For FPC/FFC
FPC/FFC connectors
(0.5mm pitch)
Back lock
Y5B/Y5BW
Pitch 0.5 mm, low profile/space saving and double top and bottom contacts
construction
FEATURES
1. Double top and bottom contacts construction
2. Wiring patterns can be placed under the connector
3. Time and effort can be reduced by delivering with lever
open
4. Lock hold type (Y5BW) with excellent holding force is
available (Y5BW: support only FPC)
5. Supports high speed transmission standard V-by-One®
HS. of THine Electronics, Inc.
APPLICATIONS
Mobile devices and industrial equipment
®
*V-by-One HS: An interface for the nextgeneration high-speed signals developed by
THine Electronics, Inc. V-by-One® is a
registered trademark of THine Electronics, Inc.
DETAILED FEATURES
Lock hold type (Y5BW) is also available
The FPC holding contacts located on both ends of the connector
facilitate positioning of FPC and further enhance the FPC
holding force.
Low profile and space saving design
Low profile and space saving design of 1.0 mm high and 3.20
mm deep (3.70 mm with lever)
Structure to lock
notches on both
ends of the FPC
with soldering
terminals
1.00
3.20
Applicable FPC shape
With notches
4 pins (Y5B: minimum)
Notes: 1. The inserted FPC can be temporarily held until the lever is closed.
2. When the lever is closed, the holding contacts lock the FPC by its notches,
enhancing the FPC holding force.
Prevent displacement of FPC insertion
Constructed to make positional displacement difficult by
surrounding the four sides on the FPC inlet side with wall
molding
–1–
ACCTB1E 201803-T
FPC/FFC connectors Y5B/Y5BW (0.5mm pitch)
ORDERING INFORMATION
Y5B
AYF 53
3 5
53: 0.5 mm pitch
Back lock
Number
of pins
(2 digits)
Function
3: Top and bottom
double contacts
Surface treatment
(Contact portion / Terminal portion)
5: Au plating/Au plating
Y5BW
AYF 53
53: 0.5 mm pitch
Back lock
Number
of pins
(2 digits)
6 5 T
Function
6: Top and bottom double contacts
and lock hold type
Surface treatment
(Contact portion / Terminal portion)
5: Au plating/Au plating
PRODUCT TYPES
Y5B
Height
Number of pins
Part number
1.0 mm
4
5
6
8
10
12
14
16
24
28
30
32
34
40
42
50
AYF530435
AYF530535
AYF530635
AYF530835
AYF531035
AYF531235
AYF531435
AYF531635
AYF532435
AYF532835
AYF533035
AYF533235
AYF533435
AYF534035
AYF534235
AYF535035
Packing
Inner carton (1-reel)
Outer carton
5,000 pieces
10,000 pieces
Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units. For samples, please contact our sales office.
2. Please contact our sales office for connectors having a number of pins other than those listed above.
–2–
ACCTB1E 201803-T
FPC/FFC connectors Y5B/Y5BW (0.5mm pitch)
Y5BW
Height
Number of pins
Part number
1.0 mm
2
3
4
6
8
10
12
14
22
26
28
30
32
38
40
48
AYF530265T
AYF530365T
AYF530465T
AYF530665T
AYF530865T
AYF531065T
AYF531265T
AYF531465T
AYF532265T
AYF532665T
AYF532865T
AYF533065T
AYF533265T
AYF533865T
AYF534065T
AYF534865T
Packing
Inner carton (1-reel)
Outer carton
5,000 pieces
10,000 pieces
Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units. For samples, please contact our sales office.
2. Please contact our sales office for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
The followings show specifications, when using an applicable FPC (thickness 0.30 mm)
Electrical
characteristics
Mechanical
characteristics
Item
Rated current
Rated voltage
Specifications
0.5A/pin contact (except for holding contact)
50V AC/DC
Dielectric strength
250V AC for 1 min.
Insulation resistance
Min. 1,000MΩ (initial)
Contact resistance
Max. 100mΩ
FPC holding force
Ambient temperature
Conditions
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Using 250V DC megger (applied for 1 min.)
Y5B: Min. 0.2N/pin contact × pin contacts (initial)
Y5BW: Min. 0.2N/pin contact × pin contacts + 2.0N
(initial)
–55 to +85°C
Soldering heat resistance
The initial specification must be satisfied electrically
and mechanically.
Storage temperature
–55 to +85°C (product only)
–40 to +50°C (emboss packing)
Based on the contact resistance measurement method
specified by JIS C 5402.
