For board-to-board For board-to-FPC
Partly to Be Discontinued
Last time buy: September 30, 2019
P4
Narrow pitch connectors
(0.4mm pitch)
FEATURES
• Without soldering terminals
m
m
96
3.
m
1m
5.
Socket
Header
• With soldering terminals
1. 0.4 mm pitch and mated heights of
1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and
3.5 mm.
2. Strong resistance to adverse
environments! Utilizes
“
” construction
for high contact reliability.
3. Constructed with impact dispersion
keys inside the body to disperse
shocks when dropped.
5. Contributes to improved mating
1) Guides are provided to take up any
position shift and facilitate insertion.
Insertion guide
Impact dispersion key
Socket
m
m
Socket
96
m
1m
5.
3.
2) Simple lock structure provides tactile
feedback to ensure excellent mating/
unmating operation feel.
Header
Header side
contact
RoHS compliant
Header
A high level of shock resistance is
ensured by dispersing impact over the
four locations where the socket
indentations and header protrusions are
mated together.
Note: The following number of pins are not supported
due to suction surface factors.
• Without soldering terminals: 18 pins or less
4. Construction makes designing
devices easier.
The lower connector bottom surface
construction prevents contact and shorts
between the PCB and metal terminals.
This enables freedom in pattern wiring,
helping to make PCB’s smaller.
Insulation area
Insulation area
Connector bottom:
Create any thru-hole and pattern wiring.
–1–
Simple lock
mechanism
Socket side
contact
6. Design facilitates efficient
mounting.
Features a terminal flatness of 0.08 mm,
construction resistant to creeping flux,
and design that allows visual inspection
of the soldered part.
7. Connectors for inspection available
APPLICATIONS
• Mobile devices, such as cellular
phones, digital still cameras and
digital video cameras.
• Board-to-board connection in
measuring devices and industrial
equipment, etc.
• Consumer equipment such as
handheld terminals
ACCTB115E 201809-T
Partly to Be Discontinued
Last time buy: September 30, 2019
Narrow pitch connectors P4 (0.4mm pitch)
ORDERING INFORMATION
AXK
G
7: Narrow Pitch Connector P4 (0.4 mm pitch) Socket
8: Narrow Pitch Connector P4 (0.4 mm pitch) Header
Number of pins (2 digits)
Mated height
1: For mated height 1.5 mm
2: For mated height 2.0 mm
3: For mated height 2.5 mm and 3.0 mm
4: For mated height 3.5 mm
1: For mated height 1.5 mm, 2.0 mm and 2.5 mm
2: For mated height 3.0 mm and 3.5 mm
Functions
2: With soldering terminals, without positioning bosses
4: Without soldering terminals, without positioning bosses
Surface treatment (Contact portion / Terminal portion)
7: Ni plating on base, Au plating on surface (for Ni barrier available)
5: Ni plating on base, Au plating on surface
Other specifications
W: V notch
Packing
G: 3,000 pieces embossed tape and plastic reel × 2∗
Notes: 1. Only a socket of mated height 3.5 mm: 2,000 pieces embossed tape and plastic reel × 2.
2. Please note that the models with a soldering terminals (8th digit of part number is “2”) and those without a soldering terminals (8th digit of part number is “4”)
are shaped differently and are not compatible.
