For board-to-board For board-to-FPC
P4
Narrow pitch connectors
(0.4mm pitch)
Mated heights of 1.5 to 3.5 mm supported with “TOUGH CONTACT”
construction to withstand of tough environments.
FEATURES
1. Mated heights of 1.5 to 3.5 mm is available
2. “TOUGH CONTACT” construction provides high
resistance to various environment.
3. Pattern wiring is possible on PC board of the connector
undersurface
4. Connectors for inspection is available
APPLICATIONS
Socket
5.1mm
3.96mm
Header
Mobile devices and industrial equipment
DETAILED FEATURES
Construction makes designing devices easier.
The lower connector bottom surface construction prevents
contact and shorts between the PC board and metal terminals.
This flexibility of pattern wiring is helping to make PC board’s
smaller.
Constructed with impact dispersion keys inside the body to
disperse shocks when dropped
A high level of shock resistance is ensured by dispersing impact
over the four locations where the socket indentations and header
protrusions are mated together.
Note: Pins 18 or less are not supported due to suction surface considerations.
Socket
Impact dispersion key
Insulation area
Insulation area
Connector bottom: Create any thru-hole and pattern wiring.
Header
Contributes to improved mating
1) Mating insertion guide
Guides are provided to take up any position shift and facilitate
insertion.
2) Simple lock construction
Simple lock construction provides tactile feedback to ensure
excellent mating/unmating operation feel.
Header side
post
Insertion guide
Simple lock
construction
–1–
Socket side
contact
ACCTB57E 201803-T
Narrow pitch connectors P4 (0.4mm pitch)
ORDERING INFORMATION
AXK
Number of pins
(2 digits)
7: Socket
8: Header
4
W G
4: (Fixed)
Mated height
(Socket)
1: For mated height
2: For mated height
3: For mated height
4: For mated height
(Header)
1: For mated height
2: For mated height
(Header)
W: (Fixed)
1.5
2.0
2.5
3.5
Package
G: Includes 3,000 pieces embossed tape and
plastic reel packaging × includes 2 reels (Note 1)
Surface treatment (Contact portion / Terminal portion)
(Socket)
7: Base: Ni plating, Surface: Au plating/Base: Ni plating, Surface: Au plating
(Header)
5: Base: Ni plating, Surface: Au plating/Base: Ni plating, Surface: Au plating
mm
mm
and 3.0 mm
mm
1.5, 2.0 and 2.5 mm
3.0 and 3.5 mm
Note: 1. Only a socket of mated height 3.5 mm: 2,000 pieces embossed tape and plastic reel packaging × 2 reels
PRODUCT TYPES
Mated height
1.5 mm
2.0 mm
2.5 mm
Number of pins
14
20
22
24
26
30
34
40
44
50
54
60
64
70
80
100
14
20
24
26
30
40
50
60
70
80
14
20
24
30
40
50
60
70
80
Part number
Socket
AXK714147G
AXK720147G
AXK722147G
AXK724147G
AXK726147G
AXK730147G
AXK734147G
AXK740147G
AXK744147G
AXK750147G
AXK754147G
AXK760147G
AXK764147G
AXK770147G
AXK780147G
AXK700147G
AXK714247G
AXK720247G
AXK724247G
AXK726247G
AXK730247G
AXK740247G
AXK750247G
AXK760247G
AXK770247G
AXK780247G
AXK714347G
AXK720347G
AXK724347G
AXK730347G
AXK740347G
AXK750347G
AXK760347G
AXK770347G
AXK780347G
Header
AXK814145WG
AXK820145WG
AXK822145WG
AXK824145WG
AXK826145WG
AXK830145WG
AXK834145WG
AXK840145WG
AXK844145WG
AXK850145WG
AXK854145WG
AXK860145WG
AXK864145WG
AXK870145WG
AXK880145WG
AXK800145WG
AXK814145WG
AXK820145WG
AXK824145WG
AXK826145WG
AXK830145WG
AXK840145WG
AXK850145WG
AXK860145WG
AXK870145WG
AXK880145WG
AXK814145WG
AXK820145WG
AXK824145WG
AXK830145WG
AXK840145WG
AXK850145WG
AXK860145WG
AXK870145WG
AXK880145WG
Packing
Inner carton (1-reel)
3,000 pieces
Outer carton
6,000 pieces
Note: Order unit: For volume production: outer carton units. For samples, please contact our sales office.
