FPC/FFC connectors For FPC/FFC
Y5B/Y5BW
(0.5 mm pitch)
Pitch 0.5 mm, low profile/space saving and double top and bottom contacts construction
FEATURES
Double top and bottom contacts construction
Wiring patterns can be placed under the connector
Time and effort can be reduced by delivering with
lever open
Lock hold type (Y5BW) with excellent holding force
is available (Y5BW: support only FPC)
Supports high speed transmission standard V-byOne® HS. of THine Electronics, Inc.
Models that support an ambient temperature of
105°C are also available.
(For more information, please contact our sales representative.)
TYPICAL APPLICATIONS
Mobile devices and industrial equipment
*V-by-One®HS: An interface for the nextgeneration high-speed signals developed by THine
Electronics, Inc. V-by-One® is a registered
trademark of THine Electronics, Inc.
DETAILS FEATURES
Low profile and space saving design
Lock hold type (Y5BW) is also available
Low profile and space saving design of 1.00 mm high and 3.20
mm deep (3.70 mm with lever)
The FPC holding contacts located on both ends of the
connector facilitate positioning of FPC and further enhance the
FPC holding force.
Structure to lock
notches on both
ends of the FPC
with holding
contacts
1.00
3.20
4 pins ( Y5B: minimum)
Applicable FPC shape
With notches
Notes: 1. The inserted FPC can be temporarily held until the lever is closed.
2. When the lever is closed, the holding contacts lock the FPC by its notches,
enhancing the FPC holding force.
Prevent displacement of FPC insertion
Constructed to make positional displacement difficult by
surrounding the four sides on the FPC inlet side with wall
molding
2021.10
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ACCTB1E 202110
FPC/FFC Connectors Y5B/Y5BW (0.5 mm pitch)
ORDERING INFORMATION (PART NO.)
Y5B
AYF
53
3 5
53: 0.5 mm pitch
Back lock
Number
of pins
(2 digits)
Function
3: Top and bottom
double contacts
Surface treatment
(Contact portion / Terminal portion)
5: Au plating/Au plating (Ni barrier)
Packing
Nil : 5,000 pieces embossed tape and plastic reel × 2
Y5BW
AYF
53: 0.5 mm pitch
Back lock
53
Number
of pins
(2 digits)
6 5 T
Function
6: Top and bottom double contacts
and lock hold type
Surface treatment
(Contact portion / Terminal portion)
5: Au plating/Au plating (Ni barrier)
Packing
Nil : 5,000 pieces embossed tape and plastic reel × 2
PRODUCT TYPES
Y5B
Height
1.0 mm
Number of pins
Part No.
4
AYF530435
5
AYF530535
6
AYF530635
8
AYF530835
10
AYF531035
12
AYF531235
14
AYF531435
16
AYF531635
24
AYF532435
28
AYF532835
30
AYF533035
32
AYF533235
34
AYF533435
Standard packing
Inner carton (1-reel)
Outer carton
5,000 pcs.
10,000 pcs.
Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units. For samples, please contact our sales representative.
2. Please contact our sales representative for connectors having a number of pins other than those listed above.
Y5BW
Height
1.0 mm
Number of pins
Part No.
2
AYF530265T
3
AYF530365T
4
AYF530465T
6
AYF530665T
8
AYF530865T
10
AYF531065T
12
AYF531265T
14
AYF531465T
22
AYF532265T
26
AYF532665T
28
AYF532865T
30
AYF533065T
32
AYF533265T
Standard packing
Inner carton (1-reel)
Outer carton
5,000 pcs.
10,000 pcs.
Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units. For samples, please contact our sales representative.
2. Please contact our sales representative for connectors having a number of pins other than those listed above.
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FPC/FFC Connectors Y5B/Y5BW (0.5 mm pitch)
SPECIFICATIONS
Characteristics
The followings show specifications, when using an applicable FPC (thickness 0.30 mm)
Item
Electrical
characteristics
Mechanical
characteristics
Conditions
0.5 A/pin contact (except for holding contact)
Rated voltage
50 V AC/DC
Dielectric strength
250 V AC for 1 min.
No short-circuiting or damage at a detection current of
1 mA when the specified voltage is applied for one
minute.
Insulation resistance
Min. 1,000 MΩ (initial)
Using 250 V DC megger (applied for 1 min.)
Contact resistance
Max. 100 mΩ
Based on the contact resistance measurement method
specified by JIS C 5402.