–2–
ACCTB115E 201809-T
Partly to Be Discontinued
Last time buy: September 30, 2019
Narrow pitch connectors P4 (0.4mm pitch)
PRODUCT TYPES
1. Without soldering terminals
Mated height
1.5 mm
2.0 mm
2.5 mm
3.0 mm
3.5 mm
Number of pins
Part number
Packing
14
Socket
AXK714147G
Header
AXK814145WG
20
22
AXK720147G
AXK722147G
AXK820145WG
AXK822145WG
24
26
30
34
40
44
50
54
60
64
70
80
100
14
AXK724147G
AXK726147G
AXK730147G
AXK734147G
AXK740147G
AXK744147G
AXK750147G
AXK754147G
AXK760147G
AXK764147G
AXK770147G
AXK780147G
AXK700147G
AXK714247G
AXK824145WG
AXK826145WG
AXK830145WG
AXK834145WG
AXK840145WG
AXK844145WG
AXK850145WG
AXK854145WG
AXK860145WG
AXK864145WG
AXK870145WG
AXK880145WG
AXK800145WG
AXK814145WG
20
24
26
30
40
50
60
70
80
AXK720247G
AXK724247G
AXK726247G
AXK730247G
AXK740247G
AXK750247G
AXK760247G
AXK770247G
AXK780247G
AXK820145WG
AXK824145WG
AXK826145WG
AXK830145WG
AXK840145WG
AXK850145WG
AXK860145WG
AXK870145WG
AXK880145WG
14
20
24
AXK714347G
AXK720347G
AXK724347G
AXK814145WG
AXK820145WG
AXK824145WG
30
40
50
60
70
80
20
24
30
40
50
60
80
20
30
40
AXK730347G
AXK740347G
AXK750347G
AXK760347G
AXK770347G
AXK780347G
AXK720347G
AXK724347G
AXK730347G
AXK740347G
AXK750347G
AXK760347G
AXK780347G
AXK720447G
AXK730447G
AXK740447G
AXK830145WG
AXK840145WG
AXK850145WG
AXK860145WG
AXK870145WG
AXK880145WG
AXK820245WG
AXK824245WG
AXK830245WG
AXK840245WG
AXK850245WG
AXK860245WG
AXK880245WG
AXK820245WG
AXK830245WG
AXK840245WG
Inner carton
Outer carton
3,000 pieces
6,000 pieces
Socket: 2,000 pieces
Header: 3,000 pieces
Socket: 4,000 pieces
Header: 6,000 pieces
Note: Regarding ordering units; During production: Please make orders in 1-reel units.
For samples, please contact our sales office.
–3–
ACCTB115E 201809-T
Partly to Be Discontinued
Last time buy: September 30, 2019
Narrow pitch connectors P4 (0.4mm pitch)
2. With soldering terminals
Mated height
Part number
Number of pins
1.5 mm
2.0 mm
2.5 mm
3.0 mm
3.5 mm
Packing
10
34
40
34
12
Socket
AXK710127G
AXK734127G
AXK740127G
AXK734227G
AXK712327G
Header
AXK810125WG
AXK834125WG
AXK840125WG
AXK834125WG
AXK812125WG
20
32
40
20
36
60
70
80
60
AXK720327G
AXK732327G
AXK740327G
AXK720327G
AXK736327G
AXK760327G
AXK770327G
AXK780327G
AXK760427G
AXK820125WG
AXK832125WG
AXK840125WG
AXK820225WG
AXK836225WG
AXK860225WG
AXK870225WG
AXK880225WG
AXK860225WG
70
80
AXK770427G
AXK780427G
AXK870225WG
AXK880225WG
Inner carton
Outer carton
3,000 pieces
6,000 pieces
Socket: 2,000 pieces
Header: 3,000 pieces
Socket: 4,000 pieces
Header: 6,000 pieces
Note: Regarding ordering units; During production: Please make orders in 1-reel units.
For samples, please contact our sales office.
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Dielectric strength
Insulation resistance
Specifications
0.3A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
150V AC for 1 min.
Min. 1,000MΩ (initial)
Contact resistance
Max. 70mΩ
Composite insertion force
Max. 0.981N/pin contact × pin contacts (initial)
Composite removal force
Min. 0.0588N/pin contact × pin contacts
(Mated height 1.5 mm)
Min. 0.118N/pin contact × pin contacts
(Mated height 2.0 D 3.5 mm)
Post holding force
Min. 0.981N/pin contact
Ambient temperature
Storage temperature
Detection current: 1mA
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No icing or condensation.
–55°C to +85°C
Soldering heat resistance
Conditions
Max. peak temperature of 260°C (on the surface of the
PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Infrared reflow soldering
Soldering iron
No icing or condensation.
