For board-to-board For board-to-FPC
P4
Narrow pitch connectors
(0.4mm pitch)
FEATURES
• Without soldering terminals
m
m
96
3.
m
1m
5.
Socket
Header
• With soldering terminals
1. 0.4 mm pitch and mated heights of
1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and
3.5 mm.
2. Strong resistance to adverse
environments! Utilizes
“
” construction
for high contact reliability.
3. Constructed with impact dispersion
keys inside the body to disperse
shocks when dropped.
Impact dispersion key
Socket
m
m
96
3.
m
1m
5.
Socket
Header
2) Guides are provided to take up any
position shift and facilitate insertion.
Insertion guide
3) Simple lock structure provides tactile
feedback to ensure excellent mating/
unmating operation feel.
Header side
contact
RoHS compliant
Header
A high level of shock resistance is
ensured by dispersing impact over the
four locations where the socket
indentations and header protrusions are
mated together.
Note: The following number of pins are not supported
due to suction surface factors.
• Without soldering terminals: 18 pin contacts or less
• With soldering terminals: 22 pin contacts or less
4. Construction makes designing
devices easier.
1) The lower connector bottom surface
construction prevents contact and shorts
between the PCB and metal terminals.
This enables freedom in pattern wiring,
helping to make PCB’s smaller.
Simple lock
mechanism
Socket side
contact
5. Design facilitates efficient
mounting.
Features a terminal flatness of 0.08 mm,
construction resistant to creeping flux,
and design that allows visual inspection
of the soldered part.
6. Connectors for inspection available
APPLICATIONS
Mobile devices, such as cellular
phones, digital still cameras and
digital video cameras.
Connector bottom: Create any thru-hole and pattern wiring.
–1–
ACCTB57E 201509-T
Narrow pitch connectors P4 (0.4mm pitch)
ORDERING INFORMATION
AXK
G
7: Narrow Pitch Connector P4 (0.4 mm pitch) Socket
8: Narrow Pitch Connector P4 (0.4 mm pitch) Header
Number of pins (2 digits)
Mated height
1: For mated height 1.5 mm
2: For mated height 2.0 mm
3: For mated height 2.5 mm and 3.0 mm
4: For mated height 3.5 mm
1: For mated height 1.5 mm, 2.0 mm and 2.5 mm
2: For mated height 3.0 mm and 3.5 mm
Functions
2: With soldering terminals, without positioning bosses
4: Without soldering terminals, without positioning bosses
Surface treatment (Contact portion / Terminal portion)
7: Ni plating on base, Au plating on surface (for Ni barrier available)
5: Ni plating on base, Au plating on surface
Other specifications
W: V notch
Packing
G: 3,000 pieces embossed tape and plastic reel × 2∗
Notes: 1. Only a socket of mated height 3.5 mm: 2,000 pieces embossed tape and plastic reel × 2.
2. Please note that the models with a soldering terminals (8th digit of part number is “2”) and those without a soldering terminals (8th digit of part number is “4”)
are shaped differently and are not compatible.
