Doc No. TT4-EA-15072
Revision. 1
Product Standards
Schottky Barrier Diode
DB2G32600L1
DB2G32600L1
For rectification
Unit: mm
Features
Low forward voltage VF
Forward current (Average) IF(AV) ≦ 1.0 A rectification is possible
RoHS compliant
(EU RoHS / MSL:Level 1 compliant)
0.6
1.0
2
Marking Symbol: A4
Absolute Maximum Ratings
Parameter
Reverse Voltage *1
Maximum Peak Reverse Voltage *1
Average Forward Current *2,3
Average Forward Current *2,4
Non-repetitive Peak Surge Forward Current
Note)
*1:
*2:
*3:
*4:
*5:
*6:
*6
*1,5
Symbol
VR
VRM
IF(AV)
IF(AV)
IFSM
Tj
Ta
Tstg
Min
-40
-55
Max
30
30
1.0
1.0
15
150
+150
+150
0.21
1
Unit
V
V
A
A
A
°C
°C
°C
0.1
0.47
0.21
1. Cathode
2. Anode
Panasonic
JEITA
Code
DCSP1006010-N1
—
—
Ta = Tj = 25℃
Squre wave : σ = 0.5
Ta ≦ 102℃, when device mounted on a FR4 PCB (25.4mm×25.4mm, 1mm thick), copper wiring (620.0mm2 area, 36μm thick).
Tsp ≦ 139℃
Squre wave : Tp = 5 ms
IF
Tp
(Waveform definition)
Power derating is necessary so that Tj < 150℃.
Tp
Duty Cycle : σ =
Electrical Characteristics Ta = 25 °C ± 3 °C
Parameter
Symbol
VF
IR
Ct
trr
Forward Voltage
Reverse Current
Terminal Capacitance
Reverse Recovery Time *1
Note)
2
0.66
Embossed type (Thermo-compression sealing) : 1 000 pcs / reel (standard)
Operating Junction Temperature
Ambient Temperature
Storage Temperature
0.47
0.065
1
Packaging
T
Time
T
Conditions
IF = 1.0 A
VR = 30 V
VR = 10 V, f = 1 MHz
IF = IR = 100 mA, Irr = 10 mA
Min
-
-
Typ
0.35
200
32
10
Max
0.44
900
-
Unit
V
μA
pF
ns
1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. This product is sensitive to electric shock (static electricity, etc.).
Due attention must be paid on the charge of a human body and the leakage of current from the operating equipment.
3. *1: Measurement circuit, input pulse, output pulse for Reverse recovery time
(Measurement circuit)
(Input pulse)
tr
(2)
(1)
DUT
(3)
tp
10%
VR
90%
(Output pulse)
t
IF
trr
t
Irr = IR ÷10
IR
(1) Bias Insertion Unit (N-50BU)
tp = 2 μs
IF = 100 mA
(2) Pulse Generator (PG-10N), RS = 50 Ω
tr = 0.35 ns
IR = 100 mA
(3) Wave Form Analyzer (SAS-8130), Ri = 50 Ω
σ = 0.05
Irr = 10 mA
Page 1 of 8
Established : 2015-10-13
Revised
: ####-##-##
Doc No. TT4-EA-15072
Revision. 1
Product Standards
Schottky Barrier Diode
DB2G32600L1
Electrical Characteristics Technical Data (Reference)
IF - VF / Typical Data
Ct - VR / Typical Data
200
1.0E+01
(1)
(2)
Terminal Capacitance : Ct [pF]
Forward Current : IF [A]
1.0E+00
180
1.0E-01
1.0E-02
(3)
(4)
1.0E-03
(5)
160
140
120
(4)
100
80
60
40
20
0
1.0E-04
0
0.1
0.2
0.3
0.4
0.5
0
0.6
Forward Voltage : VF [V]
10
20
30
Reverse Voltage : VR [V]
IR - VR / Typical Data
1.0E-01
Reverse Current : IR [A]
1.0E-02
(3)
1.0E-03
(Graph legends)
(1)
Ta = 150
(2)
Ta = 125
(3)
Ta = 85
(4)
Ta = 25
(5)
Ta = -40
℃
℃
℃
℃
℃
(4)
1.0E-04
1.0E-05
1.0E-06
(5)
1.0E-07
1.0E-08
1.0E-09
0
10
20
30
Reverse Voltage : VR [V]
Page 2 of 8
Established : 2015-10-13