Conformed to MIL-STD-202F, method 107G
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
Lifetime
characteristics
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 70mΩ
Insertion and removal life
50 times
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
saltwater concentration 5%±1%
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Repeated insertion and removal speed of max. 200
times/hours
Mated height 1.5mm, 20 pin contacts;
Socket: 0.04g Header: 0.02g
Unit weight
2. Material and surface treatment
Part name
Molded portion
Material
LCP resin (UL94V-0)
Contact/Post
Copper alloy
Soldering terminals portion
Copper alloy
Surface treatment
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal)
However, upper terminal of Ni barrier production: Exposed over Ni
The area adjacent to the terminal of the sockets on models with Ni barrier is exposed to Ni on base.
Ni plating on base, Sn plating on surface (Except for front terminal)
–4–
ACCTB115E 201809-T
Partly to Be Discontinued
Last time buy: September 30, 2019
Narrow pitch connectors P4 (0.4mm pitch)
DIMENSIONS (Unit: mm)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
1. Without Soldering Terminals
Socket (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)
CAD Data
A
Dimension table (mm)
B±0.1
1.11
(Suction face)
E
4.10
0.15±0.03
3.75
5.10
0.40±0.05
0.80
(0.675)
0.80
(0.675)
Terminal
coplanarity
0.08
0.40±0.05
C
Max. 18 pin contacts
D
General tolerance: ±0.2
Number of pins/
dimension
14
5.10
20
22
24
26
30
34
40
44
50
54
60
64
70
80
100
6.30
6.70
7.10
7.50
8.30
9.10
10.30
11.10
12.30
13.10
14.30
15.10
16.30
18.30
22.30
A
B
C
D
2.40
—
2.80
3.60
4.00
4.40
4.80
5.60
6.40
7.60
8.40
9.60
10.40
11.60
12.40
13.60
15.60
19.60
1.60
2.00
2.40
2.80
3.60
4.40
5.60
6.40
7.60
8.40
9.60
10.40
11.60
13.60
17.60
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
C
D
Mated height/dimension
1.5mm
2.0mm
2.5mm, 3.0mm
E
1.50
1.92
2.42
3.5mm
2.92
Header (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)
CAD Data
A
Terminal
coplanarity
0.08
B±0.1
0.40±0.05
(0.42)
3.12
0.10±0.03
(0.42)
0.76
0.76
C
F
(Suction face)
3.96
2.66
0.15±0.03
3.96
E
2.19
0.40±0.05
Max. 18 pin contacts
Number of pins/
dimension
14
3.90
2.40
—
3.04
20
22
24
26
30
34
40
44
50
54
60
64
70
80
100
5.10
5.50
5.90
6.30
7.10
7.90
9.10
9.90
11.10
11.90
13.10
13.90
15.10
17.10
21.10
3.60
4.00
4.40
4.80
5.60
6.40
7.60
8.40
9.60
10.40
11.60
12.40
13.60
15.60
19.60
1.60
2.00
2.40
2.80
3.60
4.40
5.60
6.40
7.60
8.40
9.60
10.40
11.60
13.60
17.60
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
E
1.31
2.26
F
1.20
1.26
A
Mated height/dimension
1.5mm, 2.0mm, 2.5mm
3.0mm, 3.5mm
General tolerance: ±0.2
D
Dimension table (mm)
B
–5–
3.50±0.15
3.00±0.15
2.50±0.15
2.00±0.15
1.50±0.15
Socket and Header are mated
ACCTB115E 201809-T
Partly to Be Discontinued
Last time buy: September 30, 2019
Narrow pitch connectors P4 (0.4mm pitch)
2. With Soldering Terminals
Socket (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)
CAD Data
Terminal
coplanarity
0.08
0.40±0.05
0.15±0.03
Dimension table (mm)
0.80
C
0.80
Soldering
terminals
(0.675)
1.11
(Suction
face)
3.75
5.10
4.10
F
0.60
(0.675)
A
B±0.1
0.10±0.03
0.50
