Narrow pitch connectors For board-to-FPC
F4S
(0.4 mm pitch)
Space-saving design with mated height of 1.0 mm and 3.6 mm width
FEATURES
“TOUGH CONTACT” construction provides strong
resistance to various environmental.
Simple lock structure provides tactile feedback to
ensure excellent mating/unmating operation feel.
Connectors for inspection available
3.6mm
Socket
2.6mm
Header
TYPICAL APPLICATIONS
Mobile devices and industrial equipment
DETAILS FEATURES
Space-saving (3.6 mm width)
Socket
Header
Soldering terminals
at four corners
Soldering terminals
at four corners
Width of suction: 0.80 mm
10.50mm
(40 pins)
3.60mm
High resistance to various environments!
“TOUGH CONTACT” construction provides high
contact reliability
Ni barrier construction
Bellows contact construction
(Tough against solder
rise!)
(Tough against shock impact!)
Porosity treatment
(Tough against
corrosive gases!)
9.80mm
(40 pins)
2.60mm
V notch and Double contact constructions
(Tough against exposure to foreign particles and solder flux!)
imple lock structure provides tactile feedback to
S
ensure excellent mating/unmating operation feel.
Simple lock
2020.04
industrial.panasonic.com/ac/e/
ー1ー
Panasonic Corporation 2020
ACCTB111E 202003
Narrow pitch connectors F4S (0.4 mm pitch)
ORDERING INFORMATION (PART NO.)
AXT
2 4
Number
of pins
(2 digits)
5: Socket
6: Header
Mated height
(Socket)
1: For mated height 1.0 mm
(Header)
1: For mated height 1.0 mm
Surface treatment (Contact portion /
Terminal portion)
(Socket)
4: Base: Ni plating, Surface: Au plating/
Base: Ni plating, Surface: Au plating
(Header)
4: Base: Ni plating, Surface: Au plating/
Base: Ni plating, Surface: Au plating
Package
Nil: Includes 3,000 pieces embossed tape and
plastic reel packaging × includes 2 reels
2: (Fixed)
PRODUCT TYPES
Mated height
1.0 mm
Number of pins
Part No.
Standard packing
Socket
Header
10
AXT510124
AXT610124
16
AXT516124
AXT616124
20
AXT520124
AXT620124
24
AXT524124
AXT624124
26
AXT526124
AXT626124
30
AXT530124
AXT630124
34
AXT534124
AXT634124
40
AXT540124
AXT640124
42
AXT542124
AXT642124
48
AXT548124
AXT648124
50
AXT550124
AXT650124
60
AXT560124
AXT660124
80
AXT580124
AXT680124
Inner carton (1-reel)
Outer carton
3,000 pcs.
6,000 pcs.
Note: Order unit: For volume production: 1-inner carton (1-reel) units. For samples, please contact our sales office.
Panasonic Corporation Electromechanical Control Business Division
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Panasonic Corporation 2020
ACCTB111E 202003
Narrow pitch connectors F4S (0.4 mm pitch)
SPECIFICATIONS
Characteristics
Item
Electrical
characteristics
Mechanical
characteristics
Rated voltage
60 V AC/DC
Dielectric strength
150 V AC for 1 min.
No short-circuiting or damage at a detection current of
1 mA when the specified voltage is applied for one
minute.
Insulation resistance
Min. 1,000 MΩ (initial)
Using 250 V DC megger (applied for 1 min.)
Contact resistance
Max. 90 mΩ
Based on the contact resistance measurement method
specified by JIS C 5402.
Composite insertion
force
Max. 0.981 N/pin contact × pin contacts (initial)
Composite removal
force
Min. 0.165 N/pin contact × pin contacts
Ambient temperature
–55 to +85°C
No icing. No condensation.
Soldering heat
resistance
The initial specification must be satisfied electrically
and mechanically.
Reflow soldering:
Peak temperature: 260°C or less
(on the surface of the PC board around the connector
terminals)
Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
Storage temperature
–55 to +85°C (product only)
–40 to +50°C (emboss packing)
No icing. No condensation.
