTB23E 202003 Narrow pitch connectors P5KF (0.5 mm pitch) NOTES Unit: mm Design of PC board patterns Conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas.  s shown below, excess force during insertion may A result in damage to the connector or removal of the solder. Also, to prevent connector damage please confirm the correct position before mating connectors.  eep the PC board warp no more than 0.03 mm in K relation to the overall length of the connector. Max. 0.03 mm Recommended PC board and metal mask patterns Max. 0.03 mm Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures are recommended patterns. Please use them as a reference. Socket Header Recommended PC board pattern (TOP VIEW) 0.50± 0.05 0.50± 0.05 0.25±0.05 B±0.05 0.50± 0.05 1.60±0.05 4.00±0.05 6.80±0.05 4.30±0.05 B±0.05 0.50± 0.05 0.25±0.05 Recommended PC board pattern (TOP VIEW) 0.125±0.05 0.30±0.05 0.125±0.05 0.30±0.05 Recommended metal mask pattern Metal mask thickness: When 150 μm (Opening area ratio: 56%) 0.50± 0.01 0.23± 0.01 0.50± 0.01 B±0.01 0.50± 0.01 4.30±0.01 (0.85) (0.85) B±0.01 (0.85) (0.85) 2.60±0.01 5.10±0.01 6.80±0.01 0.50± 0.01 0.23± 0.01 Recommended metal mask pattern Metal mask thickness: When 150 μm (Opening area ratio: 58%) Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ ー6ー Panasonic Corporation 2020 ACCTB23E 202003 Narrow pitch connectors P5KF (0.5 mm pitch) Recommended metal mask pattern Metal mask thickness: When 120 μm (Opening area ratio: 69%) 0.50± 0.01 0.23± 0.01 0.50± 0.01 B±0.01 0.50± 0.01 4.30±0.01 (1.05) (1.05) B±0.01 (1.05) (1.05) 2.20±0.01 4.70±0.01 6.80±0.01 0.50± 0.01 0.23± 0.01 Recommended metal mask pattern Metal mask thickness: When 120 μm (Opening area ratio: 72%) Note : See the dimension table for more information on the B dimension of the socket and header. Please refer to "the latest product specifications" when designing your product. •Requests to customers: https://industrial.panasonic.com/ac/e/salespolicies/ Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ ー7ー Panasonic Corporation 2020 ACCTB23E 202003 Notes on Using Narrow pitch Connectors/High Current Connectors For board-to-board/board-to-FPC Notes on Using Narrow pitch Connectors/ High Current Connectors About safety remarks Observe the following safety remarks to prevent accidents and injuries. 3) Panasonic Corporation is consistently striving to improve 1) Do not use these connectors beyond the specification sheets. quality and reliability. However, the fact remains that electrical The usage outside of specified rated current, dielectric strength, components and devices generally cause failures at a given and environmental conditions and so on may cause circuitry statistical probability. Furthermore, their durability varies with damage via abnormal heating, smoke, and fire. use environments or use conditions. In this respect, please 2) In order to avoid accidents, your thorough specification review check for actual electrical components and devices under actual is appreciated. Please contact our sales office if your usage is conditions before use. Continued usage in a state of degraded out of the specifications. Otherwise, Panasonic Corporation condition may cause the deteriorated insulation, thus result in cannot guarantee the quality and reliability. abnormal heat, smoke or firing. Please carry out safety design and periodic maintenance including redundancy design, design for fire spread prevention, and design for malfunction prevention so that no accidents resulting in injury or death, fire accidents, or social damage will be caused as a result of failure of the products or ending life of the products. Regarding the design of devices and PC board patterns 1) When using the board to board connectors, do not connect a pair of board with multiple connectors. Otherwise, misaligned connector positions may cause mating failure or product breakage. 2) With mounting equipment, there may be up to a ±0.2 to 0.3 mm error in positioning. Be sure to design PC boards and patterns while taking into consideration the performance and abilities of the required equipment. 3) Some connectors have tabs embossed on the body to aid in positioning. When using these connectors, make sure that the PC board is designed with positioning holes to match these tabs. 4) To ensure the required mechanical strength when soldering the connector terminals, make sure the PC board meets recommended PC board pattern design dimensions given. 5) PC board Control the thicknesses of the cover lay and adhesive to prevent poor soldering. This connector has no stand-off. Therefore, minimize the thickness of the cover lay, etc. so as to prevent the occurrence of poor soldering. 