–2–
ACCTB57E 201509-T
Narrow pitch connectors P4 (0.4mm pitch)
PRODUCT TYPES
1. Without soldering terminals
Mated height
1.5 mm
2.0 mm
2.5 mm
3.0 mm
3.5 mm
Number of pins
14
20
22
24
26
30
34
40
44
50
54
60
64
70
80
100
14
20
24
26
30
40
50
60
70
80
14
20
24
30
40
50
60
70
80
20
24
30
40
50
60
80
20
30
40
Part number
Socket
AXK714147G
AXK720147G
AXK722147G
AXK724147G
AXK726147G
AXK730147G
AXK734147G
AXK740147G
AXK744147G
AXK750147G
AXK754147G
AXK760147G
AXK764147G
AXK770147G
AXK780147G
AXK700147G
AXK714247G
AXK720247G
AXK724247G
AXK726247G
AXK730247G
AXK740247G
AXK750247G
AXK760247G
AXK770247G
AXK780247G
AXK714347G
AXK720347G
AXK724347G
AXK730347G
AXK740347G
AXK750347G
AXK760347G
AXK770347G
AXK780347G
AXK720347G
AXK724347G
AXK730347G
AXK740347G
AXK750347G
AXK760347G
AXK780347G
AXK720447G
AXK730447G
AXK740447G
Packing
Header
AXK814145WG
AXK820145WG
AXK822145WG
AXK824145WG
AXK826145WG
AXK830145WG
AXK834145WG
AXK840145WG
AXK844145WG
AXK850145WG
AXK854145WG
AXK860145WG
AXK864145WG
AXK870145WG
AXK880145WG
AXK800145WG
AXK814145WG
AXK820145WG
AXK824145WG
AXK826145WG
AXK830145WG
AXK840145WG
AXK850145WG
AXK860145WG
AXK870145WG
AXK880145WG
AXK814145WG
AXK820145WG
AXK824145WG
AXK830145WG
AXK840145WG
AXK850145WG
AXK860145WG
AXK870145WG
AXK880145WG
AXK820245WG
AXK824245WG
AXK830245WG
AXK840245WG
AXK850245WG
AXK860245WG
AXK880245WG
AXK820245WG
AXK830245WG
AXK840245WG
Inner carton
Outer carton
3,000 pieces
6,000 pieces
Socket: 2,000 pieces
Header: 3,000 pieces
Socket: 4,000 pieces
Header: 6,000 pieces
Note: Regarding ordering units; During production: Please make orders in 1-reel units.
For samples, please contact our sales office.
–3–
ACCTB57E 201509-T
Narrow pitch connectors P4 (0.4mm pitch)
2. With soldering terminals
Mated height
Part number
Number of pins
1.5 mm
2.0 mm
2.5 mm
3.0 mm
3.5 mm
Packing
10
34
40
34
12
20
32
40
20
36
60
70
80
60
Socket
AXK710127G
AXK734127G
AXK740127G
AXK734227G
AXK712327G
AXK720327G
AXK732327G
AXK740327G
AXK720327G
AXK736327G
AXK760327G
AXK770327G
AXK780327G
AXK760427G
Header
AXK810125WG
AXK834125WG
AXK840125WG
AXK834125WG
AXK812125WG
AXK820125WG
AXK832125WG
AXK840125WG
AXK820225WG
AXK836225WG
AXK860225WG
AXK870225WG
AXK880225WG
AXK860225WG
70
80
AXK770427G
AXK780427G
AXK870225WG
AXK880225WG
Inner carton
Outer carton
3,000 pieces
6,000 pieces
Socket: 2,000 pieces
Header: 3,000 pieces
Socket: 4,000 pieces
Header: 6,000 pieces
Note: Regarding ordering units; During production: Please make orders in 1-reel units.
For samples, please contact our sales office.
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Breakdown voltage
Insulation resistance
Specifications
0.3A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
150V AC for 1 min.
Min. 1,000MΩ (initial)
Contact resistance
Max. 70mΩ
Max. 0.981N/pin contacts × pin contacts (initial)
Composite removal force
Min. 0.0588N/pin contacts × pin contacts
(Mated height 1.5 mm without soldering terminals type)
Min. 0.118N/pin contacts × pin contacts
All the other types except the above
(Mated height 1.5 mm without soldering terminals type)
Post holding force
Min. 0.981N/pin contacts
Measuring the maximum force.
As the contact is axially pull out.
No freezing at low temperatures
–55°C to +85°C
Soldering heat resistance
Storage temperature
Detection current: 1mA
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Composite insertion force
Ambient temperature
Conditions
Max. peak temperature of 260°C (on the surface of the
PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Infrared reflow soldering
Soldering iron
No freezing at low temperatures.
No dew condensation.
Conformed to MIL-STD-202F, method 107G
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
Lifetime
characteristics
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 70mΩ
Insertion and removal life
50 times
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to IEC60068-2-78
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35±2°C,
saltwater concentration 5±1%
Bath temperature 40±2°C,
gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200
times/hours
Mated height 1.5mm, 20 pin contacts;
Socket: 0.04g Header: 0.02g
Unit weight
2. Material and surface treatment
Part name
Molded portion
Material
LCP resin (UL94V-0)
Contact/Post
Copper alloy
Soldering terminals portion
Copper alloy
Surface treatment
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal)
However, upper terminal of Ni barrier production: Exposed over Ni
The area adjacent to the terminal of the sockets on models with Ni barrier is exposed to Ni on base.