Conformed to MIL-STD-202F, method 107G
Order Temperature (℃) Time (minutes)
1
30
ー55ー03
2
Max. 5
3
30
85 +30
4
Max. 5
ー55ー03
Thermal shock
resistance
(header and socket
mated)
5 cycles,
insulation resistance Min. 100 MΩ,
contact resistance Max. 90 mΩ
Humidity resistance
(header and socket
mated)
120 hours,
insulation resistance Min. 100 MΩ,
contact resistance Max. 90 mΩ
Conformed to IEC60068-2-78
Temperature 40±2°C, humidity 90 to 95% RH
Saltwater spray
resistance
(header and socket
mated)
24 hours,
insulation resistance Min. 100 MΩ,
contact resistance Max. 90 mΩ
Conformed to IEC60068-2-11
Temperature 35±2°C, saltwater concentration 5±1%
~
Lifetime
characteristics
Conditions
0.3 A/pin contact (Max. 5 A at total pin contacts)
~
Environmental
characteristics
Specifications
Rated current
H2S resistance (header 48 hours,
and socket mated)
contact resistance Max. 90 mΩ
Temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% RH
Insertion and removal
life
Repeated insertion and removal speed of Max. 200
times/hour
Unit weight
50 times
20 pins Socket: 0.03 g Header: 0.01 g
Material and surface treatment
Part name
Material
Surface treatment
Molded portion
LCP resin (UL94V-0)
—
Contact and Post
Copper alloy
Contact portion: Base: Ni plating Surface: Au plating
Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers
(exposed nickel portions).
Copper alloy
Sockets:
Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips)
Headers:
Base: Ni plating, Surface: Au plating (except the terminal tips)
Soldering terminals
Panasonic Corporation Electromechanical Control Business Division
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Panasonic Corporation 2020
ACCTB111E 202003
Narrow pitch connectors F4S (0.4 mm pitch)
DIMENSIONS
Unit: mm
CAD The CAD data of the products with a “CAD” mark can be downloaded from our Website.
Socket (Mated height: 1.0 mm)
CAD
Dimension table
Terminal coplanarity
D
A
B±0.1
0.40±0.05
0.15±0.03
0.08
2.36
3.60
(0.62)
(Contact and soldering
terminals)
(0.62)
3.00
0.80
(Suction face)
External dimensions
C0.15
2.00
3.60
Y※
Dimensions
Number
of pins
10
A
B
C
4.50
1.60
3.40
16
5.70
2.80
4.60
20
6.50
3.60
5.40
24
7.30
4.40
6.20
26
7.70
4.80
6.60
30
8.50
5.60
7.40
34
9.30
6.40
8.20
40
10.50
7.60
9.40
42
10.90
8.00
9.80
48
12.10
9.20
11.00
50
12.50
9.60
11.40
60
14.50
11.60
13.40
80
18.50
15.60
17.40
C±0.1
0.45
0.30±0.03
(0.80)
Z※
Dimensions
Mated height
D
1.0 mm
0.97
General tolerance: ±0.2
※Because the soldering terminal Y and Z are the unified structure, they are connected electrically.
Header (Mated height: 1.0 mm)
CAD
D
Dimensions
Number
of pins
10
A
B
C
3.80
1.60
3.20
16
5.00
2.80
4.40
20
5.80
3.60
5.20
1.68
2.60
Dimension table
24
6.60
4.40
6.00
26
7.00
4.80
6.40
(0.46)
A
B±0.1
0.40±0.05
0.15±0.03
30
7.80
5.60
7.20
34
8.60
6.40
8.00
40
9.80
7.60
9.20
42
10.20
8.00
9.60
48
11.40
9.20
10.80
Terminal coplanarity
0.08
(Post and soldering
terminals)
R0.15
1.86
0.80
(Suction face)
External dimensions
C0.13
C0.13
C±0.1
0.94
1.90
(Soldering
terminals-part)
0.15±0.03
(0.48)
Soldering
terminals
50
11.80
9.60
11.20
60
13.80
11.60
13.20
80
17.80
15.60
17.20
General tolerance: ±0.2
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Panasonic Corporation 2020
Dimensions
Mated height
D
1.0 mm
0.83
ACCTB111E 202003
Narrow pitch connectors F4S (0.4 mm pitch)
Header
1.00±0.15
Socket and Header are mated
Socket
Mated height: 1.0 mm
EMBOSSED TAPE DIMENSIONS
Unit: mm
Specifications for taping
Specifications for the plastic reel
In accordance with JIS C 0806:1990. However, not applied to
the mounting-hole pitch of some connectors.
