AXK760147G

For board-to-board For board-to-FPC Partly to Be Discontinued Last time buy: September 30, 2019 P4 Narrow pitch connectors (0.4mm pitch) FEATURES • Without soldering terminals m m 96 3. m 1m 5. Socket Header • With soldering terminals 1. 0.4 mm pitch and mated heights of 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm. 2. Strong resistance to adverse environments! Utilizes “ ” construction for high contact reliability. 3. Constructed with impact dispersion keys inside the body to disperse shocks when dropped. 5. Contributes to improved mating 1) Guides are provided to take up any position shift and facilitate insertion. Insertion guide Impact dispersion key Socket m m Socket 96 m 1m 5. 3. 2) Simple lock structure provides tactile feedback to ensure excellent mating/ unmating operation feel. Header Header side contact RoHS compliant Header A high level of shock resistance is ensured by dispersing impact over the four locations where the socket indentations and header protrusions are mated together. Note: The following number of pins are not supported due to suction surface factors. • Without soldering terminals: 18 pins or less 4. Construction makes designing devices easier. The lower connector bottom surface construction prevents contact and shorts between the PCB and metal terminals. This enables freedom in pattern wiring, helping to make PCB’s smaller. Insulation area Insulation area Connector bottom: Create any thru-hole and pattern wiring. –1– Simple lock mechanism Socket side contact 6. Design facilitates efficient mounting. Features a terminal flatness of 0.08 mm, construction resistant to creeping flux, and design that allows visual inspection of the soldered part. 7. Connectors for inspection available APPLICATIONS • Mobile devices, such as cellular phones, digital still cameras and digital video cameras. • Board-to-board connection in measuring devices and industrial equipment, etc. • Consumer equipment such as handheld terminals ACCTB115E 201809-T Partly to Be Discontinued Last time buy: September 30, 2019 Narrow pitch connectors P4 (0.4mm pitch) ORDERING INFORMATION AXK G 7: Narrow Pitch Connector P4 (0.4 mm pitch) Socket 8: Narrow Pitch Connector P4 (0.4 mm pitch) Header Number of pins (2 digits) Mated height 1: For mated height 1.5 mm 2: For mated height 2.0 mm 3: For mated height 2.5 mm and 3.0 mm 4: For mated height 3.5 mm 1: For mated height 1.5 mm, 2.0 mm and 2.5 mm 2: For mated height 3.0 mm and 3.5 mm Functions 2: With soldering terminals, without positioning bosses 4: Without soldering terminals, without positioning bosses Surface treatment (Contact portion / Terminal portion) 7: Ni plating on base, Au plating on surface (for Ni barrier available) 5: Ni plating on base, Au plating on surface Other specifications W: V notch Packing G: 3,000 pieces embossed tape and plastic reel × 2∗ Notes: 1. Only a socket of mated height 3.5 mm: 2,000 pieces embossed tape and plastic reel × 2. 2. Please note that the models with a soldering terminals (8th digit of part number is “2”) and those without a soldering terminals (8th digit of part number is “4”) are shaped differently and are not compatible. –2– ACCTB115E 201809-T Partly to Be Discontinued Last time buy: September 30, 2019 Narrow pitch connectors P4 (0.4mm pitch) PRODUCT TYPES 1. Without soldering terminals Mated height 1.5 mm 2.0 mm 2.5 mm 3.0 mm 3.5 mm Number of pins Part number Packing 14 Socket AXK714147G Header AXK814145WG 20 22 AXK720147G AXK722147G AXK820145WG AXK822145WG 24 26 30 34 40 44 50 54 60 64 70 80 100 14 AXK724147G AXK726147G AXK730147G AXK734147G AXK740147G AXK744147G AXK750147G AXK754147G AXK760147G AXK764147G AXK770147G AXK780147G AXK700147G AXK714247G AXK824145WG AXK826145WG AXK830145WG AXK834145WG AXK840145WG AXK844145WG AXK850145WG AXK854145WG AXK860145WG AXK864145WG AXK870145WG AXK880145WG AXK800145WG