Ni plating on base, Sn plating on surface (Except for front terminal)
–4–
ACCTB57E 201509-T
Narrow pitch connectors P4 (0.4mm pitch)
DIMENSIONS (Unit: mm)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
1. Without Soldering Terminals
Socket (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)
CAD Data
A
Dimension table (mm)
B±0.1
0.40±0.05
3.75
5.10
E
4.10
0.15±0.03
0.80
(0.675)
0.80
(0.675)
0.08
1.11
(Suction face)
0.40±0.05
C
Max. 18 pin contacts
D
Number of pins/
dimension
14
5.10
20
22
24
26
30
34
40
44
50
54
60
64
70
80
100
6.30
6.70
7.10
7.50
8.30
9.10
10.30
11.10
12.30
13.10
14.30
15.10
16.30
18.30
22.30
A
Mated height/dimension
1.5mm
2.0mm
2.5mm, 3.0mm
3.5mm
General tolerance: ±0.2
B
C
D
2.40
—
2.80
3.60
4.00
4.40
4.80
5.60
6.40
7.60
8.40
9.60
10.40
11.60
12.40
13.60
15.60
19.60
1.60
2.00
2.40
2.80
3.60
4.40
5.60
6.40
7.60
8.40
9.60
10.40
11.60
13.60
17.60
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
C
D
E
1.50
1.92
2.42
2.92
Header (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)
CAD Data
A
B±0.1
Dimension table (mm)
0.08
0.40±0.05
(0.42)
3.12
0.10±0.03
(0.42)
0.76
0.76
C
F
(Suction face)
3.96
2.66
0.15±0.03
3.96
E
2.19
0.40±0.05
Max. 18 pin contacts
3.90
2.40
—
3.04
20
22
24
26
30
34
40
44
50
54
60
64
70
80
100
5.10
5.50
5.90
6.30
7.10
7.90
9.10
9.90
11.10
11.90
13.10
13.90
15.10
17.10
21.10
3.60
4.00
4.40
4.80
5.60
6.40
7.60
8.40
9.60
10.40
11.60
12.40
13.60
15.60
19.60
1.60
2.00
2.40
2.80
3.60
4.40
5.60
6.40
7.60
8.40
9.60
10.40
11.60
13.60
17.60
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
E
1.31
2.26
F
1.20
1.26
A
Mated height/dimension
1.5mm, 2.0mm, 2.5mm
3.0mm, 3.5mm
General tolerance: ±0.2
D
Number of pins/
dimension
14
B
–5–
3.50±0.15
3.00±0.15
2.50±0.15
2.00±0.15
1.50±0.15
Socket and Header are mated
ACCTB57E 201509-T
Narrow pitch connectors P4 (0.4mm pitch)
2. With Soldering Terminals
Socket (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)
CAD Data
A
B±0.1
Dimension table (mm)
0.80
C
0.80
Soldering
terminals
(0.675)
1.11
(Suction
face)
3.75
5.10
4.10
F
0.60
(0.675)
0.08
0.40±0.05
0.15±0.03
0.10±0.03
0.50
D
10 and 12 pin contacts
20 pin contacts
E
E
Number of pins/
dimension
10
5.90
1.60
—
4.60
2.00
12
20
32
34
36
40
60
70
80
6.30
7.90
10.30
10.70
11.10
11.90
15.90
17.90
19.90
2.00
3.60
6.00
6.40
6.80
7.60
11.60
13.60
15.60
—
—
3.20
3.60
4.00
4.80
8.80
10.80
12.80
5.00
6.60
9.00
9.40
9.40
10.60
14.60
16.60
18.60
2.40
2.40
—
—
—
—
—
—
—
C
D
E
A
B
Mated height/dimension
1.5mm
2.0mm
2.5mm, 3.0mm
3.5mm
General tolerance: ±0.2
C
D
E
F
1.50
1.92
2.42
2.92
Header (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)
CAD Data
A
B±0.1
0.08
0.40±0.05
0.40±0.05
0.76
