For board-to-board For board-to-FPC
P35S
Narrow pitch connectors
(0.35mm pitch)
FEATURES
1. Small size 0.35 mm pitch
contributes to device miniaturization.
Smaller compared to P4S (40 pins):
Socket — 11% smaller,
Header — 12% smaller
3. Greater flexibility in connector
placement.
Pattern wiring to the connector bottom is
made possible with a molded covering on
the undersurface of the connector.
Soldering terminals
at each corner
Socket
m
35
2.
m
m
6m
3.
Socket
Header
9.55 (40 pins)
3.60
Soldering terminals
at each corner
RoHS compliant
Header
Soldering
terminals
at each
corner
Insulation
Insulation
area
area
Connector bottom:
Create any thru-hole
and pattern wiring.
Soldering
terminals
at each
corner
4. Connectors for inspection available
8.73 (40 pins)
2.35
APPLICATIONS
2. Strong resistance to adverse
environments! Utilizes
“
” construction
for high contact reliability.
Mobile devices, such as cellular
phones, digital still cameras and
digital video cameras.
ORDERING INFORMATION
AXT
1
2
4
1: Narrow Pitch Connector P35S (0.35 mm pitch) Socket
2: Narrow Pitch Connector P35S (0.35 mm pitch) Header
Number of pins (2 digits)
Mated height
/
1: For mated height 1.5 mm
Functions
/
2: No pickup cover, without positioning bosses
Surface treatment (Contact portion / Terminal portion)
4: Ni plating on base, Au plating on surface (for Ni barrier available)
4: Ni plating on base, Au plating on surface
–1–
ACCTB87E 201602-T
Narrow pitch connectors P35S (0.35mm pitch)
PRODUCT TYPES
Mated height
Number of pins
1.5mm
40
50
60
70
80
100
Part number
Socket
AXT140124
AXT150124
AXT160124
AXT170124
AXT180124
AXT100124
Packing
Header
AXT240124
AXT250124
AXT260124
AXT270124
AXT280124
AXT200124
Inner carton (1-reel)
Outer carton
3,000 pieces
6,000 pieces
Notes: 1. Regarding ordering units; During production: Please make orders in 1-reel units.
For samples, please contact our sales office.
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Specifications
0.25A/pin contact (Max. 4 A at total pin contacts)
60V AC/DC
Dielectric strength
150V AC for 1 min.
Insulation resistance
Min. 1,000MΩ (initial)
Contact resistance
Max. 100mΩ
Composite insertion force
Composite removal force
Contact holding force
(Socket contact)
Ambient temperature
Max. 0.981N/pin contact × pin contacts (initial)
Min. 0.0588N/pin contact × pin contacts
Soldering heat resistance
Storage temperature
Conditions
—
—
Rated voltage is applied for one minute and check for
short circuit or damage with a detection current of 1mA.
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No icing or condensation.
Min. 0.981N/pin contact
–55°C to +85°C
Max. peak temperature of 260°C (on the surface of the
PC board around the connector terminals)
300°C within 5 sec. or 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Infrared reflow soldering
Soldering iron
No icing or condensation.
Conformed to MIL-STD-202F, method 107G
Environmental
characteristics
Lifetime
characteristics
Unit weight
Thermal shock resistance
(header and socket mated)
5 cycles, insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
120 hours, insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
24 hours, insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 100mΩ
Insertion and removal life
50 times
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
Conformed to IEC60068-2-78
Temperature 40°C±2°C, humidity 90% to 95% R.H.
Conformed to IEC60068-2-11
Temperature 35°C±2°C, saltwater concentration 5%±1%
Temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Repeated insertion and removal speed of
max. 200 times/hours
50 pin contacts Socket: 0.06 g Header: 0.03 g
2. Material and surface treatment
Part name
Molded portion
Contact and Post
Material
LCP resin (UL94V-0)
Copper alloy
Surface treatment
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for front edge of terminal)
However, the area adjacent to the socket terminal is exposed to Ni on base.
