0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
DMC261010R

DMC261010R

  • 厂商:

    NAIS(松下)

  • 封装:

    SC74A,SOT753

  • 描述:

    TRANS 2NPN PREBIAS 0.3W MINI5

  • 数据手册
  • 价格&库存
DMC261010R 数据手册
DMC26101 Silicon NPN epitaxial planar type Unit: mm For digital circuits  Features  Low collector-emitter saturation voltage VCE(sat)  Halogen-free / RoHS compliant (EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)  Marking Symbol: E1  Basic Part Number Dual DRC2114E (Common emitter)  Packaging DMC261010R Embossed type (Thermo-compression sealing): 3 000 pcs / reel (standard)  Absolute Maximum Ratings Ta = 25°C Parameter Tr1 Tr2 Overall Symbol Rating Unit Collector-base voltage (Emitter open) VCBO 50 V Collector-emitter voltage (Base open) VCEO 50 V Collector current IC 100 mA Total power dissipation PT 300 mW Junction temperature Tj 150 °C Operating ambient temperature Topr –40 to +85 °C Storage temperature Tstg –55 to +150 °C 4: Collector (Tr2) 5: Collector (Tr1) 1: Base (Tr1) 2: Emitter (Common) 3: Base (Tr2) Panasonic JEITA Code Mini5-G3-B SC-74A MO-178 (C1) 5 (C2) 4 Tr2 Tr1 R2 R2 R1 R1 1 (B1) 2 (E) Resistance value  Electrical Characteristics Ta = 25°C±3°C Parameter Symbol Conditions Min Typ 3 (B2) R1 10 kΩ R2 10 kΩ Max Unit Collector-base voltage (Emitter open) VCBO IC = 10 µA, IE = 0 50 V Collector-emitter voltage (Base open) VCEO IC = 2 mA, IB = 0 50 V Collector-base cutoff current (Emitter open) ICBO VCB = 50 V, IE = 0 0.1 µA Collector-emitter cutoff current (Base open) ICEO VCE = 50 V, IB = 0 0.5 µA Emitter-base cutoff current (Collector open) IEBO VEB = 6 V, IC = 0 0.5 mA Forward current transfer ratio hFE VCE = 10 V, IC = 5 mA 35 hFE (Small/Large) VCE = 10 V, IC = 5 mA 0.50 hFE ratio *1 VCE(sat) IC = 10 mA, IB = 0.5 mA Input voltage (ON) VI(on) VCE = 0.2 V, IC = 5 mA Input voltage (OFF) VI(off) VCE = 5 V, IC = 100 µA Collector-emitter saturation voltage  0.99  0.25 2.1 V V 0.8 V Input resistance R1 –30% 10 +30% kΩ Resistance ratio R1 / R2 0.8 1.0 1.2  Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *1: Ratio between 2 elements Publication date: October 2013 Ver. EED 1 DMC26101 DMC26101_IC-VCE DMC26101_PT-Ta PT  Ta DMC26101_hFE-IC IC  VCE hFE  IC 350 100 IB = 350 µA 80 300 µA 250 µA 60 200 µA 40 150 µA 20 0 40 80 120 160 0 200 2 4 VCE(sat)  IC 25°C 200 −40°C 150 100 50 8 10 0 0.1 12 1 10 100 DMC26101_VIN-IO IO  VIN IC / IB = 20 10 Collector current IC (mA) DMC26101_IO-VIN DMC26101_VCEsat-IC Ta = 85°C 250 Collector-emitter voltage VCE (V) Ambient temperature Ta (°C) 10 6 300 100 µA 50 µA 0 Forward current transfer ratio hFE 100 200 0 VIN  IO 100 VO = 5 V VO = 0.2 V 1 Ta = 85°C 0.1 −40°C 1 Input voltage VIN (V) Ta = 85°C Output current IO (mA) Collector-emitter saturation voltage VCE(sat) (V) VCE = 10 V Ta = 25°C 300 Collector current IC (mA) Total power dissipation PT (mW) 120 25°C 10−1 −40°C 10−2 10 −40°C 25°C 1 Ta = 85°C 25°C 0.01 0.1 1 10 Collector current IC (mA) 100 10−3 0 0.5 1.0 1.5 Input voltage VIN (V) Ver. EED 2.0 0.1 0.1 1 10 100 Output current IO (mA) 2 DMC26101 Mini5-G3-B Unit: mm  Land Pattern (Reference) (Unit: mm) Ver. EED 3 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202
DMC261010R 价格&库存

很抱歉,暂时无法提供与“DMC261010R”相匹配的价格&库存,您可以联系我们找货

免费人工找货