Y5B: Min. 0.2 N/pin contact × pin contacts (initial)
FPC/FFC holding force Y5BW: Min. 0.2 N/pin contact × pin contacts + 2.0 N
(initial)
Measurement of the maximum force applied until the
inserted compatible FPC is pulled out in the insertion
axis direction while the connector lever is closed
Ambient temperature
-55 to +85°C*
No icing. No condensation.
Soldering heat
resistance
The initial specification must be satisfied electrically
and mechanically.
Reflow soldering:
Peak temperature: 260°C or less
(on the surface of the PC board around the connector
terminals)
Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
Storage temperature
-55 to +85°C (product only)
-40 to +50°C (emboss packing)
No icing. No condensation.
Conformed to MIL-STD-202F, method 107G
Order Temperature (℃) Time (minutes)
1
30
ー55ー03
2
Max. 5
3
30
85 +30
4
Max. 5
0
ー55ー3
Thermal shock
resistance
(with FPC mated)
5 cycles,
insulation resistance Min. 100 MΩ,
contact resistance Max. 100 mΩ
Humidity resistance
(with FPC mated)
120 hours,
insulation resistance Min. 100 MΩ,
contact resistance Max. 100 mΩ
Conformed to IEC60068-2-78
Temperature 40±2°C, humidity 90 to 95% RH
Saltwater spray
resistance
(with FPC mated)
24 hours,
insulation resistance Min. 100 MΩ,
contact resistance Max. 100 mΩ
Conformed to IEC60068-2-11
Temperature 35±2°C, saltwater concentration 5±1%
H2S resistance
(with FPC mated)
48 hours,
contact resistance Max. 100 mΩ
Temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% RH
Insertion and removal
life
20 times
Repeated insertion and removal: Min. 10 sec./time
~
Environmental
characteristics
Specifications
Rated current
~
Lifetime
characteristics
Unit weight
Y5B 34 pins: 0.11 g
Y5W 32 pins: 0.11 g
*There are also products prepared for -55 to +105°C of use ambient temperature. For details, please contact our sales representative.
Material and surface treatment
Part name
Material
Surface treatment
Molded portion
Housing: LCP resin (UL94V-0)
Lever: LCP resin (UL94V-0)
−
Contact
Copper alloy
Contact portion; Base: Ni plating, Surface: Au plating
Terminal portion; Base: Ni plating, Surface: Au plating
Holding contact (Only
Y5BW)
Copper alloy
Terminal portion; Base: Ni plating, Surface: Au plating
Soldering terminal
Copper alloy
Base: Ni plating, Surface: Au plating
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FPC/FFC Connectors Y5B/Y5BW (0.5 mm pitch)
DIMENSIONS
Unit: mm
CAD The CAD data of the products with a “CAD” mark can be downloaded from our Website.
Y5B
CAD
External dimensions
A
0.50±0.10
1.00±0.10
(3.70)
Terminal coplanarity
(1.76)
(0.30)
0.1
(0.50)
(Contact and soldering terminals)
(0.15)
Dimension table
1.60
(Suction area)
(1.50)
(FPC insertion depth)
2.90
3.20
B±0.20
(0.32)
(0.15)
C±0.20
Each mentioned sizes are at the stage of initial delivery.
General tolerance: ±0.3
Dimensions
Number
of pins
4
A
B
C
4.00
3.36
1.50
5
4.50
3.86
2.00
6
5.00
4.36
2.50
8
6.00
5.36
3.50
10
7.00
6.36
4.50
12
8.00
7.36
5.50
14
9.00
8.36
6.50
16
10.00
9.36
7.50
24
14.00
13.36
11.50
28
16.00
15.36
13.50
30
17.00
16.36
14.50
32
18.00
17.36
15.50
34
19.00
18.36
16.50
Y5B Recommended FPC/FFC dimensions
(Finished thickness: t = 0.3±0.03)
The conductive parts should be based by Ni plating and then Au plating.
Dimension table
(A+1)
±0.05
A±0.03
(FPC)0.35±0.03
(FFC)
0.30±0.03
R0.20±0.05
0.30±0.03
2.50min.
(Reinforcing plate)
1.50min.
(Conductor
exposed area)
0.50±0.07
0.50±0.03
Cutting direction※
※Cut FPC/FFC from the copper foil side to the reinforcing plate side.