Soldering terminals portion;
Socket: Ni plating on base, Pd + Au flash plating on surface (Expect for front edge of terminal)
Header: Ni plating on base, Au plating on surface (Expect for front edge of terminal)
–2–
ACCTB87E 201602-T
Narrow pitch connectors P35S (0.35mm pitch)
DIMENSIONS (Unit: mm)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
1. Socket (Mated height: 1.5mm)
CAD Data
A
Terminal coplanarity
0.08
(Contact and
soldering terminals)
1.45
0.70 (Suction face)
0.35±0.05
2.60
(0.50)
3.00
0.12±0.03
3.60
B±0.1
(0.66)
Y (Note)
3.60
1.80
Dimension table (mm)
0.55
0.30±0.03
C±0.1
(0.90)
Z (Note)
General tolerance: ±0.2
Number of pins/
dimension
40
9.55
6.65
8.35
50
60
70
80
100
11.30
13.05
14.80
16.55
20.05
8.40
10.15
11.90
13.65
17.15
10.10
11.85
13.60
15.35
18.85
B
C
A
B
C
2. Header (Mated height: 1.5mm)
CAD Data
A
0.54 (Suction face)
B±0.1
20
0.35±0.05
2.35
(0.45)
0.
25
2.35
1.45
R
0.
0.12±0.03
R
R
Terminal coplanarity
0.08
(Contact and
soldering terminals)
1.24
0.
1.49
0.12±0.03
0.84
(0.33)
Soldering terminals
Soldering terminals
20
C±0.1
General tolerance: ±0.2
Dimension table (mm)
Number of pins/
dimension
40
8.73
6.65
8.05
50
60
70
80
10.48
12.23
13.98
15.73
8.40
10.15
11.90
13.65
9.80
11.55
13.30
15.05
100
19.23
17.15
18.55
A
Socket and Header are mated
Header
1.50±0.15
Socket
–3–
ACCTB87E 201602-T
Narrow pitch connectors P35S (0.35mm pitch)
EMBOSSED TAPE DIMENSIONS (unit: mm, Common for respective contact type, socket and header)
• Tape dimensions (Conforming to JIS C 0806:1990.
However, some tapes have mounting hole pitches that do
not comply with the standard.)
Tape I
Tape II
• Plastic reel dimensions (Conforming to EIAJ ET-7200B)
C
1.75
2
8.0
1.
5
Top cover tape
1.75
4
Pull out direction
Pull out direction
4
Label
380 dia.
C
Taping reel
D±1
A±0.3
B
A±0.3
2
Embossed carrier tape
Embossed mounting-hole
8.0
1.
5
+0
0 .1
+0
0 .1
di
di
a.
a.
Dimension table (mm)
Mated height
Number of pins
Type of taping
A
B
C
D
Quantity per reel
Common for socket and header:
1.5mm
40 to 70
72 to 100
Tape I
Tape II
24.0
32.0
—
28.4
11.5
14.2
25.4
33.4
3,000
3,000
Connector orientation with respect to direction of progress of embossed tape
Type
Common for P35S
Direction of
tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
–4–
ACCTB87E 201602-T
Narrow pitch connectors P35S (0.35mm pitch)
For board-to-board For board-to-FPC
P35S
Connectors for
inspection usage
(0.35mm pitch)
m
35
m
m
6m
2.
3.
Socket
Header
FEATURES
APPLICATIONS
1. 3,000 mating and unmating cycles
2. Same external dimensions and foot
pattern as standard type.
3. Improved mating
Insertion and removal easy due to a
reduction in mating retention force. This
is made possible by a simple locking
structure design.
Ideal for module unit inspection and
equipment assembly inspection
Note: Mating retention force cannot be
warranted.
Please avoid using for applications other
than inspection.
RoHS compliant
TABLE OF PRODUCT TYPES
✩: Available for sale
Product name
P35S
for inspection
Number of pins
50
✩
40
✩
60
✩
70
✩
80
✩
100
✩
Notes: 1. The pickup surface shape of the inspection sockets is different from that of the standard sockets. (For details, refer to the product specification diagram.)
2. Please inquire number of pins other than those shown above.
3. Please inquire us regarding availability.
4. Please keep the minimum order quantities no less than 50 pieces per lot.
5. Please inquire if further information is needed.
PRODUCT TYPES
Specifications
Socket
Part No.
AXT1E∗∗26
Specifications
Header
Part No.
AXT2E∗∗26
Note: When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connector.