AXK814145WG 20 24 26 30 40 50 60 70 80 AXK720247G AXK724247G AXK726247G AXK730247G AXK740247G AXK750247G AXK760247G AXK770247G AXK780247G AXK820145WG AXK824145WG AXK826145WG AXK830145WG AXK840145WG AXK850145WG AXK860145WG AXK870145WG AXK880145WG 14 20 24 AXK714347G AXK720347G AXK724347G AXK814145WG AXK820145WG AXK824145WG 30 40 50 60 70 80 20 24 30 40 50 60 80 20 30 40 AXK730347G AXK740347G AXK750347G AXK760347G AXK770347G AXK780347G AXK720347G AXK724347G AXK730347G AXK740347G AXK750347G AXK760347G AXK780347G AXK720447G AXK730447G AXK740447G AXK830145WG AXK840145WG AXK850145WG AXK860145WG AXK870145WG AXK880145WG AXK820245WG AXK824245WG AXK830245WG AXK840245WG AXK850245WG AXK860245WG AXK880245WG AXK820245WG AXK830245WG AXK840245WG Inner carton Outer carton 3,000 pieces 6,000 pieces Socket: 2,000 pieces Header: 3,000 pieces Socket: 4,000 pieces Header: 6,000 pieces Note: Regarding ordering units; During production: Please make orders in 1-reel units. For samples, please contact our sales office. –3– ACCTB115E 201809-T Partly to Be Discontinued Last time buy: September 30, 2019 Narrow pitch connectors P4 (0.4mm pitch) 2. With soldering terminals Mated height Part number Number of pins 1.5 mm 2.0 mm 2.5 mm 3.0 mm 3.5 mm Packing 10 34 40 34 12 Socket AXK710127G AXK734127G AXK740127G AXK734227G AXK712327G Header AXK810125WG AXK834125WG AXK840125WG AXK834125WG AXK812125WG 20 32 40 20 36 60 70 80 60 AXK720327G AXK732327G AXK740327G AXK720327G AXK736327G AXK760327G AXK770327G AXK780327G AXK760427G AXK820125WG AXK832125WG AXK840125WG AXK820225WG AXK836225WG AXK860225WG AXK870225WG AXK880225WG AXK860225WG 70 80 AXK770427G AXK780427G AXK870225WG AXK880225WG Inner carton Outer carton 3,000 pieces 6,000 pieces Socket: 2,000 pieces Header: 3,000 pieces Socket: 4,000 pieces Header: 6,000 pieces Note: Regarding ordering units; During production: Please make orders in 1-reel units. For samples, please contact our sales office. SPECIFICATIONS 1. Characteristics Electrical characteristics Mechanical characteristics Item Rated current Rated voltage Dielectric strength Insulation resistance Specifications 0.3A/pin contact (Max. 5 A at total pin contacts) 60V AC/DC 150V AC for 1 min. Min. 1,000MΩ (initial) Contact resistance Max. 70mΩ Composite insertion force Max. 0.981N/pin contact × pin contacts (initial) Composite removal force Min. 0.0588N/pin contact × pin contacts (Mated height 1.5 mm) Min. 0.118N/pin contact × pin contacts (Mated height 2.0 D 3.5 mm) Post holding force Min. 0.981N/pin contact Ambient temperature Storage temperature Detection current: 1mA Using 250V DC megger (applied for 1 min.) Based on the contact resistance measurement method specified by JIS C 5402. Measuring the maximum force. As the contact is axially pull out. No icing or condensation. –55°C to +85°C Soldering heat resistance Conditions Max. peak temperature of 260°C (on the surface of the PC board around the connector terminals) 300°C within 5 sec. 350°C within 3 sec. –55°C to +85°C (product only) –40°C to +50°C (emboss packing) Infrared reflow soldering Soldering iron No icing or condensation. Conformed to MIL-STD-202F, method 107G Environmental characteristics Thermal shock resistance (header and socket mated) Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) Lifetime characteristics 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 70mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 70mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 70mΩ H2S resistance (header and socket mated) 48 hours, contact resistance max. 70mΩ Insertion and removal life 50 times Order Temperature (°C) 1 –55 −30 2 3 85 +30 4 –55 −30 Time (minutes) 30 Max. 5 30 Max. 5 Conformed to IEC60068-2-78 Bath temperature 40°C±2°C, humidity 90% to 95% R.H. Conformed to IEC60068-2-11 Bath temperature 35°C±2°C, saltwater concentration 5%±1% Bath temperature 