Tape I
D±1
Label
Top cover tape
Tape Il
(A±0.3)
(A±0.3)
(B)
(4.0)
φ380
Embossed carrier tape
Embossed mounting-hole
Taping reel
(8.0) (2.0)
(8.0) (2.0)
φ1.5+0.1
0
(C)
(1.75)
Leading direction after packaging
(4.0)
(C)
(1.75)
Leading direction after packaging
In accordance with EIAJ ET-7200B.
φ1.5+0.1
0
Dimension table
Type/Mated height
Number of pins
Type of taping
A
B
Common for sockets and
headers
1.0 mm
C
D
Quantity per reel
24 or less
Tape I
16.0
—
26 to 60
Tape I
24.0
—
7.5
17.4
3,000
11.5
25.4
80
Tape II
32.0
28.4
14.2
3,000
33.4
3,000
Connector orientation with respect to embossed tape feeding direction
There is no indication on this product regarding top-bottom or left-right orientation.
Direction
of tape progress
Type
Common for F4S
Socket
Header
Panasonic Corporation Electromechanical Control Business Division
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ー5ー
Panasonic Corporation 2020
ACCTB111E 202003
Narrow pitch connectors F4S (0.4 mm pitch)
Narrow pitch connectors
F4S (0.4 mm pitch) Connectors for inspection usage
3,000 mating and unmating cycles Connectors for inspection usage
FEATURES
3.6mm
3,000 mating and unmating cycles
Same external dimensions and foot pattern as
standard type.
Improved mating
Insertion and removal easy due to a reduction in
mating retention force. This is made possible by a
simple locking structure design.
(Mating retention force cannot be warranted.)
Please avoid using for applications other than
inspection.
2.6mm
Socket
Header
TYPICAL APPLICATIONS
Ideal for module unit inspection and equipment
assembly inspection
TABLE OF PRODUCT TYPES
☆: Available for sale
Product name
F4S
for inspection
Number of pins
10
16
20
24
26
30
34
40
42
48
50
60
80
☆
☆
☆
☆
☆
☆
☆
☆
☆
☆
☆
☆
☆
Notes: 1. Please contact our sales office about availability and number of pins other than those shown above.
2. Please keep the minimum order quantities no less than 50 pieces per lot.
PRODUCT TYPES
Part No.
Socket
Header
AXT5E**26
AXT6E**26
Note: When placing an order, substitute the “ * ” (asterisk) in the above part number
with the number of pins for the specific connector.
Panasonic Corporation Electromechanical Control Business Division
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ー6ー
Panasonic Corporation 2020
ACCTB111E 202003
Narrow pitch connectors F4S (0.4 mm pitch)
NOTES
Unit: mm
Design of PC board patterns
Conduct the recommended foot pattern design, in order to
preserve the mechanical strength of terminal solder areas.
Recommended PC board and metal mask patterns
Connectors are mounted with high pitch density, intervals of
0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and
flux rise, solder bridges and other issues make sure the proper
levels of solder is used.
The figures are recommended patterns. Please use them as a
reference.