Measurement of the maximum force applied until the
inserted compatible FPC is pulled out in the insertion axis
direction while the connector lever is closed
No icing. No condensation.
Reflow soldering:
Peak temperature: 260°C or less
(on the surface of the PC board around the connector
terminals)
Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
No icing. No condensation.
Conformed to MIL-STD-202F, method 107G
Environmental
characteristics
Thermal shock resistance
(with FPC mated)
Humidity resistance
(with FPC mated)
Saltwater spray resistance
(with FPC mated)
H2S resistance
(with FPC mated)
Lifetime
characteristics
Unit weight
Insertion and removal life
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
48 hours,
contact resistance max. 100mΩ
Temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
20 times
Repeated insertion and removal: min. 10 sec./time
Conformed to IEC60068-2-78
Temperature 40±2°C, humidity 90 to 95% R.H.
Conformed to IEC60068-2-11
Temperature 35±2°C, saltwater concentration 5±1%
Y5B 50 pins: 0.16 g
–3–
ACCTB1E 201803-T
FPC/FFC connectors Y5B/Y5BW (0.5mm pitch)
2. Material and surface treatment
Part name
Material
Surface treatment
Molded portion
Housing: LCP resin (UL94V-0)
Lever: LCP resin (UL94V-0)
—
Contact
Copper alloy
Holding contact (Only Y5BW)
Soldering terminal portion
Copper alloy
Copper alloy
DIMENSIONS (Unit: mm)
Contact portion; Base: Ni plating, Surface: Au plating
Terminal portion; Base: Ni plating, Surface: Au plating
Terminal portion; Base: Ni plating, Surface: Au plating
Base: Ni plating, Surface: Au plating
The CAD data of the products with a
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Y5B
External dimensions
A
0.50±0.10
Dimension table
Dimensions
1.00±0.10
(3.70)
Terminal coplanarity
(1.76)
1.60
(Suction area)
(0.30)
0.1
(0.50)
(Contact and soldering terminals)
(1.50)
(FPC insertion depth)
2.90
3.20
B±0.20
(0.15)
(0.32)
(0.15)
C±0.20
General tolerance: ±0.3
Each mentioned sizes are at the stage of initial delivery.
Number
of pins
4
5
6
8
10
12
14
16
24
28
30
32
34
40
42
50
A
B
C
4.00
4.50
5.00
6.00
7.00
8.00
9.00
10.00
14.00
16.00
17.00
18.00
19.00
22.00
23.00
27.00
3.36
3.86
4.36
5.36
6.36
7.36
8.36
9.36
13.36
15.36
16.36
17.36
18.36
21.36
22.36
26.36
1.50
2.00
2.50
3.50
4.50
5.50
6.50
7.50
11.50
13.50
14.50
15.50
16.50
19.50
20.50
24.50
Y5B Recommended FPC/FFC dimensions
(Finished thickness: t = 0.3±0.03)
The conductive parts should be based by Ni plating and then Au plating.
Dimension table
(A+1)
±0.05
A±0.03
(FPC)
0.35±0.03
(FFC)
0.30±0.03
Dimensions
R0.20±0.05
0.30±0.03
2.50min.
(Reinforcing plate)
1.50min.
(Conductor
exposed area)
0.50±0.07
0.50±0.03
Cutting direction※
※Cut FPC/FFC from the copper foil side to the reinforcing plate side.
–4–
Number
of pins
4
5
6
8
10
12
14
16
24
28
30
32
34
40
42
50
A
1.50
2.00
2.50
3.50
4.50
5.50
6.50
7.50
11.50
13.50
14.50
15.50
16.50
19.50
20.50
24.50
ACCTB1E 201803-T
FPC/FFC connectors Y5B/Y5BW (0.5mm pitch)
Y5BW
External dimensions
A
0.50±0.10
Dimension table
Dimensions
Terminal coplanarity
1.00±0.10
1.60
(Suction area)
(1.76)
Holding contacts (The holding contacts
cannot be used as conductors.)
(3.70)
(0.30)
0.1
(0.50)
(Contact, holding contacts and soldering terminals)
(1.50)
(FPC insertion depth)
2.90
3.20
B±0.20
(0.15)
D±0.20
C±0.20
(0.32)
(0.15)
(0.32)
(0.15)
General tolerance: ±0.3
Each mentioned sizes are at the stage of initial delivery.
