AYL111240

AYL1 For LED LED lighting connector L1 Series (Joint type) FEATURES New 1. Small and low profile design does not obstruct the LED light The connector is of a 2.4 mm pitch two pins board joint type. The LED light is not obstructed by the low profile (1.4 mm mated height) L1 series connector. Explanatory diagram of the connector mounted on a circuit board Joint plug 3. Safety covered by ensuring insulation distance (Min. 1.6 mm) 4. Mating lock construction using molded lock 5. Unmating configured with jig APPLICATIONS Straight LED tube lights, LED base lights, etc. Receptacle (common) 1.4mm LED RoHS compliant 4.4mm LED mounted board 2. Floating design The three-directional floating function (X: ±0.3 mm, Y: ±0.5 mm, Z: ±0.3 mm) accommodates thermal expansion of circuit boards. X-direction: ±0.3 mm Y-direction: ±0.5 mm Z-direction: ±0.3 mm ORDERING INFORMATION AYL 1 1 2 4 0 1: L1 Product type 1: Receptacle 2: Joint plug Type of mating 1: Vertical Number of pins (1 digit) Terminal pitch 4: 2.4 mm Function 0: Standard ACCTB50E 201207-T Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/ AYL1 PRODUCT TYPES 1. Receptacle Mated height Part No. 1.4mm AYL111240 Mated height Part No. 1.4mm AYL121240 Packing Inner carton (1-reel) 5,000 pieces Outer carton 10,000 pieces 2. Joint plug Packing Inner carton (1-reel) 5,000 pieces Outer carton 10,000 pieces Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units Samples for mounting check: 50-connector units. Please contact our sales office. 2. Please contact us for connectors having a number of pins other than those listed above. SPECIFICATIONS 1. Characteristics Electrical characteristics Item Rated current Rated voltage 1.0A/pin contact 125V AC/DC Breakdown voltage 1,250V AC for 1 min. Insulation resistance Min. 1,000MΩ (initial) Contact resistance Max. 90mΩ Composite insertion force (initial) Composite removal force (initial) Specifications Conditions No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute. Using 500V DC megger (applied for 1 min.) Based on the contact resistance measurement method specified by JIS C 5402. Two contacts of receptacle and a post of joint plug Max. 25.2N Insertion force of two receptacles and a joint plug Min. 4.0N Removal force of two receptacles and a joint plug Y Mechanical characteristics Floating distance (Receptacle and joint plug mated) X direction: ±0.3 mm Y direction: ±0.5 mm Z direction: ±0.3 mm X Z Ambient temperature –40°C to +105°C No freezing at low temperatures. No dew condensation. Storage temperature –40°C to +85°C (product only) –40°C to +50°C (packing structure) No freezing at low temperatures. No dew condensation. Conformed to MIL-STD-202F, method 107G Thermal shock resistance (Receptacle and plug) Order Temperature (°C) 1 –40 −30 2 3 105 +30 4 –40 −30 200 cycles, insulation resistance min. 100MΩ, contact resistance max. 90mΩ Environmental characteristics Humidity resistance (Receptacle and plug) Saltwater spray resistance (Receptacle and plug) H2S resistance (Receptacle and plug) Durability Soldering temperature resistance Receptacle Solder paste thickness 500 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ Time (minutes) 30 Max. 5 30 Max. 5 Bath temperature 85±2°C, humidity 80 to 85% R.H. Conformed to MIL-STD-1344F, method 1001 Bath temperature 35±2°C, saltwater concentration 5±1% Conformed to JEIDA-38-1984 Bath temperature 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. 48 hours, contact resistance max. 90mΩ 3 times, contact resistance max. 90mΩ Using removal tool The initial specification must be satisfied electrically and mechanically Reflow soldering: Max. peak temperature of 260°C, Max. 2 times (PC board surface temperature near connector terminals) Soldering iron: 300°C within 5 s 350°C within 3s The initial specification must be satisfied electrically and mechanically Recommendation t = 0.12 mm screen Note: The preceding show characteristics, when mated with receptacle and Joint plug. Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/ ACCTB50E 201207-T AYL1 2. Material and surface treatment 1. Receptacle Part name Molded portion Material LCP resin (UL94V-0) Color White Contact Copper alloy — Soldering terminal Copper alloy — Material LCP resin (UL94V-0) Copper alloy Color White — Surface treatment — Contact portion: Pd-Ni+Au flash plating over Ni Terminal portion: Au plating over Ni (except the terminal tips) Terminal portion: Au plating over Ni 2. Joint plug Part name Molded portion Post Surface treatment — Terminal portion: Pd-Ni+Au flash plating over Ni DIMENSIONS (Unit: mm) Receptacle Terminal coplanarity 0.08 0.20±0.03 2.42 X X (Contact and soldering terminals) 3.78 Y 2.00 (Suction face) 2.40±0.05 3.02 Y 0.90±0.05 0.38 0.60 General tolerance: ±0.2 1.00 0.19 0.15 0.75 4.40 15.00 2.40±0.05 1.60 (Suction face) Joint plug 1.38 13.62 1.35 1.15 3.22 3.00 3.08 9.60 General tolerance: ±0.2 ACCTB50E 201207-T Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/ AYL1 Receptacle and Joint plug are mated Joint plug Receptacle 1.40±0.1 Receptacle EMBOSSED TAPE DIMENSIONS (Unit: mm) (1.75) (17.4±1) Top cover tape Label Top cover tape Embossed carrier tape Embossed carrier tape to 18 0° 380 dia. Note 1) (4.0) (16.0 +0.3 −0.1 ) (7.5) • Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) (8.0) (2.0) 1. 5 Embossed mounting-hole 165° Leading direction after packaging • Tape packed status Receptacle Taping reel Receptacle +0 0 .1 dia . (24.0 +0.3 −0.1 ) (11.50) Top cover tape (1.75) (25.4±1) Label 0° to 18 5 165° 1. +0 0 .1 Top cover tape Embossed carrier tape Embossed carrier tape 380 dia. Note 1) (4.0) (8.0) (2.0) Leading direction after packaging Joint plug Embossed mounting-hole Joint plug Taping reel dia . • Connector orientation with respect to embossed tape feeding direction Type L1 Direction of tape progress Receptacle Panasonic Corporation Automation Controls Business Unit Joint plug industrial.panasonic.com/ac/e/ ACCTB50E 201207-T AYL1 NOTES ON USING CONNECTOR FOR LED LIGHTING Recommended PC board pattern (mounting pad layout) (TOP VIEW) Unit: mm 0.05±0.03 2.32±0.03 0.05±0.03 Note 3) Between ACCTB50E 201207-T Panasonic Corporation 2.40±0.03 0.40±0.03 PC board: Max. 1.00 Note 1) 1.10±0.03 Note 2) 0.20±0.05 Note 2) Note 2) 0.20±0.05 0.20±0.05 Note 2) 0.20±0.05 Note 1) Pad area Note 2) It is necessary to do the resist processing on the copper foil. Note 3) These dimensions are applied when the insulation distance from the edge of the PC board is 1.5 mm. 2) Reflow soldering • Screen-printing is recommended for printing paste solder. • To determine the relationship between the screen opening area and the PC board foot pattern area, refer to the diagrams in the recommended patterns for PC boards and metal masks. Make sure to use the terminal tip as a reference position when setting. • Too much solder may cause solder creeping near the contacting part or contact failure. Terminal
About receptacle • PC board design Design the recommended foot pattern in order to secure the mechanical strength in the soldered areas of the terminal. • Connector mounting When mounting, if there is too much suction nozzle pressure, the molded and metal parts might deform and break. Please check beforehand. In case of dry condition, please care the occurrence of static electricity. The product may be adhered to the embossed carrier tape or the cover tape in dry condition. Recommended humidity is between 40 to 60 % and please remove static electricity by ionizer in manufacturing scene. • Soldering 1) Manual soldering. • Since this connector is the low profile type the amount of solder supplied should be closely monitored. Too much solder during manual soldering may cause solder creeping near the contacting part or contact failure. • Make sure that the soldering iron tip is heated within the temperature and time limits indicated in the specifications. • Flux from the solder wire may adhere to the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces with a magnifying glass and clean off any flux before use. • Be aware that a load applied to the connector terminals while soldering may displace the contact. • Thoroughly clean the soldering iron tip. Note 1) 1.10±0.03 11.92±0.05 0.40±0.03 Note 3) (Min. 1.84)
Safety precautions Observe the following safety precautions to prevent accidents and injuries. 1) The use of the connector outside of the specified rated current and breakdown voltage ranges may cause abnormal heating, smoke, and fire. Never use the connector beyond the specified ranges of the product. 2) In order to avoid accidents, make sure you have thoroughly reviewed the specifications before use. Consult us if you plan to use the product in a way not covered by the specifications. 