6) For all connectors of the narrow pitch series, to prevent the PC board from coming off during vibrations or impacts, and to prevent loads from falling directly on the soldered portions, be sure to design some means to fix the PC board in place. Example) Secure in place with screws 7) When mounting connectors on a FPC • When the connector soldered to FPC is mated or unmated, solder detachment may occur by the force to the terminals. Connector handling is recommended in the condition when the reinforcing plate is attached to the backside of FPC where the connector is mounted. The external dimension of the reinforcing plate is recommended to be larger than the dimension of “Recommended PC board pattern” (extended dimension of one side is approximately 0.5 to 1.0 mm). The materials and thickness of the reinforcing plate are glass epoxy or polyimide (thickness 0.2 to 0.3 mm) or SUS (thickness 0.1 to 0.2 mm). • As this connector has temporary locking structure, the connector mating may be separated by the dropping impact depend on the size, weight or bending force of the FPC. Please consider the measures at usage to prevent the mating separation. 8) The narrow pitch connector series is designed to be compact and thin. Although ease of handling has been taken into account, take care when mating the connectors, as displacement or angled mating could damage or deform the connector. Screw ↓ ↓ Spacer Connector PC board Spacer When connecting PC boards, take appropriate measures to prevent the connector from coming off. ー8ー ACCTB48E 201809-T Notes on Using Narrow pitch Connectors/High Current Connectors Regarding the selection of the connector placement machine and the mounting procedures 1) Select the placement machine taking into consideration the connector height, required positioning accuracy, and packaging conditions. 2) Be aware that if the chucking force of the placement machine is too great, it may deform the shape of the connector body or connector terminals. 3) Be aware that during mounting, external forces may be applied to the connector contact surfaces and terminals and cause deformations. 4) Depending on the size of the connector being used, self alignment may not be possible. In such cases, be sure to carefully position the terminal with the PC board pattern. 5) The positioning bosses give an approximate alignment for positioning on the PC board. For accurate positioning of the connector when mounting it to the PC board, we recommend using an automatic positioning machine. 6) In case of dry condition, please note the occurrence of static electricity. The product may be adhered to the embossed carrier tape or the cover tape in dry condition. Recommended humidity is from 40 to 60%RH and please remove static electricity by ionizer in manufacturing process. Regarding soldering Reflow soldering 1) Measure the recommended profile temperature for reflow soldering by placing a sensor on the PC board near the connector surface or terminals. (Please refer to the specification for detail because the temperature setting differs by products.) 2) As for cream solder printing, screen printing is recommended. 3) When setting the screen opening area and PC board foot pattern area, refer the recommended PC board pattern and window size of metal mask on the specification sheet, and make sure that the size of board pattern and metal mask at the base of the terminals are not increased. 4) Please pay attentions not to provide too much solder. It makes miss mating because of interference at soldering portion when mating. Terminal Paste solder PC board foot pattern 5) When mounting on both sides of the PC board and the connector is mounting on the underside, use adhesives or other means to ensure the connector is properly fixed to the PC board. (Double reflow soldering on the same side is possible.) 6) The condition of solder or flux rise and wettability varies depending on the type of solder and flux. Solder and flux characteristics should be taken into consideration and also set the reflow temperature and oxygen level. Hand soldering 1) Set the soldering iron so that the tip temperature is less than that given in the table below. Table A Product name Soldering iron temperature SMD type connectors all products 300°C within 5 sec. 350°C within 3 sec. 180℃ 150℃ Peak temperature Preheating 220℃ 200℃ 25 sec. 60 to 120 sec. 70 sec. Upper limited (Solder heat resistance) Lower limited (Solder wettability) Time For products other than the ones above, please refer to the latest product specifications. 9) The temperature profiles given in this catalog are values measured when using the connector on a resin-based PC board. When performed reflow soldering on a metal board (iron, aluminum, etc.) or a metal table to mount on a FPC, make sure there is no deformation or discoloration of the connector before mounting. 10) Please contact our sales office when using a screen-printing thickness other than that recommended. 4) Be aware that soldering while applying a load on the connector terminals may cause improper operation of the connector. 