40°C±2°C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Repeated insertion and removal speed of max. 200 times/hours Mated height 1.5mm, 20 pin contacts; Socket: 0.04g Header: 0.02g Unit weight 2. Material and surface treatment Part name Molded portion Material LCP resin (UL94V-0) Contact/Post Copper alloy Soldering terminals portion Copper alloy Surface treatment — Contact portion: Ni plating on base, Au plating on surface Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal) However, upper terminal of Ni barrier production: Exposed over Ni The area adjacent to the terminal of the sockets on models with Ni barrier is exposed to Ni on base. Ni plating on base, Sn plating on surface (Except for front terminal) –4– ACCTB115E 201809-T Partly to Be Discontinued Last time buy: September 30, 2019 Narrow pitch connectors P4 (0.4mm pitch) DIMENSIONS (Unit: mm) The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/ 1. Without Soldering Terminals Socket (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm) CAD Data A Dimension table (mm) B±0.1 1.11 (Suction face) E 4.10 0.15±0.03 3.75 5.10 0.40±0.05 0.80 (0.675) 0.80 (0.675) Terminal coplanarity 0.08 0.40±0.05 C Max. 18 pin contacts D General tolerance: ±0.2 Number of pins/ dimension 14 5.10 20 22 24 26 30 34 40 44 50 54 60 64 70 80 100 6.30 6.70 7.10 7.50 8.30 9.10 10.30 11.10 12.30 13.10 14.30 15.10 16.30 18.30 22.30 A B C D 2.40 — 2.80 3.60 4.00 4.40 4.80 5.60 6.40 7.60 8.40 9.60 10.40 11.60 12.40 13.60 15.60 19.60 1.60 2.00 2.40 2.80 3.60 4.40 5.60 6.40 7.60 8.40 9.60 10.40 11.60 13.60 17.60 — — — — — — — — — — — — — — — C D Mated height/dimension 1.5mm 2.0mm 2.5mm, 3.0mm E 1.50 1.92 2.42 3.5mm 2.92 Header (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm) CAD Data A Terminal coplanarity 0.08 B±0.1 0.40±0.05 (0.42) 3.12 0.10±0.03 (0.42) 0.76 0.76 C F (Suction face) 3.96 2.66 0.15±0.03 3.96 E 2.19 0.40±0.05 Max. 18 pin contacts Number of pins/ dimension 14 3.90 2.40 — 3.04 20 22 24 26 30 34 40 44 50 54 60 64 70 80 100 5.10 5.50 5.90 6.30 7.10 7.90 9.10 9.90 11.10 11.90 13.10 13.90 15.10 17.10 21.10 3.60 4.00 4.40 4.80 5.60 6.40 7.60 8.40 9.60 10.40 11.60 12.40 13.60 15.60 19.60 1.60 2.00 2.40 2.80 3.60 4.40 5.60 6.40 7.60 8.40 9.60 10.40 11.60 13.60 17.60 — — — — — — — — — — — — — — — E 1.31 2.26 F 1.20 1.26 A Mated height/dimension 1.5mm, 2.0mm, 2.5mm 3.0mm, 3.5mm General tolerance: ±0.2 D Dimension table (mm) B –5– 3.50±0.15 3.00±0.15 2.50±0.15 2.00±0.15 1.50±0.15 Socket and Header are mated ACCTB115E 201809-T Partly to Be Discontinued Last time buy: September 30, 2019 Narrow pitch connectors P4 (0.4mm pitch) 2. With Soldering Terminals Socket (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm) CAD Data Terminal coplanarity 0.08 0.40±0.05 0.15±0.03 Dimension table (mm) 0.80 C 0.80 Soldering terminals (0.675) 1.11 (Suction face) 3.75 5.10 4.10 F 0.60 (0.675) A B±0.1 0.10±0.03 0.50 D 10 and 12 pin contacts 20 pin contacts E E General tolerance: ±0.2 Number of pins/ dimension 10 5.90 1.60 — 4.60 2.00 12 20 32 34 36 40 60 70 80 6.30 7.90 10.30 10.70 11.10 11.90 15.90 17.90 19.90 2.00 3.60 6.00 6.40 6.80 7.60 11.60 13.60 15.60 — — 3.20 3.60 4.00 4.80 8.80 10.80 12.80 5.00 6.60 9.00 9.40 9.40 10.60 14.60 16.60 18.60 2.40 2.40 — — — — — — — C D E A B Mated height/dimension 1.5mm 2.0mm 2.5mm, 3.0mm F 1.50 1.92 2.42 3.5mm 2.92 C D E Header (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm) CAD Data A Terminal coplanarity 0.08 B±0.1 0.40±0.05 0.40±0.05 0.76 0.10±0.03 C 3.96 Dimension table (mm) (0.42) 0.60 3.12 2.19 G (Suction face) 2.66 (0.42) F 0.15±0.03 Soldering terminals D 10 and 12 pin contacts E 20 pin contacts E Number of pins/ dimension 10 3.10 1.60 — 1.94 1.64 12 20 32 34 36 40 60 70 80 3.50 5.10 7.50 7.90 8.30 9.10 13.10 15.10 17.10 2.00 3.60 6.00 6.40 6.80 7.60 11.60 13.60 15.60 — — 3.20 3.60 4.00 4.80 8.80 10.80 12.80 2.34 3.94 6.34 6.74 7.14 7.94 11.94 