–2–
ACCTB57E 201803-T
Narrow pitch connectors P4 (0.4mm pitch)
Mated height
Number of pins
3.0 mm
3.5 mm
Part number
20
24
30
40
50
60
80
20
Socket
AXK720347G
AXK724347G
AXK730347G
AXK740347G
AXK750347G
AXK760347G
AXK780347G
AXK720447G
Header
AXK820245WG
AXK824245WG
AXK830245WG
AXK840245WG
AXK850245WG
AXK860245WG
AXK880245WG
AXK820245WG
30
40
AXK730447G
AXK740447G
AXK830245WG
AXK840245WG
Packing
Inner carton (1-reel)
Outer carton
3,000 pieces
6,000 pieces
Socket: 2,000 pieces
Header: 3,000 pieces
Socket: 4,000 pieces
Header: 6,000 pieces
Note: Order unit: For volume production: outer carton units. For samples, please contact our sales office.
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Specifications
0.3A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
Dielectric strength
150V AC for 1 min.
Insulation resistance
Min. 1,000MΩ (initial)
Contact resistance
Max. 70mΩ
Composite insertion force
Composite removal force
Ambient temperature
Max. 0.981N/pin contact × pin contacts (initial)
Min. 0.0588N/pin contact × pin contacts
–55 to +85°C
Conditions
Rated voltage is applied for one minute and check for short
circuit or damage with a detection current of 1mA.
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
No icing. No condensation.
Soldering heat resistance
The initial specification must be satisfied electrically
and mechanically.
Reflow soldering:
Peak temperature: 260°C or less
(on the surface of the PC board around the connector
terminals)
Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
Storage temperature
–55 to +85°C (product only)
–40 to +50°C (emboss packing)
No icing. No condensation.
Conformed to MIL-STD-202F, method 107G
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
Humidity resistance
(header and socket mated)
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
H2S resistance
(header and socket mated)
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
48 hours,
contact resistance max. 70mΩ
Insertion and removal life
50 times
Saltwater spray resistance
(header and socket mated)
Lifetime
characteristics
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to IEC60068-2-78
Temperature 40±2°C, humidity 90 to 95% R.H.
Conformed to IEC60068-2-11
Temperature 35±2°C, saltwater concentration 5±1%
Temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200 times/
hours
Mated height 1.5mm
20 pins Socket: 0.04g Header: 0.02g
Unit weight
2. Material and surface treatment
Part name
Molded portion
Material
LCP resin (UL94V-0)
Contact and Post
Copper alloy
Surface treatment
—
Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The terminals of Ni barrier production socket close to the portion to be soldered have nickel
barriers (exposed nickel portions).
–3–
ACCTB57E 201803-T
Narrow pitch connectors P4 (0.4mm pitch)
DIMENSIONS (Unit: mm)
The CAD data of the products with a
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Socket (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)
External dimensions
Dimension table
Terminal coplanarity
E
C
(0.675)
3.75
5.10
(0.675)
4.10
0.80
0.08
1.11
(Suction face)
A
B±0.1
0.40±0.05
0.40±0.05
0.15±0.03
0.80
Max. 18 pins
Dimensions
Number
of pins
14
20
22
24
26
30
34
40
44
50
54
60
64
70
80
100
A
B
C
D
5.10
6.30
6.70
7.10
7.50
8.30
9.10
10.30
11.10
12.30
13.10
14.30
15.10
16.30
18.30
22.30
2.40
3.60
4.00
4.40
4.80
5.60
6.40
7.60
8.40
9.60
10.40
11.60
12.40
13.60
15.60
19.60
–
1.60
2.00
2.40
2.80
3.60
4.40
5.60
6.40
7.60
8.40
9.60
10.40
11.60
13.60
17.60
2.80
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Dimensions
Mated height
D
1.5mm