0.10±0.03
C
3.96
Dimension table (mm)
(0.42)
0.60
3.12
2.19
G
(Suction face)
2.66
(0.42)
F
0.15±0.03
Soldering terminals
D
10 and 12 pin contacts
E
20 pin contacts
E
Number of pins/
dimension
10
3.10
1.60
—
1.94
1.64
12
20
32
34
36
40
60
70
80
3.50
5.10
7.50
7.90
8.30
9.10
13.10
15.10
17.10
2.00
3.60
6.00
6.40
6.80
7.60
11.60
13.60
15.60
—
—
3.20
3.60
4.00
4.80
8.80
10.80
12.80
2.34
3.94
6.34
6.74
7.14
7.94
11.94
13.94
15.94
2.04
2.80
—
—
—
—
—
—
—
F
1.31
2.26
G
1.20
1.26
A
B
Mated height/dimension
1.5mm, 2.0mm, 2.5mm
3.0mm, 3.5mm
General tolerance: ±0.2
–6–
3.50±0.15
3.00±0.15
2.50±0.15
2.00±0.15
1.50±0.15
Socket and Header are mated.
ACCTB57E 201509-T
Narrow pitch connectors P4 (0.4mm pitch)
EMBOSSED TAPE DIMENSIONS (unit: mm, Common for respective contact type, socket and header)
• Tape dimensions (Conforming to JIS C 0806:1990.
However, some tapes have mounting hole pitches that do
not comply with the standard.)
Tape I
Tape II
A±0.3
D±1
A±0.3
C
Taping reel
Label
B
C
8.0
Top cover tape
4
2
Pull out direction
4
2
1.75
380 dia.
1.75
Pull out direction
• Plastic reel dimensions (Conforming to EIAJ ET-7200B)
Embossed carrier tape
Embossed mounting-hole
8.0
1.5+0.1
0 dia.
1.5+0.1
0 dia.
Dimension table (mm)
1. Without Soldering Terminals
Number of pins
Socket
Header
Type of taping
A
B
C
D
Quantity per reel
Max. 18
Max. 18
20 to 70
20 to 70
80 to 100
80 to 100
20 to 40
Tape I
Tape I
Tape II
Tape I
16.0
24.0
32.0
24.0
—
—
28.4
—
7.5
11.5
14.2
11.5
17.4
25.4
33.4
25.4
3,000
3,000
3,000
2,000
Number of pins
Socket
Header
Type of taping
A
B
C
D
Quantity per reel
Tape I
Tape I
Tape II
Tape I
Tape II
16.0
24.0
32.0
24.0
32.0
—
—
28.4
—
28.4
7.5
11.5
14.2
11.5
14.2
17.4
25.4
33.4
25.4
33.4
3,000
3,000
3,000
2,000
2,000
Mated height
Common for socket and header:
1.5 mm, 2.0 mm, 2.5 mm and 3.0 mm
Header: 3.5 mm
Socket: 3.5 mm
2. With Soldering Terminals
Mated height
Common for socket and header:
1.5 mm, 2.0 mm, 2.5 mm and 3.0 mm
Header: 3.5 mm
Max. 18
20 to 60
70 to 80
Max. 18
20 to 70
80
60
70 to 80
Socket: 3.5 mm
3. Connector orientation with respect to direction of progress of embossed tape
1) Without soldering terminals
Type
Common for P4
Direction of
tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
2) With soldering terminals
Type
Common for P4
Direction of
tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
–7–
ACCTB57E 201509-T
Narrow pitch connectors P4 (0.4mm pitch)
For board-to-board For board-to-FPC
P4
Connectors for
inspection usage
(0.4mm pitch)
m
m
96
3.
m
1m
5.
Socket
Header
RoHS compliant
FEATURES
APPLICATIONS
1. 3,000 mating and unmating cycles
2. Same external dimensions and foot
pattern as standard type.