Socket (Mated height: 1.0 mm)
Header (Mated height: 1.0 mm)
: Insulation area
0.20±0.01
0.40±0.01
0.80±0.01
0.45±0.01
2.06±0.01
0.75±0.01
(0.655)
4.20±0.01
1.80±0.01
(1.20)
0.90±0.01
0.70±0.01
Max. 1.00
(0.75)
1.70±0.03
3.20±0.03
0.20±0.01
0.40±0.01
Recommended metal mask pattern
Metal mask thickness: When 120 μm
(Terminal opening ratio: 60%)
(Metal-part opening ratio: 100%)
(0.63)
2.74±0.01
4.00±0.01
Recommended metal mask pattern
Metal mask thickness: When 120 μm
(Terminal opening ratio: 60%)
(Metal-part opening ratio: 100%)
(0.41)
2.18±0.01
3.00±0.01
0.80±0.01
0.45±0.01
2.06±0.01
0.75±0.01
(0.655)
4.20±0.01
1.80±0.01
(1.20)
0.90±0.01
0.70±0.01
: Insulation area
Recommended metal mask pattern
Metal mask thickness: When 150 μm
(Terminal opening ratio: 48%)
(Metal-part opening ratio: 100%)
(0.51)
2.98±0.01
4.00±0.01
Recommended metal mask pattern
Metal mask thickness: When 150 μm
(Terminal opening ratio: 48%)
(Metal-part opening ratio: 100%)
0.23±0.03
0.40±0.03
0.20±0.01
0.40±0.01
(0.52)
1.96±0.01
3.00±0.01
0.23±0.03
0.40±0.03
0.80±0.03
0.45±0.03
2.06±0.03
0.75±0.03
(0.655)
1.80±0.03
(1.20)
0.90±0.03
0.70±0.03
Recommended PC board pattern
(TOP VIEW)
(0.92)
2.36±0.03
4.20±0.03
Recommended PC board pattern
(TOP VIEW)
0.20±0.01
0.40±0.01
Please refer to "the latest product specifications"
when designing your product.
•Requests to customers:
https://industrial.panasonic.com/ac/e/salespolicies/
Panasonic Corporation Electromechanical Control Business Division
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ー7ー
Panasonic Corporation 2020
ACCTB111E 202003
Notes on Using Narrow pitch Connectors/High Current Connectors
For board-to-board/board-to-FPC
Notes on Using Narrow pitch Connectors/
High Current Connectors
About safety remarks
Observe the following safety remarks to prevent accidents and injuries.
3) Panasonic Corporation is consistently striving to improve
1) Do not use these connectors beyond the specification sheets.
quality and reliability. However, the fact remains that electrical
The usage outside of specified rated current, dielectric strength,
components and devices generally cause failures at a given
and environmental conditions and so on may cause circuitry
statistical probability. Furthermore, their durability varies with
damage via abnormal heating, smoke, and fire.
use environments or use conditions. In this respect, please
2) In order to avoid accidents, your thorough specification review
check for actual electrical components and devices under actual
is appreciated. Please contact our sales office if your usage is
conditions before use. Continued usage in a state of degraded
out of the specifications. Otherwise, Panasonic Corporation
condition may cause the deteriorated insulation, thus result in
cannot guarantee the quality and reliability.
abnormal heat, smoke or firing. Please carry out safety design
and periodic maintenance including redundancy design, design
for fire spread prevention, and design for malfunction prevention
so that no accidents resulting in injury or death, fire accidents, or
social damage will be caused as a result of failure of the
products or ending life of the products.
Regarding the design of devices and PC board patterns
1) When using the board to board connectors, do not connect a
pair of board with multiple connectors. Otherwise, misaligned
connector positions may cause mating failure or product
breakage.
2) With mounting equipment, there may be up to a ±0.2 to 0.3
mm error in positioning. Be sure to design PC boards and
patterns while taking into consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed on the body to aid in
positioning. When using these connectors, make sure that the
PC board is designed with positioning holes to match these tabs.
4) To ensure the required mechanical strength when soldering
the connector terminals, make sure the PC board meets
recommended PC board pattern design dimensions given.
5) PC board
Control the thicknesses of the cover lay and adhesive to prevent
poor soldering. This connector has no stand-off. Therefore,
minimize the thickness of the cover lay, etc. so as to prevent the
occurrence of poor soldering.
6) For all connectors of the narrow pitch series, to prevent the
PC board from coming off during vibrations or impacts, and to
prevent loads from falling directly on the soldered portions, be
sure to design some means to fix the PC board in place.
Example) Secure in place with screws
7) When mounting connectors on a FPC
• When the connector soldered to FPC is mated or unmated,
solder detachment may occur by the force to the terminals.
Connector handling is recommended in the condition when the
reinforcing plate is attached to the backside of FPC where the
connector is mounted. The external dimension of the reinforcing
plate is recommended to be larger than the dimension of
“Recommended PC board pattern” (extended dimension of one
side is approximately 0.5 to 1.0 mm). The materials and
thickness of the reinforcing plate are glass epoxy or polyimide
(thickness 0.2 to 0.3 mm) or SUS (thickness 0.1 to 0.2 mm).