–5–
ACCTB87E 201602-T
Narrow pitch connectors P35S (0.35mm pitch)
NOTES
Socket (Mated height: 1.5mm)
Header (Mated height: 1.5mm)
0.45±0.03
0.70±0.03
0.70±0.03
0.85±0.03
Max. 0.03 mm
Max. 0.03 mm
: Insulation area
0.35±0.01
0.18±0.01
0.35±0.01
0.18±0.01
(0.50)
1.75±0.01
2.75±0.01
Metal mask thickness: When 120 μm
(Terminal portion opening area ratio: 60%)
(Metal portion opening area ratio: 100%)
1.65±0.01
0.65±0.01
(0.50)
Recommended metal mask pattern
Metal mask thickness: When 120 μm
(Terminal portion opening area ratio: 60%)
(Metal portion opening area ratio: 100%)
(0.53)
2.94±0.01
4.00±0.01
Recommended metal mask pattern
4.20±0.01
1.80±0.01
(1.20)
2. Keep the PC board warp no more
than 0.03 mm in relation to the overall
length of the connector
0.35±0.03
0.20±0.03
Max. 0.90
(0.75)
1.45±0.03
2.95±0.03
0.35±0.03
0.20±0.03
1.65±0.03
0.65±0.03
(0.50)
Recommended PC board pattern
(TOP VIEW)
(0.80)
2.60±0.03
4.20±0.03
Recommended PC board pattern
(TOP VIEW)
1.80±0.03
(1.20)
1. As shown below, excess force
during insertion may result in damage
to the connector or removal of the
solder. Also, to prevent connector
damage please confirm the correct
position before mating connectors.
0.45±0.01
0.70±0.01
0.70±0.01
0.85±0.01
3. If extra resistance to shock caused
by dropping is required, we
recommend using P4.
4. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
Please refer to the latest product
specifications when designing your
product.
–6–
ACCTB87E 201602-T
For board-to-board/board-to-FPC
Notes on Using Narrow pitch Connectors/
High Current Connectors
About safety Remarks
1) Do not use these connectors beyond
the specification sheets. The usage
outside of specified rated current,
dielectric strength, and environmental
conditions and so on may cause circuitry
damage via abnormal heating, smoke,
and fire.
2) In order to avoid accidents, your
thorough specification review is
appreciated.
Please contact us if your usage is out of
the specifications. Otherwise, Panasonic
Corporation cannot guarantee the quality
and reliability.
3) Panasonic Corporation is consistently
striving to improve quality and reliability.
However, the fact remains that electrical
components and devices generally cause
failures at a given statistical probability.
Furthermore, their durability varies with
use environments or use conditions. In
this respect, please check for actual
electrical components and devices under
actual conditions before use.
Continued usage in a state of degraded
condition may cause the deteriorated
insulation, thus result in abnormal heat,
smoke or firing. Please carry out safety
design and periodic maintenance
including redundancy design, design for
fire spread prevention, and design for
malfunction prevention so that no
accidents resulting in injury or death, fire
accidents, or social damage will be
caused as a result of failure of the
products or ending life of the products.
Regarding the design of devices and PC board patterns
1) When using the board to board
connectors, do not connect a pair of
board with multiple connectors.
Otherwise, misaligned connector
positions may cause mating failure or
product breakage.
2) With mounting equipment, there may
be up to a ±0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
5) PC board
Control the thicknesses of the coverlay
and adhesive to prevent poor soldering.
This connector has no stand-off.
Therefore, minimize the thickness of the
coverlay, etc. so as to prevent the
occurrence of poor soldering.
6) For all connectors of the narrow pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
Example) Secure in place with screws
Screw
Connector
Spacer
PC board
Spacer
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
7) When mounting connectors on a FPC
board:
• When the connector soldered to FPC is
mated or unmated, solder detachment
may occur by the force to the terminals.
Connector handling is recommended in
the condition when the reinforcing plate is
attached to the backside of FPC where
the connector is mounted. The external
dimension of the reinforcing plate is
recommended to be larger than the
dimension of “PC board recommended
process pattern” (extended dimension of
one side is approximately 0.5 to 1.0 mm).