Revised
: ####-##-##
Doc No. TT4-EA-15072
Revision. 1
Product Standards
Schottky Barrier Diode
DB2G32600L1
Electrical Characteristics Technical Data (Reference)
PF(AV) - IF(AV) / Typical Data
Average Forward Power Dissipation : PF(AV) [W]
0.80
Tj = 25°C
(Waveform definition)
IF
(1)
0.60
Tp
(2)
(3)
Time
T
(4)
Duty Cycle : σ =
0.40
Tp
T
(Graph legends)
(1)
σ= 1.0
(2)
σ= 0.8
(3)
σ= 0.5
(4)
σ= 0.3
0.20
0.00
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
Average Forward Current : IF(AV) [A]
PR(AV) - VR / Typical Data
Average Reverse Power Dissipation : PR(AV) [W]
0.0080
Tj = 25°C
(Waveform definition)
T
0.0060
Time
(1)
VR
0.0040
(2)
Tp
Duty Cycle : σ =
Tp
T
(3)
0.0020
(4)
(Graph legends)
(1)
σ= 1.0
(2)
σ= 0.7
(3)
σ= 0.5
(4)
σ= 0.2
0.0000
0
10
20
30
Reverse Voltage : VR [V]
Page 3 of 8
Established : 2015-10-13
Revised
: ####-##-##
Doc No. TT4-EA-15072
Revision. 1
Product Standards
Schottky Barrier Diode
DB2G32600L1
Electrical Characteristics Technical Data (Reference)
PF(AV) - IF(AV) / Typical Data
Average Forward Power Dissipation : PF(AV) [W]
0.80
Tj = 150°C
(Waveform definition)
IF
0.60
Tp
(1)
(2)
(3)
(4)
0.40
Time
T
Duty Cycle : σ =
Tp
T
(Graph legends)
(1)
σ= 1.0
(2)
σ= 0.8
(3)
σ= 0.5
(4)
σ= 0.3
0.20
0.00
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
Average Forward Current : IF(AV) [A]
PR(AV) - VR / Typical Data
Average Reverse Power Dissipation : PR(AV) [W]
0.30
Tj = 85°C
(Waveform definition)
T
0.20
Time
(1)
VR
(2)
0.10
Tp
Duty Cycle : σ =
Tp
T
(3)
(4)
(Graph legends)
(1)
σ= 1.0
(2)
σ= 0.7
(3)
σ= 0.5
(4)
σ= 0.2
0.00
0
10
20
30
Reverse Voltage : VR [V]
Page 4 of 8
Established : 2015-10-13
Revised
: ####-##-##
Doc No. TT4-EA-15072
Revision. 1
Product Standards
Schottky Barrier Diode
DB2G32600L1
Thermal Characteristics
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Thermal Resistance, Junction to Solder Point
Rth(j-sp)
Ta = 25℃, in free air
-
20
-
°C/W
Thermal Resistance, Junction to Ambient *1
Rth(j-a)
Ta = 25℃, in free air
-
92
-
°C/W
Thermal Resistance, Junction to Ambient *2
Rth(j-a)
Ta = 25℃, in free air
-
170
-
°C/W
Note)
*1: Device mounted on a FR4 PCB (25.4mm×25.4mm, 1mm thick), copper wiring (620.0mm2 area, 36μm thick).
*2: Device mounted on a FR4 PCB (25.4mm×25.4mm, 1mm thick), copper wiring (108.6mm2 area, 36μm thick).
(Evaluation board outline)
Copper wiring
Copper wiring
(620.0mm2)
(108.6mm2)
25.4mm
25.4mm
FR4 PCB
FR4 PCB
25.4mm
25.4mm
Thermal Characteristics Technical Data (Reference)
Rth - T *1 / Typical Data
Thermal Resistance : Rth [℃/W]
1000
(1)
100
(2)
10
0.001
0.01
0.1
1
10
100
1000
Applying Time : T [s]
Note)
*1: Single pulse measurement
(Waveform definition)
Power
(Graph legends)
Device mounted on a FR4 PCB (25.4mm×25.4mm, 1mm thick),
(1)
copper wiring (108.6mm2 area, 36μm thick).
Device mounted on a FR4 PCB (25.4mm×25.4mm, 1mm thick),
(2)
copper wiring (620.0mm2 area, 36μm thick).