13.94 15.94 2.04 2.80 — — — — — — — F 1.31 2.26 G 1.20 1.26 A B Mated height/dimension 1.5mm, 2.0mm, 2.5mm 3.0mm, 3.5mm General tolerance: ±0.2 –6– 3.50±0.15 3.00±0.15 2.50±0.15 2.00±0.15 1.50±0.15 Socket and Header are mated. ACCTB115E 201809-T Partly to Be Discontinued Last time buy: September 30, 2019 Narrow pitch connectors P4 (0.4mm pitch) EMBOSSED TAPE DIMENSIONS (unit: mm) • Tape dimensions (Conforming to JIS C 0806:1990. However, some tapes have mounting hole pitches that do not comply with the standard.) Tape I Tape II A±0.3 D±1 A±0.3 C Taping reel Label B C 8.0 Top cover tape 4 2 Pull out direction 4 2 1.75 380 dia. 1.75 Pull out direction • Plastic reel dimensions (Conforming to EIAJ ET-7200B) Embossed carrier tape Embossed mounting-hole 8.0 1.5+0.1 0 dia. 1.5+0.1 0 dia. Dimension table (mm) 1. Without Soldering Terminals Number of pins Socket Header Type of taping A B C D Quantity per reel Max. 18 Max. 18 20 to 70 20 to 70 80 to 100 80 to 100 20 to 40 Tape I Tape I Tape II Tape I 16.0 24.0 32.0 24.0 — — 28.4 — 7.5 11.5 14.2 11.5 17.4 25.4 33.4 25.4 3,000 3,000 3,000 2,000 Number of pins Socket Header Type of taping A B C D Quantity per reel Tape I Tape I Tape II Tape I Tape II 16.0 24.0 32.0 24.0 32.0 — — 28.4 — 28.4 7.5 11.5 14.2 11.5 14.2 17.4 25.4 33.4 25.4 33.4 3,000 3,000 3,000 2,000 2,000 Mated height Common for socket and header: 1.5 mm, 2.0 mm, 2.5 mm and 3.0 mm Header: 3.5 mm Socket: 3.5 mm 2. With Soldering Terminals Mated height Common for socket and header: 1.5 mm, 2.0 mm, 2.5 mm and 3.0 mm Header: 3.5 mm Max. 18 20 to 60 70 to 80 Max. 18 20 to 70 80 60 70 to 80 Socket: 3.5 mm 3. Connector orientation with respect to direction of progress of embossed tape 1) Without soldering terminals Type Common for P4 Direction of tape progress Socket Header Note: There is no indication on this product regarding top-bottom or left-right orientation. 2) With soldering terminals Type Common for P4 Direction of tape progress Socket Header Note: There is no indication on this product regarding top-bottom or left-right orientation. –7– ACCTB115E 201809-T Partly to Be Discontinued Last time buy: September 30, 2019 Narrow pitch connectors P4 (0.4mm pitch) For board-to-board For board-to-FPC P4 Connectors for inspection usage (0.4mm pitch) m m 96 3. m 1m 5. Socket Header RoHS compliant FEATURES APPLICATIONS 1. 3,000 mating and unmating cycles 2. Same external dimensions and foot pattern as standard type. 3. Improved mating Insertion and removal easy due to a reduction in mating retention force. This is made possible by a simple locking structure design. Ideal for module unit inspection and equipment assembly inspection Note: Mating retention force cannot be warranted. Please avoid using for applications other than inspection. TABLE OF PRODUCT TYPES ✩: Available for sale Product name 10 P4 for inspection without soldering terminals P4 for inspection with soldering terminals ✩ 12 14 20 22 24 26 30 ✩ ✩ ✩ ✩ ✩ ✩ ✩ Number of pins 34 40 ✩ ✩ ✩ ✩ ✩ 44 50 54 60 64 70 80 100 ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ ✩ Notes: 1. You can use with each mated height in common. 2. Please inquire about number of pins other than those shown above. 3. Please inquire with us regarding availability. 4. Please keep the minimum order quantities no less than 50 pieces per lot. 5. Please inquire if further information is needed. PRODUCT TYPES Specifications Socket Without soldering terminals With soldering terminals Part No. AXK7E∗∗46G AXK7E∗∗26G Header Specifications Without soldering terminals With soldering terminals Part No. AXK8E∗∗46WG AXK8E∗∗26WG Note: When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connector. –8– ACCTB115E 201809-T Partly to Be Discontinued Last time buy: September 30, 2019 Narrow pitch connectors P4 (0.4mm pitch) NOTES 1) Without soldering terminals Socket Header Recommended PC board pattern (TOP VIEW) Recommended PC board pattern (TOP VIEW) 0.40±0.05 0.40±0.05 0.23±0.03 0.40±0.05 0.23±0.03 0.40±0.05 2. Keep the PC board warp no more than 0.03 mm in relation to the overall length of the connector. 