Automation Controls Catalog
To Be Discontinued
Last time buy:September 30, 2014
For board-to-FPC
F35S Series
Narrow pitch connectors
(0.35mm pitch)
FEATURES
1. Space-saving (0.35 mm pitch)
When mated, the footprint is reduced by
approx. 12% from F4S series (40 pin
contacts).
Suction face
0.8mm
m
6m
2.
m
4m
3.
Socket
Header
3.4
F4
RoHS compliant
S 3 mm
.6
mm
2. Strong resistance to adverse
environments! Utilizes
“
” construction
for high contact reliability.
Ni barrier
construction
Bellows contact
construction
(Against solder rise!)
(Against dropping!)
ts)
s)
tac act
on ont
c
c
pin pin
(40 (40
m
m
m
m
5
9.3 0.50
Socket
S1
F4
Porosity treatment
(Against corrosive gases!)
Soldering terminals
at each corner
V notch and Double contact constructions
(Against foreign particles and flux!)
Suction face
0.8mm
2.6
mm
3. Soldering terminals at each corner
enhance mounting strength.
4. Simple lock structure provides
tactile feedback to ensure excellent
mating/unmating operation feel.
5. Gull-wing-shaped terminals to
facilitate visual inspections.
)
cts ts)
nta ntac
o
c
co
pin in
(40 (40 p
m
2 m mm
8.6 9.80
Header
S
4
F
Soldering terminals
at each corner
APPLICATIONS
Ideal for board-to-FPC connections in
mobile equipment that requires size
and thickness reduction and
functionality enhancement.
ORDERING INFORMATION
AXT
1
2
4
7: Narrow Pitch Connector F35S (0.35 mm pitch) Socket
8: Narrow Pitch Connector F35S (0.35 mm pitch) Header
Number of pins (2 digits)
Mated height
/
1: For mated height 1.0 mm
Functions
2: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
4: Base: Ni plating, Surface: Au plating (for Ni barrier available)
4: Base: Ni plating, Surface: Au plating
2013.09
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–1–
© Panasonic Corporation 2013
ACCTB27E 201309-T
To Be Discontinued
Last time buy:September 30, 2014
AXT7, 8
PRODUCT TYPES
Mated height
Number of pins
1.0mm
40
50
60
70
80
Part number
Socket
AXT740124
AXT750124
AXT760124
AXT770124
AXT780124
Packing
Header
AXT840124
AXT850124
AXT860124
AXT870124
AXT880124
Inner carton
Outer carton
3,000 pieces
6,000 pieces
Notes: 1. Order unit: For volume production: 1-inner-box (1-reel) units
Samples for mounting check: 50-connector units. Please contact our sales office.
2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our
sales office.
3. Please contact us for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Specifications
0.25A/pin contact (Max. 4 A at total pin contacts)
60V AC/DC
Breakdown voltage
150V AC for 1 min.
Insulation resistance
Min. 1,000MΩ (initial)
Contact resistance
Max. 100mΩ
Composite insertion force
Composite removal force
Contact holding force
(Socket contact)
Ambient temperature
Max. 0.981N/pin contacts × pin contacts (initial)
Min. 0.165N/pin contacts × pin contacts
Soldering heat resistance
Storage temperature
Conditions
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No freezing at low temperatures. No dew condensation.
Min. 0.49N/pin contacts
–55°C to +85°C
Peak temperature: 260°C or less (on the surface of
the PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Infrared reflow soldering
Soldering iron
No freezing at low temperatures. No dew condensation.