D
10 and 12 pin contacts
20 pin contacts
E
E
General tolerance: ±0.2
Number of pins/
dimension
10
5.90
1.60
—
4.60
2.00
12
20
32
34
36
40
60
70
80
6.30
7.90
10.30
10.70
11.10
11.90
15.90
17.90
19.90
2.00
3.60
6.00
6.40
6.80
7.60
11.60
13.60
15.60
—
—
3.20
3.60
4.00
4.80
8.80
10.80
12.80
5.00
6.60
9.00
9.40
9.40
10.60
14.60
16.60
18.60
2.40
2.40
—
—
—
—
—
—
—
C
D
E
A
B
Mated height/dimension
1.5mm
2.0mm
2.5mm, 3.0mm
F
1.50
1.92
2.42
3.5mm
2.92
C
D
E
Header (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)
CAD Data
A
Terminal
coplanarity
0.08
B±0.1
0.40±0.05
0.40±0.05
0.76
0.10±0.03
C
3.96
Dimension table (mm)
(0.42)
0.60
3.12
2.19
G
(Suction face)
2.66
(0.42)
F
0.15±0.03
Soldering terminals
D
10 and 12 pin contacts
E
20 pin contacts
E
Number of pins/
dimension
10
3.10
1.60
—
1.94
1.64
12
20
32
34
36
40
60
70
80
3.50
5.10
7.50
7.90
8.30
9.10
13.10
15.10
17.10
2.00
3.60
6.00
6.40
6.80
7.60
11.60
13.60
15.60
—
—
3.20
3.60
4.00
4.80
8.80
10.80
12.80
2.34
3.94
6.34
6.74
7.14
7.94
11.94
13.94
15.94
2.04
2.80
—
—
—
—
—
—
—
F
1.31
2.26
G
1.20
1.26
A
B
Mated height/dimension
1.5mm, 2.0mm, 2.5mm
3.0mm, 3.5mm
General tolerance: ±0.2
–6–
3.50±0.15
3.00±0.15
2.50±0.15
2.00±0.15
1.50±0.15
Socket and Header are mated.
ACCTB115E 201809-T
Partly to Be Discontinued
Last time buy: September 30, 2019
Narrow pitch connectors P4 (0.4mm pitch)
EMBOSSED TAPE DIMENSIONS (unit: mm)
• Tape dimensions (Conforming to JIS C 0806:1990.
However, some tapes have mounting hole pitches that do
not comply with the standard.)
Tape I
Tape II
A±0.3
D±1
A±0.3
C
Taping reel
Label
B
C
8.0
Top cover tape
4
2
Pull out direction
4
2
1.75
380 dia.
1.75
Pull out direction
• Plastic reel dimensions (Conforming to EIAJ ET-7200B)
Embossed carrier tape
Embossed mounting-hole
8.0
1.5+0.1
0 dia.
1.5+0.1
0 dia.
Dimension table (mm)
1. Without Soldering Terminals
Number of pins
Socket
Header
Type of taping
A
B
C
D
Quantity per reel
Max. 18
Max. 18
20 to 70
20 to 70
80 to 100
80 to 100
20 to 40
Tape I
Tape I
Tape II
Tape I
16.0
24.0
32.0
24.0
—
—
28.4
—
7.5
11.5
14.2
11.5
17.4
25.4
33.4
25.4
3,000
3,000
3,000
2,000
Number of pins
Socket
Header
Type of taping
A
B
C
D
Quantity per reel
Tape I
Tape I
Tape II
Tape I
Tape II
16.0
24.0
32.0
24.0
32.0
—
—
28.4
—
28.4
7.5
11.5
14.2
11.5
14.2
17.4
25.4
33.4
25.4
33.4
3,000
3,000
3,000
2,000
2,000
Mated height
Common for socket and header:
1.5 mm, 2.0 mm, 2.5 mm and 3.0 mm
Header: 3.5 mm
Socket: 3.5 mm
2. With Soldering Terminals
Mated height
Common for socket and header:
1.5 mm, 2.0 mm, 2.5 mm and 3.0 mm
Header: 3.5 mm
Max. 18
20 to 60
70 to 80
Max. 18
20 to 70
80
60
70 to 80
Socket: 3.5 mm
3. Connector orientation with respect to direction of progress of embossed tape
1) Without soldering terminals
Type
Common for P4
Direction of
tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
2) With soldering terminals
Type
Common for P4
Direction of
tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
–7–
ACCTB115E 201809-T
Partly to Be Discontinued
Last time buy: September 30, 2019
Narrow pitch
connectors P4 (0.4mm pitch)
For board-to-board For board-to-FPC
P4
Connectors for
inspection usage
(0.4mm pitch)
m
m
96
3.
m
1m
5.