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Dimensions
Number
of pins
4
1.50
5
2.00
6
2.50
8
3.50
10
4.50
12
5.50
14
6.50
A
16
7.50
24
11.50
28
13.50
30
14.50
32
15.50
34
16.50
ACCTB1E 202110
FPC/FFC Connectors Y5B/Y5BW (0.5 mm pitch)
Y5BW
CAD
External dimensions
A
0.50±0.10
(3.70)
1.60
(Suction area)
Terminal coplanarity
B±0.20
B
C
D
4.00
3.36
1.50
0.50
3
4.50
3.86
2.00
1.00
4
5.00
4.36
2.50
1.50
6
6.00
5.36
3.50
2.50
8
7.00
6.36
4.50
3.50
10
8.00
7.36
5.50
4.50
12
9.00
8.36
6.50
5.50
14
10.00
9.36
7.50
6.50
22
14.00
13.36
11.50
10.50
26
16.00
15.36
13.50
12.50
28
17.00
16.36
14.50
13.50
30
18.00
17.36
15.50
14.50
32
19.00
18.36
16.50
15.50
(1.50)
D±0.20
C±0.20
Each mentioned sizes are at the stage of initial delivery.
(0.32)
(FPC insertion depth)
2.90
3.20
(0.32)
(0.15)
A
(0.50)
(Contact, holding contacts and soldering terminals)
(0.15)
Dimensions
Number
of pins
2
(0.30)
0.1
(0.15)
Dimension table
(1.76)
1.00±0.10
Holding contacts (The holding contacts
cannot be used as conductors.)
General tolerance: ±0.3
Y5BW Recommended FPC dimensions
(Finished thickness: t = 0.3±0.03)
The conductive parts should be based by Ni plating and then Au plating.
Notch type
R0.2±0.05
R0.2±0.05
R0.25max.
※1
※1 Not interfere conductor
※2 Cut FPC from the copper foil side to the reinforcing plate side.
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2.50min
(Reinforcing plate)
R0.25max.
1.50min
(Conductor
exposed area)
0.70±0.05※1 0.30±0.03
R0.2±0.05
0.80±0.05
(A+2)
±0.05
A±0.03
0.50±0.03 (Pitch) 0.35±0.03
1.30±0.10
1.00±0.07
Cutting direction※2
Panasonic Corporation 2021
Dimension table
Dimensions
Number
of pins
2
0.50
3
1.00
4
1.50
6
2.50
8
3.50
10
4.50
12
5.50
A
14
6.50
22
10.50
26
12.50
28
13.50
30
14.50
32
15.50
ACCTB1E 202110
FPC/FFC Connectors Y5B/Y5BW (0.5 mm pitch)
EMBOSSED TAPE DIMENSIONS
Unit: mm
Specifications for taping
Specifications for the plastic reel
Tape I
(A±0.3)
(A )
(B)
(1.75)
(D±1)
Taping reel
Top cover tape
(B)
(1.75)
Embossed carrier tape
Embossed mounting-hole
(8.0) (2.0)
(8.0) (2.0)
φ380
(4.0)
(C)
(4.0)
Leading direction after packaging
In accordance with EIAJ ET-7200B.
Tape II
+0.3
ー0.1
φ1.5+0.1
0
Label
φ1.5+0.1
0
Dimension table
Y5B
Number of pins
Type of taping
A
B
C
D
Quantity per reel
4 to 10
Tape I
16.0
7.5
-
17.4
5,000
12 to 30
Tape I
24.0
11.5
-
25.4
5,000
32 to 34
Tape II
32.0
14.2
28.4
33.4
5,000
Y5BW
Number of pins
Type of taping
A
B
C
D
Quantity per reel
2 to 8
Tape I
16.0
7.5
-
17.4
5,000
10 to 28
Tape I
24.0
11.5
-
25.4
5,000
30 to 32
Tape II
32.0
14.2
28.4
33.4
5,000
Connector orientation with respect to embossed tape feeding direction
Direction
of tape progress
Type
Y5B/Y5BW
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FPC/FFC Connectors Y5B/Y5BW (0.5 mm pitch)
NOTES
Unit: mm
Design of PC board patterns
Conduct the recommended foot pattern design, in order to
preserve the mechanical strength of terminal solder areas.