Conformed to MIL-STD-202F, method 107G
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
H2S resistance
(header and socket mated)
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
48 hours,
contact resistance max. 100mΩ
Insertion and removal life
50 times
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
Lifetime
characteristics
Unit weight
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Time (minutes)
30
Max. 5
30
Max. 5
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Bath temperature 35±2°C,
saltwater concentration 5±1%
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200 times/
hours
40 pin contact type: Socket: 0.04 g Header: 0.02 g
2. Material and surface treatment
Part name
Molded
portion
Contact and
Post
Material
LCP resin
(UL94V-0)
Copper alloy
Surface treatment
—
Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating, Surface: Au plating (except the terminal tips)
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–2–
© Panasonic Corporation 2013
ACCTB27E 201309-T
To Be Discontinued
Last time buy:September 30, 2014
AXT7, 8
DIMENSIONS (Unit: mm)
Socket (Mated height: 1.0 mm)
0.80 (Suction face)
A
B±0.1
Terminal coplanarity
0.35±0.05
0.97
0.08
0.12±0.03
3.40
3.00
(Contact and soldering terminals)
C0.15
Dimension table (mm)
2.00
3.40
Y note
Number of pins/
dimension
40
9.35
6.65
8.25
50
60
70
80
11.10
12.85
14.60
16.35
8.40
10.15
11.90
13.65
10.00
11.75
13.50
15.25
B
C
0.30±0.03
C±0.1
0.35
(0.70)
Z note
General tolerance: ±0.2
A
B
C
Note: Since the soldering terminals are built into the body, the sections Y and Z are electrically connected.
Header (Mated height: 1.0 mm)
0.80 (Suction face)
A
B±0.1
Terminal coplanarity
0.35±0.05
0.83
0.08
0.
15
0.12±0.03
C
0.
13
1.86
2.60
R
(Post and soldering terminals)
C
13
0.
C±0.1
Dimension table (mm)
1.90
Soldering terminals
0.12±0.03
(0.48)
0.94
Soldering terminals
Number of pins/
dimension
40
8.62
6.65
8.05
50
60
70
80
10.37
12.12
13.87
15.62
8.40
10.15
11.90
13.65
9.80
11.55
13.30
15.05
General tolerance: ±0.2
A
Header
Socket
1.00±0.15
• Socket and Header are mated
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© Panasonic Corporation 2013
ACCTB27E 201309-T
To Be Discontinued
Last time buy:September 30, 2014
AXT7, 8
EMBOSSED TAPE DIMENSIONS (Unit: mm) (Common to all sockets and headers)
• Specifications for taping
(In accordance with JIS C 0806-1990. However, not applied to
the mounting-hole pitch of some connectors.)
Tape I
Tape II
(A±0.3)
(A±0.3)
(B)
Label
Embossed carrier tape
(2.0)
380 dia.
(4.0)
Top cover tape
Embossed mounting-hole
8.0
Taping reel
.1
+0 0
.1
+0 0
5
1.
Leading direction after packaging
(4.0)
(2.0)
8.0
(D±1)
(C)
(1.75)
5
1.
Leading direction after packaging
(C)
(1.75)
• Specifications for the plastic reel
(In accordance with EIAJET-7200B.)
a.
di
a.
di
• Dimension table (Unit: mm)
Type/Mated height
Number of pins
Type of taping
A
B
C
D
Quantity per reel
Common for sockets and headers:
1.0mm
40 to 70
80
Tape I
Tape II
24.0
32.0
—
28.4
11.5
14.2
25.4
33.4
3,000
3,000
• Connector orientation with respect to embossed tape feeding direction
Type
Common for F35S
Direction
of tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
NOTES
(0.75)
1.70±0.03
3.20±0.03
0.45±0.03
: Insulatin
area
0.70±0.03
0.80±0.03
0.20±0.03
1.00 or less
0.35±0.03
(0.655)
2.06±0.03
(0.72)
(1.00)
3.80±0.03
1.80±0.03
0.20±0.03
0.75±0.03
Recommended PC board pattern (TOP VIEW)
0.35±0.03
0.60 or less
• Header (Mated height: 1.0 mm)
Recommended PC board pattern (TOP VIEW)
2.36±0.03
• Socket (Mated height: 1.0 mm)
: Insulation
area
(0.50)
0.18±0.01
2.00±0.01
(0.655)
0.35±0.01
3.00±0.01
3.60±0.01
0.18±0.01
0.75±0.01
(0.52)
(1.00)
0.35±0.01
2.06±0.01
Metal mask thickness: When 120µm
(Terminal opening ratio: 60%)
(Metal-part opening ratio: 100%)
2.56±0.01
Recommended metal mask opening pattern
Metal mask thickness: When 120µm
(Terminal opening ratio: 65%)
(Metal-part opening ratio: 100%)
1.80±0.01
Recommended metal mask opening pattern
3.80±0.01
1. Design of PC board patterns
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
2. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder bridges and
other issues make sure the proper levels
of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
0.45±0.01
0.70±0.01
0.70±0.01
0.80±0.01
Please refer to the latest product
specifications when designing your
product.