2.96±0.05 4.56±0.05 3.50±0.05 5.70±0.05 1. As shown below, excess force during insertion may result in damage to the connector or removal of the solder. Also, to prevent connector damage please confirm the correct position before mating connectors. 0.115±0.05 0.40±0.05 0.115±0.05 0.40±0.05 Recommended metal mask pattern Recommended metal mask pattern Metal mask thickness: When 150 μm (Opening area ratio: 40%) Metal mask thickness: When 150 μm (Opening area ratio: 32%) 0.40±0.01 0.20±0.01 4.10±0.01 (0.51) (0.30) 3.50±0.01 (0.30) 0.35±0.01 0.10±0.01 Recommended metal mask pattern Recommended metal mask pattern Metal mask thickness: When 120 μm (Opening area ratio: 50%) Metal mask thickness: When 120 μm (Opening area ratio: 40%) 0.40±0.01 0.35±0.01 0.40±0.01 0.10±0.01 0.20±0.01 0.35±0.01 0.10±0.01 4.10±0.01 (0.37) 3.36±0.01 (0.37) (0.63) 0.20±0.01 (0.63) 3. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. 0.40±0.01 0.10±0.01 5.50±0.01 4.48±0.01 Max. 0.03 mm 5.50±0.01 4.24±0.01 Max. 0.03 mm 0.35±0.01 (0.51) 0.20±0.01 –9– ACCTB115E 201809-T Partly to Be Discontinued Last time buy: September 30, 2019 Narrow pitch connectors P4 (0.4mm pitch) 2) With soldering terminals Socket Header Recommended PC board pattern (TOP VIEW) Recommended PC board pattern (TOP VIEW) 0.40±0.05 0.23±0.03 0.90±0.05 (0.80) (0.80) (1.10) 0.40±0.05 0.115±0.05 4.56±0.05 2.96±0.05 0.90±0.05 (1.10) 3.50±0.05 0.80±0.05 2.15±0.05 0.80±0.05 0.82±0.05 Recommended metal mask pattern Recommended metal mask pattern Metal mask thickness: When 150 μm (Terminal portion opening area ratio: 40%) (Metal portion opening area ratio: 65%) Metal mask thickness: When 150 μm (Terminal portion opening area ratio: 32%) (Metal portion opening area ratio: 65%) 0.35±0.01 0.10±0.01 0.40±0.01 0.20±0.01 0.35±0.01 0.10±0.01 (0.51) (0.30) 5.50±0.01 4.48±0.01 0.80±0.01 4.10±0.01 3.50±0.01 0.80±0.01 (0.30) (0.51) 0.40±0.01 0.20±0.01 0.58±0.01 0.82±0.01 0.82±0.01 0.58±0.01 2.15±0.01 2.15±0.01 Recommended metal mask pattern Metal mask thickness: When 120 μm (Terminal portion opening area ratio: 50%) (Metal portion opening area ratio: 80%) Metal mask thickness: When 120 μm (Terminal portion opening area ratio: 40%) (Metal portion opening area ratio: 80%) 0.40±0.01 0.20±0.01 0.35±0.01 0.10±0.01 (0.37) (0.63) Recommended metal mask pattern 0.40±0.01 0.20±0.01 0.35±0.01 0.10±0.01 (0.63) (0.37) 4.10±0.01 3.36±0.01 0.80±0.01 5.50±0.01 4.24±0.01 0.80±0.01 5.70±0.05 0.40±0.05 0.23±0.03 0.40±0.05 0.115±0.05 Please refer to the latest product specifications when designing your product. 0.72±0.01 2.15±0.01 2.15±0.01 0.72±0.01 0.82±0.01 0.82±0.01 –10– ACCTB115E 201809-T Notes on Using Narrow pitch Connectors/High Current Connectors For board-to-board/board-to-FPC Notes on Using Narrow pitch Connectors/ High Current Connectors About safety remarks Observe the following safety remarks to prevent accidents and injuries. 3) Panasonic Corporation is consistently striving to improve 1) Do not use these connectors beyond the specification sheets. quality and reliability. However, the fact remains that electrical The usage outside of specified rated current, dielectric strength, components and devices generally cause failures at a given and environmental conditions and so on may cause circuitry statistical probability. Furthermore, their durability varies with damage via abnormal heating, smoke, and fire. use environments or use conditions. In this respect, please 2) In order to avoid accidents, your thorough specification review check for actual electrical components and devices under actual is appreciated. Please contact our sales office if your usage is conditions before use. Continued