Recommended PC board and metal mask patterns
Recommended PC board pattern
(mounting layout)
Recommended metal mask pattern
Metal mask thickness: When 120 μm
(Terminal opening ratio: 57%)
(Metal-part opening ratio: 100%)
0.40±0.05
1.00±0.05
1.00±0.05
0.80±0.05
3.30±0.05
0.50±0.01
0.25±0.01
0.40±0.01
1.00±0.01
1.00±0.01
0.80±0.01
3.30±0.01
0.50±0.05
0.30±0.05
0.55±0.01
The figures are recommended patterns. Please use them as a
reference.
0.80±0.05
Connectors are mounted with high pitch density, intervals of
0.4 mm, 0.5 mm or 0.6 mm. In order to reduce solder and flux
rise, solder bridges and other issues make sure the proper
levels of solder is used.
Please refer to "the latest product specifications"
when designing your product.
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Notes on Using FPC/FFC Connectors
About safety remarks
o not use these connectors beyond the specification sheets. The
D
usage outside of specified rated current, dielectric strength,and
environmental conditions and so on may cause circuitry damage via
abnormal heating, smoke, and fire.
In order to avoid accidents, your thorough specification review is
appreciated. Please contact our sales representative if your usage is
out of the specifications. Otherwise, Panasonic Corporation cannot
guarantee the quality and reliability.
Panasonic Corporation is consistently striving to improve quality
and reliability. However, the fact remains that electrical components
and devices generally cause failures at a given statistical probability.
Furthermore, their durability varies with use environments or
use conditions. In this respect, please check for actual electrical
components and devices under actual conditions before use.
Continued usage in a state of degraded condition may cause the
deteriorated insulation, thus result in abnormal heat, smoke or firing.
Please carry out safety design and periodic maintenance including
redundancy design, design for fire spread prevention, and design
for malfunction prevention so that no accidents resulting in injury or
death, fire accidents, or social damage will be caused as a result of
failure of the products or ending life of the products.
PC board design
esign the recommended foot pattern in order to secure the
D
mechanical strength in the soldered areas of the terminal.
In order to facilitate the connector mount, make sure to design the
board with reduced warpage.
Please design and pay attention to the distance from the board edge
to the pattern. When cutting the board, do not give an excessive
stress to the connector, which risks damaging the connector.
Y5BW
Depending on FPC/FFC dimension and FPC/FFC insertion location,
there is a possibility that the holding contact and an FPC/FFC
pattern of both end of signal contacts are in shortcircuited. Please
design the equipment not to be affected even if a board pattern of
holding contacts and an FPC/FFC pattern of both end of signal
contacts are in short-circuited.
(For example: Do not connect a board pattern of holding contacts
and GND. If connect a board pattern of holding contacts and GND,
also connect board pattern of both end of signal contacts.)
FPC/FFC and equipment design
Design the FPC/FFC based with recommended dimensions to
ensure the required connector performance.
When back lock type is used, secure enough space for closing the
lever and for open-close operation of the lever.
Make sure that connector positioning and FPC/FFC length are
appropriate to prevent diagonal insertion of the FPC/FFC.
Due to the FPC/FFC size, weight, or the reaction force of the routed
FPC/FFC, FPC/FFC removed and connector deformation may occur
by a fall, vibration, or other impact. When using FPC/FFC connector
for smart phones, cellular phones and other applications which
require falling resistance, please pay attention to precautions.
Carefully check the equipment design and take required measures
to prevent the FPC/FFC removed.
If the shock of falling, vibration is applied to the FPC/FFC, please
design the equipment not to be applied a load to connector, such as
fixing the FPC/FFC.
Make sure to design the FPC/FFC insertion part with reduced
warpage. Otherwise, the warpage may adversely affect the
FPC/FFC insertion.
Y5BH
When using in high-speed transmission applications, please take
care when designing the FPC/FFC, because the differential
impedance values may be uneven depending on FPC/FFC
dimensions settings, uneven dimensions, and layering composition.
Y5BW
The holding contacts cannot be used as conductors.
The holding contacts are located on both ends of the connector, and
the shape of the soldered portions is the same as that of the signal
contacts. Use caution to ensure connect identification.
Connector mounting
xcessive mounter chucking force may deform the molded or metal
E
part of the connector. Consult us in advance if chucking is to be
applied.
In case of dry condition, please note the occurrence of static
electricity. The product may be adhered to the embossed carrier
tape or the cover tape in dry condition. Recommended humidity is
from 40 to 60%RH and please remove static electricity by ionizer in
manufacturing process.