2.0mm
2.5mm, 3.0mm
3.5mm
General tolerance: ±0.2
Header (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)
External dimensions
Dimension table
Terminal coplanarity
E
0.76
C
3.12
3.96
(0.42)
0.08
0.10±0.03
(0.42)
0.76
2.19
3.96
2.66
F
(Suction face)
A
B±0.1
0.40±0.05
0.40±0.05
0.15±0.03
Max. 18 pins
D
E
1.50
1.92
2.42
2.92
General tolerance: ±0.2
Dimensions
Number
of pins
14
20
22
24
26
30
34
40
44
50
54
60
64
70
80
100
A
B
C
D
3.90
5.10
5.50
5.90
6.30
7.10
7.90
9.10
9.90
11.10
11.90
13.10
13.90
15.10
17.10
21.10
2.40
3.60
4.00
4.40
4.80
5.60
6.40
7.60
8.40
9.60
10.40
11.60
12.40
13.60
15.60
19.60
–
1.60
2.00
2.40
2.80
3.60
4.40
5.60
6.40
7.60
8.40
9.60
10.40
11.60
13.60
17.60
3.04
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
E
F
1.31
2.26
1.20
1.26
Dimensions
Mated height
1.5mm, 2.0mm, 2.5mm
3.0mm, 3.5mm
–4–
3.50±0.15
3.00±0.15
2.50±0.15
2.00±0.15
1.50±0.15
Socket and Header are mated
ACCTB57E 201803-T
Narrow pitch connectors P4 (0.4mm pitch)
EMBOSSED TAPE DIMENSIONS (unit: mm)
Specifications for taping
In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.
Tape I
Tape Il
（A±0.3）
（A±0.3）
D±1
（B）
Label
Embossed carrier tape
φ380
（4.0）
Top cover tape
（8.0） （2.0）
（8.0） （2.0）
φ1.5 +0.1
0
（C）
（1.75）
Leading direction after packaging
（4.0）
（C）
（1.75）
Leading direction after packaging
Specifications for the plastic reel
In accordance with EIAJ ET-7200B.
Embossed mounting-hole
Taping reel
φ1.5 +0.1
0
Dimension table
Type/Mated height
Number of pins
Type of taping
A
B
C
D
Quantity per reel
Common for socket and header
1.5 mm, 2.0 mm,
2.5 mm and 3.0 mm
Header
3.5 mm
Max. 18
Tape I
16.0
—
7.5
17.4
3,000
20 to 70
Tape I
24.0
—
11.5
25.4
3,000
80 to 100
Tape II
32.0
28.4
14.2
33.4
3,000
20 to 40
Tape I
24.0
—
11.5
25.4
2,000
Socket
3.5 mm
Connector orientation with respect to embossed tape feeding direction
There is no indication on this product regarding top-bottom or left-right orientation.
Type
Direction
of tape progress
Common for P4
Socket
Header
–5–
ACCTB57E 201803-T
Narrow pitch connectors P4 (0.4mm pitch)
For board-to-board For board-to-FPC
P4
Connectors for
inspection usage
(0.4mm pitch)
3,000 mating and unmating cycles Connectors for inspection usage
FEATURES
m
m
96
3.
m
1m
5.
Socket
1. 3,000 mating and unmating cycles
2. Same external dimensions and foot pattern as standard
type.
3. Improved mating
Insertion and removal easy due to a reduction in mating
retention force. This is made possible by a simple locking
structure design.
(Mating retention force cannot be warranted.)
4. Please avoid using for applications other than inspection.
Header
APPLICATIONS
Ideal for module unit inspection and equipment assembly
inspection
TABLE OF PRODUCT TYPES
✩: Available for sale
Product name
P4 for inspection
14
✩
20
✩
22
✩
24
✩
26
✩
30
✩
34
✩
Number of pins
40
44
✩
✩
50
✩
54
✩
60
✩
64
✩
70
✩
80
✩
100
✩
Notes: 1. You can use with each mated height in common.
2. Please contact our sales office about availability and number of pins other than those shown above.
3. Please keep the minimum order quantities no less than 50 pieces per lot.
PRODUCT TYPES
Part No.
Socket
AXK7E**46G
Header
AXK8E**46WG
Note: When placing an order, substitute the “ ** ” (asterisk) in the above part number with the number of pins for the specific connector.
–6–
ACCTB57E 201803-T
Narrow pitch connectors P4 (0.4mm pitch)
NOTES (Unit: mm)
As shown below, excess force during insertion may result
in damage to the connector or removal of the solder. Also,
to prevent connector damage please confirm the correct
position before mating connectors.