Socket
Header
RoHS compliant
FEATURES
APPLICATIONS
1. 3,000 mating and unmating cycles
2. Same external dimensions and foot
pattern as standard type.
3. Improved mating
Insertion and removal easy due to a
reduction in mating retention force. This
is made possible by a simple locking
structure design.
Ideal for module unit inspection and
equipment assembly inspection
Note: Mating retention force cannot be
warranted. Please avoid using for
applications other than inspection.
TABLE OF PRODUCT TYPES
✩: Available for sale
Product name
10
P4 for inspection
without soldering terminals
P4 for inspection
with soldering terminals
✩
12
14
20
22
24
26
30
✩
✩
✩
✩
✩
✩
✩
Number of pins
34
40
✩
✩
✩
✩
✩
44
50
54
60
64
70
80
100
✩
✩
✩
✩
✩
✩
✩
✩
✩
✩
Notes: 1. You can use with each mated height in common.
2. Please inquire about number of pins other than those shown above.
3. Please inquire with us regarding availability.
4. Please keep the minimum order quantities no less than 50 pieces per lot.
5. Please inquire if further information is needed.
PRODUCT TYPES
Specifications
Socket
Without soldering terminals
With soldering terminals
Part No.
AXK7E∗∗46G
AXK7E∗∗26G
Header
Specifications
Without soldering terminals
With soldering terminals
Part No.
AXK8E∗∗46WG
AXK8E∗∗26WG
Note: When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connector.
–8–
ACCTB115E 201809-T
Partly to Be Discontinued
Last time buy: September 30, 2019
Narrow pitch connectors P4 (0.4mm pitch)
NOTES
1) Without soldering terminals
Socket
Header
Recommended PC board pattern (TOP VIEW)
Recommended PC board pattern (TOP VIEW)
0.40±0.05
0.40±0.05
0.23±0.03
0.40±0.05
0.23±0.03
0.40±0.05
2. Keep the PC board warp no more
than 0.03 mm in relation to the overall
length of the connector.
2.96±0.05
4.56±0.05
3.50±0.05
5.70±0.05
1. As shown below, excess force
during insertion may result in damage
to the connector or removal of the
solder. Also, to prevent connector
damage please confirm the correct
position before mating connectors.
0.115±0.05
0.40±0.05
0.115±0.05
0.40±0.05
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 150 μm
(Opening area ratio: 40%)
Metal mask thickness: When 150 μm
(Opening area ratio: 32%)
0.40±0.01
0.20±0.01
4.10±0.01
(0.51)
(0.30)
3.50±0.01
(0.30)
0.35±0.01
0.10±0.01
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 120 μm
(Opening area ratio: 50%)
Metal mask thickness: When 120 μm
(Opening area ratio: 40%)
0.40±0.01
0.35±0.01
0.40±0.01
0.10±0.01
0.20±0.01
0.35±0.01
0.10±0.01
4.10±0.01
(0.37)
3.36±0.01
(0.37)
(0.63)
0.20±0.01
(0.63)
3. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
0.40±0.01
0.10±0.01
5.50±0.01
4.48±0.01
Max. 0.03 mm
5.50±0.01
4.24±0.01
Max. 0.03 mm
0.35±0.01
(0.51)
0.20±0.01
–9–
ACCTB115E 201809-T
Partly to Be Discontinued
Last time buy: September 30, 2019
Narrow pitch connectors P4 (0.4mm pitch)
2) With soldering terminals
Socket
Header
Recommended PC board pattern (TOP VIEW)
Recommended PC board pattern (TOP VIEW)
0.40±0.05
0.23±0.03
0.90±0.05
(0.80)
(0.80)
(1.10)
0.40±0.05
0.115±0.05
4.56±0.05
2.96±0.05
0.90±0.05
(1.10)
3.50±0.05
0.80±0.05
2.15±0.05
0.80±0.05
0.82±0.05
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 150 μm
(Terminal portion opening area ratio: 40%)
(Metal portion opening area ratio: 65%)
Metal mask thickness: When 150 μm
(Terminal portion opening area ratio: 32%)
(Metal portion opening area ratio: 65%)
0.35±0.01
0.10±0.01
0.40±0.01
0.20±0.01
0.35±0.01
0.10±0.01
(0.51)
(0.30)
5.50±0.01
4.48±0.01
0.80±0.01
4.10±0.01
3.50±0.01
0.80±0.01
(0.30)
(0.51)
0.40±0.01
0.20±0.01
0.58±0.01
0.82±0.01
0.82±0.01
0.58±0.01
2.15±0.01
2.15±0.01
Recommended metal mask pattern