3) We are consistently striving to improve quality and reliability. However, the fact remains that electrical components and devices generally fail at a given statistical probability. Furthermore, their durability varies depending on where and how they are used. Please be sure to verify electrical components and devices under actual conditions before use. Continuously using them in a state of degraded performance may cause deterioration in insulation performance, thus resulting in abnormal heat generation, smoke generation, or fire. To avoid that, we ask you to implement safe designs that include redundancy, fire prevention, and malfunction prevention. Also, please conduct periodic maintenance so that no accidents resulting in injury or death, fire, or harm to society will be caused as a result of product failure or service life. Paste solder PC board foot pattern • Consult us when using a screen-printing thickness other than that recommended. • Depending on the size of the connector being used, self alignment may not be possible. Accordingly, carefully position the terminal with the PC board pattern. • The recommended reflow temperature profile is given in the figure below Upper limit (Soldering heat resistance) Lower limit (Solder wettability) Temperature 260°C 230°C 180°C 150°C Peak temperature Preheating 220°C 200°C 25 sec. 60 to 120 sec. 70 sec. Time • The temperature is measured on the surface of the PC board near the connector terminal. • Certain solder and flux types may cause serious solder creeping. Solder and flux characteristics should be taken into consideration when setting the reflow soldering conditions. • Do not apply adhesive to secure the connector, because it can affect the spring action of the contact. • When coating the PC board after soldering the connector to prevent the deterioration of insulation, perform the coating in such a way so that the coating does not get on the connector. 3) Reworking on a soldered portion • Finish reworking in one operation. • For reworking of the solder bridge, use a soldering iron with a flat tip. Do not add flux, otherwise, the flux may creep to the contact parts. • Use a soldering iron whose tip temperature is within the temperature range specified in the specifications. Automation Controls Business Unit industrial.panasonic.com/ac/e/ AYL1 • Although this product has floating structure, it’s the performance in the state of receptacles and a plug mated. We can’t guarantee mating in the state where receptacles and a plug are shifted from the center. When inserting a plug in receptacles, please check the position of a mutual receptacle. Position sifts Joint plug Joint plug Position sifts Receptacle Position sifts • Do not drop or handle the connector carelessly. Otherwise, the terminals may become deformed due to excessive force or applied solderability may degrade. • When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive forces.
Insertion / Removal and mating retention of connectors • Do not insert or remove the connector when it is not soldered. Also, forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. • Excessive prying-force applied to one end may cause product breakage and separation of the solder joints at the terminal. Excessive force applied for insertion in a pivot action as shown may also cause product breakage. Always align the connector with the mating part and slide it in parallel. Mating X Z Receptacle X Y Receptacle Joint plug Joint plug Z Z Y Y Receptacle Receptacle • Pushing the plug excessively when inserting it may deform and break the product. • This product has simple lock structure for mating. However, connectors may be unmated because of impact by dropping and so on. Please take countermeasures at the equipment side for preventing removal of connectors. In order to prevent removal of connectors, please fix the PC board by frame and so on not to move more than floating distance, especially the neighborhood of connectors. Receptacle Fix the PC board by frame and so on Z Y PC board with mounted connectors (Don’t move more than floating distance) • When removing the connector, please use the recommended removal tool. After inserting the tip of removal jig under the plug, push down the jig shown in below. (Removable from either the left or right side) Since holding force of mating will decline when removing the connector without using tool, please don’t use the remove plug, and exchange to a new plug. Removal tool Z Insert removal tool and push down in the direction of the arrow. Y X Z Insertion point of removal tool Panasonic Corporation Y Automation Controls Business Unit industrial.panasonic.com/ac/e/ ACCTB50E 201207-T