3. Improved mating
Insertion and removal easy due to a
reduction in mating retention force. This
is made possible by a simple locking
structure design.
Note: Mating retention force cannot be
warranted.
Ideal for module unit inspection and
equipment assembly inspection
TABLE OF PRODUCT TYPES
✩: Available for sale
Product name
P4 for inspection
without soldering terminals
P4 for inspection
with soldering terminals
10
✩
12
14
20
22
24
26
30
✩
✩
✩
✩
✩
✩
✩
Number of pins
34
40
✩
✩
✩
✩
✩
44
50
54
60
64
70
80
100
✩
✩
✩
✩
✩
✩
✩
✩
✩
✩
Notes: 1. You can use with each mated height in common.
2. Please inquire about number of pins other than those shown above.
3. Please inquire with us regarding availability.
4. Please keep the minimum order quantities no less than 50 pieces per lot.
5. Please inquire if further information is needed.
PRODUCT TYPES
Socket
Specifications
With soldering terminals
Without soldering terminals
Part No.
AXK7E∗∗26G
AXK7E∗∗46G
Header
Specifications
With soldering terminals
Without soldering terminals
Part No.
AXK8E∗∗26WG
AXK8E∗∗46WG
Note: When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connector.
–8–
ACCTB57E 201509-T
Narrow pitch connectors P4 (0.4mm pitch)
NOTES
1) Without soldering terminals
Socket
Header
Recommended PC board pattern (TOP VIEW)
Recommended PC board pattern (TOP VIEW)
0.40±0.05
0.40±0.05
0.23±0.03
0.40±0.05
0.23±0.03
0.40±0.05
2. Keep the PC board warp no more
than 0.03 mm in relation to the overall
length of the connector.
2.96±0.05
4.56±0.05
3.50±0.05
5.70±0.05
1. As shown below, excess force
during insertion may result in damage
to the connector or removal of the
solder. Also, to prevent connector
damage please confirm the correct
position before mating connectors.
0.115±0.05
0.40±0.05
0.115±0.05
0.40±0.05
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 150 μm
(Opening area ratio: 40%)
Metal mask thickness: When 150 μm
(Opening area ratio: 32%)
0.40±0.01
0.20±0.01
(0.51)
(0.30)
3.50±0.01
4.10±0.01
(0.30)
0.35±0.01
0.10±0.01
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 120 μm
(Opening area ratio: 50%)
Metal mask thickness: When 120 μm
(Opening area ratio: 40%)
0.40±0.01
0.35±0.01
0.40±0.01
0.10±0.01
0.20±0.01
0.35±0.01
0.10±0.01
4.10±0.01
(0.37)
3.36±0.01
(0.37)
(0.63)
0.20±0.01
(0.63)
3. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
0.40±0.01
0.10±0.01
5.50±0.01
4.48±0.01
Max. 0.03 mm
5.50±0.01
4.24±0.01
Max. 0.03 mm
0.35±0.01
(0.51)
0.20±0.01
–9–
ACCTB57E 201509-T
Narrow pitch connectors P4 (0.4mm pitch)
2) With soldering terminals
Socket
Header
Recommended PC board pattern (TOP VIEW)
Recommended PC board pattern (TOP VIEW)
0.40±0.05
0.23±0.03
0.90±0.05
(0.80)
(0.80)
(1.10)
0.40±0.05
0.115±0.05
4.56±0.05
2.96±0.05
0.90±0.05
(1.10)
3.50±0.05
0.80±0.05
2.15±0.05
0.80±0.05
0.82±0.05
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 150 μm
(Terminal portion opening area ratio: 40%)
(Metal portion opening area ratio: 65%)
Metal mask thickness: When 150 μm
(Terminal portion opening area ratio: 32%)
(Metal portion opening area ratio: 65%)
0.35±0.01
0.10±0.01
0.40±0.01
0.20±0.01
0.35±0.01
0.10±0.01
(0.51)
(0.30)
5.50±0.01
4.48±0.01
0.80±0.01
4.10±0.01
3.50±0.01
0.80±0.01
(0.30)
(0.51)
0.40±0.01
0.20±0.01
0.58±0.01
0.82±0.01
0.82±0.01
0.58±0.01
2.15±0.01
2.15±0.01
Recommended metal mask pattern
Metal mask thickness: When 120 μm
(Terminal portion opening area ratio: 50%)
(Metal portion opening area ratio: 80%)
Metal mask thickness: When 120 μm
(Terminal portion opening area ratio: 40%)
(Metal portion opening area ratio: 80%)
0.40±0.01
0.20±0.01
0.35±0.01
0.10±0.01
(0.37)
(0.63)
Recommended metal mask pattern
0.40±0.01
0.20±0.01
0.35±0.01
0.10±0.01
(0.63)
(0.37)
4.10±0.01
3.36±0.01
0.80±0.01
5.50±0.01
4.24±0.01
0.80±0.01
5.70±0.05
0.40±0.05
0.23±0.03
0.40±0.05
0.115±0.05
Please refer to the latest product
specifications when designing your
product.