usage in a state of degraded out of the specifications. Otherwise, Panasonic Corporation condition may cause the deteriorated insulation, thus result in cannot guarantee the quality and reliability. abnormal heat, smoke or firing. Please carry out safety design and periodic maintenance including redundancy design, design for fire spread prevention, and design for malfunction prevention so that no accidents resulting in injury or death, fire accidents, or social damage will be caused as a result of failure of the products or ending life of the products. Regarding the design of devices and PC board patterns 1) When using the board to board connectors, do not connect a pair of board with multiple connectors. Otherwise, misaligned connector positions may cause mating failure or product breakage. 2) With mounting equipment, there may be up to a ±0.2 to 0.3 mm error in positioning. Be sure to design PC boards and patterns while taking into consideration the performance and abilities of the required equipment. 3) Some connectors have tabs embossed on the body to aid in positioning. When using these connectors, make sure that the PC board is designed with positioning holes to match these tabs. 4) To ensure the required mechanical strength when soldering the connector terminals, make sure the PC board meets recommended PC board pattern design dimensions given. 5) PC board Control the thicknesses of the cover lay and adhesive to prevent poor soldering. This connector has no stand-off. Therefore, minimize the thickness of the cover lay, etc. so as to prevent the occurrence of poor soldering. 6) For all connectors of the narrow pitch series, to prevent the PC board from coming off during vibrations or impacts, and to prevent loads from falling directly on the soldered portions, be sure to design some means to fix the PC board in place. Example) Secure in place with screws 7) When mounting connectors on a FPC • When the connector soldered to FPC is mated or unmated, solder detachment may occur by the force to the terminals. Connector handling is recommended in the condition when the reinforcing plate is attached to the backside of FPC where the connector is mounted. The external dimension of the reinforcing plate is recommended to be larger than the dimension of “Recommended PC board pattern” (extended dimension of one side is approximately 0.5 to 1.0 mm). The materials and thickness of the reinforcing plate are glass epoxy or polyimide (thickness 0.2 to 0.3 mm) or SUS (thickness 0.1 to 0.2 mm). • As this connector has temporary locking structure, the connector mating may be separated by the dropping impact depend on the size, weight or bending force of the FPC. Please consider the measures at usage to prevent the mating separation. 8) The narrow pitch connector series is designed to be compact and thin. Although ease of handling has been taken into account, take care when mating the connectors, as displacement or angled mating could damage or deform the connector. Screw ↓ ↓ Spacer Connector PC board Spacer When connecting PC boards, take appropriate measures to prevent the connector from coming off. –11– ACCTB48E 201803-T Notes on Using Narrow pitch Connectors/High Current Connectors Regarding the selection of the connector placement machine and the mounting procedures 1) Select the placement machine taking into consideration the connector height, required positioning accuracy, and packaging conditions. 2) Be aware that if the chucking force of the placement machine is too great, it may deform the shape of the connector body or connector terminals. 3) Be aware that during mounting, external forces may be applied to the connector contact surfaces and terminals and cause deformations. 4) Depending on the size of the connector being used, self alignment may not be possible. In such cases, be sure to carefully position the terminal with the PC board pattern. 