DA2JF2300L

DA2JF2300L

  • 厂商:

    NAIS(松下)

  • 封装:

    SOD323F

  • 描述:

    DIODE GEN PURP 300V 300MA SMINI2

  • 数据手册
  • 价格&库存
DA2JF2300L 数据手册
Doc No. TT4-EA-12494 Revision. 4 Product Standards Fast Recovery Diode DA2JF2300L DA2JF2300L Silicon epitaxial planar type Unit: mm 1.25 0.35 For high speed switching circuits 0.13 2  Features 1.7 2.5  Small reverse current IR  Halogen-free / RoHS compliant (EU RoHS / UL-94 V-0 / MSL:Level 1 compliant) 1  Marking Symbol: 4A 0.5 0.7  Packaging Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)  Absolute Maximum Ratings Ta = 25 C Parameter Symbol Repetitive peak reverse voltage Non-repetitive peak reverse surge voltage Forward current (Average) *1 Non-repetitive peak forward surge current *2 Junction temperature Operating ambient temperature Storage temperature Note) VRRM VRSM IF(AV) IFSM Tj Topr Tstg 1. Cathode 2. Anode Panasonic JEITA Code Rating Unit 300 300 0.3 3.0 150 -40 to +85 -40 to +150 V V A A °C °C °C *1: temperature:Ta = 90°C, with DC wave and Alumina PC board (Board:20 ㎜×50 ㎜, Soldering land:2 ㎜×2 ㎜) *2: 50 Hz sine wave 1 cycle (Non-repetitive peak current) SMini2-F5-B SC-90A ― Internal Connection 2 1 Page 1 of 4 Established : 2010-03-31 Revised : 2013-05-29 Doc No. TT4-EA-12494 Revision. 4 Product Standards Fast Recovery Diode DA2JF2300L  Electrical Characteristics Ta = 25 C  3 C Parameter Symbol Forward voltage Reverse current Terminal capacitance Reverse recovery time Min IF = 300 mA VRRM = 300 V VR = 0 V, f = 1 MHz IF = 100 mA, IR = 200mA trr Irr = 0.25 x IR Rth(j-a) Mounted on an alumina PC board *1 Thermal resistance(ch-a) Note) Conditions VF IRRM Ct *2 Typ Max Unit 1.25 1.0 3.5 V μA pF 400 ns 160 °C/W 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031measuring methods for diodes. 2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the charge of a human body and the leakage of current from the operating equipment. 3. Absolute frequency of lnput and output is 20 MHz 4. *1 trr measurement circuit 50 Ω 50 Ω trr D.U.T. IF 5.5 Ω 0.25 × IR IR *2 Mounted on an alumina PC board (Board:20 ㎜×50 ㎜, Soldering land:2 ㎜×2 ㎜) Page 2 of 4 Established : 2010-03-31 Revised : 2013-05-29 Doc No. TT4-EA-12494 Revision. 4 Product Standards Fast Recovery Diode DA2JF2300L Technical Data ( reference ) IF - VF IR - VR 1.E-04 Ta = 125 °C 1.E-01 Reverse current IR (A) Forward current IF (A) 1.E+00 1.E-02 85 °C 1.E-03 25 °C 1.E-04 1.E-05 1.E-06 0.0 -40 °C IR value is not exceeding 100 pA at -40 °C 1.E-05 Ta = 125 °C 1.E-06 85 °C 1.E-07 1.E-08 25 °C 1.E-09 1.E-10 0.2 0.4 0.6 0.8 1.0 1.2 Forward voltage VF (V) 0 50 100 150 200 250 300 Reverse voltage VR (V) Ct - VR Terminal capacitance Ct (pF) 4.0 Ta = 25 °C f = 1 MHz 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 10 20 30 40 Reverse voltage VR (V) Page 3 of 4 Established : 2010-03-31 Revised : 2013-05-29 Doc No. TT4-EA-12494 Revision. 4 Product Standards Fast Recovery Diode DA2JF2300L SMini2-F5-B Unit: mm 1.25±0.10 +0.05 0.35±0.05 0.13-0.02 (5°) 2.5±0.2 1.7±0.1 2 0.50±0.05 0.4±0.1 1 0 to 0.05 (0.15) 0.7±0.1 (5°)  Land Pattern (Reference) (Unit: mm) 0.9 2.4 0.9 0.9 1.1 Page 4 of 4 Established : 2010-03-31 Revised : 2013-05-29 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202
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