• As this connector has temporary locking structure, the
connector mating may be separated by the dropping impact
depend on the size, weight or bending force of the FPC. Please
consider the measures at usage to prevent the mating
separation.
8) The narrow pitch connector series is designed to be compact
and thin. Although ease of handling has been taken into
account, take care when mating the connectors, as
displacement or angled mating could damage or deform the
connector.
Screw
↓
↓
Spacer
Connector
PC board
Spacer
When connecting PC boards, take appropriate measures to
prevent the connector from coming off.
ー8ー
ACCTB48E 201809-T
Notes on Using Narrow pitch Connectors/High Current Connectors
Regarding the selection of the connector placement machine and the mounting
procedures
1) Select the placement machine taking into consideration the
connector height, required positioning accuracy, and packaging
conditions.
2) Be aware that if the chucking force of the placement machine
is too great, it may deform the shape of the connector body or
connector terminals.
3) Be aware that during mounting, external forces may be
applied to the connector contact surfaces and terminals and
cause deformations.
4) Depending on the size of the connector being used, self
alignment may not be possible. In such cases, be sure to
carefully position the terminal with the PC board pattern.
5) The positioning bosses give an approximate alignment for
positioning on the PC board. For accurate positioning of the
connector when mounting it to the PC board, we recommend
using an automatic positioning machine.
6) In case of dry condition, please note the occurrence of static
electricity. The product may be adhered to the embossed carrier
tape or the cover tape in dry condition. Recommended humidity
is from 40 to 60%RH and please remove static electricity by
ionizer in manufacturing process.
Regarding soldering
Reflow soldering
1) Measure the recommended profile temperature for reflow
soldering by placing a sensor on the PC board near the
connector surface or terminals. (Please refer to the specification
for detail because the temperature setting differs by products.)
2) As for cream solder printing, screen printing is recommended.
3) When setting the screen opening area and PC board foot
pattern area, refer the recommended PC board pattern and
window size of metal mask on the specification sheet, and make
sure that the size of board pattern and metal mask at the base of
the terminals are not increased.
4) Please pay attentions not to provide too much solder. It
makes miss mating because of interference at soldering portion
when mating.
Terminal
Paste solder
PC board foot pattern
5) When mounting on both sides of the PC board and the
connector is mounting on the underside, use adhesives or other
means to ensure the connector is properly fixed to the PC board.
(Double reflow soldering on the same side is possible.)
6) The condition of solder or flux rise and wettability varies
depending on the type of solder and flux. Solder and flux
characteristics should be taken into consideration and also set
the reflow temperature and oxygen level.
Hand soldering
1) Set the soldering iron so that the tip temperature is less than
that given in the table below.
Table A
Product name
Soldering iron temperature
SMD type connectors all products
300°C within 5 sec.
350°C within 3 sec.
180℃
150℃
Peak temperature
Preheating
220℃
200℃
25 sec.
60 to 120 sec.
70 sec.
Upper limited
(Solder heat resistance)
Lower limited
(Solder wettability)
Time
For products other than the ones above, please refer to the
latest product specifications.
9) The temperature profiles given in this catalog are values
measured when using the connector on a resin-based PC
board. When performed reflow soldering on a metal board (iron,
aluminum, etc.) or a metal table to mount on a FPC, make sure
there is no deformation or discoloration of the connector before
mounting.
10) Please contact our sales office when using a screen-printing
thickness other than that recommended.
4) Be aware that soldering while applying a load on the
connector terminals may cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on the contact surfaces
during soldering operations. After soldering, carefully check the
contact surfaces and clean off any solder before use.
7) These connector is low profile type. If too much solder is
supplied for hand soldering, It makes miss mating because of
interference at soldering portion. Please pay attentions.
S
iro old
n eri
Apply the solder
wire here
Temperature
Peak temperature 260℃
230℃
ng
2) Do not allow flux to spread onto the connector leads or PC
board. This may lead to flux rising up to the connector inside.
3) Touch the soldering iron to the foot pattern. After the foot
pattern and connector terminal are heated, apply the solder wire
so it melts at the end of the connector terminals.