Number
of pins
2
3
4
6
8
10
12
14
22
26
28
30
32
38
40
48
A
B
C
D
4.00
4.50
5.00
6.00
7.00
8.00
9.00
10.00
14.00
16.00
17.00
18.00
19.00
22.00
23.00
27.00
3.36
3.86
4.36
5.36
6.36
7.36
8.36
9.36
13.36
15.36
16.36
17.36
18.36
21.36
22.36
26.36
1.50
2.00
2.50
3.50
4.50
5.50
6.50
7.50
11.50
13.50
14.50
15.50
16.50
19.50
20.50
24.50
0.50
1.00
1.50
2.50
3.50
4.50
5.50
6.50
10.50
12.50
13.50
14.50
15.50
18.50
19.50
23.50
Y5BW Recommended FPC dimensions
(Finished thickness: t = 0.3±0.03)
The conductive parts should be based by Ni plating and then Au plating.
Dimension table
Dimensions
R0.20±0.05
R0.20±0.05
R0.25max.
2.50min
(Reinforcing plate)
R0.25max.
1.50min
(Conductor
exposed area)
0.
80±0.
05
0.70±0.05※1 0.30±0.03
R0.20±0.05
1.30±0.10
1.00±0.07
(A+2)
±0.05
A±0.03
0.
50±0.
03 (Pitch) 0.
35±0.
03
Cutting direction※2
※1
※1 Not interfere conductor
※2 Cut FPC from the copper foil side to the reinforcing plate side.
–5–
Number
of pins
2
3
4
6
8
10
12
14
22
26
28
30
32
38
40
48
A
0.50
1.00
1.50
2.50
3.50
4.50
5.50
6.50
10.50
12.50
13.50
14.50
15.50
18.50
19.50
23.50
ACCTB1E 201803-T
FPC/FFC connectors Y5B/Y5BW (0.5mm pitch)
EMBOSSED TAPE DIMENSIONS (Unit: mm)
Specifications for taping
Tape I
Tape II
+0.3
(A±0.3)
-0.1
(A )
(B)
(1.75)
(C)
D±1
(B)
(1.75)
Taping reel
(4.0)
(8.0) (2.0)
Embossed carrier tape
φ380
(4.0)
Top cover tape
(8.0) (2.0)
Leading direction after packaging
Specifications for the plastic reel
In accordance with EIAJ ET-7200B.
Embossed mounting-hole
Label
φ1.5+0.1
0
φ1.5+0.1
0
Dimension table
Y5B
Number of pins
4 to 10
12 to 30
32 to 34
40 to 50
Type of taping
Tape I
Tape I
Tape II
Tape II
A
16.0
24.0
32.0
44.0
B
7.5
11.5
14.2
20.2
C
–
–
28.4
40.4
D
17.4
25.4
33.4
45.4
Quantity per reel
5,000
5,000
5,000
5,000
Number of pins
2 to 8
10 to 28
30 to 32
38 to 48
Type of taping
Tape I
Tape I
Tape II
Tape II
A
16.0
24.0
32.0
44.0
B
7.5
11.5
14.2
20.2
C
–
–
28.4
40.4
D
17.4
25.4
33.4
45.4
Quantity per reel
5,000
5,000
5,000
5,000
Y5BW
Connector orientation with respect to embossed tape feeding direction
Type
Y5B/Y5BW
Direction
of tape progress
–6–
ACCTB1E 201803-T
FPC/FFC connectors Y5B/Y5BW (0.5mm pitch)
NOTES (Unit: mm)
Design of PC board patterns
Conduct the recommended foot pattern design, in order to
preserve the mechanical strength of terminal solder areas.
Recommended PC board and metal mask patterns
Connectors are mounted with high pitch density, intervals of 0.4
mm, 0.5 mm or 0.6 mm. In order to reduce solder and flux rise,
solder bridges and other issues make sure the proper levels of
solder is used.
0.40±0.05
1.00±0.05
1.00±0.05
0.80±0.05
3.
30±0.
05
0.50±0.01
0.25±0.01
0.40±0.01
1.00±0.01
1.00±0.01
0.80±0.01
3.
30±0.
01
0.50±0.05
0.30±0.05
0.55±0.01
Recommended metal mask pattern
Metal mask thickness: When 120μm
(Terminal portion opening area ratio: 57%)
(Metal-part portion opening area ratio: 100%)
0.80±0.05
Recommended PC board pattern
(mounting layout)
The figures are recommended patterns. Please use them as a
reference.