5) The positioning bosses give an approximate alignment for positioning on the PC board. For accurate positioning of the connector when mounting it to the PC board, we recommend using an automatic positioning machine. 6) In case of dry condition, please note the occurrence of static electricity. The product may be adhered to the embossed carrier tape or the cover tape in dry condition. Recommended humidity is from 40 to 60%RH and please remove static electricity by ionizer in manufacturing process. Regarding soldering Reflow soldering 1) Measure the recommended profile temperature for reflow soldering by placing a sensor on the PC board near the connector surface or terminals. (Please refer to the specification for detail because the temperature setting differs by products.) 2) As for cream solder printing, screen printing is recommended. 3) When setting the screen opening area and PC board foot pattern area, refer the recommended PC board pattern and window size of metal mask on the specification sheet, and make sure that the size of board pattern and metal mask at the base of the terminals are not increased. 4) Please pay attentions not to provide too much solder. It makes miss mating because of interference at soldering portion when mating. Terminal Paste solder PC board foot pattern 5) When mounting on both sides of the PC board and the connector is mounting on the underside, use adhesives or other means to ensure the connector is properly fixed to the PC board. (Double reflow soldering on the same side is possible.) 6) The condition of solder or flux rise and wettability varies depending on the type of solder and flux. Solder and flux characteristics should be taken into consideration and also set the reflow temperature and oxygen level. Hand soldering 1) Set the soldering iron so that the tip temperature is less than that given in the table below. Table A Product name Soldering iron temperature SMD type connectors all products 300°C within 5 sec. 350°C within 3 sec. 180℃ 150℃ Peak temperature Preheating 220℃ 200℃ 25 sec. 60 to 120 sec. 70 sec. Upper limited (Solder heat resistance) Lower limited (Solder wettability) Time For products other than the ones above, please refer to the latest product specifications. 9) The temperature profiles given in this catalog are values measured when using the connector on a resin-based PC board. When performed reflow soldering on a metal board (iron, aluminum, etc.) or a metal table to mount on a FPC, make sure there is no deformation or discoloration of the connector before mounting. 10) Please contact our sales office when using a screen-printing thickness other than that recommended. 4) Be aware that soldering while applying a load on the connector terminals may cause improper operation of the connector. 5) Thoroughly clean the soldering iron. 6) Flux from the solder wire may get on the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any solder before use. 7) These connector is low profile type. If too much solder is supplied for hand soldering, It makes miss mating because of interference at soldering portion. Please pay attentions. S iro old n eri Apply the solder wire here Temperature Peak temperature 260℃ 230℃ ng 2) Do not allow flux to spread onto the connector leads or PC board. This may lead to flux rising up to the connector inside. 3) Touch the soldering iron to the foot pattern. After the foot pattern and connector terminal are heated, apply the solder wire so it melts at the end of the connector terminals. 7) Do not use resin-containing solder. Otherwise, the contacts might be firmly fixed. 8) Soldering conditions Please use the reflow temperature profile conditions recommended below for reflow soldering. Please contact our sales office before using a temperature profile other than that described below (e.g. lead-free solder) Small angle as possible up to 45 degrees Terminal PC board Pattern –12– ACCTB48E 201803-T Notes on Using Narrow pitch Connectors/High Current Connectors Solder reworking 1) Finish reworking in one operation. 