CNC1S171R0LF

CNC1S171R0LF

  • 厂商:

    NAIS(松下)

  • 封装:

    4-DIP(0.400",10.16mm)

  • 描述:

    CNC1S171R0LF

  • 数据手册
  • 价格&库存
CNC1S171R0LF 数据手册
This product complies with the RoHS Directive (EU 2002/95/EC). Optoisolators CNC1S171 (ON3171) Optoisolator For isolated signal transmission  Features  Absolute Maximum Ratings Ta = 25°C Parameter Power dissipation *1 Input (Light emitting diode) Forward current Pulse forward current *2 Reverse voltage Collector-emitter voltage (Base open) Emitter-collector voltage (Base open) Output (Photo transistor) Collector current di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. M Di ain sc te on na tin nc ue e/ d  High current transfer ratio: CTR > 50%  High I/O isolation voltage: VISO = 5 000 V[rms] (min.)  Fast response: tr = 2 μs, tf = 3 μs (typ.)  Low collector-emitter cutoff current (base open): ICEO < 100 nA  UL listed (UL File No. E79920) Collector power dissipation *3 Isolation voltage, input to output *4 ue Total power dissipation on tin Operating ambient temperature Rating Unit PD 75 mW IF 50 mA IFP 1 A VR 6 V VCEO 80 V VECO 7 V IC 50 mA PC 150 mW VISO 5 000 V[rms] PT 200 mW Topr –30 to +100 °C Tstg –55 to +125 °C en an ce /D Input power derating ratio is 0.75 mW/°C at Ta ≥ 25°C. Pulse width ≤ 100 μs, repeat 100 pps Output power derating ratio is 1.5 mW/°C at Ta ≥ 25°C. AC 1 min. RH < 60% Ma int Note) *1: *2: *3: *4: isc Storage temperature Symbol Note) The part number in the parenthesis shows conventional part number. Publication date: January 2009 SHF00003CED 1 This product complies with the RoHS Directive (EU 2002/95/EC). CNC1S171  Electrical-Optical Characteristics Ta = 25°C±3°C Parameter Symbol Reverse current Input Forward voltage characteristics Terminal capacitance Collector-emitter voltage (Base open) IR VR = 3 V VF IF = 50 mA Ct VR = 0 V, f = 1 MHz Min Typ 1.35 DC current transfer ratio *1 Isolation capacitance, input to output Transfer Isolation resistance, input to output characteristics Rise time *2 Fall time *3 Note) 1. Input and output are practiced by electricity. 10 µA 1.5 V pF VCEO IC = 100 mA 80 V VECO IE = 10 mA 7 V ICEO VCE = 20 V 5 CC VCE = 10 V, f = 1 MHz 10 CTR VCE = 10 V, IF = 5 mA CISO f = 1 MHz RISO VISO = 500 V tr 100 nA pF 50 600 0.7 1011 VCC = 10 V, IC = 2 mA, RL = 100 W tf Collector-emitter saturation voltage Unit di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. Collector-emitter capacitance Max 15 M Di ain sc te on na tin nc ue e/ d Emitter-collector voltage Output characteristics (Base open) Collector-emitter cutoff current (Base open) Conditions VCE(sat) IF = 20 mA, IC = 1 mA ue on tin PD 40 3 µs 0.1 0.2 IC  IF VCC = 10 V Ta = 25°C 50 40 30 20 10 1 10 −1 10 0 −20 20 60 100 Ambient temperature Ta (°C) 2 102 Ta = 25°C Collector current IC (mA) int 80 Forward current IF (mA) isc ce /D en an 120 IF  VF 60 Ma Collector power dissipation PC , Power dissipation PD (mW) PC , PD  Ta 0 0 0.9 1.0 1.1 1.2 1.3 Forward voltage VF (V) SHF00003CED 1.4 10 −2 10 −1 1 W µs *2: tr : Time required for the collector current to increase from 10% to 90% of its final value *3: tf : Time required for the collector current to decrease from 90% to 10% of its initial value PC pF 2 2. This device is designed by disregarding radiation. 3. *1: IC CTR × 100% IF 160 % 10 Forward current IF (mA) 102 V This product complies with the RoHS Directive (EU 2002/95/EC). CNC1S171 IC  VCE(sat) 102 50 mA VCC = 5 V 25 mA 20 mA 20 15 mA 12 mA 10 mA 10 9 mA 8 mA 7 mA 6 mA 5 mA 4 mA 3 mA 2 mA 1 mA 24 32 40 Collector current IC (mA) 30 mA IF = 50 mA 20 mA 10 10 mA 5 mA 2 mA 1 120 IF = 10 mA 1 mA 80 10 mA 5 mA 40 8 16 10 −1 ICEO  Ta 10 VCE = 30 V 20 V 10 V 0.3 10 −2 40 60 80 100 100 Ω 1 Sig. in VCC ce /D an 1 tr VCC = 10 V Ta = 25°C RL = 1 kΩ tf 102 500 Ω 100 Ω 1 90% 10% td 10 Sig. in Sig. out 50 Ω 10 −2 10 −1 VCC Sig. out RL 1 tr td 10 90% 10% tf 102 Collector current IC (mA) +10 V +10 V 50 kΩ en int Sig. out Sig. in 50 Ω Ma 2 mA IF = 5 mA 102 Measurement circuit of frequency characteristics 100 µF 16 V 10 −2 10 Sig. out RL 50 Ω 1 1 100 tr  IC 102 10 −1 Collector current IC (mA) isc Ta = 25°C 10 −1 10 −2 10 −1 on tin Pf 10 50 ue Ambient temperature Ta (°C) 0 Ambient temperature Ta (°C) 10 500 Ω 5 kΩ 20 0 −50 0.6 RL = 1 kΩ Sig. out 50 Ω 0 0.5 VCC = 10 V Ta = 25°C 10 −1 10 −3 10 −4 −40 −20 0.4 tr  IC 10 10 −1 Relative power output P (dB) 0.2 102 1 10 −3 0.1 Collector-emitter saturation voltage VCE(sat) (V) Rise time tr (µs) Collector-emitter cutoff current (Base open) ICEO (µA) Collector-emitter voltage VCE (V) 0 Fall time tf (µs) 0 di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. 0 5 mA 1 mA M Di ain sc te on na tin nc ue e/ d Collector current IC (mA) 40 mA 30 ∆IC  Ta 160 Ta = 25°C Relative collector current ∆IC (%) IC  VCE 40 Sig. out 50 Ω 103 Frequency f (kHz) SHF00003CED 3 4 an en ce /D ue on tin di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. int  Pin name 1: Anode 2: Cathode 3: Emitter 4: Collector Ma isc M Di ain sc te on na tin nc ue e/ d This product complies with the RoHS Directive (EU 2002/95/EC). CNC1S171  Package (Unit: mm) LCTXXN4Z0002 SHF00003CED Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. M Di ain sc te on na tin nc ue e/ d (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. d pla inc ne lud se pla m d m es ne ain ain foll htt visit d d te te ow p:/ fo d /w llo is isc nan nan ing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i / on . (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. Pl ea Ma int en an ce /D isc on tin ue 20080805
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