0.72±0.01
2.15±0.01
2.15±0.01
0.72±0.01
0.82±0.01
0.82±0.01
–10–
ACCTB57E 201509-T
Notes on Using Narrow pitch Connectors/Stacking Connectors for High Current
For board-to-board/board-to-FPC
Notes on Using Narrow pitch Connectors/
Stacking Connectors for High Current
About safety remarks
Observe the following safety precautions
to prevent accidents and injuries.
1) Do not use these connectors beyond
the specified ranges. The use of the
product outside of the specified rated
current and breakdown voltage ranges
may cause abnormal heating, smoke,
and fire.
2) In order to avoid accidents, make sure
you have thoroughly reviewed the
specifications and the operation manual
before use. Please consult us if you plan
to use the product in a way not covered
by the specifications. Otherwise, the
quality cannot be guaranteed.
3) We are consistently striving to improve
quality and reliability. However, the fact
remains that electrical components and
devices generally cause failures at a
given statistical probability. Furthermore,
their durability varies with use
environments or use conditions. In this
respect, we ask you to check for actual
electrical components and devices under
actual conditions before use without fail.
Continuously using them in a state of
degraded performance may cause
deterioration in insulation performance,
thus resulting in abnormal heat
generation, smoke generation, or firing.
We ask you to carry out safety design
including redundancy design, design for
fire spread prevention, and design for
malfunction prevention as well as
periodic maintenance so that no
accidents resulting in injury or death, fire
accidents, or social damage will be
caused as a result of our product failure
or service life.
Regarding the design of devices and PC board patterns
1) When using the board to board
connectors, do not connect a pair of
board with multiple connectors.
Otherwise, misaligned connector
positions may cause mating failure or
product breakage.
2) With mounting equipment, there may
be up to a ±0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
5) PC board
Control the thicknesses of the coverlay
and adhesive to prevent poor soldering.
This connector has no stand-off.
Therefore, minimize the thickness of the
coverlay, etc. so as to prevent the
occurrence of poor soldering.
6) For all connectors of the narrow pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
Example) Secure in place with screws
Screw
Connector
Spacer
PC board
Spacer
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
7) Notes when using a FPC.
• Due to its flexibility, a FPC board may
make the connector terminal soldering
connection weak.
In order to strengthen the connection and
prevent the peeling off of terminal
soldering, a stiffener is strongly
recommended to be attached to the
backside of the connector area.
The size of stiffener should be bigger
than the recommended PC board pattern
area shown in the drawing. (Outward
dimension + approximate 0.5 to 1.0 mm)
Recommended material of reinforcement
is Glass-Fiber board, Polyimide board
(0.2 to 0.3 mm thickness) or SUS (0.1 to
0.2 mm thickness) which have 0.2 to 0.3
mm thickness.
• Connector would be taken off due to
size, weight or bending force of FPC at
dropping condition.
Please check the connector not to be
taken off at real equipment.
In order to secure connector’s connection
even when a shock applied, please take
measures against taking off of the
connector.