7) Do not use resin-containing solder. Otherwise, the contacts
might be firmly fixed.
8) Soldering conditions
Please use the reflow temperature profile conditions
recommended below for reflow soldering. Please contact our
sales office before using a temperature profile other than that
described below (e.g. lead-free solder)
Small angle as
possible up to
45 degrees
Terminal
PC board
Pattern
ー9ー
ACCTB48E 201809-T
Notes on Using Narrow pitch Connectors/High Current Connectors
Solder reworking
1) Finish reworking in one operation.
2) In case of soldering rework of bridges. Do not use
supplementary solder flux. Doing so may cause contact
problems by flux.
3) Keep the soldering iron tip temperature below the
temperature given in Table A.
Handling single components
1) Make sure not to drop or allow parts to fall from work bench.
2) Excessive force applied to the terminals could cause warping,
come out, or weaken the adhesive strength of the solder. Handle
with care.
3) Do not insert or remove the connector when it is not soldered.
Forcibly applied external pressure on the terminals can weaken
the adherence of the terminals to the molded part or cause the
terminals to lose their evenness.
Precautions for mating
This product is designed with ease of handling. However, in
order to prevent the deformation or damage of contacts and
molding, take care and do not mate the connectors as shown
right.
Press-fitting while the mating
inlets of the socket and
Strongly pressed and
header are not matched.
twisted
Tilted mating
Cleaning flux from PC board
There is no need to clean this product.
If cleaning it, pay attention to the following points to prevent the
negative effect to the product.
1) Keep the cleaning solvent clean and prevent the connector
contacts from contamination.
2) Some cleaning solvents are strong and they may dissolve the
molded part and characters, so pure water passed liquid solvent
is recommended.
Handling the PC board
Handling the PC board after mounting the connector
When cutting or bending the PC board after mounting the
connector, be careful that the soldered sections are subjected to
excessive force.
The soldered areas should not be subjected to force.
Storage of connectors
1) To prevent problems from voids or air pockets due to heat of
reflow soldering, avoid storing the connectors in areas of high
humidity.
2) Depending on the connector type, the color of the connector
may vary from connector to connector depending on when it is
produced. Some connectors may change color slightly if
subjected to ultraviolet rays during storage. This is normal and
will not affect the operation of the connector.
3) When storing the connectors with the PC boards assembled
and components already set, be careful not to stack them up so
the connectors are subjected to excessive forces.
4) Avoid storing the connectors in locations with excessive dust.
The dust may accumulate and cause improper connections at
the contact surfaces.
Other Notes
1) Do not remove or insert the electrified connector (in the state
of carrying current or applying voltage).
2) Dropping of the products or rough mishandling may bend or
damage the terminals and possibly hinder proper reflow
soldering.
3) Before soldering, try not to insert or remove the connector
more than absolutely necessary.
ー 10 ー
4) When coating the PC board after soldering the connector to
prevent the deterioration of insulation, perform the coating in
such a way so that the coating does not get on the connector.
5) There may be variations in the colors of products from
different production lots. This is normal.
6) The connectors are not meant to be used for switching.
7) Product failures due to condensation are not covered by
warranty.
ACCTB48E 201809-T
Notes on Using Narrow pitch Connectors/High Current Connectors
Regarding sample orders to confirm proper mounting
When ordering samples to confirm proper mounting with the
placement machine, connectors are delivered in 50-piece units
in the condition given right. Consult a sale representative for
ordering sample units.
Condition when delivered from manufacturing
Embossed tape
amount required
for the mounting
Required number
of products for
sample production
Reel
Delivery can also be made on a reel
by customer request.
(Unit 50 pcs.)
Please refer to “the latest product specifications” when designing your product.
• Requests to customers:
https://industrial.panasonic.com/ac/e/salespolicies/
ー 11 ー
ACCTB48E 201809-T
Please contact ..........
Electromechanical Control Business Division
1006, Oaza Kadoma, Kadoma-shi, Osaka 571-8506, Japan
industral.panasonic.com/ac/e/
©Panasonic Corporation 2020
ACCTB111E 202003
Specifications are subject to change without notice.