Metal mask thickness: When 120 μm
(Terminal portion opening area ratio: 50%)
(Metal portion opening area ratio: 80%)
Metal mask thickness: When 120 μm
(Terminal portion opening area ratio: 40%)
(Metal portion opening area ratio: 80%)
0.40±0.01
0.20±0.01
0.35±0.01
0.10±0.01
(0.37)
(0.63)
Recommended metal mask pattern
0.40±0.01
0.20±0.01
0.35±0.01
0.10±0.01
(0.63)
(0.37)
4.10±0.01
3.36±0.01
0.80±0.01
5.50±0.01
4.24±0.01
0.80±0.01
5.70±0.05
0.40±0.05
0.23±0.03
0.40±0.05
0.115±0.05
Please refer to the latest product
specifications when designing your
product.
0.72±0.01
2.15±0.01
2.15±0.01
0.72±0.01
0.82±0.01
0.82±0.01
–10–
ACCTB115E 201809-T
Notes on Using Narrow pitch Connectors/High Current Connectors
For board-to-board/board-to-FPC
Notes on Using Narrow pitch Connectors/
High Current Connectors
About safety remarks
Observe the following safety remarks to prevent accidents and injuries.
3) Panasonic Corporation is consistently striving to improve
1) Do not use these connectors beyond the specification sheets.
quality and reliability. However, the fact remains that electrical
The usage outside of specified rated current, dielectric strength,
components and devices generally cause failures at a given
and environmental conditions and so on may cause circuitry
statistical probability. Furthermore, their durability varies with
damage via abnormal heating, smoke, and fire.
use environments or use conditions. In this respect, please
2) In order to avoid accidents, your thorough specification review
check for actual electrical components and devices under actual
is appreciated. Please contact our sales office if your usage is
conditions before use. Continued usage in a state of degraded
out of the specifications. Otherwise, Panasonic Corporation
condition may cause the deteriorated insulation, thus result in
cannot guarantee the quality and reliability.
abnormal heat, smoke or firing. Please carry out safety design
and periodic maintenance including redundancy design, design
for fire spread prevention, and design for malfunction prevention
so that no accidents resulting in injury or death, fire accidents, or
social damage will be caused as a result of failure of the
products or ending life of the products.
Regarding the design of devices and PC board patterns
1) When using the board to board connectors, do not connect a
pair of board with multiple connectors. Otherwise, misaligned
connector positions may cause mating failure or product
breakage.
2) With mounting equipment, there may be up to a ±0.2 to 0.3
mm error in positioning. Be sure to design PC boards and
patterns while taking into consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed on the body to aid in
positioning. When using these connectors, make sure that the
PC board is designed with positioning holes to match these tabs.
4) To ensure the required mechanical strength when soldering
the connector terminals, make sure the PC board meets
recommended PC board pattern design dimensions given.
5) PC board
Control the thicknesses of the cover lay and adhesive to prevent
poor soldering. This connector has no stand-off. Therefore,
minimize the thickness of the cover lay, etc. so as to prevent the
occurrence of poor soldering.
6) For all connectors of the narrow pitch series, to prevent the
PC board from coming off during vibrations or impacts, and to
prevent loads from falling directly on the soldered portions, be
sure to design some means to fix the PC board in place.
Example) Secure in place with screws
7) When mounting connectors on a FPC
• When the connector soldered to FPC is mated or unmated,
solder detachment may occur by the force to the terminals.