8) The narrow pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
Regarding the selection of the connector placement machine and the mounting
procedures
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the catching force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
4) Depending on the size of the
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
–11–
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
6) Excessive mounter chucking force may
deform the molded or metal part of the
connector. Consult us in advance if
chucking is to be applied.
ACCTB48E 201503-T
Notes on Using Narrow pitch Connectors/Stacking Connectors for High Current
Regarding soldering
Terminal
• Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
• Narrow pitch connectors
(except P8 type)
Upper limited (Solder heat resistance)
Lower limited (Solder wettability)
Temperature
Peak temperature 260°C
230°C
180°C
150°C
Peak temperature
25 sec.
60 to 120 sec.
• Narrow pitch connector (P8)
Table A
Product name
Soldering iron temperature
SMD type connectors
300°C within 5 sec.
350°C within 3 sec.
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
Temperature
245°C max.
Apply the solder
wire here
Peak temperature
200°C
155 to 165°C
Preheating
Terminal
Paste
solder
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) The condition of solder or flux rise and
wettability varies depending on the type
of solder and flux. Solder and flux
characteristics should be taken into
consideration and also set the reflow
temperature and oxygen level.
7) Do not use resin-containing solder.
Otherwise, the contacts might be firmly
fixed.
70 sec.
Time
60 to 120 sec.
PC board
foot pattern
220°C
200°C
Preheating
■ Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
So
ld
iro erin
n g
■ Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals.
(Please refer to the specification for detail
because the temperature setting differs
by products.)
2) As for cream solder printing, screen
printing is recommended.
3) When setting the screen opening area
and PC board foot pattern area, refer the
recommended PC board pattern and
window size of metal mask on the
specification sheet, and make sure that
the size of board pattern and metal mask
at the base of the terminals are not
increased.
4) Please pay attentions not to provide
too much solder. It makes miss mating
because of interference at soldering
portion when mating.
Small angle as
possible up to
45 degrees
Within 30 sec.
Time
For products other than the ones above,
please refer to the latest product
specifications.
8) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector before
mounting.
9) Consult us when using a screenprinting thickness other than that
recommended.
PC board
Pattern
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) These connector is low profile type. If
too much solder is supplied for hand
soldering, It makes miss mating because
of interference at soldering portion.
Please pay attentions.
■ Solder reworking
1) Finish reworking in one operation.
2) In case of soldering rework of bridges.
Don’t use supplementary solder flux.
Doing so may cause contact problems by
flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
Handling Single Components
1) Make sure not to drop or allow parts to
fall from work bench.
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
3) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
–12–
ACCTB48E 201503-T
Notes on Using Narrow pitch Connectors/Stacking Connectors for High Current
Precautions for mating
This product is designed with ease of
handling. However, in order to prevent the
deformation or damage of contacts and
molding, take care and do not mate the
connectors as shown right.
Press-fitting while the mating
inlets of the socket and
header are not matched.
Strongly pressed and twisted
Tilted mating
Cleaning flux from PC board
There is no need to clean this product.
If cleaning it, pay attention to the
following points to prevent the negative
effect to the product.
1) Keep the cleaning solvent clean and
prevent the connector contacts from
contamination.
2) Some cleaning solvents are strong and
they may dissolve the molded part and
characters, so pure water passed liquid
solvent is recommended.
Handling the PC board
■ Handling the PC board after
mounting the connector
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
The soldered areas should not be subjected to force.
Storage of connectors
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage. This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
5) There may be variations in the colors
of products from different production lots.
This is normal.
6) The connectors are not meant to be
used for switching.
7) Product failures due to condensation
are not covered by warranty.
Other Notes
1) Do not remove or insert the electrified
connector (in the state of carrying current
or applying voltage).
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
–13–
ACCTB48E 201503-T
Notes on Using Narrow pitch Connectors/Stacking Connectors for High Current
Regarding sample orders to confirm proper mounting
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Please refer to the latest product
specifications when designing your
product.
Condition when delivered from manufacturing
Reel
Embossed tape
amount required for
the mounting
Required number
of products for
sample production
(Delivery can also be made on a reel by
customer request.)
(Unit 50 pcs.)
–14–
ACCTB48E 201503-T