2) In case of soldering rework of bridges. Do not use supplementary solder flux. Doing so may cause contact problems by flux. 3) Keep the soldering iron tip temperature below the temperature given in Table A. Handling single components 1) Make sure not to drop or allow parts to fall from work bench. 2) Excessive force applied to the terminals could cause warping, come out, or weaken the adhesive strength of the solder. Handle with care. 3) Do not insert or remove the connector when it is not soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. Precautions for mating This product is designed with ease of handling. However, in order to prevent the deformation or damage of contacts and molding, take care and do not mate the connectors as shown right. Press-fitting while the mating Strongly pressed and inlets of the socket and twisted header are not matched. Tilted mating Cleaning flux from PC board There is no need to clean this product. If cleaning it, pay attention to the following points to prevent the negative effect to the product. 1) Keep the cleaning solvent clean and prevent the connector contacts from contamination. 2) Some cleaning solvents are strong and they may dissolve the molded part and characters, so pure water passed liquid solvent is recommended. Handling the PC board Handling the PC board after mounting the connector When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive force. The soldered areas should not be subjected to force. Storage of connectors 1) To prevent problems from voids or air pockets due to heat of reflow soldering, avoid storing the connectors in areas of high humidity. 2) Depending on the connector type, the color of the connector may vary from connector to connector depending on when it is produced. Some connectors may change color slightly if subjected to ultraviolet rays during storage. This is normal and will not affect the operation of the connector. 3) When storing the connectors with the PC boards assembled and components already set, be careful not to stack them up so the connectors are subjected to excessive forces. 4) Avoid storing the connectors in locations with excessive dust. The dust may accumulate and cause improper connections at the contact surfaces. Other Notes 1) Do not remove or insert the electrified connector (in the state of carrying current or applying voltage). 2) Dropping of the products or rough mishandling may bend or damage the terminals and possibly hinder proper reflow soldering. 3) Before soldering, try not to insert or remove the connector more than absolutely necessary. –13– 4) When coating the PC board after soldering the connector to prevent the deterioration of insulation, perform the coating in such a way so that the coating does not get on the connector. 5) There may be variations in the colors of products from different production lots. This is normal. 6) The connectors are not meant to be used for switching. 7) Product failures due to condensation are not covered by warranty. ACCTB48E 201803-T Notes on Using Narrow pitch Connectors/High Current Connectors Regarding sample orders to confirm proper mounting When ordering samples to confirm proper mounting with the placement machine, connectors are delivered in 50-piece units in the condition given right. Consult a sale representative for ordering sample units. Condition when delivered from manufacturing Embossed tape amount required for the mounting Required number of products for sample production Reel Delivery can also be made on a reel by customer request. (Unit 50 pcs.) Please refer to the latest product specifications when designing your product. –14– ACCTB48E 201803-T