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–4–
© Panasonic Corporation 2013
ACCTB27E 201309-T
Notes on Using Narrow pitch Connectors
Notes on Using Narrow pitch Connectors
Regarding the design of devices and PC board patterns
1) When connecting several connectors
together by stacking, make sure to
maintain proper accuracy in the design of
structure and mounting equipment so
that the connectors are not subjected to
twisting and torsional forces.
2) With mounting equipment, there may
be up to a ±0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
5) For all connectors of the narrow pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
Example) Secure in place with screws
Screw
Connector
Spacer
PC board
Spacer
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
6) Notes when using a FPC.
(1) When the connector is soldered to an
FPC board, during its insertion and
removal procedures, forces may be
applied to the terminals and cause the
soldering to come off. It is recommended
to use a reinforcement board on the
backside of the FPC board to which the
connector is being connected. Please
make the reinforcement board
dimensions bigger than the outer limits of
the recommended PC board pattern
(should be approximately 1 mm greater
than the outer limit).
Material should be glass epoxy or
polyimide, and the thickness should be
between 0.2 and 0.3 mm.
(2) Collisions, impacts, or turning of FPC
boards, may apply forces on the
connector and cause it to come loose.
Therefore, make to design retaining
plates or screws that will fix the connector
in place.
7) The narrow pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
Regarding the selection of the connector placement machine and the mounting
procedures
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the catching force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
4) Depending on the size of the
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
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–5–
6) Excessive mounter chucking force may
deform the molded or metal part of the
connector. Consult us in advance if
chucking is to be applied.
© Panasonic Corporation 2013
ACCTB48E 201303-T
Notes on Using Narrow pitch Connectors
Regarding soldering
Terminal
Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
• Narrow pitch connectors
(except P8 type)
Temperature
Peak temperature
25 sec.
60 to 120 sec.
• Narrow pitch connector (P8)
Soldering iron temperature
300°C within 5 sec.
350°C within 3 sec.
Apply the solder
wire here
Peak temperature
245°C max.
200°C
Preheating
Terminal
60 to 120 sec.
Small angle as
possible up to
45 degrees
Within 30 sec.
Time
For products other than the ones above,
please refer to the latest product
specifications.
7) The temperatures are measured at the
surface of the PC board near the
connector terminals. (The setting for the
sensor will differ depending on the sensor
used, so be sure to carefully read the
instructions that comes with it.)
8) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector beforehand
and then begin mounting.
9) Consult us when using a screenprinting thickness other than that
recommended.
10) Some solder and flux types may
cause serious solder or flux creeping.
Solder and flux characteristics should be
taken into consideration when setting the
reflow soldering conditions.
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Product name
SMD type connectors
Temperature
Paste
solder
4) Consult us when using a screenprinting thickness other than that
recommended.
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) N2 reflow, conducting reflow soldering
in a nitrogen atmosphere, increases the
solder flow too greatly, enabling wicking
to occur. Make sure that the solder feed
rate and temperature profile are
appropriate.
70 sec.