Keep the PC board warp no more than 0.03 mm in relation
to the overall length of the connector.
Max. 0.03 mm
Design of PC board patterns
Conduct the recommended foot pattern design, in order to
preserve the mechanical strength of terminal solder areas.
Recommended PC board and metal mask patterns
Connectors are mounted with high pitch density, intervals of 0.35
mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise,
solder bridges and other issues make sure the proper levels of
solder is used.
0.40±0.05
0.115±0.05
0.40±0.05
0.23±0.03
0.40±0.05
0.40±0.05
0.115±0.05
5.70±0.05
3.50±0.05
4.56±0.05
2.96±0.05
0.40±0.05
The figures are recommended patterns. Please use them as a
reference.
Header
Recommended PC board pattern
(TOP VIEW)
Socket
Recommended PC board pattern
(TOP VIEW)
0.40±0.05
0.23±0.03
Max. 0.03 mm
Recommended metal mask pattern
Metal mask thickness: When 150μm
(Opening ratio: 32%)
0.35±0.01
0.10±0.01
(0.30)
0.40±0.01
0.20±0.01
0.40±0.01
0.20±0.01
0.35±0.01
0.10±0.01
(0.51)
(0.30)
5.50±0.01
4.48±0.01
4.10±0.01
3.50±0.01
(0.51)
Recommended metal mask pattern
Metal mask thickness: When 150μm
(Opening ratio: 40%)
Recommended metal mask pattern
Metal mask thickness: When 120μm
(Opening ratio: 40%)
0.35±0.01
0.10±0.01
(0.37)
0.40±0.01
0.20±0.01
0.40±0.01
0.20±0.01
0.35±0.01
0.10±0.01
(0.63)
(0.37)
5.50±0.01
4.24±0.01
4.10±0.01
3.36±0.01
(0.63)
Recommended metal mask pattern
Metal mask thickness: When 120μm
(Opening ratio: 50%)
Please refer to the latest product specifications when
designing your product.
–7–
ACCTB57E 201803-T
For board-to-board/board-to-FPC
Notes on Using Narrow pitch Connectors/
High Current Connectors
About safety remarks
Observe the following safety remarks to prevent accidents and injuries.
3) Panasonic Corporation is consistently striving to improve
1) Do not use these connectors beyond the specification sheets.
quality and reliability. However, the fact remains that electrical
The usage outside of specified rated current, dielectric strength,
components and devices generally cause failures at a given
and environmental conditions and so on may cause circuitry
statistical probability. Furthermore, their durability varies with
damage via abnormal heating, smoke, and fire.
use environments or use conditions. In this respect, please
2) In order to avoid accidents, your thorough specification review
check for actual electrical components and devices under actual
is appreciated. Please contact our sales office if your usage is
conditions before use. Continued usage in a state of degraded
out of the specifications. Otherwise, Panasonic Corporation
condition may cause the deteriorated insulation, thus result in
cannot guarantee the quality and reliability.
abnormal heat, smoke or firing. Please carry out safety design
and periodic maintenance including redundancy design, design
for fire spread prevention, and design for malfunction prevention
so that no accidents resulting in injury or death, fire accidents, or
social damage will be caused as a result of failure of the
products or ending life of the products.
Regarding the design of devices and PC board patterns
1) When using the board to board connectors, do not connect a
pair of board with multiple connectors. Otherwise, misaligned
connector positions may cause mating failure or product
breakage.
2) With mounting equipment, there may be up to a ±0.2 to 0.3
mm error in positioning. Be sure to design PC boards and
patterns while taking into consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed on the body to aid in
positioning. When using these connectors, make sure that the
PC board is designed with positioning holes to match these tabs.
4) To ensure the required mechanical strength when soldering
the connector terminals, make sure the PC board meets
recommended PC board pattern design dimensions given.
5) PC board
Control the thicknesses of the cover lay and adhesive to prevent
poor soldering. This connector has no stand-off. Therefore,
minimize the thickness of the cover lay, etc. so as to prevent the
occurrence of poor soldering.
6) For all connectors of the narrow pitch series, to prevent the
PC board from coming off during vibrations or impacts, and to
prevent loads from falling directly on the soldered portions, be
sure to design some means to fix the PC board in place.