5) Thoroughly clean the soldering iron. 6) Flux from the solder wire may get on the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any solder before use. 7) These connector is low profile type. If too much solder is supplied for hand soldering, It makes miss mating because of interference at soldering portion. Please pay attentions. S iro old n eri Apply the solder wire here Temperature Peak temperature 260℃ 230℃ ng 2) Do not allow flux to spread onto the connector leads or PC board. This may lead to flux rising up to the connector inside. 3) Touch the soldering iron to the foot pattern. After the foot pattern and connector terminal are heated, apply the solder wire so it melts at the end of the connector terminals. 7) Do not use resin-containing solder. Otherwise, the contacts might be firmly fixed. 8) Soldering conditions Please use the reflow temperature profile conditions recommended below for reflow soldering. Please contact our sales office before using a temperature profile other than that described below (e.g. lead-free solder) Small angle as possible up to 45 degrees Terminal PC board Pattern ー9ー ACCTB48E 201809-T Notes on Using Narrow pitch Connectors/High Current Connectors Solder reworking 1) Finish reworking in one operation. 2) In case of soldering rework of bridges. Do not use supplementary solder flux. Doing so may cause contact problems by flux. 3) Keep the soldering iron tip temperature below the temperature given in Table A. Handling single components 1) Make sure not to drop or allow parts to fall from work bench. 2) Excessive force applied to the terminals could cause warping, come out, or weaken the adhesive strength of the solder. Handle with care. 3) Do not insert or remove the connector when it is not soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. Precautions for mating This product is designed with ease of handling. However, in order to prevent the deformation or damage of contacts and molding, take care and do not mate the connectors as shown right. Press-fitting while the mating inlets of the socket and Strongly pressed and header are not matched. twisted Tilted mating Cleaning flux from PC board There is no need to clean this product. If cleaning it, pay attention to the following points to prevent the negative effect to the product. 1) Keep the cleaning solvent clean and prevent the connector contacts from contamination. 2) Some cleaning solvents are strong and they may dissolve the molded part and characters, so pure water passed liquid solvent is recommended. Handling the PC board Handling the PC board after mounting the connector When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive force. The soldered areas should not be subjected to force. Storage of connectors 1) To prevent problems from voids or air pockets due to heat of reflow soldering, avoid storing the connectors in areas of high humidity. 2) Depending on the connector type, the color of the connector may vary from connector to connector depending on when it is produced. Some connectors may change color slightly if subjected to ultraviolet rays during storage. This is normal and will not affect the operation of the connector. 3) When storing the connectors with the PC boards assembled and components already set, be careful not to stack them up so the connectors are subjected to excessive forces. 4) Avoid storing the connectors in locations with excessive dust. The dust may accumulate and cause improper connections at the contact surfaces. Other Notes 1) Do not remove or insert the electrified connector (in the state of carrying current or applying voltage). 2) Dropping of the products or rough mishandling may bend or damage the terminals and possibly hinder proper reflow soldering. 3) Before soldering, try not to insert or remove the connector more than absolutely necessary. ー 10 ー 4) When coating the PC board after soldering the connector to prevent the deterioration of insulation, perform the coating in such a way so that the coating does not get on the connector. 5) There may be variations in the colors of products from different production lots. This is normal. 6) The connectors are not meant to be used for switching. 7) Product failures due to condensation are not covered by warranty. ACCTB48E 201809-T Notes on Using Narrow pitch Connectors/High Current Connectors Regarding sample orders to confirm proper mounting When ordering samples to confirm proper mounting with the placement machine, connectors are delivered in 50-piece units in the condition given right. Consult a sale representative for ordering sample units. Condition when delivered from manufacturing Embossed tape amount required for the mounting Required number of products for sample production Reel Delivery can also be made on a reel by customer request. (Unit 50 pcs.) Please refer to “the latest product specifications” when designing your product. • Requests to customers: https://industrial.panasonic.com/ac/e/salespolicies/ ー 11 ー ACCTB48E 201809-T Please contact .......... Electromechanical Control Business Division 1006, Oaza Kadoma, Kadoma-shi, Osaka 571-8506, Japan industral.panasonic.com/ac/e/ ©Panasonic Corporation 2020 ACCTB23E 202003 Specifications are subject to change without notice.