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Notes on Using FPC/FFC Connectors
Soldering
Manual soldering
As this product is compact size, please avoid the excessive solder.
Because the excessive solder makes creepage and flux wicking at
contact portion, or impact contact by soldering interference.
Please use the soldering iron under specified temperature and
times.
Soldering flux may contaminate the contact portion, please check
the contact portion after soldering with a magnifying glass. If the
contamination is found, please clean the contamination before use.
As excessive force to terminal by manual soldering has some
possibilities of contact portion deformation, please be careful to the
force by hand.
Please clean soldering iron tip.
Reflow soldering
When cream solder printing is used, screen method is
recommended.
To achieve the appropriate soldering state, make sure that the reflow
temperature, PC board foot pattern, window size and thickness of
metal mask are recommended condition.
Note that excess solder on the terminals prevents complete insertion
of the FPC/FFC, and causes flux climbing up.
A screen thickness of 120μm is recommended during cream solder
printing.
When applying the different thickness of a screen, please contact
our sales representative.
There may be a case of difficult self-alignment depending on the
connector size. In that case, please be careful to align terminals and
solder pads.
The following diagram shows the recommended reflow soldering
temperature profile.
Temperature
Peak temperature
260℃
230℃
Preheating
180℃
150℃
60 to 120 sec.
220℃
200℃
25 sec.
70 sec.
Infrared reflow soldering is able to passed two times.
The temperature is measured on the PC board surface near
connector terminals.
The condition of solder or flux creepage and wettability depend on
the type of solder and flux. Please set the reflow temperature and
oxygen level by considering the solder and flux characteristics.
Do not use resin-containing solder. Otherwise, the contacts might be
firmly fixed.
When performing reflow soldering on the back of the PC board
after reflow soldering the connector, secure the connector using, for
example, an adhesive.
(Double reflow soldering on the same side is possible.)
Do not apply reflow heating while a lever is closing (or on the way of
closing)
The terminals may be deformed by reflow heating with a lever is
closing (or on the way of closing).
Upper limited
(Solder heat resistance)
Lower limited
(Solder wettability)
Time
Rework of soldering portion.
Rework shall be only one time.
Please avoid the supplementary flux in case of rework for soldering
bridge, as this may cause flux creepage to contact portion.
When adding the solder for reworking, do not add an excessive
solder.
Please use the soldering iron under specified temperature.
s the excessive force on the terminals may cause the
A
deformation and the integrity of solderability will be lost
during reflow soldering, please avoid dropping or rough
handling of the product.
When the soldering is not completed, do not open/close
the lever or insert/remove an FPC/FFC. And the external
compulsory force to the terminal may cause the fixing
force lowering between the terminal and the molding or
the coplanarity failures. In addition, do not insert an
FPC/FFC into the connector before soldering the
connector.
hen cutting or bending the PC board after mounting
W
the connector, please avoid the stress at the soldering
portion.
The soldered areas should not be subjected to force.
PC board
As thick coverlay/solder resist and adhesive may cause poor
soldering, please set thickness of coverlay and adhesive as thin as
possible.
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Notes on Using FPC/FFC Connectors
Precautions for insertion/removal of FPC/FFC
Avoid touching the lever (applying any external force) until an
FPC/FFC is inserted. Do not open/close the lever without an FPC/
FFC inserted. Failure to follow this instruction will cause the contacts
to warp, leading to the contact tips to interfere with the insertion of
an FPC/FFC, deforming the terminals. Failure to follow this
instruction may cause the lever to be removed, terminals to be
deformed, and/or the FPC/FFC insertion force to increase.
Without an FPC inserted
These connectors are of the back lock type, which has the
FPC/FFC insertion section on the opposite side of the lever. Be
careful not to make a mistake in the FPC/FFC insertion position or
the lever opening/closing position. Otherwise, a contact failure or
connector breakage may occur.
Do not insert an FPC/FFC upside down. Inserting an FPC/ FFC in
a direction opposite to that you intended may cause an operation
failure or malfunction.
Insert an FPC/FFC with the lever opened at right angle, that is, in
the factory default position.
After checking the position of FPC/FFC insertion slot and FPC/FFC,
completely insert the FPC/FFC horizontally to the full depth of the
connector without altering the angle. An FPC/FFC inserted at an
excessive angle to the board may cause the deformation of metal
parts, crack of molding parts, FPC/FFC insertion failures, and
FPC/FFC circuit breakages.