Example) Secure in place with screws
7) When mounting connectors on a FPC
• When the connector soldered to FPC is mated or unmated,
solder detachment may occur by the force to the terminals.
Connector handling is recommended in the condition when the
reinforcing plate is attached to the backside of FPC where the
connector is mounted. The external dimension of the reinforcing
plate is recommended to be larger than the dimension of
“Recommended PC board pattern” (extended dimension of one
side is approximately 0.5 to 1.0 mm). The materials and
thickness of the reinforcing plate are glass epoxy or polyimide
(thickness 0.2 to 0.3 mm) or SUS (thickness 0.1 to 0.2 mm).
• As this connector has temporary locking structure, the
connector mating may be separated by the dropping impact
depend on the size, weight or bending force of the FPC. Please
consider the measures at usage to prevent the mating
separation.
8) The narrow pitch connector series is designed to be compact
and thin. Although ease of handling has been taken into
account, take care when mating the connectors, as
displacement or angled mating could damage or deform the
connector.
Screw
↓
↓
Spacer
Connector
PC board
Spacer
When connecting PC boards, take appropriate measures to
prevent the connector from coming off.
–1–
ACCTB48E 201803-T
Notes on Using Narrow pitch Connectors/High Current Connectors
Regarding the selection of the connector placement machine and the mounting
procedures
1) Select the placement machine taking into consideration the
connector height, required positioning accuracy, and packaging
conditions.
2) Be aware that if the chucking force of the placement machine
is too great, it may deform the shape of the connector body or
connector terminals.
3) Be aware that during mounting, external forces may be
applied to the connector contact surfaces and terminals and
cause deformations.
4) Depending on the size of the connector being used, self
alignment may not be possible. In such cases, be sure to
carefully position the terminal with the PC board pattern.
5) The positioning bosses give an approximate alignment for
positioning on the PC board. For accurate positioning of the
connector when mounting it to the PC board, we recommend
using an automatic positioning machine.
6) In case of dry condition, please note the occurrence of static
electricity. The product may be adhered to the embossed carrier
tape or the cover tape in dry condition. Recommended humidity
is from 40 to 60%RH and please remove static electricity by
ionizer in manufacturing process.
Regarding soldering
Reflow soldering
1) Measure the recommended profile temperature for reflow
soldering by placing a sensor on the PC board near the
connector surface or terminals. (Please refer to the specification
for detail because the temperature setting differs by products.)
2) As for cream solder printing, screen printing is recommended.
3) When setting the screen opening area and PC board foot
pattern area, refer the recommended PC board pattern and
window size of metal mask on the specification sheet, and make
sure that the size of board pattern and metal mask at the base of
the terminals are not increased.
4) Please pay attentions not to provide too much solder. It
makes miss mating because of interference at soldering portion
when mating.
Terminal
Paste solder
PC board foot pattern
5) When mounting on both sides of the PC board and the
connector is mounting on the underside, use adhesives or other
means to ensure the connector is properly fixed to the PC board.
(Double reflow soldering on the same side is possible.)
6) The condition of solder or flux rise and wettability varies
depending on the type of solder and flux. Solder and flux
characteristics should be taken into consideration and also set
the reflow temperature and oxygen level.
Hand soldering
1) Set the soldering iron so that the tip temperature is less than
that given in the table below.
Table A
Product name
Soldering iron temperature
SMD type connectors all products
300°C within 5 sec.
350°C within 3 sec.
180℃
150℃
Peak temperature
Preheating
220℃
200℃
25 sec.
60 to 120 sec.
70 sec.
Upper limited
(Solder heat resistance)
Lower limited
(Solder wettability)
Time
For products other than the ones above, please refer to the
latest product specifications.
9) The temperature profiles given in this catalog are values
measured when using the connector on a resin-based PC
board. When performed reflow soldering on a metal board (iron,
aluminum, etc.) or a metal table to mount on a FPC, make sure
there is no deformation or discoloration of the connector before
mounting.
10) Please contact our sales office when using a screen-printing
thickness other than that recommended.
4) Be aware that soldering while applying a load on the
connector terminals may cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on the contact surfaces
during soldering operations. After soldering, carefully check the
contact surfaces and clean off any solder before use.