Connector handling is recommended in the condition when the
reinforcing plate is attached to the backside of FPC where the
connector is mounted. The external dimension of the reinforcing
plate is recommended to be larger than the dimension of
“Recommended PC board pattern” (extended dimension of one
side is approximately 0.5 to 1.0 mm). The materials and
thickness of the reinforcing plate are glass epoxy or polyimide
(thickness 0.2 to 0.3 mm) or SUS (thickness 0.1 to 0.2 mm).
• As this connector has temporary locking structure, the
connector mating may be separated by the dropping impact
depend on the size, weight or bending force of the FPC. Please
consider the measures at usage to prevent the mating
separation.
8) The narrow pitch connector series is designed to be compact
and thin. Although ease of handling has been taken into
account, take care when mating the connectors, as
displacement or angled mating could damage or deform the
connector.
Screw
↓
↓
Spacer
Connector
PC board
Spacer
When connecting PC boards, take appropriate measures to
prevent the connector from coming off.
–11–
ACCTB48E 201803-T
Notes on Using Narrow pitch Connectors/High Current Connectors
Regarding the selection of the connector placement machine and the mounting
procedures
1) Select the placement machine taking into consideration the
connector height, required positioning accuracy, and packaging
conditions.
2) Be aware that if the chucking force of the placement machine
is too great, it may deform the shape of the connector body or
connector terminals.
3) Be aware that during mounting, external forces may be
applied to the connector contact surfaces and terminals and
cause deformations.
4) Depending on the size of the connector being used, self
alignment may not be possible. In such cases, be sure to
carefully position the terminal with the PC board pattern.
5) The positioning bosses give an approximate alignment for
positioning on the PC board. For accurate positioning of the
connector when mounting it to the PC board, we recommend
using an automatic positioning machine.
6) In case of dry condition, please note the occurrence of static
electricity. The product may be adhered to the embossed carrier
tape or the cover tape in dry condition. Recommended humidity
is from 40 to 60%RH and please remove static electricity by
ionizer in manufacturing process.
Regarding soldering
Reflow soldering
1) Measure the recommended profile temperature for reflow
soldering by placing a sensor on the PC board near the
connector surface or terminals. (Please refer to the specification
for detail because the temperature setting differs by products.)
2) As for cream solder printing, screen printing is recommended.
3) When setting the screen opening area and PC board foot
pattern area, refer the recommended PC board pattern and
window size of metal mask on the specification sheet, and make
sure that the size of board pattern and metal mask at the base of
the terminals are not increased.
4) Please pay attentions not to provide too much solder. It
makes miss mating because of interference at soldering portion
when mating.
Terminal
Paste solder
PC board foot pattern
5) When mounting on both sides of the PC board and the
connector is mounting on the underside, use adhesives or other
means to ensure the connector is properly fixed to the PC board.
(Double reflow soldering on the same side is possible.)
6) The condition of solder or flux rise and wettability varies
depending on the type of solder and flux. Solder and flux
characteristics should be taken into consideration and also set
the reflow temperature and oxygen level.
Hand soldering
1) Set the soldering iron so that the tip temperature is less than
that given in the table below.
Table A
Product name
Soldering iron temperature
SMD type connectors all products
300°C within 5 sec.
350°C within 3 sec.
180℃
150℃
Peak temperature
Preheating
220℃
200℃
25 sec.
60 to 120 sec.
70 sec.
Upper limited
(Solder heat resistance)
Lower limited
(Solder wettability)
Time
For products other than the ones above, please refer to the
latest product specifications.
9) The temperature profiles given in this catalog are values
measured when using the connector on a resin-based PC
board. When performed reflow soldering on a metal board (iron,
aluminum, etc.) or a metal table to mount on a FPC, make sure
there is no deformation or discoloration of the connector before
mounting.
10) Please contact our sales office when using a screen-printing
thickness other than that recommended.
4) Be aware that soldering while applying a load on the
connector terminals may cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on the contact surfaces
during soldering operations. After soldering, carefully check the
contact surfaces and clean off any solder before use.
7) These connector is low profile type. If too much solder is
supplied for hand soldering, It makes miss mating because of
interference at soldering portion. Please pay attentions.