Please refer to the latest product specifications when
designing your product.
–7–
ACCTB1E 201803-T
Notes on Using FPC/FFC Connectors
About safety remarks
1) Do not use these connectors beyond the specification sheets.
The usage outside of specified rated current, dielectric strength,
and environmental conditions and so on may cause circuitry
damage via abnormal heating, smoke, and fire.
2) In order to avoid accidents, your thorough specification review
is appreciated. Please contact our sales office if your usage is
out of the specifications. Otherwise, Panasonic Corporation
cannot guarantee the quality and reliability.
3) Panasonic Corporation is consistently striving to improve
quality and reliability. However, the fact remains that electrical
components and devices generally cause failures at a given
statistical probability. Furthermore, their durability varies with
use environments or use conditions. In this respect, please
check for actual electrical components and devices under actual
conditions before use.
Continued usage in a state of degraded condition may cause the
deteriorated insulation, thus result in abnormal heat, smoke or
firing. Please carry out safety design and periodic maintenance
including redundancy design, design for fire spread prevention,
and design for malfunction prevention so that no accidents
resulting in injury or death, fire accidents, or social damage will
be caused as a result of failure of the products or ending life of
the products.
PC board design
1) Design the recommended foot pattern in order to secure the
mechanical strength in the soldered areas of the terminal.
2) In order to facilitate the connector mount, make sure to design
the board with reduced warpage.
3) Please design and pay attention to the distance from the
board edge to the pattern. When cutting the board, do not give
an excessive stress to the connector, which risks damaging the
connector.
4) Y3BW/Y5BW
Depending on FPC/FFC dimension and FPC/FFC insertion
location, there is a possibility that the holding contact and an
FPC/FFC pattern of both end of signal contacts are in shortcircuited. Please design the equipment not to be affected even if
a board pattern of holding contacts and an FPC/FFC pattern of
both end of signal contacts are in short-circuited.
(For example: Do not connect a board pattern of holding
contacts and GND.
If connect a board pattern of holding contacts and GND, also
connect board pattern of both end of signal contacts.)
FPC/FFC and equipment design
1) Design the FPC/FFC based with recommended dimensions
to ensure the required connector performance.
2) When back lock type is used, secure enough space for
closing the lever and for open-close operation of the lever.
3) Make sure that connector positioning and FPC/FFC length
are appropriate to prevent diagonal insertion of the FPC/FFC.
4) Due to the FPC/FFC size, weight, or the reaction force of the
routed FPC/FFC, FPC/FFC removed and connector deformation
may occur by a fall, vibration, or other impact.
When using FPC/FFC connector for smart phones, cellular
phones and other applications which require falling resistance,
please pay attention to precautions.
5) Carefully check the equipment design and take required
measures to prevent the FPC/FFC removed.
6) If the shock of falling, vibration is applied to the FPC/FFC,
please design the equipment not to be applied a load to
connector, such as fixing the FPC/FFC.
7) Make sure to design the FPC/FFC insertion part with reduced
warpage. Otherwise, the warpage may adversely affect the FPC/
FFC insertion.
–1–
8) Y4BH, Y5BH
When using in high-speed transmission applications, please
take care when designing the FPC/FFC, because the differential
impedance values may be uneven depending on FPC/FFC
dimensions settings, uneven dimensions, and layering
composition.
9) Y3BW/Y5BW
The holding contacts cannot be used as conductors.
The holding contacts are located on both ends of the
connector, and the shape of the soldered portions is the
same as that of the signal contacts. Use caution to ensure
connect identification.
10) Y3BL
Soldering terminal structure
• Since soldering terminals touch FPC/FFC, note that the short
circuit may occur when the metal parts exposed on side of FPC/
FFC.
• Depending on FPC/FFC dimension, there is a possibility that
soldering terminals and an FPC/FFC pattern of both end of
signal contacts are in short-circuited. Please design the
equipment not to be affected even if a board pattern of soldering
terminals and an FPC/FFC pattern of both end of signal contacts
are in short-circuited.
(For example: Do not connect a board pattern of soldering
terminals and GND.
If connect a board pattern of soldering terminals and GND, also
connect board pattern of both end of signal contacts.)
ACCTB13E 201803-T
Notes on Using FPC/FFC Connectors
Connector mounting
1) Excessive mounter chucking force may deform the molded or
metal part of the connector. Consult us in advance if chucking is
to be applied.