7) These connector is low profile type. If too much solder is
supplied for hand soldering, It makes miss mating because of
interference at soldering portion. Please pay attentions.
S
iro old
n eri
Apply the solder
wire here
Temperature
Peak temperature 260℃
230℃
ng
2) Do not allow flux to spread onto the connector leads or PC
board. This may lead to flux rising up to the connector inside.
3) Touch the soldering iron to the foot pattern. After the foot
pattern and connector terminal are heated, apply the solder wire
so it melts at the end of the connector terminals.
7) Do not use resin-containing solder. Otherwise, the contacts
might be firmly fixed.
8) Soldering conditions
Please use the reflow temperature profile conditions
recommended below for reflow soldering. Please contact our
sales office before using a temperature profile other than that
described below (e.g. lead-free solder)
Small angle as
possible up to
45 degrees
Terminal
PC board
Pattern
–2–
ACCTB48E 201803-T
Notes on Using Narrow pitch Connectors/High Current Connectors
Solder reworking
1) Finish reworking in one operation.
2) In case of soldering rework of bridges. Do not use
supplementary solder flux. Doing so may cause contact
problems by flux.
3) Keep the soldering iron tip temperature below the
temperature given in Table A.
Handling single components
1) Make sure not to drop or allow parts to fall from work bench.
2) Excessive force applied to the terminals could cause warping,
come out, or weaken the adhesive strength of the solder. Handle
with care.
3) Do not insert or remove the connector when it is not soldered.
Forcibly applied external pressure on the terminals can weaken
the adherence of the terminals to the molded part or cause the
terminals to lose their evenness.
Precautions for mating
This product is designed with ease of handling. However, in
order to prevent the deformation or damage of contacts and
molding, take care and do not mate the connectors as shown
right.
Press-fitting while the mating
Strongly pressed and
inlets of the socket and
twisted
header are not matched.
Tilted mating
Cleaning flux from PC board
There is no need to clean this product.
If cleaning it, pay attention to the following points to prevent the
negative effect to the product.
1) Keep the cleaning solvent clean and prevent the connector
contacts from contamination.
2) Some cleaning solvents are strong and they may dissolve the
molded part and characters, so pure water passed liquid solvent
is recommended.
Handling the PC board
Handling the PC board after mounting the connector
When cutting or bending the PC board after mounting the
connector, be careful that the soldered sections are subjected to
excessive force.
The soldered areas should not be subjected to force.
Storage of connectors
1) To prevent problems from voids or air pockets due to heat of
reflow soldering, avoid storing the connectors in areas of high
humidity.
2) Depending on the connector type, the color of the connector
may vary from connector to connector depending on when it is
produced. Some connectors may change color slightly if
subjected to ultraviolet rays during storage. This is normal and
will not affect the operation of the connector.
3) When storing the connectors with the PC boards assembled
and components already set, be careful not to stack them up so
the connectors are subjected to excessive forces.
4) Avoid storing the connectors in locations with excessive dust.
The dust may accumulate and cause improper connections at
the contact surfaces.
Other Notes
1) Do not remove or insert the electrified connector (in the state
of carrying current or applying voltage).
2) Dropping of the products or rough mishandling may bend or
damage the terminals and possibly hinder proper reflow
soldering.
3) Before soldering, try not to insert or remove the connector
more than absolutely necessary.
–3–
4) When coating the PC board after soldering the connector to
prevent the deterioration of insulation, perform the coating in
such a way so that the coating does not get on the connector.
5) There may be variations in the colors of products from
different production lots. This is normal.
6) The connectors are not meant to be used for switching.
7) Product failures due to condensation are not covered by
warranty.
ACCTB48E 201803-T
Notes on Using Narrow pitch Connectors/High Current Connectors
Regarding sample orders to confirm proper mounting
When ordering samples to confirm proper mounting with the
placement machine, connectors are delivered in 50-piece units
in the condition given right. Consult a sale representative for
ordering sample units.
Condition when delivered from manufacturing
Embossed tape
amount required
for the mounting
Required number
of products for
sample production
Reel
Delivery can also be made on a reel
by customer request.
(Unit 50 pcs.)
Please refer to the latest product specifications when
designing your product.
–4–
ACCTB48E 201803-T