Insert the FPC/FFC into the connector after checking the position of
FPC/FFC insertion slot and FPC/FFC. Do not insert the FPC/FFC
without positioning the FPC/FFC and connector. Otherwise, it may
cause connector breakages. When it is hard to insert the FPC/FFC,
do not insert the FPC/FFC on that condition. Confirm the FPC/FFC
and connector positioning.
Do not apply an excessive load to the lever in the opening direction
beyond its open position; otherwise, the lever may be deformed or
removed.
Do not apply an excessive load to the lever in a direction
perpendicular to the lever rotation axis or in the lever opening
direction; otherwise, the terminals may be deformed, and the lever
may be removed.
To close the lever, turn down the lever by pressing the entire lever
or both sides of the lever with fingers tips. And close the lever
completely. Be careful not to apply partial load to the lever that may
cause its deformation or destruction or lever going back to initial
position. Close the lever completely to prevent contact failure.
Avoid applying an excessive load to the top of the lever during or
after closing the lever. Otherwise, the terminals may be deformed.
When opening the lever to remove the FPC/FFC, rotate the lever
to the initial position. Do not push the lever into the FPC/FFC inlet
side and ensure that the lever will not go over the initial position;
otherwise, it may be deformed or broken.
To open the lever, if pressure to the lever is applied unevenly, such
as to an edge only, it may deform or break.
Do not open the lever forcefully with something sharp tool,
otherwise, the lever may be deformed.
Remove the FPC/FFC at parallel with the lever fully opened. If the
lever is closed, or if the FPC/FFC is forcedly pulled, the product or
FPC/FFC may break.
If a lever is accidentally detached during the handling of a connector,
do not use the connector any longer.
fter an FPC/FFC is inserted, carefully handle it so as
A
not to apply excessive stress to the base of the
FPC/FFC. When using FPC/FFC with a bent condition,
please pay attention to precautions below; otherwise,
in some conditions it may cause conduction failure,
connector breakage, unlocking lever or FPC/FFC
disconnection.
Design so that a load is not applied to connector directly by
FPC/FFC bending.
Avoid sharp FPC/FFC bending at the root of FPC/FFC insertion
part.
Design so that a load is not applied to the part of FPC/FFC bending.
If there might be a load on FPC/FFC, please fix the FPC/ FFC.
Y5BW
Fix the FPC/FFC if there might be a load to the cut out, do not apply
bending load to the cutout part of FPC/FFC. Otherwise, it may
cause FPC/FFC disconnection and deformation since the cutout
part of FPC/FFC is subjected to bending stress.
FPC/FFC cutout part
Cleaning treatment
Cleaning this product is not needed basically.
Please note the following points to prevent the negative effect to the
product when cleaning is necessary.
Please keep the cleanliness of the cleaning fluid to make sure that
the contact surfaces are not contaminated by the cleaning fluid
itself.
Semi-aqueous cleaning solvent is recommended as some powerful
solvent may dissolve the molding portion or the marked letters.
Please contact our sales representative when other solvent is used.
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
ー 10 ー
Panasonic Corporation 2021
ACCTB13E 202110
Notes on Using FPC/FFC Connectors
Precautions for operating environment and storage environment
Panasonic Corporation does not guarantee the failures caused by
condensation.
Other precautions
When the coating material is used for preventing PC board isolation
deterioration after soldering, please assure the coating material is
not adhered on any part of connector.
Please avoid the usage of connector as electric switching basically.
There is no problem on the product quality though the swelling, the
black spot, the small scars and the foreign matter, etc. might be
generated in the molding parts.
There is no problem on the product quality though the weld line
might be generated in the weld part of molding parts when the use
of product is within the specifications.
The detailed shape of metal parts and molding parts may differ
depending on the mold.
Height in FPC/FFC mating depends on the way to being used, such
as mounting condition, thickness of FPC/FFC, and angle of lever
lock etc. Please check it by actual equipment.
Please refer to "the latest product specifications"
when designing your product.
•Requests to customers:
https://industrial.panasonic.com/ac/e/salespolicies/
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
ー 11 ー
Panasonic Corporation 2021
ACCTB13E 202110
Please contact ..........
Electromechanical Control Business Division
1006, Oaza Kadoma, Kadoma-shi, Osaka 571-8506, Japan
industral.panasonic.com/ac/e/
©Panasonic Corporation 2021
ACCTB1E 202110
Specifications are subject to change without notice.