2) In case of dry condition, please note the occurrence of static
electricity. The product may be adhered to the embossed carrier
tape or the cover tape in dry condition. Recommended humidity
is from 40 to 60%RH and please remove static electricity by
ionizer in manufacturing process.
Soldering
1. Manual soldering
1) As this product is compact size, please avoid the excessive
solder. Because the excessive solder makes creepage and flux
wicking at contact portion, or impact contact by soldering
interference.
2) Please use the soldering iron under specified temperature
and times.
2. Reflow soldering
1) When cream solder printing is used, screen method is
recommended.
2) To achieve the appropriate soldering state, make sure that the
reflow temperature, PC board foot pattern, window size and
thickness of metal mask are recommended condition.
3) Note that excess solder on the terminals prevents complete
insertion of the FPC/FFC, and causes flux climbing up.
4) A screen thickness of 120μm is recommended during cream
solder printing.
5) When applying the different thickness of a screen, please
contact our sales office.
6) There may be a case of difficult self-alignment depending on
the connector size. In that case, please be careful to align
terminals and solder pads.
7) The following diagram shows the recommended reflow
soldering temperature profile.
Temperature
Peak temperature 260℃
230℃
180℃
150℃
3) Soldering flux may contaminate the contact portion, please
check the contact portion after soldering with a magnifying
glass. If the contamination is found, please clean the
contamination before use.
4) As excessive force to terminal by manual soldering has some
possibilities of contact portion deformation, please be careful to
the force by hand.
5) Please clean soldering iron tip.
8) Infrared reflow soldering is able to passed two times.
9) The temperature is measured on the PC board surface near
connector terminals.
10) The condition of solder or flux creepage and wettability
depend on the type of solder and flux. Please set the reflow
temperature and oxygen level by considering the solder and flux
characteristics.
11) Do not use resin-containing solder. Otherwise, the contacts
might be firmly fixed.
12) When performing reflow soldering on the back of the PC
board after reflow soldering the connector, secure the connector
using, for example, an adhesive.
(Double reflow soldering on the same side is possible.)
Do not apply reflow heating while a lever is closing (or on
the way of closing)
The terminals may be deformed by reflow heating with a lever is
closing (or on the way of closing).
Peak temperature
Preheating
220℃
200℃
25 sec.
60 to 120 sec.
70 sec.
Upper limited
(Solder heat resistance)
Lower limited
(Solder wettability)
Time
3. Rework of soldering portion.
1) Rework shall be only one time.
2) Please avoid the supplementary flux in case of rework for
soldering bridge, as this may cause flux creepage to contact
portion.
When adding the solder for reworking, do not add an excessive
solder.
3) Please use the soldering iron under specified temperature.
4. As the excessive force on the terminals may cause the
deformation and the integrity of solderability will be lost
during reflow soldering, please avoid dropping or rough
handling of the product.
5. When the soldering is not completed, do not open/close
the lever or insert/ remove an FPC/FFC. And the external
compulsory force to the terminal may cause the fixing force
lowering between the terminal and the molding or the
coplanarity failures. In addition, do not insert an FPC/FFC
into the connector before soldering the connector.
6. When cutting or bending the PC board after mounting the
connector, please avoid the stress at the soldering portion.
The soldered areas should not be subjected to force.
–2–
ACCTB13E 201803-T
Notes on Using FPC/FFC Connectors
PC board
1) As thick coverlay/solder resist and adhesive may cause poor
soldering, please set thickness of coverlay and adhesive as thin
as possible.
Precautions for insertion/removal of FPC/FFC
1) (Except for Y3BC)
Avoid touching the lever (applying any external force) until an
FPC/FFC is inserted. Do not open/close the lever without an
FPC/FFC inserted. Failure to follow this instruction will cause
the contacts to warp, leading to the contact tips to interfere with
the insertion of an FPC/FFC, deforming the terminals. Failure to
follow this instruction may cause the lever to be removed,
terminals to be deformed, and/or the FPC/FFC insertion force to
increase.
Without an FPC inserted
2) These connectors are of the back lock type, which has the
FPC/FFC insertion section on the opposite side of the lever. Be
careful not to make a mistake in the FPC/FFC insertion position
or the lever opening/closing position. Otherwise, a contact failure
or connector breakage may occur.
3) Do not insert an FPC/FFC upside down. Inserting an FPC/
FFC in a direction opposite to that you intended may cause an
operation failure or malfunction.
4) Insert an FPC/FFC with the lever opened at right angle, that
is, in the factory default position.
