CNB1304H

CNB1304H

  • 厂商:

    NAIS(松下)

  • 封装:

    PCB

  • 描述:

    CNB1304H

  • 数据手册
  • 价格&库存
CNB1304H 数据手册
Reflective Photosensors (Photo Reflectors) CNB1304H (ON2175) Reflective photosensor Tape end sensor for DAT (R2.3) 4.0±0.3 Unit: mm φ2.2±0.3 Symbol Rating Reverse voltage VR 3 V emitting diode) Forward current IF 50 mA Power dissipation *1 Unit PD 75 mW Output (Photo Collector-emitter voltage transistor) (Base open) VCEO 30 V Emitter-collector voltage (Base open) VECO 5 V Collector current IC 20 mA Collector power dissipation *2 PC 100 mW Operating ambient temperature T opr −20 to +85 °C Storage temperature Tstg −30 to +100 °C +0 4.0±0.3 (C0.2) 2-0.4±0.2 (3.75) 4 2 3.0±0.3 +0 φ1.2 −0.3 2-0.15 +0.2 -0.1 (3.75) 1: Anode 2: Cathode 3 1 3: Collector 4: Emitter PRSTR104-005 Package (Note) ( ) Dimension is reference Note) *1: Input power derating ratio is 1.0 mW/°C at Ta ≥ 25°C. *2: Output power derating ratio is 1.33 mW/°C at Ta ≥ 25°C. ce /D isc on tin ue Temperature (C0.3) 7±0.3 5.0 min. ■ Absolute Maximum Ratings Ta = 25°C Parameter 2-φ1.2±0.15 7.0±0.3 1.0±0.3 • Fast response • Small size and light weight Input (Light 3.75±0.15 +0 8.0 -0.3 di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. ■ Features 6.5±0.3 5.0 -0.3 M Di ain sc te on na tin nc ue e/ d CNB1304H is a sensor which consists of a high efficiency GaAs infrared light emitting diode and a high sensitivity Si phototransistor which are arranged together in the same direction. It detects the beginning and end of a tape based on changes in the amount of light reflected from a prism which is situated outside of the sensor. (4-R0.3) 6.0±0.15 8.3±0.3 2-φ1.2±0.15 ■ Overview ■ Electrical-Optical Characteristics Ta = 25°C ± 3°C Parameter Input Symbol Forward voltage an characteristics Reverse current Max Unit VF IF = 50 mA 1.5 V IR VR = 3 V 10.0 µA VCE = 10 V 200 nA 1 500 µA ICEO Collector current *1 IC Ma Transfer int en Output Collector-emitter cutoff current characteristics (Base open) characteristics Collector-emitter saturation voltage VCE(sat) Rise time tr Fall time tf Conditions Min VCE = 5 V, IF = 20 mA Typ 100 IF = 50 mA, IC = 0.1 mA 0.5 VCC = 10 V, IC = 0.5 mA, RL = 100 Ω 6 V µs 6 Note) 1. Input and output are handled electrically. 2. This product is not designed to withstand radiation 3. *1: IC measurement circuit *2: Switching time measurement circuit (Unit: mm) 1 2.5 1 Sig. in VCC (Input pulse) Sig. out CNB1304H 2- 1.5 50 Ω RL (Output pulse) 90% 10% tr tf tr: Rise time tf: Fall time prism Note) The part number in the parenthesis shows conventional part number. Publication date: April 2004 SHG00049BED 1 Caution for Safety ¢ This product contains Gallium Arsenide (GaAs). DANGER GaAs powder and vapor are hazardous to human health if inhaled or ingested. Do not burn, destroy, cut, cleave off, or chemically dissolve the product. Follow related laws and ordinances for disposal. The product should be excluded from general industrial waste or household garbage. M Di ain sc te on na tin nc ue e/ d Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. d pla inc ne lud se pla m d m es v ne ain ain foll htt isit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. on tin ue (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. ce /D isc (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. Pl ea Ma int en an (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. If you have any inquiries or questions about this book or our semiconductor products, please contact one of our sales offices listed on the back or Semiconductor Company's Department.
CNB1304H 价格&库存

很抱歉,暂时无法提供与“CNB1304H”相匹配的价格&库存,您可以联系我们找货

免费人工找货