Time
155 to 165°C
PC board
foot pattern
220°C
200°C
Preheating
180°C
150°C
Table A
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
Upper limited (Solder heat resistance)
Lower limited (Solder wettability)
Peak temperature 260°C
230°C
2. Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
So
ld
iro erin
n g
1. Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals. (The
setting for the sensor will differ depending
on the sensor used, so be sure to
carefully read the instructions that comes
with it.)
2) As for cream solder printing, screen
printing is recommended.
3) To determine the relationship between
the screen opening area and the PCboard foot pattern area, refer to the
diagrams in the recommended patterns
for PC boards and metal masks. Make
sure to use the terminal tip as a reference
position when setting. Avoid an excessive
amount of solder from being applied,
otherwise, interference by the solder will
cause an imperfect contact.
–6–
PC board
Pattern
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) For soldering of prototype devices
during product development, you can
perform soldering at the necessary
locations by heating with a hot-air gun by
applying cream solder to the foot pattern
beforehand. However, at this time, make
sure that the air pressure does not move
connectors by carefully holding them
down with tweezers or other similar tool.
Also, be careful not to go too close to the
connectors and melt any of the molded
components.
8) If an excessive amount of solder is
applied during manual soldering, the
solder may creep up near the contact
points, or solder interference may cause
imperfect contact.
3. Solder reworking
1) Finish reworking in one operation.
2) For reworking of the solder bridge, use
a soldering iron with a flat tip. To prevent
flux from climbing up to the contact
surfaces, do not add more flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
© Panasonic Corporation 2013
ACCTB48E 201303-T
Notes on Using Narrow pitch Connectors
Handling Single Components
1) Make sure not to drop or allow parts to
fall from work bench
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
3) Repeated bending of the terminals
may cause terminals to break.
4) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
5) Excessive prying-force applied to one
end may cause product breakage and
separation of the solder joints at the
terminal.
Excessive force applied for insertion in a
pivot action as shown may also cause
product breakage.
Align the header and socket positions
before connecting them.
Cleaning flux from PC board
3) Since some powerful cleaning
solutions may dissolve molded
components of the connector and wipe
off or discolor printed letters, we
recommend aqua pura electronic parts
cleaners. Please consult us if you wish to
use other types of cleaning fluids.
4) Please note that the surfaces of
molded parts may whiten when cleaned
with alcohol.
Handling the PC board
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage. This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
5) There may be variations in the colors
of products from different production lots.
This is normal.
6) The connectors are not meant to be
used for switching.
7) Be sure not to allow external pressure
to act on connectors when assembling
PCBs or moving in block assemblies.
1) To increase the cleanliness of the
cleaning fluid and cleaning operations,
prepare equipment for cleaning process
beginning with boil cleaning, ultrasonic
cleaning, and then vapor cleaning.
2) Carefully oversee the cleanliness of
the cleaning fluids to make sure that the
contact surfaces do not become dirty
from the cleaning fluid itself.
• Handling the PC board after
mounting the connector
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
The soldered areas should not be subjected to force.
Storage of connectors
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity. When storing the
connectors for more than six months, be
sure to consider storage area where the
humidity is properly controlled.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Other Notes
1) These products are made for the
design of compact and lightweight
devices and therefore the thickness of the
molded components has been made very
thin. Therefore, be careful during
insertion and removal operations for
excessive forces applied may damage
the products.
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
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–7–
© Panasonic Corporation 2013
ACCTB48E 201303-T
Notes on Using Narrow pitch Connectors
Regarding sample orders to confirm proper mounting
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Please refer to the latest product
specifications when designing your
product.
Condition when delivered from manufacturing
Reel
Embossed tape
amount required for
the mounting
Required number
of products for
sample production
(Delivery can also be made on a reel by
customer request.)
(Unit 50 pcs.)
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–8–
© Panasonic Corporation 2013
ACCTB48E 201303-T