Time
Applying Time : T
Page 5 of 8
Established : 2015-10-13
Revised
: ####-##-##
Doc No. TT4-EA-15072
Revision. 1
Product Standards
Schottky Barrier Diode
DB2G32600L1
Thermal Characteristics Technical Data (Reference)
Effective Transient Thermal Resistance - Tp *1 / Typical Data
Effective Transient Thermal Resistance [℃/W]
1000
100
(Evaluation board outline)
(Waveform definition)
Power
(1)
Tp
(2)
10
(4)
0.0001
(5)
0.001
Tp
Duty Cycle : σ =
(6)
1
Time
T
(3)
0.01
0.1
1
10
100
1000
Tp [s]
T
(Graph legends)
(1)
σ = 0.5
(2)
σ = 0.2
(3)
σ = 0.1
(4)
σ = 0.05
σ = 0.02
(5)
(6)
σ= 0
Effective Transient Thermal Resistance - Tp *2 / Typical Data
Effective Transient Thermal Resistance [℃/W]
1000
(Evaluation board outline)
(Waveform definition)
100
Power
(1)
T
(2)
(3)
10
0.001
Time
Duty Cycle : σ =
(4)
(5)
(6)
1
0.0001
0.01
0.1
1
Tp [s]
Note)
Tp
10
100
1000
Tp
T
(Graph legends)
(1)
σ = 0.5
(2)
σ = 0.2
(3)
σ = 0.1
(4)
σ = 0.05
(5)
σ = 0.02
σ= 0
(6)
*1: Device mounted on a FR4 PCB (25.4mm×25.4mm, 1mm thick), copper wiring (108.6mm2 area, 36μm thick).
*2: Device mounted on a FR4 PCB (25.4mm×25.4mm, 1mm thick), copper wiring (620.0mm2 area, 36μm thick).
Page 6 of 8
Established : 2015-10-13
Revised
: ####-##-##
Doc No. TT4-EA-15072
Revision. 1
Product Standards
Schottky Barrier Diode
DB2G32600L1
Power Derating Technical Data (Reference)
IF(AV) - Ta *1 / Typical Data
IF(AV) - Ta *2 / Typical Data
1.6
1.6
Tj =150°C
(1)
1.4
1.4
Average Forward Current : IF(AV) [A]
Average Forward Current : IF(AV) [A]
Tj =150°C
(1)
(2)
1.2
(3)
1.0
(4)
0.8
0.6
0.4
0.2
0.0
(2)
1.2
(3)
1.0
(4)
0.8
0.6
0.4
0.2
0.0
0
25
50
75
100
125
150
Ambient Temperature : Ta [℃]
0
25
50
(Graph legends)
(1)
σ = 1.0
(2)
σ = 0.8
(3)
σ = 0.5
(4)
σ = 0.3
1.6
Tj =150°C
1.4
Average Forward Current : IF(AV) [A]
100
(2)
1.2
150
(Waveform definition)
IF
Tp
T
Duty Cycle : σ =
(3)
1.0
Time
Tp
T
Note)
*1: Device mounted on a FR4 PCB (25.4mm×25.4mm, 1mm thick),
(4)
0.8
125
Ambient Temperature : Ta [℃]
IF(AV) - Tsp / Typical Data
(1)
75
copper wiring (108.6mm2 area, 36μm thick).
(Evaluation board outline)
0.6
0.4
0.2
*2: Device mounted on a FR4 PCB (25.4mm×25.4mm, 1mm thick),
copper wiring (620.0mm2 area, 36μm thick).
0.0
0
25
50
75
100
125
150
(Evaluation board outline)
Solder Point Temperature : Tsp [℃]
Page 7 of 8
Established : 2015-10-13
Revised
: ####-##-##
Doc No. TT4-EA-15072
Revision. 1
Product Standards
Schottky Barrier Diode
DB2G32600L1
DCSP1006010-N1
Unit: mm
0.60±0.05
1
0.47±0.03
1
0.47±0.03
Land Pattern (Reference)
0.21±0.03
0.66
0.065±0.040
0.10±0.02
2
0.21±0.03
1.00±0.05
2
Unit: mm
0.21
0.66
0.21
0.47
Page 8 of 8
Established : 2015-10-13
Revised
: ####-##-##
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
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(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
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defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
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