5) After checking the position of FPC/FFC insertion slot and
FPC/FFC, completely insert the FPC/FFC horizontally to the full
depth of the connector without altering the angle. An FPC/FFC
inserted at an excessive angle to the board may cause the
deformation of metal parts, crack of molding parts, FPC/FFC
insertion failures, and FPC/FFC circuit breakages.
6) Insert the FPC/FFC into the connector after checking the
position of FPC/FFC insertion slot and FPC/FFC. Do not insert
the FPC/FFC without positioning the FPC/FFC and connector.
Otherwise, it may cause connector breakages. When it is hard to
insert the FPC/FFC, do not insert the FPC/FFC on that
condition. Confirm the FPC/FFC and connector positioning.
7) Do not apply an excessive load to the lever in the opening
direction beyond its open position; otherwise, the lever may be
deformed or removed.
8) Do not apply an excessive load to the lever in a direction
perpendicular to the lever rotation axis or in the lever opening
direction; otherwise, the terminals may be deformed, and the
lever may be removed.
–3–
9) To close the lever, turn down the lever by pressing the entire
lever or both sides of the lever with fingers tips. And close the
lever completely. Be careful not to apply partial load to the lever
that may cause its deformation or destruction or lever going back
to initial position. Close the lever completely to prevent contact
failure.
10) Avoid applying an excessive load to the top of the lever
during or after closing the lever. Otherwise, the terminals may be
deformed.
11) When opening the lever to remove the FPC/FFC, rotate the
lever to the initial position. Do not push the lever into the FPC/
FFC inlet side and ensure that the lever will not go over the initial
position; otherwise, it may be deformed or broken.
12) To open the lever, if pressure to the lever is applied unevenly,
such as to an edge only, it may deform or break.
13) Do not open the lever forcefully with something sharp tool,
otherwise, the lever may be deformed.
14) Remove the FPC/FFC at parallel with the lever fully opened.
If the lever is closed, or if the FPC/FFC is forcedly pulled, the
product or FPC/FFC may break.
15) If a lever is accidentally detached during the handling of a
connector, do not use the connector any longer.
1. After an FPC/FFC is inserted, carefully handle it so as not
to apply excessive stress to the base of the FPC/FFC. When
using FPC/FFC with a bent condition, please pay attention
to precautions below; otherwise, in some conditions it may
cause conduction failure, connector breakage, unlocking
lever or FPC/FFC disconnection.
16) Design so that a load is not applied to connector directly by
FPC/FFC bending.
17) Avoid sharp FPC/FFC bending at the root of FPC/FFC
insertion part.
18) Design so that a load is not applied to the part of FPC/FFC
bending.
19) If there might be a load on FPC/FFC, please fix the FPC/
FFC.
20) Y3BW and Y5BW
Fix the FPC/FFC if there might be a load to the cut out, do not
apply bending load to the cutout part of FPC/FFC. Otherwise, it
may cause FPC/FFC disconnection and deformation since the
cutout part of FPC/FFC is subjected to bending stress.
FPC/FFC cutout part
ACCTB13E 201803-T
Notes on Using FPC/FFC Connectors
Cleaning treatment
Cleaning this product is not needed basically.
Please note the following points to prevent the negative effect to
the product when cleaning is necessary.
1) Please keep the cleanliness of the cleaning fluid to make sure
that the contact surfaces are not contaminated by the cleaning
fluid itself.
2) Semi-aqueous cleaning solvent is recommended as some
powerful solvent may dissolve the molding portion or the marked
letters. Please contact our sales office when other solvent is
used.
Precautions for operating environment and storage environment
1) Panasonic Corporation does not guarantee the failures
caused by condensation.
Other precautions
1) When the coating material is used for preventing PC board
isolation deterioration after soldering, please assure the coating
material is not adhered on any part of connector.
2) Please avoid the usage of connector as electric switching
basically.
3) There is no problem on the product quality though the
swelling, the black spot, the small scars and the foreign matter,
etc. might be generated in the molding parts.
4) There is no problem on the product quality though the weld
line might be generated in the weld part of molding parts when
the use of product is within the specifications.
5) The detailed shape of metal parts and molding parts may
differ depending on the mold.
6) Height in FPC/FFC mating depends on the way to being used,
such as mounting condition, thickness of FPC/FFC, and angle of
lever lock etc. Please check it by actual equipment.
Please refer to the latest product specifications when
designing your product.
–4–
ACCTB13E 201803-T