The materials and thickness of the
reinforcing plate are glass epoxy or
polyimide (thickness 0.2 - 0.3 mm) or
SUS (thickness 0.1 - 0.2 mm).
• As this connector has temporary locking
structure, the connector mating may be
separated by the dropping impact
depend on the size, weight or bending
force of the FPC. Please consider the
measures at usage to prevent the mating
separation.
8) The narrow pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
Regarding the selection of the connector placement machine and the mounting
procedures
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the chucking force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
4) Depending on the size of the
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
–1–
6) In case of dry condition, please note
the occurrence of static electricity.
The product may be adhered to the
embossed carrier tape or the cover tape
in dry condition.
Recommended humidity is from 40%RH
to 60%RH and please remove static
electricity by ionizer in manufacturing
process.
ACCTB48E 201606-T
Notes on Using Narrow pitch Connectors/High Current Connectors
Regarding soldering
Terminal
Paste
solder
PC board
foot pattern
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) The condition of solder or flux rise and
wettability varies depending on the type
of solder and flux. Solder and flux
characteristics should be taken into
consideration and also set the reflow
temperature and oxygen level.
7) Do not use resin-containing solder.
Otherwise, the contacts might be firmly
fixed.
8) Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
Apply the solder
wire here
Upper limited (Solder heat resistance)
Lower limited (Solder wettability)
Terminal
Temperature
Peak temperature 260°C
230°C
180°C
150°C
So
ld
iro erin
n g
■ Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals.
(Please refer to the specification for detail
because the temperature setting differs
by products.)
2) As for cream solder printing, screen
printing is recommended.
3) When setting the screen opening area
and PC board foot pattern area, refer the
recommended PC board pattern and
window size of metal mask on the
specification sheet, and make sure that
the size of board pattern and metal mask
at the base of the terminals are not
increased.
4) Please pay attentions not to provide
too much solder. It makes miss mating
because of interference at soldering
portion when mating.
Small angle as
possible up to
45 degrees
Peak temperature
Preheating
220°C
200°C
PC board
25 sec.
60 to 120 sec.
70 sec.
Time
For products other than the ones above,
please refer to the latest product
specifications.
9) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector before
mounting.
10) Consult us when using a screenprinting thickness other than that
recommended.
■ Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
Table A
Product name
Soldering iron temperature
SMD type connectors
300°C within 5 sec.
350°C within 3 sec.
Pattern
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) These connector is low profile type. If
too much solder is supplied for hand
soldering, It makes miss mating because
of interference at soldering portion.
Please pay attentions.
■ Solder reworking
1) Finish reworking in one operation.
2) In case of soldering rework of bridges.
Don’t use supplementary solder flux.
Doing so may cause contact problems by
flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
Handling Single Components
1) Make sure not to drop or allow parts to
fall from work bench.
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
3) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
Precautions for mating
This product is designed with ease of
handling. However, in order to prevent the
deformation or damage of contacts and
molding, take care and do not mate the
connectors as shown right.
Press-fitting while the mating
inlets of the socket and
header are not matched.
Strongly pressed and twisted
Tilted mating
–2–
ACCTB48E 201606-T
Notes on Using Narrow pitch Connectors/High Current Connectors
Cleaning flux from PC board
There is no need to clean this product.
If cleaning it, pay attention to the
following points to prevent the negative
effect to the product.
1) Keep the cleaning solvent clean and
prevent the connector contacts from
contamination.
2) Some cleaning solvents are strong and
they may dissolve the molded part and
characters, so pure water passed liquid
solvent is recommended.
Handling the PC board after mounting the connector
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
The soldered areas should not be subjected to force.
Storage of connectors
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage. This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
5) There may be variations in the colors
of products from different production lots.
This is normal.
6) The connectors are not meant to be
used for switching.
7) Product failures due to condensation
are not covered by warranty.
Other Notes
1) Do not remove or insert the electrified
connector (in the state of carrying current
or applying voltage).
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
Regarding sample orders to confirm proper mounting
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Please refer to the latest product
specifications when designing your
product.
Condition when delivered from manufacturing
Reel
Embossed tape
amount required for
the mounting
Required number
of products for
sample production
(Delivery can also be made on a reel by
customer request.)
(Unit 50 pcs.)
–3–
ACCTB48E 201606-T