S
iro old
n eri
Apply the solder
wire here
Temperature
Peak temperature 260℃
230℃
ng
2) Do not allow flux to spread onto the connector leads or PC
board. This may lead to flux rising up to the connector inside.
3) Touch the soldering iron to the foot pattern. After the foot
pattern and connector terminal are heated, apply the solder wire
so it melts at the end of the connector terminals.
7) Do not use resin-containing solder. Otherwise, the contacts
might be firmly fixed.
8) Soldering conditions
Please use the reflow temperature profile conditions
recommended below for reflow soldering. Please contact our
sales office before using a temperature profile other than that
described below (e.g. lead-free solder)
Small angle as
possible up to
45 degrees
Terminal
PC board
Pattern
–12–
ACCTB48E 201803-T
Notes on Using Narrow pitch Connectors/High Current Connectors
Solder reworking
1) Finish reworking in one operation.
2) In case of soldering rework of bridges. Do not use
supplementary solder flux. Doing so may cause contact
problems by flux.
3) Keep the soldering iron tip temperature below the
temperature given in Table A.
Handling single components
1) Make sure not to drop or allow parts to fall from work bench.
2) Excessive force applied to the terminals could cause warping,
come out, or weaken the adhesive strength of the solder. Handle
with care.
3) Do not insert or remove the connector when it is not soldered.
Forcibly applied external pressure on the terminals can weaken
the adherence of the terminals to the molded part or cause the
terminals to lose their evenness.
Precautions for mating
This product is designed with ease of handling. However, in
order to prevent the deformation or damage of contacts and
molding, take care and do not mate the connectors as shown
right.
Press-fitting while the mating
Strongly pressed and
inlets of the socket and
twisted
header are not matched.
Tilted mating
Cleaning flux from PC board
There is no need to clean this product.
If cleaning it, pay attention to the following points to prevent the
negative effect to the product.
1) Keep the cleaning solvent clean and prevent the connector
contacts from contamination.
2) Some cleaning solvents are strong and they may dissolve the
molded part and characters, so pure water passed liquid solvent
is recommended.
Handling the PC board
Handling the PC board after mounting the connector
When cutting or bending the PC board after mounting the
connector, be careful that the soldered sections are subjected to
excessive force.
The soldered areas should not be subjected to force.
Storage of connectors
1) To prevent problems from voids or air pockets due to heat of
reflow soldering, avoid storing the connectors in areas of high
humidity.
2) Depending on the connector type, the color of the connector
may vary from connector to connector depending on when it is
produced. Some connectors may change color slightly if
subjected to ultraviolet rays during storage. This is normal and
will not affect the operation of the connector.
3) When storing the connectors with the PC boards assembled
and components already set, be careful not to stack them up so
the connectors are subjected to excessive forces.
4) Avoid storing the connectors in locations with excessive dust.
The dust may accumulate and cause improper connections at
the contact surfaces.
Other Notes
1) Do not remove or insert the electrified connector (in the state
of carrying current or applying voltage).
2) Dropping of the products or rough mishandling may bend or
damage the terminals and possibly hinder proper reflow
soldering.
3) Before soldering, try not to insert or remove the connector
more than absolutely necessary.
–13–
4) When coating the PC board after soldering the connector to
prevent the deterioration of insulation, perform the coating in
such a way so that the coating does not get on the connector.
5) There may be variations in the colors of products from
different production lots. This is normal.
6) The connectors are not meant to be used for switching.
7) Product failures due to condensation are not covered by
warranty.
ACCTB48E 201803-T
Notes on Using Narrow pitch Connectors/High Current Connectors
Regarding sample orders to confirm proper mounting
When ordering samples to confirm proper mounting with the
placement machine, connectors are delivered in 50-piece units
in the condition given right. Consult a sale representative for
ordering sample units.
Condition when delivered from manufacturing
Embossed tape
amount required
for the mounting
Required number
of products for
sample production
Reel
Delivery can also be made on a reel
by customer request.
(Unit 50 pcs.)
Please refer to the latest product specifications when
designing your product.
–14–
ACCTB48E 201803-T